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China https://www.semi.org.cn/semiconchina/mail/251017/251017.html SIIAS2 Business Executive Technical
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New Territories
Hong Kong
China

Off Add to Calendar 2025-12-02 00:00:00 2025-12-02 00:00:00 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS) New Territories Hong Kong China SEMI.org [email protected] America/Los_Angeles public
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United States Smarter Fabs Tile Business Executive Technical Training

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Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC #27- recorded Business Executive Technical
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A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. 

This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins. 

ABOUT THE SPEAKERS

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.

Peter Doerschuk, PhD

Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
Headshot of Peter
Peter Doerschuk, PhD
Professor
Cornell Engineering
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.

10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-Demand
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Conference Pricing

SEMI Members: $1,500.00 (Use your corporate email address during log-in to be recognized as a SEMI Member.)

Non-Members: $1,800.00

Speakers and Students: $550.00

Cancellations received on or before April 26, 2026 will be refunded, less a $30 cancellation fee.

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

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Wild Horse Pass

Limited rooms are available at the Wild Horse Pass Resort. Reserve your stay within our room block using the link below.

Deadline: Friday, April 17

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Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

Contact Tim Janes at [email protected]

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The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing. Formerly presented by Linx Consulting, SPCC continues its legacy of delivering high-quality technical content through invited presentations, peer-reviewed sessions, and poster presentations covering all aspects of cleaning science, process integration, materials, equipment, and metrology.

SPCC will feature invited business-focused presentations that examine macroeconomic, market, and structural trends shaping the global semiconductor industry that were formerly included in the Business Interface Conference (BIC). These sessions will provide attendees with valuable context on industry dynamics, supply chain, and strategic outlooks that complement the technical discussions at SPCC.

Now a unified conference, SPCC unites both business and technical aspects of industry into a comprehensive program that bridges technology development and business strategy, offering attendees enhanced opportunities for cross-disciplinary learning, collaboration, and networking with industry leaders, researchers, and decision-makers across the semiconductor ecosystem.

Join our premier technical forum with topics including—                                                                                                          

  • Cleaning Science
  • Equipment
  • Industry Dynamics
  • Materials
  • Metrology
  • Process Integration
  • Strategic Outlook
  • Supply Chain

Wild Horse Pass
5040 Wild Horse Pass Blvd
Chandler, AZ , AZ 85226
United States

MONDAY, MAY 18, 2026

Session 1

8:00 am - 9:00 am

Breakfast

9:00 am - 9:20 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Opening Remarks

9:20 am - 9:50 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

KEYNOTE—Semiconductor Industry Update

9:50 am - 10:10 am
Alma Vela Ramirez_IBM
Alma Vela Ramirez
Unit Process Engineer
IBM

Dummy Gate Poly Wet Etch Studies in GAA Nanosheet Flow

10:10 am - 10:30 am
Adara Yang
Shihui (Adara) Yang
Member of Technical Specialist
Micron

Enabling Novel Innovation in Containers Profile Sculpting for Cell Structure Improvement

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Gary Van Schooneveld
Gary Van Schooneveld
President
CT Associates

Particle Precursors and On-Wafer Defectivity: IRDS Collaborative Research Progress and Future Directions

11:20 am - 11:40 am
Tomoki Nara
Tomoki Nara
Research Scientist
Mitsubishi Chemical Corporation

Si/SiGe Selective Wet Etchant for BSPDN Application: Maximization of Selectivity in Single Wafer Spin Wet Processing

11:40 am - 12:00 pm
Deepak Kumar
Deepak Kumar
Technical Program Director
ACM Research

Optimization of Particle and Atmosphere Control in the SPM Process via Nozzle Cover

12:00 pm - 12:20 pm
Daiki Morimoto
Daiki Morimoto
Process Engineer
TEL

New Surface Preparation System; Batch-Single Hybrid Equipment

12:20 pm - 1:50 pm

Lunch

Session 2

1:50 pm - 2:20 pm
Duncan Meldrum, Hilltop Economics
Duncan Meldrum
Chief Economist
Hilltop Economics

Market Outlook

2:20 pm - 2:40 pm
Hsin-Yu Hsu
Hsin-Yu Hsu
R&D Engineer
Interuniversity Microelectronics Centre (IMEC)

Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al Stacks

2:40 pm - 3:00 pm
Chun-Ren (Jack) Ke
Chun-Ren (Jack) Ke
R&D Manager
Qnity Electronics

Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor Devices

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Nawaphorn Kuhakongkiat
Nawaphorn Kuhakongkiat
Researcher
Hiroshima University

Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface Control

3:50 pm - 4:10 pm
Soonmin Lee
Soonmin Lee
Master's Student
Hanyang University

An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration Scheme

4:10 pm - 4:30 pm
Wei-Shang Lo
Wei-Shang Lo
Advisory Scientist
IBM Research

Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures

4:30 pm - 4:50 pm
Ryotaro Maeda
Ryotaro Maeda
Engineer
Tokyo Electron Kyushu

Approaches to Further Enhance Cut Accuracy

4:50 pm - 5:10 pm
Hiroki Uoyama
Hiroki Uoyama
Manager
Micron Memory Japan, K.K

Advancements in Wafer Backside cleaning for DRAM Manufacturing

TUESDAY, MAY 19, 2026

Session 3

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 2 Opening Remarks

9:10 am - 9:50 am
Inna Skvortsova
Inna Skvortsova
Market Research Manager
SEMI

Day 2 Keynote—Navigating the AI-driven Cycle: Fab Investments and Materials Dynamics in a Fragmented World

9:50 am - 10:10 am
Srini Raghavan, ProSys Headshot
Srini Raghavan
Director of New Process Development
ProSys

Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging Structures

10:10 am - 10:30 am
Amir Taghavi
Amir Taghavi
Research Scientist
TEL

Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon Surface

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Tyler Duncan
Tyler Duncan
Research Scientist
TEL

Ab Initio Study of Confined HF Etching Mechanism on SiO2

11:20 am - 11:40 pm
Shih Chih lin
Shih-Chih Lin
PhD Candidate
University of Washington

WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process Optimization

11:40 am - 12:00 pm
Moeka Ajiki
Moeka Ajiki
Engineer
Fujimi

Challenges and Solution of Post Ceria CMP Clean

12:00 pm - 1:30 pm

Lunch

Session 4

1:30 pm - 2:00 pm
JC Yang
Ji Chul Yang, Ph.D.
Chief of Technology Executive
EBARA Precision Machinery

Advanced Topography Correction Planarization Technology for Yield Enhancement

2:00 pm - 2:20 pm
Gyeongwon Lee
Gyeongwon Lee
Graduate Student
Hanyang University

Controlling the Molybdenum Dissolution and Oxidation During Post-CMP Cleaning

2:20 pm - 2:40 pm
Mona Moukrati
Mona Moukrati
PhD Student
STMicroelectronics

Controlled Cracking-Induced Delamination for Polymer-Based Cleaning

2:40 pm - 3:00 pm
Shogo Onishi
Shogo Onishi
RD Technical Manager
Fujimi

Design of the Buffing Cleaning Solution for Chemical Mechanical Cleaning on Advanced Technology Node

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Suhas Ketkar
Suhas Ketkar
Marketing Leader
Elemental Scientific

Impact of Supply Chain Conditions on IPA Product Quality

3:50 pm - 4:10 pm
Dana Shoken
Dr. Dana Shoken
R&D Manager
CI-SEMI

Trace Water Measurement in Organic Solvent Systems for Semiconductor Manufacturing

4:10 pm - 4:30 pm
Allen Chan
Allen Chan, PhD
R&D Scientist, Balazs™ NanoAnalysis
Air Liquide

Thermal Vacuum Analysis and Identification of Contaminant Outgassing from Polymer Seals

4:30 pm - 4:50 pm
Sina Kaabipour
Sina Kaabipour
Postdoctoral Researcher
imec-USA

Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization Techniques

4:50 pm - 5:10 pm
Padraic O'Reilly
Padraic O'Reilly
Applications Scientist
Molecular Vista

IR-PiFM: Molecular Detection and Identification of Nanoscale Surface Contamination

6:30 pm - 8:00 pm

Networking & Poster Session Reception

WEDNESDAY, MAY 20, 2026

Session 5

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 3 Opening Remarks

9:10 am - 9:40 am
Ian Brown
Ian J. Brown, Ph.D.
President
SCREEN Advanced Technology Center of America

Wet Etching and Cleaning Trends: Scaling x 3D Integration

9:40 am - 10:00 am
Ashutosh Bhabhe
Ashutosh Bhabhe
CEO
14Si Solutions

Characterization of Particle Filtration Solutions in a Weak Acid

Siddarth Sampath
Siddarth Sampath
Director, Global WEC Filtration Applications
Entegris
10:00 am - 10:30 am

Networking Break

10:30 am - 11:00 am
Steven Kraft Entegris
Steven Kraft, Ph. D., PMP
Director of SG&E R&D Materials Solutions
Entegris

Wet-Etch Solutions Development for Advanced Node Devices

11:00 am - 11:20 am
Arim Woo
Arim Woo
Master's Student
Hanyang University

Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP Cleaning

11:20 am - 11:40 am
Sangita Kumari
Sangita Kumari
Principal Process Engineer
TEL Technology Center, America

Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL Integration

11:40 am - 12:00 pm
Hui Zhou
Hui Zhou
Principal Scientist
Huntsman USA

Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning Performance

12:00 pm - 1:30 pm

Lunch

Session 6

1:30 pm - 2:10 pm
Rebecca Routson
Rebecca Routson
Principal Director for CHIPS Test & Metrology
NIST

Day 3 Keynote—Measuring the Future: CHIPS Metrology Program Updates

2:10 pm - 2:30 pm
Diane Bijou
Diane Bijou
Researcher in Chemistry
Technic France

High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers

2:30 pm - 2:50 pm
Jim De Boer
Jim De Boer
Director, US Product and Operations
Trymax NexGen

TTV Optimization in Wet Chemical Thinning Using Integrated Metrology

2:50 pm - 3:20 pm

Networking Break

3:20 pm - 3:40 pm
Koji Nakata
Koji Nakata
Senior Researcher
Kurita Industries

Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional Water

3:40 pm - 4:00 pm
Chihiro Kobata
Chihiro Kobata
Engineer
JSR

Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOG

4:00 pm - 4:10 pm
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Closing Remarks

-

Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.

Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge.

Off Add to Calendar 2026-05-18 00:00:00 2026-05-20 00:00:00 SPCC 2026—Surface Preparation & Cleaning Conference Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge. Wild Horse Pass 5040 Wild Horse Pass Blvd Chandler, AZ , AZ 85226 United States SEMI.org [email protected] America/Phoenix public America/Phoenix
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Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

United States

SCM

Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.

Choose your session:

9:00 am - 10:00 am Off Add to Calendar 2025-09-23 09:00:00 2025-09-23 10:00:00 2025 Semiconductor Supply Chain survey: Insights for strategy and capabilities Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.Choose your session:US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Speakers

 

Henry Marcil

Partner

McKinsey & Company

Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech)

Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor

 

Kushal Jolapara

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines

Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors

Dan Peacock

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects

Leads Operations projects at Foundries, IDMs, and equipment clients

 

Event Contact:

Krish Dharma

[email protected]

Agenda

•    Lead times throughout the semiconductor value chain
•    Landscape and trends in purchasing agreements and LTAs
•    Demand forecasts, backlogs, and end markets
•    Market outlook, opportunities, and threats
•    New for 2025: Organizational capabilities in supply chain management

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Registration for the Global Executive Summit is closed.  Please contact Heidi Hoffman at [email protected] with any questions.  

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SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight.  View the hotels and rates HERE.

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Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to: 

  • Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
  • Define clear deliverables and next-phase commitments that unlock scale and momentum
  • Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results

This Summit is not about what we could do — it’s about what we will do, and who will lead.

Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees.  Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.

Okura Hotel
Tokyo
Japan

Monday, December 15, 2025

9:00 am - 9:20 am

Coffee & Registration

9:25 am - 9:30 am
 Masahiko (Jim) Hamajima - President, SEMI Japan
Jim Hamajima
President
SEMI Japan

9:30 am - 9:45 am
Ajit Manocha, SEMI
Ajit Manocha
CEO & President
SEMI
Carolin Seward, Google
Carolin Seward
VP of Custom Silicon Sourcing and Operations
Google

GES Opening

9:45 am - 10:25 am
Carolin Seward, Google
Moderator
Carolin Seward
Google
Jinman Han
Jinman Han
President
Samsung Foundry
Jens Liebermann
Jens Liebermann
Senior VP of Global Business
BASF
Sundeep Bajikar
Sundeep Bajikar
Corp. VP Head of Corp Strategy
Applied Materials
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration

Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?

10:25 am - 10:40 am
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Spotlight: AMD on the role of Silicon Design for Energy Efficiency

Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.

10:40 am - 11:10 am
Anne Meegan
Moderator
Anna Meegan
Director of Sustainability
Google Platforms & Devices
Angela Baker
Angela Baker
VP Sustainability
Qualcomm
Dharmesh Jani
Dharmesh Jani
Director, AI Infra Ecosystem & Partnerships
Meta
Cooper Elsworth
Cooper Elsworth
Sr. TPM, Advanced Energy Labs
Google

End-User Panel: The Decarbonization Imperative

Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.

11:10 am - 11:25 am

Break

11:25 am - 11:30 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Overview of Priority Initiatives

Priority Initiative: Fab Upstream Materials

11:30 am - 11:40 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Opening Remarks

From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.

11:40 am - 12:10 pm
Bessima
Bessma Aljarbou
Head of Strategy of Environment & Supply Chain Innovation
Apple, Inc.

Keynote: Apple's Supply Chain Engagement

Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.

12:10 pm - 12:40 pm
Handy Ko TSMC
Handy Ko
Director, Materials Management
TSMC

From Ambition to Action: A Fab's Role in Upstream Decarbonization

Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.

12:40 pm - 12:55 pm
Andrea Jorissen
Andrea Jorissen
Supplier Carbon Solutions
Apple, Inc.

Solutions Enablement & Calls-to-Action

Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.

12:55 pm - 1:55 pm

Networking & Lunch

Priority Initiative: Clean Electricity

1:55 pm - 2:05 pm
Rebecca Green
Rebecca Green
Partner
ERM
Ken Haig
Ken Haig
Senior Director Government Affairs
Microsoft

Opening Remarks

Setting the stage for collective action on clean electricity in Asia.

2:05 pm - 2:30 pm
Patrick Tan
Patrick Tan
Head of Wider Asia, APAC
Aurora Energy Research

From Visibility to Viability: Developer Insights on Building a Net Zero Future

Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.

2:30 pm - 2:55 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy
Microsoft

Keynote: Clean Electricity Policy Action & Urgency

Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.

2:55 pm - 3:25 pm
YS Kim SK HYNIX
Yong Sung Kim
Head of Clean Energy
SK Hynix

Deep Dive: A Clean Semiconductor Partnership in Korea

Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.

3:25 pm - 3:40 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy, Asia Pacific
Microsoft

Calls to Action

From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.

3:40 pm - 4:10 pm

Break

4:10 pm - 4:50 pm
Rebecca Green
Moderator
Rebecca Green
ERM
Josh Seidenfeld
Josh Seidenfeld
Supply Chain Clean Energy Lead
Google
Chikako Matsumoto
Chikako Matsumoto
Director, Managing Executive Officer
Sumitomo Mitsui Trust Group
Rei Ushikubo
Rei Ushikubo
Director and Head of the Carbon-Free Solutions Division
Shizen Energy
Daisuke Tsujimoto
Daisuke Tsujimoto
Executive Officer, CSO
Renova Inc.

Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.

How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.

4:50 pm - 5:00 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
Vice President, Sustainability
SEMI

Day 1 Closing Remarks and Look Ahead

Reflect on the day's takeaways and action items.

5:00 pm - 6:00 pm

Member-to-Member Meetings / Break

6:00 pm - 6:30 pm

Networking Reception

Join us for Networking in the Orchard Foyer

6:30 pm - 8:30 pm
Alison Drury
Alison Drury
Global Technology Industry Lead
ERM

Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”

A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.

Tuesday, December 16, 2025

8:30 am - 9:15 am

Coffee & Networking

9:15 am - 10:00 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Day 2 Opening

Opening remarks will summarize Day 1 and preview Day 2.

9:30 am - 10:00 am
Lora Ho
Lora Ho
SVP Strategy & ESG
TSMC

TSMC Keynote

Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.

10:00 am - 10:15 am

Break

Priority Initiative: Gas Substitution

10:15 am - 10:25 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Opening Remarks

Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan

10:25 am - 10:45 am
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research

Equipment Perspective: Scaling Low-GWP Gas Substitution

Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing

10:45 am - 11:05 am
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

imec’s Gas Assessment Platform for Sustainability (GAPS) 

Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution

11:05 am - 11:35 am
Bruce Gall Google
Moderator
Bruce Gall
Google
Rachel Potter EMD
Rachel Potter
VP of Specialty Gas
EMD / Merck
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption

Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases

11:35 am - 11:45 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Calls to Action

From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.

11:45 am - 12:45 pm

Networking Lunch

Priority Initiative: Abatement

12:45 pm - 1:10 pm
Beth Elroy
Elizabeth Elroy
VP Sustainability
Micron

Opening Remarks & Keynote

Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.

1:10 pm - 1:50 pm
Josh Robbins
Moderator
Josh Robbins
Google
Phil Kester
Phil Kester, PhD
Senior Chemical Engineer
Guild Associates
HK KIM KIMM
Dr. Hak-Joon Kim
Korea Institute of Machinery & Materials

F-GHG Catalyst Development & Funding Vehicles

Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.

1:50 pm - 2:20 pm
Yong Keong Goh
Moderator
Yong Keong Goh
Senior Manager
Micron
Martin Tollner
Martin Tollner
President, Semiconductor Division
Edwards
Morihara Kanken
Atsushi Morihara
Chief Technical Officer
Kanken
Rene Reichardt
Rene Reichardt
CEO
DAS EE
Jong Pil Yoon
Jong Pil Yoon
President
EcoEnergen

F-GHG and Nitrous Oxide Abatement Technology Panel

Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.

2:20 pm - 2:30 pm
Kongyeong Goh
YongKeong Goh
Micron
Josh Robbins
Joshua Robbins
Google

Closing Remarks: Abatement

Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.

2:30 pm - 2:45 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Calls to Action Summary & Closing

Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.

- Sustainability

Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry.

9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States Masterclass #28 Business Executive Technical
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Improved materials are required for progress in fields including printed electronics, semiconductors, aerospace & defense, energy, and life sciences/medical care.  Developing such materials and chemicals involves considerations of performance, cost, manufacturability, safety, and stability.  Scaling production of new materials is a very different challenge than making 50 grams in a laboratory.  Transitioning/commercializing new materials is a separate effort where intellectual property, regulation, quality control, system documentation, supply chain development, and business relationships become key.  This talk will address these aspects of introducing a new material into our enterprise.

ABOUT THE SPEAKER:

Larry Takiff, PhD

Larry Takiff is co-Founder and President of Akita Innovations LLC, a small business in Massachusetts that develops and produces novel chemicals and materials for government and commercial customers.  He founded Akita in 2012 with Lawrence Hancock after working at Polaroid Corporation, Aprilis Inc., and Nomadics/ICx/FLIR Systems.  He is a chemist by training and a businessman by necessity.  At Akita, he has initiated and led projects in materials R&D and pilot production for a variety of government agencies/DoD components and for commercial partners.  Currently he is leading an effort to scale production of a decontamination fluid for the Defense Threat Reduction Agency (DTRA), and a FlexTech project to advance the TRL/MRL of a dielectric ink for printed electronics, as well as several Phase II SBIR development projects.

United States

lt
Larry Takiff, PhD
President
Akita Innovations LLC
Gity Samadi
Moderator
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.

10:00 am - 11:30 am Off Add to Calendar 2025-11-12 10:00:00 2025-11-12 11:30:00 FEMC#28 Development, Scaling, and Transition of Novel Chemicals & Materials Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success. United States SEMI.org [email protected] America/Los_Angeles public Watch on-demand
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Registration

Early Bird Pricing (Ends Sept 21)

Member: $1,295

Non-Member: $1,555

Regular Pricing

Member: $1,555

Non-Member: $1,865

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

+
United States Register Now ESGS Event Tile Executive Technical

Travel

ESGS Hyatt Regency Phoenix

Hyatt Regency PhoenixBook your room!  

122 North Second Street, Phoenix, Arizona, 85004

Service and Benefits 
  • $219/night
  • No resort fee
  • Standard high-speed wireless Internet access
  • Shuttle Transportation (Phoenix Premium Outlets, Aji Spa & Whirlwind Golf Club) 

 

 

ESGS Hyatt Regency Phoenix

Thank You to Our ESGS 2026 Sponsors

Platinum

Entegris

Gold

Pall Corporation 170x65
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Silver

ASTG_25 Years_170x65
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Bronze

Become a Sponsor

View the 2026 ESGS Sponsorship Brochure

Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

Contact Tim Janes at +1.720.939.4992 or [email protected]

The Electronic Specialty Gases & Systems Conference (ESGS) provides a forum of engagement and learning around the market, technology trends, and market drivers for electronic gases. The conference includes sections focusing on developments in the bulk, rare and specialty gas markets that are critical to the continued growth of the electronics industry.

The conference is designed for executives, buyers, product managers, and strategic planners from the electronic gases value chain including end-users, producers, and equipment suppliers. The conference features knowledgeable experts in the industry, who understand the key developments and challenges unique to this market.

Hyatt Regency Phoenix
122 N 2nd St
Phoenix, AZ 85004
United States

TUESDAY, NOVEMBER 10, 2026

7:00 am - 8:00 am

Breakfast

8:00 am - 8:10 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Opening Day Remarks

8:10 am - 8:30 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Opening Keynote

8:30 am - 9:15 am
Bruce Gall, Google
Bruce Gall
Strategic Partnerships
Google

Keynote Presentation

9:15 am - 9:45 am

U.S. Semiconductor Public Policy Update

9:45 am - 10:15 am
Rebecca Routson
Rebecca Routson
Principal Director
National Institute of Standards and Technology, NIST

Measuring the Future: CHIPS Metrology Program Updates

10:15 am - 11:00 am

Networking Break

11:00 am - 11:30 am
Photo Coming Soon
Gustavo Albuquerque
PTD Gas Systems Engineer
Intel

Gas Systems Challenges as Moore’s Law Advances

11:30 am - 12:00 pm
Mark O'Neill, Entegris
Mark O'Neill
Vice President, R&D and Engineering,
Entegris

12:00 pm - 1:15 pm

Lunch

Vapor Phase Materials and Electronics Specialty Gases

1:15 pm - 1:20 pm
Venkat Pallam
Venkat Pallam
Deputy CTO & Technology Director, Thin Film Processing
Air Liquide

Opening Session Remarks

1:20 pm - 1:50 pm
David Mandia_LAM
David Mandia, PhD
Staff Process Engineer
Lam Research

Large Grain Molybdenum Deposition

1:50 pm - 2:20 pm
Photo Coming Soon
Feng Li
Senior R&D Manager
Air Liquide Advanced Materials

Solid Precursor Delivery: Challenges and Solutions

2:20 pm - 2:50 pm
Rachel Potter EMD
Rachel Potter
VP, Specialty Gases
EMD Electronics

Tungsten Powder Supply Chain Issues & Impacts

2:50 pm - 3:35 pm

Networking Break

Contamination Control and Yield

3:35 pm - 3:40 pm
Sarah Vogt
Sarah Vogt
Director, E/R&D Gas Purification
Entegris

Opening Session Remarks

3:40 pm - 4:10 pm
Photo Coming Soon
Vindhya Kunduru
Supply Chain Engineer
Intel

IRDS Update

Latif Ahmed, Intel
Latif Ahmed
Senior Microcontamination Engineer
Intel
4:10 pm - 4:40 pm
Rocky Gipson, Entegris
Rocky Gibson, PhD
Senior Research & Development Manager
Entegris

Defining and Solving Contamination Challenges of Hydrogen Halides

4:40 pm - 5:10 pm
Photo Coming Soon
Steve Bovair
Sales Manager
deutraMed

Deuterium Supply Chain & Purity Considerations

5:10 pm - 5:20 pm
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

WEDNESDAY, NOVEMBER 11, 2026

7:00 am - 8:00 am

Breakfast

New Technology Advancements

8:30 am - 8:40 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Opening Day Remarks

8:40 am - 8:45 am
Ashwini Sinha
Linde

Opening Session Remarks

8:45 am - 9:15 am
Heejeong Kim, Samsung
Heejeong Kim
Staff Engineer
Samsung Electronics

Isotropic Dry-Cleaning Technology for Next-Generation Semiconductor Devices

9:15 am - 9:45 am
Stefano Marani, ASP Isotopes
Stefano Marani
President
ASP

Advanced Isotopes in SEMI

9:45 am - 10:15 am
Elizaveta Kossoy
Elizaveta Kossoy
Principal Scientist
EMD Electronics

Tailoring New Etch Gases to Challenging Applications

10:15 am - 11:00 am

Break

11:00 am - 11:30 am
Calvin Chen, Qnity
Calvin Chen
Senior Engineer
Qnity Electronics

Innovative Low-Permeation Sealing Solutions for Specialty Gas Systems

11:30 am - 12:00 pm
Jake Armstrong, Micron
Jake Armstrong
Principal Chemical Engineer
Micron

AI Applications in Automated Gas Handling/Cylinder Changeout

Jonathan Graham
Johnathen Graham
Senior Sales Engineer
Wonik Holdings USA
12:00 pm - 12:30 pm
Kris Chupka, Nippon Sanso Matheson
Kris Chupka
Director of R&D, Gas Analysis
Nippon Sanso Matheson

Point of Use NANOCHEM Purifiers for Ultra-High Purity Inert Purge Gas Delivery in EUV Lithography Tools

Facilities and Infrastructure

12:00 pm - 1:30 pm

Lunch

1:30 pm - 1:35 pm
Kurtis Fairley
Kurtis Fairley
Director, Technical Programs North America
Edwards Vacuum

Opening Session Remarks

1:35 pm - 2:05 pm
Kassey Rydberg, NY CREATES
Kassey Rydberg
Director of Environmental, Health, and Safety
NY Creates

Advancing Sustainable Semiconductor Innovation: NY Creates' High NA EUV Lithography Center

2:05 pm - 2:35 pm
Ilya Zabelinsky, ISRL
Ilya Zabelinsky
CTO
ISRL

Industry Collaboration, Roadmaps, and Pre-Competitive Action in Sub Fab

2:35 pm - 3:05 pm
Kim Fjeldsted
Sr. Applications Specialist
Ceres

Integrated Molecule Delivery Solutions for Semiconductor Manufacturing

3:05 pm - 3:50 pm

Break

Sustainability

3:50 pm - 3:55 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager, SCC
SEMI

Opening Session Remarks

4:25 pm - 4:55 pm
Chris Jones
Chris Jones
Environment and Sustainability Manager
Edwards Vacuum

Abatement Update / Catalytic

4:55 pm - 5:25 pm
Blake Ericson, Onterris
Blake Ericson
Business Manager
Onterris

Bridging the Measurement Gap: Enhancing Sustainability Compliance via Emissions Monitoring

5:25 pm - 5:30 pm
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

6:00 pm - 8:00 pm

Networking & Poster Session Reception

THURSDAY, NOVEMBER 12, 2026

7:00 am - 8:00 am

Breakfast

Gas Metrology

8:00 am - 8:10 am
Nithin Yathapu
Senior Director, Yield Strategy
Intel

Opening Session Remarks

8:10 am - 8:40 am
Berc Kalanyan
Research Chemical Engineer
NIST

Stability of MoCl5 in Heated Canisters and During Delivery

8:40 am - 9:10 am
Florian Adler
Florian Adler
Lead Scientist & Technical Product Manager
Process Insights

Fast Impurity Measurements in Electronic-Grade Rare Gases

9:10 am - 9:40 am
Connor Martens
Connor Martens
Global Marketing Development
Thermo Fisher Scientific

Real-Time PPT Impurity Detection in Ultra-High Purity Gases for Semiconductor Fabs

9:40 am - 9:50 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

Market Review and Updates

10:20 am - 10:30 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting

Opening Session Remarks

10:30 am - 11:00 am
Duncan Meldrum, Headshot
Duncan Meldrum
Chief Economist and Founder
Hilltop Economics

Does the Global Economy Matter for Semiconductors?

11:00 am - 11:30 am
 Inna Skvortsova
Inna Skvortsova
Research Manager, Market Intelligence
SEMI

SEMI Fab Capacity and Equipment Update

11:30 am - 12:00 pm
Phil Kornbluth
Phil Kornbluth
Founder & President
Kornbluth Helium Consulting

Helium Market Overview, Outlook & Trends

12:00 pm - 12:30 pm
Andy Tuan, Linx Consulting
Andy Tuan
Managing Director, Asia
Linx Consulting

Specialty Gas Market Update

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Driving Innovation Across the Electronic Gases Ecosystem

ESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event.

Off Add to Calendar 2026-11-10 00:00:00 2026-11-12 00:00:00 ESGS 2026—Electronic Specialty Gases & Systems Conference Driving Innovation Across the Electronic Gases EcosystemESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event. Hyatt Regency Phoenix 122 N 2nd St Phoenix, AZ 85004 United States SEMI.org [email protected] America/Phoenix public America/Phoenix 1

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Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States EMG Webinar 2025_1 Business Executive Technical

Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​

In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.

In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.

The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.

Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.

Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!

 

United States

Dario Alliata
Dario Alliata, PhD
Senior Director of Applications
The Electronics business of Merck KGaA, Darmstadt, Germany

The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips

The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.

Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).

EB
Eric Beyne, PhD
VP R&D / Program Director 3D System Integration Program / Senior Fellow
imec

Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges

Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.

Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.

Michael Weigand
Michael Weigand
Senior Application Manager
Brewer Science

Moderator

Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.

EMG

Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany 

10:00 am - 11:00 am Off Add to Calendar 2025-09-17 10:00:00 2025-09-17 11:00:00 Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​ Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles WATCH NOW
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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Webinar-Critical Minerals-v1_360x317_Event_Calendar_CM Business Executive Technical
Highlighted content

As world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains.  Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals. 

Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement. 

The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).

United States

8:00 am - 8:05 am
Kim Harrison
Dr. Kimberly Harrison, Ph.D
Senior MEMS Engineer
AMFitzgerald & Associates

Welcome and Introductions of RSC working group

Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.

Conflict Minerals Supply Chain Overview

8:05 am - 8:35 am
Kimberly Gianopoulos
Kimberly Gianopoulos
Managing Director for the International Affairs and Trade
U.S. Government Accountability Office (GAO)

Report Review

Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.

Jen Peyser
Jennifer Peyser
Executive Director
Responsible Minerals Initiative

RMI Activity Overview

“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”

8:35 am - 8:55 am

Q&A

8:55 am - 9:00 am

Summary and Closing Remarks

SCM 8:00 am - 9:00 am Off Add to Calendar 2025-07-09 08:00:00 2025-07-09 09:00:00 Critical Minerals, Due Diligence and the Semiconductor Supply Chain United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register for On-demand
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