Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
The SEMI Silicon Valley and Northeast Chapters Present:
Semiconductor Industry Outlook 2026
As we step into 2026, the semiconductor industry continues to evolve at an unprecedented pace, driven by technological innovation, global market dynamics, and shifting economic conditions. Join us for an engaging virtual forum where leading experts will share insights into the trends, challenges, and opportunities shaping the future of the semiconductor ecosystem.
Topics Include:
Key market and technology trends shaping the industry.
Expert forecasts for 2026 and beyond.
Geopolitical impacts.
Emerging and expanding markets
Don’t miss out—register now to secure your spot!
United States
Virtual Forum | Wednesday, March 4, 2026 | Pacific Time
SEMI Southeast Asia's Members' Night | Penang, Malaysia
Join SEMI Southeast Asia for a night of networking and celebration at our Members' Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities with our Members' Networking Night.
End of Networking Night and Collection of Welcome Gift
Note: Program is subject to changes.
Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections.
6:00 pm - 9:30 pm
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Add to Calendar2024-03-07 18:00:002024-03-07 21:30:00Penang Business Summit Members' Night Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections. Non-member fee: SGD 800 (limited tickets available)Members: Free (restricted to 2 pax per member company) Contact us for enquiries!For the Event: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration: Ms. Gillian Lim | [email protected] | +65.9048.1123Over & Above 3, Pengkalan Weld, George Town 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
Register Today
Penang Business Summit Seminar 2: Revolutionizing Manufacturing
This seminar is designed to offer a platform where executives, managers, and engineers who specialize in process development, equipment maintenance, factory automation, and manufacturing can come together to discuss ways to improve production output, increase yield and work efficiency through implementing some of AI solutions presented in this seminar.
The landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.
This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.
This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.
Usual Member Rate: SGD 152 Usual Non-member Rate: SGD 227
*The above rates are inclusive of coffee/tea breaks and luncheon
30% Early Bird Rate extended until 1 March 2024!
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information). For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
1:00 pm - 6:00 pm
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Add to Calendar2024-03-07 13:00:002024-03-07 18:00:00Penang Business Summit Seminar 2: Revolutionizing ManufacturingThe role of AI in Future FactoriesThe landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 152Usual Non-member Rate: SGD 227*The above rates are inclusive of coffee/tea breaks and luncheon30% Early Bird Rate extended until 1 March 2024! *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Presentation slides can be found HERE!Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
Register Today
Penang Business Summit Seminar 1: Advanced Packaging
Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
Material characterization from bulk to interfaces for Microelectronics packaging
Why should I attend?
Gain technical knowledge for industry professionals
Enhance knowledge in manufacturing and R&D know-how in IC packaging
Apply Key Technical Concepts in Problem Solving through Real Case Studies
Networking opportunities with industry peers
Who should attend?
Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
Useful for sale or application engineers who supply packaging materials and tools to the industry
Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300Penang Pulau Pinang Malaysia
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am
Introduction to IC Packaging & Interconnects
Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging
Board Assembly and Soldering & PCB and IC Carriers
Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution
PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development
4:00 pm
Q&A | Case Studies
5:00 pm
End of Day 1
9:00 am
Assembly Process
• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism
Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935
*The above rates are inclusive of coffee/tea breaks and luncheon for both days
Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.
A certificate of completion will be awarded at the end of the seminar.
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information). For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
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Add to Calendar2024-03-06 00:00:002024-03-07 00:00:00Penang Business Summit Seminar 1: Advanced PackagingAdvanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar. *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
SOLD OUT
U.S. EPA Update on Recent PFAS Research and Regulatory Actions
The webinar will feature senior leaders and other experts from EPA and provide SEMI members with an overview of EPA’s efforts under the PFAS Strategic Roadmap; the recently finalized reporting rules under the Toxic Substances Control Act (TSCA) and the Toxics Release Inventory (TRI) program; the review and management of new PFAS chemicals under the TSCA New Chemicals program; and an update on research and development activities, including analytical test methods development. In addition to hearing directly from EPA officials on these important topics, participants will have an opportunity to ask questions at the end.
United States
Welcome Remarks
1:00 pm
Joe Stockunas
President
SEMI Americas
Speakers
Dr. Michal Freedhoff
Assistant Administrator, Office of Chemical Safety and Pollution Prevention
Join us to learn more about several of the U.S. Environmental Protection Agency’s recent actions related to PFAS and their relevance to the semiconductor manufacturing industry.
U.S. EPA Update on Recent PFAS Research and Regulatory Actions
VIRTUAL WEBINAR
1:00-2:00PM (Eastern Time)
1:00 pm - 2:00 pm
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America/New_York
The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:
Government relations/advocacy staff
EHS regulatory professionals
Senior executives
Business development
Device manufacturers
Equipment suppliers
Materials suppliers
Component suppliers
Fab and facility systems construction companies
SEMI 673 South Milpitas Avenue Milpitas, CA95035 United States
8:30 am
-
9:00 am
Registration & Networking
9:00 am
-
9:05 am
James Amano
Senior Director, EHS
SEMI
Welcome
9:05 am
-
9:20 am
James Amano
Sr. Director, EHS
SEMI
Europe PFAS Restriction Proposal
9:20 am
-
9:45 am
Russ LaMotte
Principal
Beveridge & Diamond PC
US EPA PFAS Reporting rule
9:45 am
-
10:10 am
Andrew Petraszak
Tokyo Electron
Ben Kallen
SEMI
PFAS US States Proposals & Positions
10:10 am
-
10:30 am
Break
10:30 am
-
11:00 am
Lauren Crane
Lam Research
European Regulations
Including: EU Machinery Regulation, Battery Regulation, Cybersecurity Resiliency Act (CRA), AI regulation, the Ecodesign “passport” concept. UK Conformity Assessed (UKCA) mark. California fan efficiency regulation. SEMI EHS Standards update.
11:00 am
-
11:25 am
Allen Karpman
Arkema
AIM Act: HFC Allocations
11:25 am
-
11:50 am
Kristine Baranski, PE
Global Air Program Manager
Intel
AIM Act: challenges with new refrigerants
11:50 am
-
12:10 pm
Katelyn Walck
Chemours
James Snow
SCREEN
SIA PFAS Consortium
12:10 pm
-
1:15 pm
Lunch & Networking
1:15 pm
-
1:35 pm
James Amano
SEMI
SEMI PFAS Initiative
1:35 pm
-
2:00 pm
Russ LaMotte
Principal
Beveridge & Diamond
TSCA PBT: PIP, DecaBDE, What's Next?
2:00 pm
-
2:35 pm
Ben Gross
Applied Materials
Supika Mashiro
TEL
Katelyn Walck
Chemours
Lauren Crane
Lam Research
Supply Chain Inquiry Panel - sharing best practices
Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.
Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:
US EPA PFAS Reporting Rule
US AIM Act HFC phasedown: challenges with new refrigerants
Updates from SEMI PFAS Initiative and other collaborative industry efforts.
US EPA TSCA: PIP 3:1, DecaBDE…what's next?
Panel discussion on supply chain communication.
Plan now to attend, network and strategically prepare your company. This event is offered as an in-person briefing only.
EHS Summit 2024
Regulations, Rules, Allocations & Proposals
8:30 am - 3:30 pm
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Add to Calendar2024-01-25 08:30:002024-01-25 15:30:002024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.
Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:
US EPA PFAS Reporting Rule
US AIM Act HFC phasedown: challenges with new refrigerants
US AIM Act HFC Allocation
EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
Updates from SEMI PFAS Initiative and other collaborative industry efforts.
US EPA TSCA: PIP 3:1, DecaBDE…what's next?
Panel discussion on supply chain communication.
Plan now to attend, network and strategically prepare your company. This event is offered as an in-person briefing only.SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Many semiconductor-based systems are moving toward 2.5D and 3D designs consisting of different pre-manufactured chips (chiplets) that perform specific functions. These are often provided by multiple vendors and are typically interconnected using an interposer. However, unlike monolithic multi-function chips, chiplets can be developed anywhere and at any process node. As such, chiplets from untrusted vendors can be unreliable or malicious. Third parties can reverse engineer, overproduce, or steal the IP of chiplets. Consequently, they raise new security challenges for an industry still figuring out ways to effectively mitigate hardware security threats to monolithic chips.
The webinar will focus on the potential threats that occur at the different stages of bringing chiplets to life, including design, assembly, and testing. The panelists will assess current safeguards to mitigate these risks and discuss open challenges for industry and academia.
ESDA Webinar: Chiplet Security—Current and Future
VIRTUAL WEBINAR
9:00-10:00AM (Pacific Time)
9:00 am - 10:00 am
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Electromagnetic Interference and Electrical Overstress Management: Why, What, and How
Electromagnetic interference (EMI) is becoming more critical in all aspects of semiconductor manufacturing, affecting productivity and yield.
The SEMI E176 Standard, "Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment," addresses this issue. This document provides practical, actionable guidance on establishing an acceptable EMI environment in semiconductor processes: from assessing the EMI environment to EMI mitigation to verification. SEMI E176 sets recommended EMI limits for different process categories. The Standard can benefit every stage of the semiconductor process and electronic assembly.
1. Overview of SEMI and SEMI Standards
- SEMI as a resource for your company
2. EMI and EMC - an overview
3. Effect of EMI on processes and equipment
- EMI and Electrical Overstress
- Equipment precision
- Process variations
- Other problems
4. Sources and propagation of EMI
5. Overview of SEMI E.33
- Emphasis on Table 1: Compliance Assignment/Responsibility Table
6. Overview of SEMI E.176
7. Basics of a viable EMI program at a factory based on SEMI E.176
- Purpose
- Structure
- Resources and budget
- Similarity and synergy with already-existing ESD program
Join us for a hybrid experience with both in-person and virtual attendance options.
Electromagnetic Interference and Electrical Overstress Management
Why, What, and How
An executive overview course
December 18, 2023
4:00 pm - 5:00 pm
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Add to Calendar2023-12-18 16:00:002023-12-18 17:00:00EMI and EOS Management CourseJoin us for a hybrid experience with both in-person and virtual attendance options.SEMI HQ CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register now
Leveraging the CHIPS Act in the Silicon Heartland: Ohio Semiconductor Industry Initiatives
SEMI has invited key stakeholders from Ohio to discuss state initiatives that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. Webinar participants will learn why Ohio is a premier location for semiconductor operations and what government initiatives are available to strategically complement competitive CHIPS proposals. JobsOhio, the state’s unique private economic development corporation, acts as a catalyst for high-growth business investments and job creation that are helping propel the state’s ingenuity and ambitions forward.
Meet the Speakers
Joe Stockunas
President
SEMI Americas
David Brewster
Managing Director, Technology Sector
JobsOhio
Join us for a 2-day working session to align our industry on concrete next steps to secure semiconductor manufacturing against an ever-evolving threat environment. With our complex and interconnected supply chains, no single company can be safe unless all companies are safe. Our consortium of device makers, foundries, equipment makers, component suppliers, and software suppliers are working together to rapidly develop a practical plan to improve security now, and for years to come while minimizing costs and avoiding duplication.
• Consortia governance, structure, deliverables, and roadmap for 2024
• E187 SEMI Standard implementation ideation session
• Develop a method to survey, evaluate, and certify manufacturing equipment cybersecurity protections
• Globalization of SEMI Taiwan’s E187 reference architecture and checklist
Day 2: December 7, 2023 - 8 am - 3 pm PT
8:00 am
-
3:00 pm
• Opportunities for collaboration and information sharing for cyber threats and incidents
• Supply Chain Cybersecurity working session
• Create a semiconductor industry-specific framework to measure security and implementation approach across the entire ecosystem
• Review NIST industry profiles and evaluate for suitability in semiconductor
• Next steps: Including forming working groups and assigning leaders
Join us for a 2-day workshop aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.
Time:
Day 1: Noon - 7 pm PT
Day 2: 8 am – 3 pm PT
In-person registration has reached capacity. However, you can still register to participate online.
SEMI Cybersecurity Launch Workshop
December 6-7, 2023
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