United States
MSIG Off Add to Calendar 2021-11-12 00:00:00 2021-11-12 00:00:00 Smart Cities and Sensors: How to Maximize the Opportunity and What NOT to do United States SEMI.org [email protected] America/Los_Angeles public 1
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Given the on-going China-U.S. trade tensions, companies have been moving production bases to Vietnam to diversify risk. At the same time, foreign Multinational Corporations (MNCs) have been setting up new manufacturing bases or expanding existing capacities. Vietnam’s political stability and a young, vibrant, and productive middle class, coupled with solid economic growth, means that the country is poised to become the next manufacturing hub of the world. Companies looking to invest in Vietnam can also take advantage of several Free Trade Agreements (FTAs), with many agreements signed through its membership in the Association of Southeast Asian Nations (ASEAN) and the recent RCEP.
The electronics industry, a priority sector set by the Vietnamese government, has impressively developed since 2010. Vietnam’s active participation in the global integration of electronics manufacturing has enabled it to engage deeply in global value chains. Today, Vietnam is a favourable investment hotspot for the electronics and semiconductor industry, with major MNCs having a manufacturing presence in the country. This webinar brings together speakers from the government, industry park developers, and major MNCs to provide an update on Vietnam’s investment climate, benefits of investing, and sharing of investors’ experiences. The goal is to promote and grow the electronics and semiconductor industry in Vietnam as a compliment to the entire Southeast Asian electronics and semiconductor eco-system.
Organized by SEMI Southeast Asia
Online via Zoom
Singapore
Vietnam is the third-largest market in Southeast Asia and rising to take its place as Asia’s new tiger. According to the World Bank, Vietnam’s estimated GDP growth rate of approximately 7 percent is three times higher than the world average and the second fastest in East Asia.
Join this 2 hours webinar to learn how you can promote, grow the electronics and semiconductor industry in Vietnam, and compliment the entire Southeast Asia’s electronics and semiconductor eco-system.
Admission: SGD30 (Member) / SGD50 (Non-Member)
Contact: [email protected] for any questions
Elastomer seals are critical components in semiconductor manufacturing equipment, where they are routinely exposed to demanding conditions including aggressive process chemistries, plasma environments, vacuum, elevated temperatures, and repeated mechanical cycling. Understanding how elastomer properties, seal design, application conditions, and installation practices interact is essential for achieving reliable sealing performance.
This webinar will explore common seal failure modes and the mechanisms that can contribute to premature failure, including chemical and plasma degradation, compression set, thermal effects, mechanical damage, and installation-related issues. Examples will be used to demonstrate how visual observations, application information, and engineering analysis can help identify potential root causes and guide corrective actions.
The course concludes by presenting information on current or emerging technologies and the attendant challenges, that include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps.
An understanding of the fundamental properties of elastomers and how those properties influence seal performance.
Types of elastomers used in semiconductor manufacturing and factors that affect the material selection process.
How operating conditions such as temperature, plasma, process chemistry, vacuum, and mechanical loading can affect seal life.
Common seal failure modes and how to identify them.
The importance of proper seal design, gland design, and installation practices.
Understand how failure analysis can be used to troubleshoot sealing problems and identify opportunities for improvement.
How ASNA can support customers through application evaluation, material and design recommendation, failure analysis, customer engineering, and on-site installation support.
This course is ideal for engineers and technical professionals, including equipment, process, mechanical, applications, reliability, maintenance, and field service engineers.
ANSA
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI UThis two-hour webinar provides a practical introduction to elastomer sealing technology, beginning with the fundamentals of seal elastomers and the properties that influence their performance.
Given the immense cost of AI products & platforms, an important and differentiating factor for a successful packaging technology supplier is offering stellar quality and reliability to preserve the value of the expensive silicon chiplets. This course introduces various aspects of demonstrating Quality and Reliability in semiconductor packaging. One way to guarantee stellar quality and reliability of products with new technologies is to overdesign them, but that can be very expensive. Alternatively, under-designing packages from a reliability perspective may be cheaper; however, it will likely trigger premature failures in the field, leading to higher ownership costs and frustration for customers. Optimizing this balance to deliver new technology and meet customer expectations requires drawing from experience (history), judicious use of simulations, augmenting with empirical data and, more importantly, engineering rigor to make the right technology decisions.
This course will prepare the audience to tackle technical problems (related to failure mechanisms and product qualification) by providing a blueprint that aids in proving that the technology capabilities can meet the market demands. The participants will experience the concepts through hands-on exercises throughout the course.
A brief overview of semiconductor packaging.
Understand the fundamentals of quality and reliability principles.
Understand the concept of the bathtub curve and its use for Q&R optimization.
Introduce the philosophy, and practical elements, of product qualification.
Understand use conditions based on different markets like Automotive, Data Centers, Mobile, Space, etc.
Understand different quality tests and reliability stress tests done for product qualification.
Get insight into typical failure mechanisms and failure analysis techniques.
Demonstrate how to perform life distribution analysis to characterize statistical behavior of failures.
Introduction to acceleration models for predicting useful life of the package.
Hands-on exercises
This course is ideal for anyone seeking a better understanding of how quality and reliability evaluation s performed for semiconductor packaging.
 Shalabh Tandon |  Shubhada Sahasrabudhe |
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI UThis four-hour course presents a methodology to deliver an optimum approach, and quantify, figures of merit that define quality and reliability for complex, heterogeneous integrated products.
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
SEMI Members: $75
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $149
Students: Free
Contact [email protected] with a picture of your student ID to receive your discount code.
Rapid advances in electronics, sensors, computation, wireless systems, artificial intelligence, and neurotechnology are creating a new generation of medical solutions that interact directly with the body’s electrical and physiological control systems. Collectively described as bioelectronic medicine, these technologies offer the potential to complement—and in some applications overcome important limitations of—traditional pharmaceutical approaches by providing interventions that can be spatially targeted, dynamically adjusted, continuously monitored, and personalized to an individual patient’s physiology.
This Master Class will provide a broad introduction to the rapidly evolving field of bioelectronic medicine from the perspective of electrical and computer engineering. It will examine how technologies familiar to engineers—including low-noise sensing, embedded computing, signal processing, machine learning, wireless communications, miniaturized stimulation electronics, wearable devices, and closed-loop control—are being translated into new diagnostic and therapeutic platforms. Examples will range from cardiac pacemakers and cochlear implants to deep-brain stimulation, vagus nerve stimulation, spinal cord stimulation, transcranial stimulation, peripheral nerve interfaces, and digital biomarkers. Particular attention will be given to the transition from open-loop stimulation toward sensor-guided, closed-loop bioelectronic medicine, in which physiological measurements provide real-time feedback for optimizing stimulation parameters and tracking therapeutic responses.
The Master Class will also explore why engineers are increasingly central to the future of medicine. Biological systems present unusual engineering challenges: signals are weak and noisy, anatomy and physiology vary substantially between individuals, neural systems are nonlinear and adaptive, and successful devices must operate safely at the interface between electronics and living tissue. These challenges are generating opportunities for innovation across semiconductor technology, MEMS and wearable sensors, electrode design, power management, computational modeling, AI, cybersecurity, human-machine interfaces, and systems engineering.
The Master Class will conclude with a look toward the next generation of bioelectronic medicine: intelligent therapeutic systems and digital twins capable not simply of measuring disease or delivering predetermined stimulation, but of continuously sensing physiological state, interpreting changes in biological function, and adapting interventions to promote recovery and maintain health. For electrical and computer engineers, this emerging field represents an opportunity to apply core engineering disciplines to some of the most consequential challenges in human health.
ABOUT THE SPEAKER
John Ralston, PhD, CEO and Co-founder, Neursantys Inc.
John Ralston is a pioneer in the development of non-invasive bioelectronic devices and adaptive neuroplastic treatments for neurosensory, neuromotor, and neurocognitive impairments that have limited pharmacological treatment options.
At Neursantys, John is collaborating with healthcare researchers, providers, and payers to restore motor and cognitive functions that have been impaired by both normal aging and accelerated aging caused by head trauma, disease, and spaceflight.
With a career spanning public and private R&D organizations and entrepreneurial ventures in Canada, Europe, and the U.S., John has authored/co-authored over 250 professional publications, presented over 150 talks and seminars, and has 16 issued patents. John earned B.Sc. degrees in Physics and Electrical Engineering from M.I.T., a PhD in Electrical Engineering from Cornell University, and the MSc in Management of Technology from the MIT Sloan School of Management.
United States
Join Dr. John Ralston, Founder and CEO of Neursantys, a pioneering bioelectronics company developing non-invasive neurostimulation and wearable technologies for diagnosing and treating neuromotor conditions, for an engaging Master Class on the rapidly advancing field of bioelectronic medicine.
Learn how innovations in sensors, AI, embedded systems, neural interfaces, and closed-loop therapies are enabling personalized, real-time treatments that interact directly with the body’s physiological systems and are shaping the future of healthcare.
This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps. Some technical background from attendees will improve the workshop learning.
The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors.
The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes.
The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics. We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung.
After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
- SEMI UUnlock the essentials of the semiconductor manufacturing process. We will cover science and engineering concepts needed to understand device manufacturing.
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.
This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers.
Ilya Zabelinksy
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI U StandardsSubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends.
* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].
In this course, we dive into the fundamental roles of packaging in enabling a complex product; namely, signal distribution, power delivery, thermal management, mechanical protection of the fragile silicon die(s), and the risks associated with the manufacturing flow. We trace the evolution of packaging technology from wire-bonded leadframe packages through flip-chip and ball grid arrays to today's advanced heterogeneous integration platforms, including 2.5D interposers, 3D die stacking, fan-out wafer level packaging, and chiplet-based architectures.
Given the complicated, and expensive, nature of these semiconductor packages, quality and reliability are a central theme for such complex products. We will discuss quality metrology used to maintain outgoing product quality and accelerated testing methods used to predict field performance using physics of failure methodology.
The course concludes by presenting information on current or emerging technologies and the attendant challenges, that include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps.
Define core packaging functions (signal, power, thermal, and mechanical).
Trace the evolution from leadframes to 2.5D/3D and chiplet architectures.
Explain the "More than Moore" shift from transistor to package innovation.
Identify key failure mechanisms like electromigration and thermal fatigue.
Apply quality metrology and screening methods to ensure outgoing product standards.
Use accelerated testing and physics-of-failure models to predict long-term package reliability.
Evaluate emerging trends in hybrid bonding and co-package optics.
Hands-on exercises
This course is ideal for anyone seeking a better understanding of semiconductor packaging fundamentals, challenges, and latest technologies.
Shalabh Tandon | Shubhada Sahasrabudhe |
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI UThis four-hour workshop provides a comprehensive technical foundation in semiconductor packaging, bridging the gaps between front-end wafer fabrication and final system integration.
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Upon completion of the course, participants should be able to:
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Singapore
SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Any questions, please contact [email protected]
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Upon completion of the course, participants should be able to:
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Pricing:
Any questions, please contact [email protected]