United States
MSIG Off Add to Calendar 2021-11-12 00:00:00 2021-11-12 00:00:00 Smart Cities and Sensors: How to Maximize the Opportunity and What NOT to do United States SEMI.org [email protected] America/Los_Angeles public 1
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For more information, contact [email protected].
Given the on-going China-U.S. trade tensions, companies have been moving production bases to Vietnam to diversify risk. At the same time, foreign Multinational Corporations (MNCs) have been setting up new manufacturing bases or expanding existing capacities. Vietnam’s political stability and a young, vibrant, and productive middle class, coupled with solid economic growth, means that the country is poised to become the next manufacturing hub of the world. Companies looking to invest in Vietnam can also take advantage of several Free Trade Agreements (FTAs), with many agreements signed through its membership in the Association of Southeast Asian Nations (ASEAN) and the recent RCEP.
The electronics industry, a priority sector set by the Vietnamese government, has impressively developed since 2010. Vietnam’s active participation in the global integration of electronics manufacturing has enabled it to engage deeply in global value chains. Today, Vietnam is a favourable investment hotspot for the electronics and semiconductor industry, with major MNCs having a manufacturing presence in the country. This webinar brings together speakers from the government, industry park developers, and major MNCs to provide an update on Vietnam’s investment climate, benefits of investing, and sharing of investors’ experiences. The goal is to promote and grow the electronics and semiconductor industry in Vietnam as a compliment to the entire Southeast Asian electronics and semiconductor eco-system.
Organized by SEMI Southeast Asia
Online via Zoom
Singapore
Vietnam is the third-largest market in Southeast Asia and rising to take its place as Asia’s new tiger. According to the World Bank, Vietnam’s estimated GDP growth rate of approximately 7 percent is three times higher than the world average and the second fastest in East Asia.
Join this 2 hours webinar to learn how you can promote, grow the electronics and semiconductor industry in Vietnam, and compliment the entire Southeast Asia’s electronics and semiconductor eco-system.
Admission: SGD30 (Member) / SGD50 (Non-Member)
Contact: [email protected] for any questions
Subhadra Sampathkumar
Subhadra Sampathkumaran, M.S. in Computer Science, is a Software Engineering Manager at Intel Corporation with over 20 years of experience leading digital transformation, data engineering, and automation across global semiconductor fabs. She has built and scaled solutions spanning software architecture, advanced analytics, manufacturing operations, big
data integration, IoT, workflow automation, and agentic AI, helping improve efficiency, reduce costs, enhance operational resilience, strengthen compliance, and enable predictive maintenance, lights-out manufacturing, and real-time decision support. Passionate about orchestrating intelligence across facilities and sub-fabs, she envisions a future where maintenance and operations evolve from reactive, time-based models into adaptive, anticipatory ecosystems that redefine reliability engineering.
Sean Tropsa
Sean Tropsa began his career as an engineer in the semiconductor manufacturing industry, where he developed expertise in large-scale data analysis, root cause analysis, and process optimization. As Head of Technical Solutions, Growth Markets at Seeq, he helps semiconductor customers use analytics and AI to turn data into business value, supporting sustainability goals while improving reliability, yield, and quality. Sean earned BS and MS degrees in Chemical Engineering from Arizona State University.
United States
Learn how Intel is using agentic AI-supported workflows in Seeq to transform maintenance operations across its global semiconductor manufacturing footprint. With thousands of critical assets across multiple sites, Intel is projecting 30% faster anomaly detection in ultrapure water systems, a 15-20% reduction in technician workload through autonomous work order generation, and more than 120,000 labor hours saved annually.
These results are powered by a shift from time-based and alarm-driven maintenance to condition-based operations. Intel leverages Seeq to continuously monitor asset health, detect abnormal conditions earlier, forecast maintenance needs, generate work orders, and provide engineers with actionable context. By codifying the expertise of its global engineering and operations teams into scalable workflows, Intel is extending institutional knowledge across facilities, improving consistency, and accelerating action. With human oversight built into every step, Intel is on a practical, governed journey toward semi-autonomous maintenance operations.
This session will explore real-world applications in ultrapure water and compressor maintenance and share practical lessons for implementing agentic AI at scale, including governance, repeatability, and scaling AI-driven reliability programs across a global manufacturing enterprise.
By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.
This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers.
Ilya Zabelinksy
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Singapore
SEMI U StandardsSubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends.
* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].
By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.
This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers.
Ilya Zabelinksy
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI U StandardsSubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends.
* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Upon completion of the course, participants should be able to:
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Singapore
SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Any questions, please contact [email protected]
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Upon completion of the course, participants should be able to:
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Pricing:
Any questions, please contact [email protected]
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Upon completion of the course, participants should be able to:
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Singapore
- SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
SEMI Members: $75
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $149
Students: Free
Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.
High-temperature materials are critical for applications in harsh-environment circuitry, where devices must operate reliably under extreme thermal, chemical, and mechanical stress. In this Master Class, Dr. Shenqiang (Shen) Ren will present a high-throughput ink materials development strategy enabled by non-equilibrium processing and hybrid additive manufacturing. This approach enables rapid synthesis, combinatorial screening, and direct integration of functional materials onto diverse substrates. The resulting materials exhibit strong electrical performance, robust adhesion, and long-term stability under harsh operating conditions. This high-throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, providing a versatile pathway toward next-generation printed electronics designed for extreme environments.
ABOUT THE SPEAKER
Shenqiang (Shen) Ren, PhD
Dr. Shenqiang Ren is a Professor of Materials Science and Engineering at the University of Maryland, College Park, with research interests in emerging functional and structural materials. He received his Ph.D. in Materials Science and Engineering from the University of Maryland, College Park, and subsequently completed postdoctoral training at the Massachusetts Institute of Technology (MIT).
United States
Join us for a focused Master Class with Dr. Shenqiang (Shen) Ren, exploring the development of high‑temperature materials for harsh‑environment printed and flexible hybrid electronics (FHE). This session will examine how devices can be engineered to operate reliably under extreme thermal, chemical, and mechanical stress—conditions where conventional materials and processes often fail.
The Master Class will also highlight how this high‑throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, offering a versatile pathway toward next‑generation printed electronics designed for extreme conditions.
This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Dr. Terry Alford
PT International LLC
Biography
United States
Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets.
Early Bird Pricing $100 off
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
