United States Arizona Chapter Forum Thumbnail Business Executive

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

 

Organized by the SEMI Arizona Chapter — 

Join us for the Arizona Chapter Breakfast Forum to explore the thriving innovation ecosystem in the Silicon Desert. 

Is Silicon Desert the New Innovation Hub?

With the influx of high-tech companies and substantial government funding through the CHIPS Act, Arizona has invested over $65 billion in the semiconductor sector emerging as the top destination for semiconductor jobs, investments, and ecosystem expansion in the United States.

Arizona promises to play a leading role in the future of U.S. chip manufacturing and innovation, this has led to the question, is the Silicon Desert the new technology hub?

To maximize opportunities under the CHIPS Act, Arizona has launched an unprecedented collaborative effort, bringing together stakeholders from state and local governments, industry, trade groups, economic development organizations, universities and community colleges, workforce partners, and more.

Get first-hand insight on—

• Market Trends & Technology Drivers, Emerging Sectors, Forecast and Outlook
• Semiconductor Growth and How It Will Impact Silicon Desert
• University and State Infrastructure and R&D
• Empowering a Sustainable Future in Semiconductor Manufacturing
• Training the Workforce

These informative sessions will equip you with a comprehensive understanding of Silicon Desert's potential as an innovation powerhouse, the opportunity to network with industry leaders, and foster collaboration with like-minded professionals.

Register now and be a part of this exciting journey shaping the future of technology in the Silicon Desert.

In-Person + Virtual
EMD Electronics
8555 S River Pkwy
Tempe, AZ 85284
United States

May 1, 2024

SEMI Breakfast Forum Organized by SEMI Arizona Chapter

In-Person + Virtual | Mountain Time


We are sold out!

Thank you for your support. We are excited to welcome you to an outstanding event with excellent speaker lineup and attendees. 

Is Silicon Desert the New Innovation Hub?

In-Person + Virtual | May 1, 2024
8:00–11:30am MT

7:30 am - 11:45 am Off Add to Calendar 2024-05-01 07:30:00 2024-05-01 11:45:00 SEMI Arizona Chapter Breakfast Forum—Is Silicon Desert the New Innovation Hub? SEMI Breakfast Forum Organized by SEMI Arizona ChapterIn-Person + Virtual | Mountain TimeWe are sold out!Thank you for your support. We are excited to welcome you to an outstanding event with excellent speaker lineup and attendees.  In-Person + Virtual EMD Electronics 8555 S River Pkwy Tempe, AZ 85284 United States SEMI.org [email protected] America/Phoenix public Apr 30, 2024 America/Phoenix 2

Registration

Early Bird (Before April 11, 2024):

Member: $75 | Non-member: $100

Regular:

Member: $100 | Non-member: $125

Cancellation Policy

Registration is final. No refunds provided. No substitutions.

Questions?

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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United States Register Now Pacific Northwest Chapter Forum Thumbnail Business Executive

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

AI Driving Fabs of the Future...People, Technology, Infrastructure

There has never been a more exciting time in the history of semiconductor manufacturing. Following the supply chain disruption of the early 2020s, teams rushing to expand operations and add capacity are looking to maximize operating leverage amidst a challenging market backdrop. With dozens of new fully automated 300mm fabs set to open their doors in the next two years, here are the burning questions—

• What does it mean for the existing 200mm legacy fabs? 
• What challenges will we face in 2024?
• How can we solve them together? 

Learn about current market trends, workforce development, equipment advancements, and AI's potential uses in manufacturing. 
Join the conversation on—

• KEYNOTE: The 5th Industrial Revolution: The Adjacent Possible of AI in Semiconductor Manufacturing—Analog Devices
• Macro Trends and Value Creation in the Semiconductor Industry—McKinsey & Company
• What Does It Mean for the Existing 200mm Legacy Fabs?—Microchip Technology
• AI Use Cases in the Fab—Applied Materials
• SEMI Smart Manufacturing Initiative—Microchip Technology
• EXECUTIVE PANEL: Discussion for Talent Acquisition, Workforce Development, Labor Shortage

The SEMI Pacific Northwest Breakfast Forum is a great way to network with colleagues while meeting other local industry leaders.
 

Analog Devices—ADI
14320 SW Jenkins Road
Beaverton, OR 97005
United States

Apr 25, 2024

Organizer: SEMI Pacific Northwest Chapter

IN-PERSON + VIRTUAL
8:00–11:45am Pacific Time (PT)

Pacific Northwest Chapter Breakfast Forum

SEMI Pacific Northwest Chapter
In-Person + Virtual | April 25, 2024
8:00–11:45am PT

8:00 am - 11:45 am Off Add to Calendar 2024-04-25 08:00:00 2024-04-25 11:45:00 Pacific Northwest Chapter Breakfast Forum Organizer: SEMI Pacific Northwest ChapterIN-PERSON + VIRTUAL8:00–11:45am Pacific Time (PT) Analog Devices—ADI 14320 SW Jenkins Road Beaverton, OR 97005 United States SEMI.org [email protected] America/Los_Angeles public Apr 23, 2024 America/Los_Angeles 2

ADI Fab Tour

Cleanroom Transformation—Beaverton, OR

Join us for a tour of the recently renovated Beaverton factory which added a new cleanroom below the existing production cleanroom! Ryan Bestwick will lead the SEMI attendees through the chronology of this incredible fab transformation.

VISITOR PARKING INFORMATION

Registration

Early Bird (Before March 26, 2024):

Member: $75 | Non-member: $100

Regular:

Member: $100 | Non-member: $125

Cancellation Policy

Registration is final. No refunds provided. No substitutions.

Questions?

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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United States Register Now Midwest Chapter Forum Thumbnail Business Executive

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

Join us for the Midwest Chapter Forum—

What's Going on in the Silicon Heartland? Opportunities and Growth Outlook in the Semiconductor Sector

The CHIPS Act helps the U.S. regain semiconductor manufacturing leadership. The bill also advances the nation’s strengths in the semiconductor and microelectronics arena, including the automotive sector. Join us to hear executive experts, from Ohio, Michigan, and Indiana, share how their state is helping to boost the industry with significant new manufacturing projects.

SEMI Midwest Breakfast Forum is an excellent opportunity to LEARN, NETWORK, and SHARE your business solutions and ideas—Register Today!

This new regional chapter was formed to serve SEMI Members in the Midwest region. Its goal is to support member companies to grow and prosper collectively. Future chapter forums will identify, discuss, and find solutions to current topics impacting our industry. 

In-Person—Eastern Time
The Ohio State University, Ohio Union
1739 North High Street - The Great Hall Meeting Room
Columbus, OH 43210
United States

Apr 9, 2024

SEMI Breakfast Forum Organized by SEMI Midwest Chapter

In-Person

Eastern Time

Hosted and Breakfast Forum Sponsored by The Ohio State University

What's Going on in the Silicon Heartland?—Opportunity and Growth Outlook

In-Person | April 9, 2024
The Great Hall Meeting Room
8:00–11:30am ET

8:00 am - 11:30 am Off Add to Calendar 2024-04-09 08:00:00 2024-04-09 11:30:00 Midwest Chapter Breakfast Forum—What's Going on in the Silicon Heartland? - Opportunity and Growth Outlook SEMI Breakfast Forum Organized by SEMI Midwest ChapterIn-PersonEastern TimeHosted and Breakfast Forum Sponsored by The Ohio State University In-Person—Eastern Time The Ohio State University, Ohio Union 1739 North High Street - The Great Hall Meeting Room Columbus, OH 43210 United States SEMI.org [email protected] America/New_York public Apr 4, 2024 America/New_York 2

Registration

Member Price: $49

Non-Member Price: $99

Cancellation Policy

Registration is final. All registrants will receive the presentation recording after the event.

Questions?

Taylor Zhao
Email: [email protected]

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REGISTER NOW

United States Semiconductor Industry Outlook Thumbnail Business Executive

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Industry Outlook 2026 

As we step into 2026, the semiconductor industry continues to evolve at an unprecedented pace, driven by technological innovation, global market dynamics, and shifting economic conditions. Join us for an engaging virtual forum where leading experts will share insights into the trends, challenges, and opportunities shaping the future of the semiconductor ecosystem.

Topics Include:

• Key market and technology trends shaping the industry.
• Expert forecasts for 2026 and beyond.
• Geopolitical impacts.
• Emerging and expanding markets

Don’t miss out—register now to secure your spot!
 

United States

Mar 4, 2026

Silicon Valley & Northeast Virtual Forum

Semiconductor Industry Outlook 2026
March 4, 2026
8:30–11:00am Pacific | 11:30am–2:00pm Eastern Time

8:30 am - 11:00 am Off Add to Calendar Disabled Feb 26, 2026 America/Los_Angeles 2 Register Now

Malaysia Singapore Vietnam Members' Networking Night Mar 2024 Business Executive

Co-hosted by

 

SEMI Southeast Asia's Members' Night | Penang, Malaysia

Join SEMI Southeast Asia for a night of networking and celebration at our Members' Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities with our Members' Networking Night. 

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BROWSE OUR PHOTO GALLERY

Over & Above
3, Pengkalan Weld, George Town
10300 Penang
Pulau Pinang
Malaysia

Mar 7, 2024

Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections.

 

Non-member fee: SGD 800 (limited tickets available)

Members: Free (restricted to 2 pax per member company)

 

Contact us for enquiries!

For the Event: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

Members' Night

6:00 pm - 9:30 pm Off Add to Calendar 2024-03-07 18:00:00 2024-03-07 21:30:00 Penang Business Summit Members' Night Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections. Non-member fee: SGD 800 (limited tickets available)Members: Free (restricted to 2 pax per member company) Contact us for enquiries!For the Event: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration: Ms. Gillian Lim | [email protected] | +65.9048.1123 Over & Above 3, Pengkalan Weld, George Town 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Mar 11, 2024 Asia/Kuala_Lumpur Register Today

Malaysia Singapore Vietnam Seminar 2: Revolutionizing Manufacturing Business Executive

Who should attend

This seminar is designed to offer a platform where executives, managers, and engineers who specialize in process development, equipment maintenance,  factory automation, and manufacturing can come together to discuss ways to improve production output,  increase yield and work efficiency through implementing some of AI solutions presented in this seminar.

 

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BROWSE OUR PHOTO GALLERY

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Mar 7, 2024 Smart MFG

The role of AI in Future Factories

The landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.

This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.

This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.

*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar 

 

Participating Fee:

Usual Member Rate: SGD 152
Usual Non-member Rate: SGD 227

*The above rates are inclusive of coffee/tea breaks and luncheon

30% Early Bird Rate extended until 1 March 2024!

 

 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

• HRDC Approval Letter for Penang Business Summit
• Allowable Cost Matrix
• HRDC SBL Grant Helper
• HRDC SBL Claim Helper

 

Contact us for enquiries!

For Program: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Presentation slides can be found HERE!

Seminar 2: Revolutionizing Manufacturing

1:00 pm - 6:00 pm Off Add to Calendar 2024-03-07 13:00:00 2024-03-07 18:00:00 Penang Business Summit Seminar 2: Revolutionizing Manufacturing The role of AI in Future FactoriesThe landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar  Participating Fee:Usual Member Rate: SGD 152Usual Non-member Rate: SGD 227*The above rates are inclusive of coffee/tea breaks and luncheon30% Early Bird Rate extended until 1 March 2024!  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Presentation slides can be found HERE! Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Mar 7, 2024 Asia/Kuala_Lumpur Register Today

Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Featured Speakers

This course will cover:

• Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
• Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
• Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
• Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
• Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
• Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

• Gain technical knowledge for industry professionals
• Enhance knowledge in manufacturing and R&D know-how in IC packaging
• Apply Key Technical Concepts in Problem Solving through Real Case Studies
• Networking opportunities with industry peers

Who should attend?

• Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
• Useful for sale or application engineers who supply packaging materials and tools to the industry

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BROWSE OUR PHOTO GALLERY

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

MEET OUR SPEAKER

Dr. Lee Teck Kheng

Director, Technology Development Centre, Institute of Technical Education Singapore,

SEMI SEA Advance Packaging Technical Committee Member

Mar 6, 2024 - Mar 7, 2024 APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

• HRDC Approval Letter for Penang Business Summit
• Allowable Cost Matrix
• HRDC SBL Grant Helper
• HRDC SBL Claim Helper

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Seminar 1: Advanced Packaging

Advanced Packaging and Material Characterization

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Mar 11, 2024 Asia/Kuala_Lumpur SOLD OUT

REGISTRATION

Registration is free.

REGISTER NOW

Belgium France Germany Ireland Italy Japan South Korea United States REGISTER NOW EPA Thumbnail Image_NEW Business Executive

The webinar will feature senior leaders and other experts from EPA and provide SEMI members with an overview of EPA’s efforts under the PFAS Strategic Roadmap; the recently finalized reporting rules under the Toxic Substances Control Act (TSCA) and the Toxics Release Inventory (TRI) program; the review and management of new PFAS chemicals under the TSCA New Chemicals program; and an update on research and development activities, including analytical test methods development.  In addition to hearing directly from EPA officials on these important topics, participants will have an opportunity to ask questions at the end.  

United States

Jan 16, 2024

Join us to learn more about several of the U.S. Environmental Protection Agency’s recent actions related to PFAS and their relevance to the semiconductor manufacturing industry.

U.S. EPA Update on Recent PFAS Research and Regulatory Actions

VIRTUAL WEBINAR
1:00-2:00PM (Eastern Time)

1:00 pm - 2:00 pm Off Add to Calendar Disabled Jan 3, 2024 America/New_York

Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $100

Non-Members of SEMI:  $150

Refunds possible before January 10, 2024.  Substitutions allowed up to January 24.

Questions? Contact James Amano at [email protected].

Register Now

Belgium France Germany Ireland Italy United States Register Now 2024 EHS Summit Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

• Government relations/advocacy staff
• EHS regulatory professionals
• Senior executives
• Business development
• Device manufacturers
• Equipment suppliers
• Materials suppliers
• Component suppliers
• Fab and facility systems construction companies

SEMI
673 South Milpitas Avenue
Milpitas, CA 95035
United States

Jan 25, 2024 Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.

Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:

• US EPA PFAS Reporting Rule 
• US AIM Act HFC phasedown: challenges with new refrigerants 
• US AIM Act HFC Allocation 
• EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
• Updates from SEMI PFAS Initiative and other collaborative industry efforts.
• US EPA TSCA: PIP 3:1, DecaBDE…what's next?
• Panel discussion on supply chain communication.

Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only.

EHS Summit 2024

Regulations, Rules, Allocations & Proposals

8:30 am - 3:30 pm Off Add to Calendar 2024-01-25 08:30:00 2024-01-25 15:30:00 2024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry. Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include: US EPA PFAS Reporting Rule  US AIM Act HFC phasedown: challenges with new refrigerants  US AIM Act HFC Allocation  EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept. Updates from SEMI PFAS Initiative and other collaborative industry efforts. US EPA TSCA: PIP 3:1, DecaBDE…what's next? Panel discussion on supply chain communication. Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only. SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public Jan 24, 2024 America/Los_Angeles

Registration is free

Register Now

Belgium France Germany Ireland Italy Japan South Korea United States ESDA_Thumbnail Image Business Executive

United States

Mar 14, 2024 EMG

Many semiconductor-based systems are moving toward 2.5D and 3D designs consisting of different pre-manufactured chips (chiplets) that perform specific functions. These are often provided by multiple vendors and are typically interconnected using an interposer. However, unlike monolithic multi-function chips, chiplets can be developed anywhere and at any process node. As such, chiplets from untrusted vendors can be unreliable or malicious. Third parties can reverse engineer, overproduce, or steal the IP of chiplets. Consequently, they raise new security challenges for an industry still figuring out ways to effectively mitigate hardware security threats to monolithic chips.

The webinar will focus on the potential threats that occur at the different stages of bringing chiplets to life, including design, assembly, and testing. The panelists will assess current safeguards to mitigate these risks and discuss open challenges for industry and academia.

ESDA Webinar: Chiplet Security—Current and Future

VIRTUAL WEBINAR
9:00-10:00AM (Pacific Time)

9:00 am - 10:00 am Off Add to Calendar Disabled Jan 22, 2024 America/Los_Angeles Register Now