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Add to Calendar2026-02-11 00:00:002026-02-13 00:00:00SEMICON Korea 2026TRANSFORM TOMORROWThe future of the semiconductor industry starts here.Join us at SEMICON Korea 2026 to shape tomorrow together. HoursFebruary 11, 2026 | 10:00-17:00 (Last entry 16:30)February 12, 2026 | 10:00-17:00 (Last entry 16:30)February 13, 2026 | 10:00-16:00 (Last entry 15:30)VenueCOEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)Westin Seoul ParnasGrand InterContinental Seoul ParnasScale550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)Seoul South KoreaSEMI.org[email protected]America/Los_Angelespublic
Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports. The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge.
The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.
9:00 am - 10:00 am
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Add to Calendar2026-05-21 09:00:002026-05-21 10:00:00Water Management Strategies WebinarJoin the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports. The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Here
Smart Sensors and Edge Intelligence for Advanced Process Control
Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.
Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system
8:00 am
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8:45 am
Registration & Breakfast
8:45 am
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8:55 am
Anshu Bahadur
SEMI
Day 1 - Welcome All
Welcome & SEMI Manufacturing Coalitions Overview
8:55 am
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9:30 am
Russell Dover
General Manager, Service Product Line
LAM
Keynote: Vision – Edge Inference – Process Control, APC, FDC
9:30 am
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9:55 am
James Bramante
Senior Data Scientist
INFICON
Managing Edge AI for Smart Sensor Process Control
9:55 am
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10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler
Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing
10:20 am
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10:35 am
Coffee Break
10:35 am
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11:00 am
Chris Dickens
Application Eng
Beckhoff Automation
A Unified Industrial Platform for Production-Ready AI
11:00 am
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11:25 am
Gokul Sathya
Research Scientist
Siemens
Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment
11:25 am
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11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds
Intelligent Robots & Digital Twins for Advanced Manufacturing
11:50 am
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12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector
Sensor as the Eyes and Ears of AI
12:05 pm
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1:00 pm
Networking Lunch
Afternoon, Day 1: March 18th, 2026
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Yield Enhancement through Edge-Driven Defect Detection and Classification
Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.
Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards
1:00 pm
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1:05 pm
Karim Somani
SEMI
SEMI Fab Owners Alliance (FOA)
1:05 pm
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1:35 pm
Surya Kalidindi
Co-Founder
Multiscale
Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier
1:35 pm
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2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL
Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals
2:00 pm
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2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense
Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test
2:25 pm
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2:40 pm
Coffee Break
2:40 pm
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3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA
Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures
3:05 pm
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3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation
Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics
3:30 pm
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3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic
Overcoming the challenges of AI defect detection and classification of semiconductor macro defects
3:55 pm
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4:20 pm
Chengli He
Industry Manager
MathWorks
From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights
4:20 pm
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4:35 pm
Stephen March
Semiconductor Leader
Schneider
Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing
4:35 pm
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6:35 pm
Reception
Morning, Day 2: March 19th, 2026
Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination
Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.
Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems
8:00 am
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8:45 am
Registration & Breakfast
8:45 am
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8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI
Day 2 - Welcome All
Day 1 Overview & MSIG Overview
8:55 am
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9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA
Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling
9:30 am
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9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson
Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance
9:55 am
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10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D
Perception-Enabled Assurance of Semiconductor Manufacturing Systems
10:20 am
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10:35 am
Coffee Break
10:35 am
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11:00 am
Murali Krishna
Vice President of Products
Minds.ai
Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance
11:00 am
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11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine
Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs
11:25 am
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11:50 am
Greg Berger
Solution Consultant
Rockwell Automation
Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs
11:50 am
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12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon
The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence
12:15 pm
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12:30 pm
Anshu Bahadur
SEMI
Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing
12:30 pm
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1:30 pm
Networking Lunch
Afternoon, Day 2: March 19th, 2026
Predictive Maintenance at the Edge: From Vibration to Vision
Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.
Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization
1:30 pm
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2:05 pm
James Bramante
Senior Data Scientist
INFICON
Keynote: Predictive Maintenance at the Edge - AI Enabling PdM
2:05 pm
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2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM
Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations
2:30 pm
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2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch
The Edge Revolution: Predictive Maintenance Reborn with Edge AI
2:55 pm
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3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards
The Challenge Of AI At The Edge – Making Use Of Advanced Sensors
3:20 pm
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3:35 pm
Coffee Break
3:35 pm
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4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation
Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing
4:00 pm
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4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI
Edge AI: The Future of Industrial Machine Health Monitoring
4:25 pm
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4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens
How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%
Unlocking Smarter, More Autonomous Fabs with Edge AI
As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.
This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:
Predictive maintenance to prevent downtime
Adaptive process automation for maximum efficiency
Real-time decision-making at the source of data generation
Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.
Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing
In-Person Workshop | March 18-19, 2026 | Milpitas, CA
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Add to Calendar2026-03-18 00:00:002026-03-19 00:00:00Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor ManufacturingUnlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.Milpitas, CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
On Demand
The chips powering today’s cell phones, cars, computers, and more can contain billions of transistors. Designing these chips requires a team of engineers with expertise in various aspects of the design flow, along with Electronic Design Automation (EDA) tools that are needed to implement and verify these complex designs.
This Master Class is intended for non-technical staff that wish to understand the basics of semiconductor chip design. It provides an appreciation of the complex design flows and an understanding of some of the terminology used by chip design teams.
For students, the course will introduce some of the rewarding challenges and career opportunities available in the design and EDA industries.
In this class we will cover basic information about digital chips, then introduce some of the key steps and tools used during the design flow. We will also discuss some of the tradeoffs of different implementation methodologies and some of the challenges presented by various critical applications such as devices used in medical and automotive systems.
Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed.
ESD Alliance Master Class: Introduction to Chip Design and EDA
Overview of the design of today's complex chips with Electronic Design Automation tools.
(On-line Event)
10:00 am - 11:30 am
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Add to Calendar2025-06-25 10:00:002025-06-25 11:30:00ESD Alliance Master Class: Introduction to Design and EDAComplex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed. SEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now to Watch the Recorded Event
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
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Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
