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Technical

South Korea Learn More sk-2026 Business Executive Expositions Technical Training

Seoul
South Korea

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development

TRANSFORM TOMORROW

The future of the semiconductor industry starts here.
Join us at SEMICON Korea 2026 to shape tomorrow together.

 

Hours

  • February 11, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 12, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 13, 2026 | 10:00-16:00 (Last entry 15:30)

Venue

  • COEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)
  • Westin Seoul Parnas
  • Grand InterContinental Seoul Parnas

Scale

  • 550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)
Off Add to Calendar 2026-02-11 00:00:00 2026-02-13 00:00:00 SEMICON Korea 2026 TRANSFORM TOMORROWThe future of the semiconductor industry starts here.Join us at SEMICON Korea 2026 to shape tomorrow together. HoursFebruary 11, 2026 | 10:00-17:00 (Last entry 16:30)February 12, 2026 | 10:00-17:00 (Last entry 16:30)February 13, 2026 | 10:00-16:00 (Last entry 15:30)VenueCOEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)Westin Seoul ParnasGrand InterContinental Seoul ParnasScale550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths) Seoul South Korea SEMI.org [email protected] America/Los_Angeles public
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REGISTRATION

Registration
  • Early-bird Registration Close: 3 pm, Friday, May 12(KST)

Registration Fee

  • Early Bird (~ May 12)
    • SEMI Member: KRW 280,000
    • Non Member: KRW 330,000
  • On site
    • SEMI Member/ Student : KRW 330,000
    • Non Member: KRW 380,000

※ Group registration fee applies if more than 5 people are registered from one company. Please contact us by email ([email protected] ) for group registration.

Registration
South Korea Register Now SMC-Korea-2023-Banner_2023.03.14_square.jpg Business Technical

OVERVIEW

  • Date: May 17(Wed), 2023
  • Time: 09:00 - 17:30
  • Venue: Convention Hall 2, Suwon Convention Center

 

SPONSORS

SMC-Korea-2023-Sponsor_DW.jpg SMC-Korea-2023-Sponsor_DP.jpg SMC-Korea-2023-Sponsor_WM.jpg SMC-Korea-2023-Sponsor_MC.jpg
SMC-Korea-2023-Sponsor_LC.jpgSMC-Korea-2023-Sponsor_KT.jpgSMC-Korea-2023-Sponsor_ET.jpgSMC-Korea-2023-Sponsor_JSR.jpg
SMC-Korea-2023-Sponsor_AC.jpg SMC-Korea-2023-Sponsor_DS_0.jpg SMC-Korea-2023-Sponsor_SM_0.jpg SMC-Korea-2023-Sponsor_CO_1.jpg

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Convention Hall 2, Suwon Convention Center
Suwon-si
Gyeonggi-do
South Korea

9:00 am - 9:05 am

Welcome

Keynote

9:05 am - 9:35 am
1_Namsung Kim_Applied Materials_Abstract_Biography_SMC Korea 2023.jpg
Namsung Kim
Senior Director
Applied Materials

GAA(Gate-All-Around) technology to enable continuous CMOS transistor scaling for energy efficient computing solution

Namsung Kim is a Senior Director in the Integrated Module Solutions (IMS) Group at Applied Materials. He is currently responsible for managing customer engagement programs, driving business growth, and leading cross-functional teams (various Business Units) to deliver the integrated materials/modules-base product solutions across leading-edge CMOS Logic and Memory technologies. Prior to this role, he has successfully led & accomplished the definition of CMOS Logic technology roadmap, its inflections of future technology nodes and delivered multiple product development paths by validating innovative pathway solutions.

He joined Applied Materials, Inc., USA in 2015, bringing over 20 years of semiconductor device/process integration experiences (various engineering/management positions) from both CMOS Logic (GlobalFoundries/IBM alliance in USA and SSMC in Singapore) and Memory (SK-Hynix, previously LG Semi., in Korea) industries. He earned a MS in electrical and computer engineering from the National University of Singapore. He has authored and co-authored more than 50 technical publications and holds over 40 patents in the field of advanced logic (FinFETs and GAA devices) and memory technologies.

※ Abstract

9:35 am - 10:05 am
Jeongdong Choe5.PNG
Jeongdong Choe
Senior Technical Fellow
TechInsights

Market & Technology Trends for Memory Devices including Materials

Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights. He has over 30 years of experience in the semiconductor industry, R&D, and reverse engineering on DRAM, NAND/NOR FLASH, SRAM/Logic, and Emerging Memory. He worked for SK Hynix and Samsung Electronics for over 20 years. He joined TechInsights and has been focusing on technology analysis of semiconductor processes, materials, devices, and architecture. He has written many articles on memory technology including roadmaps, technology trends, and detailed comparisons.

※ Abstract

10:05 am - 10:35 am
Profile.jpg
Inji Yeom
Associate Partner
Mckinsey & Company

Global Supply Chain

10:35 am - 10:50 am

Break

Session 1: Advanced Materials for Enabling Next-Generation Devices

10:50 am - 11:15 am
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Jean-Marc Girard
CTO and Sr. VP
Air Liquide

Precursors for Memory

Jean-Marc Girard Ph.D. is CTO and Sr. VP of Manufacturing Technologies at Air Liquide Advanced Materials (ALAM), and an Air Liquid Group Fellow. He has 25 years of experience of R&D and product development management in the field of semiconductor materials and process technology in Europe, Japan and the US, and is one of the founders and was the global director of ALOHA™ from 2005 to 2010 (Air Liquide’s original CVD/ALD materials product line).
Within ALAM, Jean-Marc globally manages the Research and Development for deposition & advanced dry etching materials, oversees strategic engagements and collaborations with leading customers and equipment companies, and supervises the Intellectual Property generation and portfolio management. Since 2021, Jean-Marc’s role has expanded to leading packaging and manufacturing technology developments efforts.

11:15 am - 11:40 am
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Andy Kim
Sr. Director
Lam Research

Materials Trends in Semiconductor Manufacturing

“Byunghee Kim” has been Sr. Technologist in Lam Research since 2017.

Prior to joining Lam Research, “Kim” was director position for Samsung Electronics. During his 23 years at Samsung Electronics, “Kim” spent time doing module development, including gate, contact and BEOL.

“Kim” received a bachelor’s degree in chemistry from Yonsei Univ., Seoul, Korea and a master’s degree in MSE from Seoul Nat’l Univ., Seoul, Korea.

※ Abstract

11:40 am - 12:05 pm
6_Jeongsik Kim_Dongjin Semichem_Abstract_Biography_SMC Korea 2023.jpg
Jeongsik Kim
Genaral Manager
Dongjin Semichem

CAR Type EUV Resist Performance Improvement

Jeongsik Kim, received a MS degree in Organic Synthetic Chemistry from Sogang University(Korean) in 2006 and then joined Dongjin Semichem. He had developed the patterning process materials such as bottom antireflective coating(BARC), spin on hardmask(SOH), photoresist materials in Semiconductor Materials Business Division since 2006. In 2013, he had joined the advanced lithography program of IMEC(Belgium) as Dongjin Semichem assignee and researched the ArF immersion patterning and defectivity for two years. Currently, he is in charge of developing EUV photoresist at Dongjin Semichem.

※ Abstract

12:05 pm - 1:30 pm

Lunch

Session 2: GWP

1:30 pm - 1:55 pm
7_Sung Ho Kim_Merck_Abstract_Biography_SMC Korea 2023.png
Sung-Ho Kim
Head of Global Marketing
Merck KGaA, Darmstadt, Germany

Material Innovation for low-GWP Gas Development

Sung Ho Kim is the Head of Specialty Gases Marketing, Clean & Etch platform, Merck KGaA, Darmstadt, Germany where he drives the execution of product marketing strategy to meet with industry’s dry etch and chamber clean gas technical and commercial needs, and leads product life cycle management and NPI (New product introduction) initiatives to help customers to advance its dry etch and chamber clean process performance. He is a proven business leader with more than 20 years of experience in the semiconductor materials industry, with a wide range of leadership experience in product marketing, product management, and technical/engineering expertise. He is based in Pangyo, Korea. Sung-Ho received a bachelor's degree in Chemical Engineering from Seoul National University.

※ Abstract

1:55 pm - 2:20 pm
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WonSeob Cho
Head of BASF Electronic Materials R&D Center in Suwon
BASF

Aiming CO2 neutrality – Sustainable Solutions for IC Applications

Won-Seob Cho, Ph.D. presently serves as the Head of the BASF Electronics Materials R&D Center in Suwon, Korea. In this esteemed position, he is responsible for leading research teams dedicated to the development of advanced wet chemical solutions, such as advanced cleaning and electroplating methods. He boasts over 20 years of research and development experience, particularly in the formulation and electrochemical screening of solutions.

Prior to joining BASF a decade ago, He served as a Principal Researcher at Samsung SDI and Samsung Fine Chemicals, where he specialized in developing planarization and electroplating solutions. Notably, his research interests have recently expanded to encompass the Advanced Package field.

Won-Seob Cho holds a distinguished Ph.D. in Chemistry from the University of Texas at Austin and has also served as a postdoctoral fellow in Supramolecular Chemistry at the University of California at Los Angeles, further solidifying his scientific expertise.

※ Abstract

2:20 pm - 2:45 pm
9_Sang Uk Nam_KIET_Abstract_Biography_SMC Korea 2023_nam sanguk.jpg
Sang Uk Nam
Associate Research Fellow
KIET

Carbon Neutral Strategy of Korean Government and Role of Material Companies

Dr. Nam, Sang Uk is conducting various studies on the ICT (semiconductor, display) industry based on economics at the KIET (Korea Institute of Industrial Research), a national research institute.

Since joining the KIET in 2018, he has participated in various studies on ICT industry policies such as Japanese export regulations, development strategy of material, parts and equipment, global value chain, and digital transformation.

In the field of carbon neutrality, he participated in major reports such as the semiconductor and display industry's carbon neutral promotion strategy and policy tasks, and the impact of RE100 on Korea's major export industries.

※ Abstract

Session 3: Market Trends

2:45 pm - 3:10 pm
S4-1_Mark Thirsk.jpg
Mark Thirsk
Managing Partner
Linx Consulting

Materials still matter. Trends in materials demand and supply.

Mark Thirsk is Managing Partner of Linx Consulting, a leading management and strategic consulting company for electronic materials.

Mark Thirsk has experience spanning many materials and processes in wafer fabrication, combined with economic and business forecasting, strategic planning, technical marketing and M&A experience. Mark has worked in materials and equipment development, marketing, applications support, and production, as well as having expertise in business incubation, strategic development, and M&A. Mark is well placed to bring clarity and insight to market analysis from both a technical and commercial perspective. Additionally, Mark has been active in SEMI since 1999, volunteering in industry advocacy, education, and recruiting.

Mark has worked in the UK, Germany, Belgium, and the USA. Mark holds an Honours B.Sc. in Metallurgy and Materials Science from Birmingham University and an MBA

※ Abstract

3:10 pm - 3:35 pm
S6_TechSearch_E. Jan Vardaman(CFP)_picture.jpg
E. Jan Vardaman
President & Founder
TechSearch International

Advanced Packaging Technology & Market Trends

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow. She is a member of MEPTEC, SMTA, and SEMI. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

3:35 pm - 3:50 pm

Break

Session 4: Collaboration

3:50 pm - 4:20 pm
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Sungsu Kim
Project Leader
SK hynix

Advanced Packaging Material for Semiconductor

4:20 pm - 4:50 pm
13_Sam-Jong Choi_Samsung Electronics_Abstract_Biography_SMC Korea 2023.png
Samjong Choi
Corporate VP / Group Leader
Samsung Electronics

Re-visioning Material Technology for Sustainable Resource Utilization and Supply Chain

Sam-Jong Choi, Ph.D. has been working as a material expert at Samsung Electronics Semiconductor for over 30 years. He joined the company in 1991 and has been responsible as a material engineer and expert for Memory Manufacturing Technology Center in Samsung Electronics by now. He obtained a Ph.D in Electronic, Computer, and Telecommunication Engineering from Hanyang University in 2020.
In 2019, he was promoted to Group Leader for Memory Material Technology Group, where he oversaw the development of new materials and quality management for Samsung Electronics. In 2020, Samjong Choi was appointed as an Corporate VP at Samsung Electronics, where he continues to play a key role in the field of semiconductor material.
As an experienced engineer and leader, he brings a wealth of knowledge and expertise to his current role, making Samsung Electronics stay at the forefront of technological innovation in the global semiconductor material industry.

※ Abstract

4:50 pm - 5:30 pm

Networking Reception

APHI EMG

Semiconductor Materials for Sustainable Future

In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts!

Off Add to Calendar 2023-05-17 00:00:00 2023-05-17 00:00:00 SMC Korea 2023 Semiconductor Materials for Sustainable Future In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together. SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts! Convention Hall 2, Suwon Convention Center Suwon-si Gyeonggi-do South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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Registration

Registration Fee: $985 Members | $1,185 Non-members

Students*: $100
*Current students (18 and above) are invited to register for a student pass. Please plan to have your student ID available when picking up your badge onsite. 

(Airfare and hotel accommodations are not included)

  • All Keynotes, tutorial, panel discussion, technical and poster sessions 
  • All conference materials (conference proceedings, attendee list, and approved PDF presentations) 
  • Breakfast, Lunch, and networking breaks
  • All Networking Events (Welcome Reception, Poster Session Reception, and Networking Happy Hour)
  • Complimentary entry to the Women In Semiconductors (WiS) Program ($50 value) 
  • Complimentary registration to the SEMI Standards Meetings (Registration Required)
  • Discount on SEMI U Workshop registration
  • Discount room rate at Hilton Albany 
  • Cancellations refund request must be submitted in writing to Taylor Zhao ([email protected]) on or before April 10, 2026 and will be subject to a $150 processing fee. After April 10, only substitution requests will be accepted. 
  • Substitution requests are welcome and will be accepted in writing from the original registrant by May 10, 2026. Email request to Taylor Zhao ([email protected]). 

If you have any questions regarding the conference or registration, please contact Taylor Zhao ([email protected]). 

+
United States SEMI ASMC Advanced Semiconductor Manufacturing Conference Business Technical

Hotel

Hilton Albany

ASMC attendees may book accommodations at the Hilton Albany using our conference rate: 

The reservation deadline is Closed. We encourage early booking, as rooms may sell out before the cutoff.

Other hotels near Hilton Albany: 

Hilton Albany

2026 Sponsors

Become an ASMC Sponsor

Align your company with the ASMC, one of the most highly respected semiconductor manufacturing conferences in the industry. The attendees are an excellent audience to expand your brand image to new and existing markets.

CONTACT

Shane Poblete
Director, Sales & Business Development - Expo and Events, SEMI
Tel: +1 202-847-5983
Email: [email protected]

Media Sponsors

SEMI is proud to partner with the following media to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.

www.3dincites.com

Read | Subscribe | Website 

www.meptec.org

Read | Subscribe | Website 

www.semiconductordigest.com

Read | Subscribe | Website

www.techbriefs.com

Read | Subscribe | Website

Advancing Semiconductor Manufacturing Excellence

ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results and select ASMC manuscripts are published in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing.

The ASMC Committee is composed of industry professionals representing the microelectronics supply chain. All papers presented at the conference are peer-reviewed by the ASMC Technical Committee.

 

WHO SHOULD ATTEND

  • Academia
  • Chief Technology Officers
  • Fab Managers
  • Equipment Manufacturers
  • IC Manufacturers
  • Materials Suppliers
  • Operations Managers
  • Process Engineers
  • Product Managers
  • Technical Experts

       
     

Mobile App Sponsor—

 

ASMC 2026 Full Agenda

 

 

Hilton Albany
40 Lodge St
Albany, NY 12207
United States

Technical Sessions

Advanced Equipment Processes and Materials

Advanced Metrology

Sponsor—Nova

Nova

Advanced Patterning

Advanced Process Control

Big Data Management and Machine Learning

Contamination Free Manufacturing

Defect Inspection and Reduction

Equipment Optimization

Factory Optimization

Smart Manufacturing

Inficon Logo 170x65

Wafer Level Packaging & Novel Devices

GlobalFoundriesNEW_170x65

Yield Enhancement / Yield Methodologies

Networking Events

Welcome Reception

Sponsor—Axcelis

Axcelis

Buffet Lunch

Sponsor—SilcoTek

SilcoTek 170x65_NEW

Poster Session Reception

Student Robotics Demo

TEL

Networking Happy Hour

- APHI

ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies. 

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Co-located Events & Meetings

 

SEMI University (SEMI U)

We are excited to partner with SEMI University on Monday, May 11 and Thursday, May 14, 2026.  Whether you're a seasoned professional looking to improve your skills or a newcomer eager to break into the industry, SEMI U specializes in semiconductor training, certifications, and the technical education to support your personal and professional growth. 

SEMI University (SEMI U) is the premier learning platform designed for individuals passionate about advancing their careers in the global semiconductor and electronics industry. With over 800 courses available in multiple languages and flexible formats, SEMI U empowers you with knowledge to enhance your expertise, staying ahead in our rapidly evolving field.  

 

Women in Semiconductors

We look forward to reuniting with Women in Semiconductors (WiS), to be held on Thursday, May 14, 2026 at the Albany Hilton, Albany, New York. 

WHO SHOULD ATTEND?

Company leaders, managers, team members, HR professionals, academia and students. Regardless of gender, we encourage attendance by everyone who is interested in fostering a more diverse, equitable and inclusive semiconductor industry, and by anyone who is responsible for developing internal or external programs to support women. 

 

SEMI Standards

Shape the Future of Our Industry! Attend and participate in SEMI Standards meetings during ASMC.
Discover more and register at no cost.

WHO SHOULD ATTEND?

Technical; process engineers, materials specialists, director of engineering, software programmers, EHS/sustainability officers

 

SCIS General Meeting

The Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community - General Meeting is on Thursday, May 14, 11:30am-1:00pm. 

WHO SHOULD ATTEND?

All SEMI SCIS members are welcome to attend.

To RSVP, or if you are a SEMI member interested in learning more about how to get involved with SCIS, please contact Christie Baker at [email protected] for more information.
 

SEMI Manufacturing Cybersecurity

The Semiconductor Manufacturing Cybersecurity Consortium (SMCC)  Technology Community - Hybrid General Meeting is on Wednesday, May 13, 4-5 PM. Contact [email protected] for questions and RSVP at http://tiny.cc/smcc26
 

Glass4Chips Summit

Join FuzeHub in partnership with SEMI and NY Creates on May 14–15, 2026 in Albany, NY for the Glass4Chips Summit 2026.

Hosted at NY Creates (May 14) and the Hilton Albany (May 15), this two-day summit will convene leaders from industry, government, academia, and national security to:

✔ Address adoption barriers
✔ Strengthen the domestic glass supply chain
✔ Define actionable next steps to secure U.S. leadership

WHO SHOULD ATTEND?

Semiconductor manufacturers and suppliers, startups and design houses, defense stakeholders, researchers, policymakers, and ecosystem strategists.

Register Now
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Japan standards Technical
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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Flexible Hybrid Electronics Japan TC Chapter Meeting 

Date: Friday, July 10, 2026

Time: 3:00 PM - 5:00 PM (JST)

via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)

Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed.

 

AGENDA

 

Standards Contact Information:

Nahoko Koga

Coordinator, Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

 

Questions? Contact your local staff coordinator: Click here

3:00 pm - 5:00 pm Off Add to Calendar 2026-07-10 15:00:00 2026-07-10 17:00:00 Flexible Hybrid Electronics Japan TC Chapter Meeting Flexible Hybrid Electronics Japan TC Chapter Meeting Date: Friday, July 10, 2026Time: 3:00 PM - 5:00 PM (JST)via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed. AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC30 Business Executive Technical
Highlighted content

High-temperature materials are critical for applications in harsh-environment circuitry, where devices must operate reliably under extreme thermal, chemical, and mechanical stress. In this Master Class, Dr. Shenqiang (Shen) Ren will present a high-throughput ink materials development strategy enabled by non-equilibrium processing and hybrid additive manufacturing. This approach enables rapid synthesis, combinatorial screening, and direct integration of functional materials onto diverse substrates. The resulting materials exhibit strong electrical performance, robust adhesion, and long-term stability under harsh operating conditions. This high-throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, providing a versatile pathway toward next-generation printed electronics designed for extreme environments.

ABOUT THE SPEAKER

Shenqiang (Shen) Ren, PhD
Dr. Shenqiang Ren is a Professor of Materials Science and Engineering at the University of Maryland, College Park, with research interests in emerging functional and structural materials. He received his Ph.D. in Materials Science and Engineering from the University of Maryland, College Park, and subsequently completed postdoctoral training at the Massachusetts Institute of Technology (MIT). 

United States

Shenqiang Ren
Shenqiang (Shen) Ren , PhD
Department of Materials Science and Engineering, Professor
University of Maryland, College Park
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a focused Master Class with Dr. Shenqiang (Shen) Ren, exploring the development of high‑temperature materials for harsh‑environment printed and flexible hybrid electronics (FHE). This session will examine how devices can be engineered to operate reliably under extreme thermal, chemical, and mechanical stress—conditions where conventional materials and processes often fail.

The Master Class will also highlight how this high‑throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, offering a versatile pathway toward next‑generation printed electronics designed for extreme conditions.

10:00 am - 12:00 pm Off Add to Calendar 2026-08-26 10:00:00 2026-08-26 12:00:00 FEMC#30 High Throughput Material Development for Extreme Environment Printed Electronics Join us for a focused Master Class with Dr. Shenqiang (Shen) Ren, exploring the development of high‑temperature materials for harsh‑environment printed and flexible hybrid electronics (FHE). This session will examine how devices can be engineered to operate reliably under extreme thermal, chemical, and mechanical stress—conditions where conventional materials and processes often fail.The Master Class will also highlight how this high‑throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, offering a versatile pathway toward next‑generation printed electronics designed for extreme conditions. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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Registration

※ Early-bird Registration Deadline: July 8 (Wed), 2026, 17:00 PM (KST)  

 Early BirdOn-siteGroup
SEMI MemberKRW 308,000KRW 385,000KRW 275,000
Non-MemberKRW 363,000KRW 330,000

※ Group registration fee applies to groups of five or more from the same company.
※ For group registration inquiries, please contact SEMI Korea Program Team at [email protected].

Registration
South Korea APS 2026 Business Technical

OVERVIEW

  • Date: July 15(Wed), 2026
  • Time: 08:30 - 17:00
  • Venue: Convention Hall 1, 3F, Suwon Convention Center
  • Language: Korean/English (Simultaneous interpretation will be provided)
  • Organizer: SEMI Korea  

 

SPONSORS

  

 

NOTICE

  • The agenda is subject to change at the discretion of the speakers.
  • Presentation files agreed by speakers will be provided to attendees after the event through SEMI registration website.

 

CONTACT

Convention Hall 1, 3F, Suwon Convention Center South Korea
South Korea

8:30 am - 9:00 am

Welcome Reception

9:00 am - 9:30 am
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Gun-chang Roh
Hyundai Motor Securities

Overview

9:30 am - 10:00 am
Chee ping Lee
Chee ping Lee
Lam Research

Making 3DIC Manufacturable for AI: From Vertical Integration to Scalable Production

As AI systems push requirements for higher bandwidth, lower power, and increased integration density, 3D integrated circuits (3DIC) are moving rapidly from development to production. However, scaling 3DIC introduces complex application challenges across the manufacturing flow, where process interactions and control become critical.
This talk examines key 3DIC applications and process challenges, including high aspect ratio TSV etch, void free TSV fill, and dielectric deposition, required for reliable wafer and die level stacking. Emerging applications such as inter die gap fill for advanced chiplets integration and plasma dicing for improved yield, edge quality, and die strength further increase integration complexity and productivity demands.
The presentation highlights Lam Research innovations across etch, deposition and clean processes that enable tighter process windows, improved uniformity, and higher throughput. In addition, equipment intelligence and data driven control are increasingly essential to enhance yield learning and manufacturing productivity. Together, these advances are enabling scalable, high volume 3DIC manufacturing for next generation AI systems.

※ Biography

10:00 am - 10:30 am
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Yin Chang
ASE

Advanced Packaging: Infusing AI at Scale

10:30 am - 11:00 am
Shinji Baba
Shinji Baba
Amkor Japan

Advanced Power Module Packaging Technologies

The rapid electrification of automotive and industrial systems is placing increasingly stringent demands on power semiconductor devices in terms of voltage capability, thermal performance, reliability, and system integration. This presentation reviews recent trends in power devices and power module packaging technologies aimed at improving performance while addressing cost and manufacturability constraints.
First, the fundamental differences between digital and power devices are outlined, followed by an overview of power device applications based on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, together with Amkor’s product portfolio.
Next, power module packaging technologies are discussed with a focus on key electrical and thermal challenges. Representative solutions, including advanced interconnects, cooling architectures, and embedded power modules, are introduced, along with a brief overview of Amkor’s technology roadmap.
Finally, the role of the Amkor Technology Japan R&D Center in supporting open innovation and global collaboration is briefly discussed.

※ Biography

11:00 am - 11:20 am

Networking Break

11:20 am - 12:30 pm

Panel Discussion

12:30 pm - 1:30 pm

Lunch

1:30 pm - 2:00 pm
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Minwoo Lee
Samsung Electronics

PLP

2:00 pm - 2:30 pm
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Yasushi Araki
Shinko

Glass Substrates

2:30 pm - 3:00 pm
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Sandeep Sane
Lightmatter

Photonics

3:00 pm - 3:30 pm
Amit Oren
Amit Oren
NVIDIA

CPO Packaging: Challenges and Opportunities

Co-packaged optics (CPO) is emerging as a key enabler for scaling bandwidth while containing power and cost in next-generation AI and cloud infrastructure. By moving optical engines closer to the switch ASIC and shortening high-speed electrical reaches, CPO can reduce SerDes power, ease signal-integrity constraints, and increase overall front-panel bandwidth density. However, delivering these benefits at volume requires new approaches across package architecture, manufacturing, and system integration.
This presentation reviews the main packaging challenges that must be solved to industrialize CPO, including thermal management and heat spreading near high-power silicon, fiber attach and optical alignment tolerances, photonics/laser integration choices, high-density optical and electrical I/O, substrate and interposer selection, and reliability risks such as warpage, CTE mismatch, and contamination control. Test and rework strategy, yield learning, and supply-chain readiness (materials, assembly, and metrology) are highlighted as practical barriers to adoption.
The talk also outlines opportunities created by CPO packaging innovations—such as modular optical tiles, standardized fiber interfaces, advanced lid/heat-sink concepts, and co-design of electrical, mechanical, and optical domains—to unlock higher radix switches and lower system power. Attendees will leave with a structured view of technology tradeoffs, a roadmap of near-term versus long-term packaging options, and actionable considerations for bringing CPO from prototypes to deployable products.

※ Biography

3:30 pm - 3:50 pm

Networking Break

3:50 pm - 5:00 pm

Panel Discussion

Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era.

8:30 am - 5:00 pm Off Add to Calendar 2026-07-15 08:30:00 2026-07-15 17:00:00 ADVANCED PACKAGING SUMMIT 2026 Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era. Convention Hall 1, 3F, Suwon Convention Center South Korea South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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Japan standards Technical
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26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Information & Control Japan TC Chapter Meeting 

Date: Wednesday, June 17, 2026

Time: 10:00 am - 12:00 pm JST

Venue: SEMI Japan Office Room 1 + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 12:00 pm Off Add to Calendar 2026-06-17 10:00:00 2026-06-17 12:00:00 Information & Control Japan TC Chapter Meeting Information & Control Japan TC Chapter Meeting Date: Wednesday, June 17, 2026Time: 10:00 am - 12:00 pm JSTVenue: SEMI Japan Office Room 1 + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
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SEMI
United States

9:00 am - 9:15 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
Ben Gross Headshot
Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
Jeff Rudnik Headshot
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
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