New Territories
Hong Kong
China
Suggested Hotels:
Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400
Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966
Milpitas, CA
United States
Morning, Day 1: March 18th, 2026
Smart Sensors and Edge Intelligence for Advanced Process Control
Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.
Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system
Smart Sensors and Edge Intelligence for Advanced Process Control
Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.
Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system
Registration & Breakfast
Day 1 - Welcome All
Welcome & SEMI Manufacturing Coalitions Overview
Keynote: Vision – Edge Inference – Process Control, APC, FDC
Managing Edge AI for Smart Sensor Process Control
Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing
Coffee Break
A Unified Industrial Platform for Production-Ready AI
Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment
Intelligent Robots & Digital Twins for Advanced Manufacturing
Sensor as the Eyes and Ears of AI
Networking Lunch
Afternoon, Day 1: March 18th, 2026
Yield Enhancement through Edge-Driven Defect Detection and Classification
Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.
Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards
SEMI Fab Owners Alliance (FOA)
Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier
Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals
Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test
Coffee Break
Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures
Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics
Overcoming the challenges of AI defect detection and classification of semiconductor macro defects
From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights
Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing
Reception
Morning, Day 2: March 19th, 2026
Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination
Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.
Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems
Registration & Breakfast
Day 2 - Welcome All
Day 1 Overview & MSIG Overview
Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling
Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance
Perception-Enabled Assurance of Semiconductor Manufacturing Systems
Coffee Break
Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance
Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs
Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs
The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence
Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing
Networking Lunch
Afternoon, Day 2: March 19th, 2026
Predictive Maintenance at the Edge: From Vibration to Vision
Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.
Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization
Keynote: Predictive Maintenance at the Edge - AI Enabling PdM
Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations
The Edge Revolution: Predictive Maintenance Reborn with Edge AI
The Challenge Of AI At The Edge – Making Use Of Advanced Sensors
Coffee Break
Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing
Edge AI: The Future of Industrial Machine Health Monitoring
How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%
Wrap-Up
Unlocking Smarter, More Autonomous Fabs with Edge AI
As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.
This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:
- Predictive maintenance to prevent downtime
- Adaptive process automation for maximum efficiency
- Real-time decision-making at the source of data generation
Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.
Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On DemandSEMI Members: $75
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $149
Students: Free
Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.
A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets.
This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins.
ABOUT THE SPEAKERS
Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.
Peter Doerschuk, PhD
Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.
United States
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.
10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-DemandRegistration
Conference Pricing
SEMI Members: $1,500.00 (Use your corporate email address during log-in to be recognized as a SEMI Member.)
Non-Members: $1,800.00
Speakers and Students: $550.00
Cancellations received on or before April 26, 2026 will be refunded, less a $30 cancellation fee.
Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]
Hotel
Limited rooms are available at the Wild Horse Pass Resort. Reserve your stay within our room block using the link below.
Deadline: Friday, April 17
Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.
Contact Tim Janes at [email protected]
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Event
The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing. Formerly presented by Linx Consulting, SPCC continues its legacy of delivering high-quality technical content through invited presentations, peer-reviewed sessions, and poster presentations covering all aspects of cleaning science, process integration, materials, equipment, and metrology.
SPCC will feature invited business-focused presentations that examine macroeconomic, market, and structural trends shaping the global semiconductor industry that were formerly included in the Business Interface Conference (BIC). These sessions will provide attendees with valuable context on industry dynamics, supply chain, and strategic outlooks that complement the technical discussions at SPCC.
Now a unified conference, SPCC unites both business and technical aspects of industry into a comprehensive program that bridges technology development and business strategy, offering attendees enhanced opportunities for cross-disciplinary learning, collaboration, and networking with industry leaders, researchers, and decision-makers across the semiconductor ecosystem.
Join our premier technical forum with topics including—
- Cleaning Science
- Equipment
- Industry Dynamics
- Materials
- Metrology
- Process Integration
- Strategic Outlook
- Supply Chain
Wild Horse Pass
5040 Wild Horse Pass Blvd
Chandler, AZ , AZ 85226
United States
MONDAY, MAY 18, 2026
Session 1
Breakfast
Opening Remarks
KEYNOTE—Semiconductor Industry Update
Dummy Gate Poly Wet Etch Studies in GAA Nanosheet Flow
Enabling Novel Innovation in Containers Profile Sculpting for Cell Structure Improvement
Networking Break
Particle Precursors and On-Wafer Defectivity: IRDS Collaborative Research Progress and Future Directions
Si/SiGe Selective Wet Etchant for BSPDN Application: Maximization of Selectivity in Single Wafer Spin Wet Processing
Optimization of Particle and Atmosphere Control in the SPM Process via Nozzle Cover
New Surface Preparation System; Batch-Single Hybrid Equipment
Lunch
Session 2
Market Outlook
Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al Stacks
Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor Devices
Networking Break
Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface Control
An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration Scheme
Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures
Approaches to Further Enhance Cut Accuracy
Advancements in Wafer Backside cleaning for DRAM Manufacturing
TUESDAY, MAY 19, 2026
Session 3
Breakfast
Day 2 Opening Remarks
Day 2 Keynote—Navigating the AI-driven Cycle: Fab Investments and Materials Dynamics in a Fragmented World
Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging Structures
Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon Surface
Networking Break
Ab Initio Study of Confined HF Etching Mechanism on SiO2
WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process Optimization
Challenges and Solution of Post Ceria CMP Clean
Lunch
Session 4
Advanced Topography Correction Planarization Technology for Yield Enhancement
Controlling the Molybdenum Dissolution and Oxidation During Post-CMP Cleaning
Controlled Cracking-Induced Delamination for Polymer-Based Cleaning
Design of the Buffing Cleaning Solution for Chemical Mechanical Cleaning on Advanced Technology Node
Networking Break
Impact of Supply Chain Conditions on IPA Product Quality
Trace Water Measurement in Organic Solvent Systems for Semiconductor Manufacturing
Thermal Vacuum Analysis and Identification of Contaminant Outgassing from Polymer Seals
Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization Techniques
IR-PiFM: Molecular Detection and Identification of Nanoscale Surface Contamination
WEDNESDAY, MAY 20, 2026
Session 5
Breakfast
Day 3 Opening Remarks
Wet Etching and Cleaning Trends: Scaling x 3D Integration
Characterization of Particle Filtration Solutions in a Weak Acid
Networking Break
Wet-Etch Solutions Development for Advanced Node Devices
Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP Cleaning
Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL Integration
Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning Performance
Lunch
Session 6
Day 3 Keynote—Measuring the Future: CHIPS Metrology Program Updates
High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers
TTV Optimization in Wet Chemical Thinning Using Integrated Metrology
Networking Break
Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional Water
Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOG
Closing Remarks
Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.
Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge.
Off Add to Calendar 2026-05-18 00:00:00 2026-05-20 00:00:00 SPCC 2026—Surface Preparation & Cleaning Conference Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge. Wild Horse Pass 5040 Wild Horse Pass Blvd Chandler, AZ , AZ 85226 United States SEMI.org [email protected] America/Phoenix public America/PhoenixShare on LinkedIn
Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.
The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities
During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.
United States
SCMJoin us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.
Choose your session:
- US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]
- Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ]
Speakers
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| Henry Marcil Partner McKinsey & Company Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech) Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor |
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| Kushal Jolapara Engagement Manager McKinsey & Company Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors |
![]() | Dan Peacock Engagement Manager McKinsey & Company Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects Leads Operations projects at Foundries, IDMs, and equipment clients |
Event Contact:
Krish Dharma
Agenda
• Lead times throughout the semiconductor value chain
• Landscape and trends in purchasing agreements and LTAs
• Demand forecasts, backlogs, and end markets
• Market outlook, opportunities, and threats
• New for 2025: Organizational capabilities in supply chain management
Registration for the Global Executive Summit is closed. Please contact Heidi Hoffman at [email protected] with any questions.
SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight. View the hotels and rates HERE.
Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to:
- Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
- Define clear deliverables and next-phase commitments that unlock scale and momentum
- Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results
This Summit is not about what we could do — it’s about what we will do, and who will lead.
Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees. Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.
Okura Hotel
Tokyo
Japan
Monday, December 15, 2025
Coffee & Registration
GES Opening
Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration
Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?
Spotlight: AMD on the role of Silicon Design for Energy Efficiency
Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.
End-User Panel: The Decarbonization Imperative
Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.
Break
Overview of Priority Initiatives
Priority Initiative: Fab Upstream Materials
Opening Remarks
From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.
Keynote: Apple's Supply Chain Engagement
Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.
From Ambition to Action: A Fab's Role in Upstream Decarbonization
Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.
Solutions Enablement & Calls-to-Action
Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.
Networking & Lunch
Priority Initiative: Clean Electricity
Opening Remarks
Setting the stage for collective action on clean electricity in Asia.
From Visibility to Viability: Developer Insights on Building a Net Zero Future
Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.
Keynote: Clean Electricity Policy Action & Urgency
Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.
Deep Dive: A Clean Semiconductor Partnership in Korea
Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.
Calls to Action
From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.
Break
Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.
How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.
Day 1 Closing Remarks and Look Ahead
Reflect on the day's takeaways and action items.
Member-to-Member Meetings / Break
Networking Reception
Join us for Networking in the Orchard Foyer
Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”
A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.
Tuesday, December 16, 2025
Coffee & Networking
Day 2 Opening
Opening remarks will summarize Day 1 and preview Day 2.
TSMC Keynote
Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.
Break
Priority Initiative: Gas Substitution
Opening Remarks
Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan
Equipment Perspective: Scaling Low-GWP Gas Substitution
Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing
imec’s Gas Assessment Platform for Sustainability (GAPS)
Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution
It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption
Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases
Calls to Action
From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.
Networking Lunch
Priority Initiative: Abatement
Opening Remarks & Keynote
Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.
F-GHG Catalyst Development & Funding Vehicles
Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.
F-GHG and Nitrous Oxide Abatement Technology Panel
Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.
Closing Remarks: Abatement
Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.
Calls to Action Summary & Closing
Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.
Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far. Together, we will forge an actionable plan for global industry collaboration in three focus areas: direct emissions, energy-related emissions, and reporting. This invite-only event will be conducive to accelerating the decarbonization across the industry.
9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far. Together, we will forge an actionable plan for global industry collaboration in three focus areas: direct emissions, energy-related emissions, and reporting. This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/TokyoSEMI Members: $75
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $149
Students: Free
Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.
Improved materials are required for progress in fields including printed electronics, semiconductors, aerospace & defense, energy, and life sciences/medical care. Developing such materials and chemicals involves considerations of performance, cost, manufacturability, safety, and stability. Scaling production of new materials is a very different challenge than making 50 grams in a laboratory. Transitioning/commercializing new materials is a separate effort where intellectual property, regulation, quality control, system documentation, supply chain development, and business relationships become key. This talk will address these aspects of introducing a new material into our enterprise.
ABOUT THE SPEAKER:
Larry Takiff, PhD
Larry Takiff is co-Founder and President of Akita Innovations LLC, a small business in Massachusetts that develops and produces novel chemicals and materials for government and commercial customers. He founded Akita in 2012 with Lawrence Hancock after working at Polaroid Corporation, Aprilis Inc., and Nomadics/ICx/FLIR Systems. He is a chemist by training and a businessman by necessity. At Akita, he has initiated and led projects in materials R&D and pilot production for a variety of government agencies/DoD components and for commercial partners. Currently he is leading an effort to scale production of a decontamination fluid for the Defense Threat Reduction Agency (DTRA), and a FlexTech project to advance the TRL/MRL of a dielectric ink for printed electronics, as well as several Phase II SBIR development projects.
United States
Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.
10:00 am - 11:30 am Off Add to Calendar 2025-11-12 10:00:00 2025-11-12 11:30:00 FEMC#28 Development, Scaling, and Transition of Novel Chemicals & Materials Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success. United States SEMI.org [email protected] America/Los_Angeles public Watch on-demandRegistration
Early Bird Pricing (Ends Sept 21)
Member: $1,295
Non-Member: $1,555
Regular Pricing
Member: $1,555
Non-Member: $1,865
Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]
Travel
Hyatt Regency Phoenix—Book your room!
122 North Second Street, Phoenix, Arizona, 85004
Service and Benefits
- $219/night
- No resort fee
- Standard high-speed wireless Internet access
- Shuttle Transportation (Phoenix Premium Outlets, Aji Spa & Whirlwind Golf Club)
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The Electronic Specialty Gases & Systems Conference (ESGS) provides a forum of engagement and learning around the market, technology trends, and market drivers for electronic gases. The conference includes sections focusing on developments in the bulk, rare and specialty gas markets that are critical to the continued growth of the electronics industry.
The conference is designed for executives, buyers, product managers, and strategic planners from the electronic gases value chain including end-users, producers, and equipment suppliers. The conference features knowledgeable experts in the industry, who understand the key developments and challenges unique to this market.
Hyatt Regency Phoenix
122 N 2nd St
Phoenix, AZ 85004
United States
TUESDAY, NOVEMBER 10, 2026
Breakfast
Opening Day Remarks
Opening Keynote
Keynote Presentation
U.S. Semiconductor Public Policy Update
Measuring the Future: CHIPS Metrology Program Updates
Networking Break
Gas Systems Challenges as Moore’s Law Advances
Lunch
Vapor Phase Materials and Electronics Specialty Gases
Opening Session Remarks
Large Grain Molybdenum Deposition
Solid Precursor Delivery: Challenges and Solutions
Tungsten Powder Supply Chain Issues & Impacts
Networking Break
Contamination Control and Yield
Opening Session Remarks
IRDS Update
Defining and Solving Contamination Challenges of Hydrogen Halides
Deuterium Supply Chain & Purity Considerations
Closing Remarks
WEDNESDAY, NOVEMBER 11, 2026
Breakfast
New Technology Advancements
Opening Day Remarks
Opening Session Remarks
Isotropic Dry-Cleaning Technology for Next-Generation Semiconductor Devices
Tailoring New Etch Gases to Challenging Applications
Break
Innovative Low-Permeation Sealing Solutions for Specialty Gas Systems
AI Applications in Automated Gas Handling/Cylinder Changeout
Point of Use NANOCHEM Purifiers for Ultra-High Purity Inert Purge Gas Delivery in EUV Lithography Tools
Facilities and Infrastructure
Lunch
Opening Session Remarks
Advancing Sustainable Semiconductor Innovation: NY Creates' High NA EUV Lithography Center
Industry Collaboration, Roadmaps, and Pre-Competitive Action in Sub Fab
Integrated Molecule Delivery Solutions for Semiconductor Manufacturing
Break
Sustainability
Opening Session Remarks
Abatement Update / Catalytic
Bridging the Measurement Gap: Enhancing Sustainability Compliance via Emissions Monitoring
Closing Remarks
Networking & Poster Session Reception
THURSDAY, NOVEMBER 12, 2026
Breakfast
Gas Metrology
Opening Session Remarks
Stability of MoCl5 in Heated Canisters and During Delivery
Fast Impurity Measurements in Electronic-Grade Rare Gases
Real-Time PPT Impurity Detection in Ultra-High Purity Gases for Semiconductor Fabs
Closing Remarks
Market Review and Updates
Opening Session Remarks
Does the Global Economy Matter for Semiconductors?
SEMI Fab Capacity and Equipment Update
Helium Market Overview, Outlook & Trends
Specialty Gas Market Update
Driving Innovation Across the Electronic Gases Ecosystem
ESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event.
Off Add to Calendar 2026-11-10 00:00:00 2026-11-12 00:00:00 ESGS 2026—Electronic Specialty Gases & Systems Conference Driving Innovation Across the Electronic Gases EcosystemESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event. Hyatt Regency Phoenix 122 N 2nd St Phoenix, AZ 85004 United States SEMI.org [email protected] America/Phoenix public America/Phoenix 1Share on LinkedIn
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WATCH ON-DEMAND
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.
In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.
The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.
Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.
Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!
United States
The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips
The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.
Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).
Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges
Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.
Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.
Moderator
Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.
Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany
10:00 am - 11:00 am Off Add to Calendar 2025-09-17 10:00:00 2025-09-17 11:00:00 Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles WATCH NOWAs world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains. Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals.
Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement.
The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).
United States
Welcome and Introductions of RSC working group
Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.
Conflict Minerals Supply Chain Overview
Report Review
Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.
RMI Activity Overview
“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”


