This exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.
Times
2 Sessions available for global business hours:
EMEA: April 1, 2025 - 5:00-5:45 pm CET
America: April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific Time
Asia Pacific: April 2, 2025 8-8:45 am Singapore
Navigating Climate Risk in the Semiconductor Value Chain
Metrics, Tactics & Strategies
Off
Add to Calendar2025-04-01 00:00:002025-04-02 00:00:00Navigating Climate RiskThis exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.Times2 Sessions available for global business hours:EMEA: April 1, 2025 - 5:00-5:45 pm CETAmerica: April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific TimeAsia Pacific: April 2, 2025 8-8:45 am Singapore United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Session #1 – Overview of Agentic AI in Semiconductor Manufacturing
The session introduces Agentic AI and its applications in semiconductor manufacturing, addressing critical challenges like defect detection, yield enhancement, and process variability. Through real-world case studies, it will demonstrate how AI-driven solutions can significantly improve in fab efficiency and accuracy. The discussion will highlight the transformative potential of Agentic AI in optimizing semiconductor production, setting the stage for deeper exploration in future discussions.
Keynote Speaker - Industrial Co-Pilots and Agentic AI
9:55 am
-
10:25 am
Coffee Break
10:25 am
-
10:55 am
Michael Passow
AI/ML Leader for IBM Semiconductors
IBM
Real World Manufacturing Applications
10:55 am
-
11:25 am
Garrett Schlenvogt
VP, Worldwide Field Applications Engineering
Silvaco
Leveraging Physics-Based Digital Twins for Efficient Semiconductor Manufacturing
11:25 am
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11:45 am
Sean Tropsa
Principal Solution Consultant
SEEQ
Sponsor Presentation - SEEQ
11:45 am
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12:15 pm
Panel Discussion
12:15 pm
-
1:15 pm
Lunch
Afternoon, Day 1: June 11, 2025
1:15 pm
-
5:15 pm
Session #2 – Process Control with Agentic AI
The session will focus on leveraging Agentic AI for process optimization, including Smart FDC, YMS, ML Ops, and recipe optimization. Key topics will include look-ahead scheduling, line balancing, virtual metrology, and smart inspection strategies. Energy and gas management strategies are highlighted alongside AI-driven sampling optimization. Practical methods for seamlessly integrating AI into existing manufacturing systems will be explored, with an emphasis on streamlining operations to achieve autonomous manufacturing.
1:15 pm
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2:00 pm
Jon Herlocker
VP & General Manager of Tignis, a Cohu Analytics Solution
Tignis
Keynote Speaker - Agentic AI in Process Control: A Practical Roadmap for Fab Transformation
2:00 pm
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2:30 pm
Christopher Nguyen
CEO & Co-Founder
Aitomatic
Autonomous Process Control & Optimization
2:30 pm
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3:00 pm
Brendon Choe
VP of Technology
Gauss Labs
Purpose-Specific Automatic Learning Machine for Fab-Wide Virtual Metrology
3:00 pm
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3:30 pm
Coffee Break
3:30 pm
-
4:00 pm
John Bongaarts
Applied AI Consultant
Soliton Technologies
AI Agents as Troubleshooting Partners & Knowledge Managers
4:00 pm
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4:30 pm
Dr. Holland M. Smith III
Director of Data Science
INFICON
Automate the Mundane or Achieve the Incredible (or Both): The Dawn of Agents in the Fab
4:30 pm
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5:00 pm
Panel Discussion
5:00 pm
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5:15 pm
John Behnke
Smart Manufacturing GM
INFICON
SEMI Smart Mfg NA Chapter introduction with the Smart Mfg Roadmap pyramid
5:15 pm
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7:15 pm
Networking Dinner Reception
Sponsored by SEEQ
Morning, Day 2: June 12, 2025
8:00 am
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9:00 am
Registration & Breakfast
9:00 am
-
1:00 pm
Session #3 – Predictive Maintenance in Semiconductor Fabs
The session will highlight the use of Agentic AI for equipment health monitoring and predictive maintenance in fabs and sub-fabs, exploring benefits such as cost savings, improved uptime, and enhanced operational efficiency. Key topics will include smart maintenance, prognosis health monitoring, anomaly detection and techniques for estimating the remaining useful life (RUL) of equipment. The session will emphasize AI's role in optimizing maintenance practices.
9:00 am
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9:30 am
Pugal Janakiraman
Global Manufacturing CTO
Snowflake
Keynote Speaker – Agentic AI for Industry 4.0 (Smart Manufacturing)
9:30 am
-
10:00 am
David Meyer
CEO
Lynceus
From Engineer Assistant to Virtual Engineer
10:00 am
-
10:30 am
Kiran Karunakran
CTO
Via Automation
AI Agents for Factory Maintenance: Using Factory Data for Automated Decisions
10:30 am
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11:00 am
Coffee Break
11:00 am
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11:30 am
Mayurakshi Dutta
Director Industry Advisor Semiconductor Industry
Microsoft
Predictive Maintenance in Semiconductor Fabs
11:30 am
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12:00 pm
David Duval
Edwards
Enhancing Predictive Maintenance Algorithms through Equipment Failure Analysis
12:00 pm
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12:30 pm
Maryia Kurdina
AI R&D Group Leader
Tokyo Electron Limited Technology and AI Design
AI agents in a few-shot learning for autonomous fault detection and prediction in semiconductor fabrication
12:30 pm
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1:00 pm
Viraj Modak
Sr. Solutions Architect
Nvidia
Vineeth Kalluru
Senior Solutions Architect - Generative AI
Nvidia
Building observable and scalable Multi Agent Workflows for Predictive Maintenance
1:00 pm
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2:00 pm
Lunch
Afternoon, Day 2: June 12, 2025
2:00 pm
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5:00 pm
Session #4 – Data Integration & Supply Chain
Efficiency in supply chains can be significantly enhanced by deploying AI agents for fundamental tasks such as factory-level planning, floor scheduling, real-time dispatching, and monitoring manufacturing processes at remote or contract facilities. These agents can quickly issue alerts for variations in yields or shipping schedules, taking corrective actions, such as expediting or rerouting shipments to prevent delays. Given the complexity of extended global supply chains—especially those involving multiple fabrication, assembly, and testing cycles compounded by chiplet production and advanced packaging—AI agents substantially improve coordination and operational efficiency.
2:00 pm
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2:30 pm
Paul Schneider
Principal Engineer, Director
Intel
Agentic AI in Factory Planning & Scheduling Digital Twin Solutions
2:30 pm
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3:00 pm
Jeff David
VP of AI Solutions
PDF Solutions
Data Integration & Supply Chain - Challenges & Opportunities
3:00 pm
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3:30 pm
Sunil Pandit
Senior Director
Accel4
Orchestrating Data for Agentic AI: Transforming Semiconductor Manufacturing
3:30 pm
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3:45 pm
Coffee Break
3:45 pm
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4:15 pm
Sebastian Steele
Product Director
Flexciton
Agentic AI and Advanced Optimization for Production Planning and Scheduling
4:15 pm
-
4:45 pm
Itzik Gilboa
CEO
Minds.ai
Multi-Agent Reinforcement Learning and Tool Processing Time Prediction for Optimized Semiconductor Manufacturing
This workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge.
Agentic AI For Next-Generation Semiconductor Manufacturing
In-Person Training
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Add to Calendar2025-06-11 00:00:002025-06-12 00:00:00Agentic AI For Next-Generation Semiconductor ManufacturingThis workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge.Milpitas, CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Registration—SOLD OUT!
This webinar will feature the authors and analysts of the recently released report "Toward a Shared View on the Climate Impact of Digital Technology" exploring the positive climate impact of digital technology and how to calculate when understanding any organizations footprint. They will explain the role of the semiconductor industry, in particular, in shaping a more sustainable future and how to account for that in emissions calculations. Download the report here.
Calculating the Climate Impact of Digital Technology
A Webinar
8:00 am - 9:00 am
Off
Add to Calendar2025-03-25 08:00:002025-03-25 09:00:00Quantifying the Positive Impacts of the ICT SectorThis webinar will feature the authors and analysts of the recently released report "Toward a Shared View on the Climate Impact of Digital Technology" exploring the positive climate impact of digital technology and how to calculate when understanding any organizations footprint. They will explain the role of the semiconductor industry, in particular, in shaping a more sustainable future and how to account for that in emissions calculations. Download the report here.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
With the world's growing reliance on semiconductor chips, the industry needs a more reliable solution to improve and innovate at a rapid pace while addressing manufacturing challenges such as temperature, chemistry, and mechanical issues.
One critical equipment in the industry is vacuum Pendulum Valves, a vacuum equipment incorporating plasma that are widely used in the semiconductor manufacturing process. The form, fit and function of these valves pose multiple challenges for the seals required in the valve's assemblies. Greene Tweed engineers have analyzed the most commonly used pendulum valves and broken down the various sealing challenges and have also created solutions to the challenges.
Join us to learn about the 6 W's—Who, What, When, Where, Why, & How—of these pendulum valve solutions.
Who—Anyone running a vacuum plasma chamber, etch and/or deposition
What—The pendulum valves, specifically the seals in the valve
Where—Every fabricator in the world
When—Now, as there are, tens of thousands that are currently operating
Why—The prevalent sealing challenges for pendulum valves
How—The sealing solutions and how we develop them, and the case study behind it to show in the 'How' part as well
Join our webinar where Greene Tweed engineers will discuss the most commonly used pendulum valves, the various sealing challenges and solutions to address them.
United States
Virtual Webinar | Tuesday, March 4, 2025 | Pacific Time
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Pacific Northwest Breakfast Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
Powering the AI Era: Infrastructure, Integration & Policy
There has never been a more pivotal moment for the semiconductor industry. As AI adoption accelerates across every sector, the demands on infrastructure, technology integration, and policy frameworks have intensified. Companies across the Pacific Northwest and beyond are navigating rapid capacity expansion, new technical challenges, and the workforce transformation required to support the AI era.
This year’s SEMI Pacific Northwest Breakfast Forum brings together leaders from industry, government, academia, and regional organizations to explore how we build the resilient, intelligent, and scalable semiconductor ecosystem the AI future requires.
Join us as we examine energy infrastructurereadiness, advanced packaginginnovation, economic signals, and regional workforce development initiatives—all essential to powering the next decade of growth.
Intel - RA1 2501 NE Century Blvd Hillsboro, OR97124 United States
7:30 am
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8:00 am
Check-In & Networking Breakfast
Host—Intel
8:00 am
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8:05 am
Damian Scandiffio
Co-Chair of SEMI Pacific Northwest Chapter
Acara Solutions
Matt Kleinke
Co-Chair of SEMI Pacific Northwest Chapter
Siltronic
SEMI Pacific Northwest Chapter Welcome Remarks
8:05 am
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8:15 am
David Bloss
Corporate VP, Technology & Manufacturing Group General Manager, Global Sourcing for Equipment and Materials
Powering the AI Era: Infrastructure, Integration & Policy
SEMI Pacific Northwest Chapter
In-Person | April 30, 2026
7:30 am - 11:15 am
Off
Add to Calendar2026-04-30 07:30:002026-04-30 11:15:00Pacific Northwest Chapter Breakfast Forum—Powering the AI Era: Infrastructure, Integration & PolicyOrganizer: SEMI Pacific Northwest ChapterHosted by IntelIN-PERSONIntel - RA1 2501 NE Century Blvd Hillsboro, OR 97124 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
2
The decisions made at the design stage of today's greenfield fabs will shape U.S. semiconductor performance for the next two decades. This webinar explores how organizations can move beyond traditional automation toward adaptive and ultimately autonomous fabs—starting with the foundational design of the built environment. Focusing on greenfield projects, Siemens experts will outline how early integration of power distribution, building systems, and automation technologies enables scalable, resilient, and future-ready facilities. Attendees will learn why designing autonomy requires a holistic approach—one that connects infrastructure, process, and production through a unified technology stack. The webinar will address challenges in adapting global fab designs to U.S. markets, highlighting the need for local expertise, regulatory alignment, and lifecycle planning. It will also explore how digitalization, predictive maintenance, and connected ecosystems drive efficiency in brownfield sites. Join the webinar and discover how to design facilities ready for autonomous, high-performance fabs.
Key takeaways: Shift from automation to autonomy starts with design Future fabs require rethinking the built environment upfront—not just layering automation later.
Early integration is critical for scalability and resilience Aligning power distribution, building systems, and automation from the start enables flexible, future-ready facilities.
A unified technology stack connects infrastructure to production Achieving autonomy depends on a holistic approach that links physical infrastructure, processes, and operations end-to-end.
Localization and lifecycle planning are key for U.S. fabs Adapting global designs requires navigating local regulations, leveraging regional expertise, and planning for long-term operations.
Digitalization drives performance across both greenfield and brownfield sites Technologies like predictive maintenance and connected ecosystems improve efficiency and enable continuous optimization.
This webinar is in collaboration with
United States
Virtual Webinar | Tuesday, August 25, 2025 | 11am Pacific Time
11:00 am
Ben Green
Senior Digitalization Consultant
Siemens Digital Industries
Matthew Hamilton
Semiconductor Market Leader
Siemens Smart Infrastructure
Opening Remarks
Early integration is critical for scalability and resilience
A unified technology stack connects infrastructure to production
Localization and lifecycle planning are key for U.S. fabs
Digitalization drives performance across both greenfield and brownfield sites
11:45 am
Q&A Session
12:00 pm
Closing Remarks
Ben Green
Ben Green is a Senior Digitalization Consultant at Siemens Digital Industries, where he leads strategic customer engagements focused on digital transformation and industrial innovation. He works with manufacturers to develop and execute digitalization strategies that integrate automation, control systems, and advanced software solutions. With nearly two decades of experience at Siemens, Ben has held a variety of customer-facing roles spanning sales, business development, and technical consulting. He previously led the Siemens Industrial Automation Solution Partner Program, collaborating with system integrators across the United States. Ben specializes in helping organizations define a clear vision for their digital future and translating that vision into practical, actionable steps that deliver measurable results. Ben holds a B.S. focused in Industrial Distribution from Texas A&M University.
Matthew Hamilton
Matthew Hamilton leads Siemens Smart Infrastructure's Semiconductor Vertical segment. A mechanical engineer by training, Matthew began his career in product development and manufacturing before spending a decade delivering complex energy and infrastructure programs at scale. His eight years at Siemens have centered on executive-level engagement with large-scale, mission-critical facilities where power resilience, decarbonization, and built-environment performance converge. His technical depth spans MV/LV power distribution, microgrid integration, solar and battery storage, central utility plants, building automation, fire and life safety, and enterprise digitalization — giving him a distinctive lens on how energy architecture and built-environment strategy shape fab performance, resilience, and the long path toward operational autonomy. Matthew holds a B.S. in Mechanical Engineering from the University of California Santa Barbara and an MBA in Finance from the Graduate School of Management at the University of California, Davis.
Register now to join the live webinar in collaboration with Siemens!
From Automated to Autonomous: Rethinking Fab Design for the Future
SIEMENS WEBINAR IN PARTNERSHIP WITH SEMI
11:00 am - 12:00 pm
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Register
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the SEMI Arizona Breakfast Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
Host—
Playbook for Winning
Arizona’s semiconductor ecosystem is at an inflection point—poised to transform rapid growth into sustainable global leadership. This forum convenes industry executives, policymakers and innovators to define strategies for making Arizona the premier global semiconductor resource. The SEMI Arizona Breakfast Forum is where Arizona’s semiconductor current and future playbook is defined, designed to mobilize leadership towards actionable strategies helping evolve Arizona’s semiconductor industry into an international winning playbook.
Arizona’s Rapid Rise as America’s Semiconductor Headquarters has attracted major global companies, with more than 60 expansions and over $200 billion in new investments since 2020, including TSMC, Intel, and ASM, all of whom are expanding operations or building new fabs in AZ due to strong business climate, strategic location and infrastructure. Statewide commitment through the Arizona Semiconductor Task Force, and the National Semiconductor Economic Roadmap (NSER) are enhanced by targeted incentives to attract companies and federal-state-industry alignments reinforce Arizona as a national leader in the next era of US semiconductor sovereignty.
Join Us at Edwards Vacuum's Facility in Chandler to Learn More About—
Building the Premier Semiconductor Hub
Powering the Ecosystem—Infrastructure as the Foundation
The right strategy is critical to success. Arizona’s must include water reliability, energy stability, long-term sustainability and cost-competitiveness. The game plan must include sustainable growth at the scale demanded by advanced nodes, packaging and AI-driven manufacturing.
Leading Regional & Global Supply Chain Resilience
Developing a World-Class Talent Team
Executive Panel Discussion—Investing in the Future: Capturing Long Range Goals
Questions?
Karen Popp—Sr. Program Manager, Programs & Committees [email protected]
Edwards Vacuum 2411 E. Germann Rd. Chandler, AZ95286 United States
Arizona is evolving from rapid expansion to ecosystem integration, ensuring every piece of the value chain connects efficiently. All the fundamental components, from research institutions to logistics and infrastructure partners to materials suppliers, packaging facilities to fabs are fundamental elements to this integration.
9:10 am
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9:40 am
Kathryn Sorensen, PhD
Director of Research & Professor of Practice, Kyl Center for Water Policy at Morrison Institute;
Senior Global Futures Scientist, Arizona State University
Powering the Ecosystem—Infrastructure as the Foundation - Water Resources
Arizona is leading the way in becoming the most resilient, efficient semiconductor hub in North America. Through diversified sourcing, regional collaboration, logistics optimization, and flexible, shock-resistant supply models, Arizona will lead the way. Deployment of automated mitigation workflows, enabling alternate-site activation and faster recovery. Strong emphasis on transparent supplier collaboration, including exchange of validated data across tiers down to parts and materials.
Arizona’s strategic success depends upon its ability to produce, attract, and retain top-tier semiconductor talent. This plan includes investment in semiconductor training programs, securing next-gen engineering talent, research partnerships, on-the-job R&D exposure, and providing retraining and upscaling pathways.
Investment in semiconductor training programs, securing next-gen engineering talent, research partnerships, on-the-job R&D exposure, and providing retraining and upscaling pathways.
Vice President, Architecture, Advanced Design and Customer Enabling, Technology Development
Intel
Richard Simoncic
Chief Operating Officer
Microchip Technology
Nasser Peyghambarian, PhD
Professor of Optical Sciences and Materials Science and Engineering
University of Arizona
Executive Panel Discussion: Investing in the Future—Capturing Long Range Goals
The winning strategy will continue to require accelerated investments in R&D, creating new labs and testing capabilities, advanced packaging pilot lines, next-gen university research facilities, and sustainable infrastructure. Arizona is positioned to attract investments and to remain a market leader in 2026, 2030, and beyond.
SEMI Breakfast Forum Organized by SEMI Arizona Chapter
In-Person | Arizona Time
Arizona Breakfast Forum
In-Person | May 6, 2026
7:30AM–12:30PM Arizona Time
7:30 am - 12:30 pm
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Add to Calendar2026-05-06 07:30:002026-05-06 12:30:00SEMI Arizona Breakfast ForumSEMI Breakfast Forum Organized by SEMI Arizona ChapterIn-Person | Arizona TimeEdwards Vacuum 2411 E. Germann Rd. Chandler, AZ 95286 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
2
NOTE: This webinar has been indefinitely postponed.
The FDA’s Center for Devices and Radiological Health (CDRH) launched the voluntary Total Product Life Cycle (TPLC) Advisory Program (TAP) Pilot to help spur more rapid development of high-quality, safe, effective, and innovative medical devices that are critical to public health. TAP’s primary goal is to expedite patient access to innovative medical devices by providing early, frequent, and strategic communications with the FDA and by facilitating engagement with other key parties for developers of devices of public health importance. To achieve this goal, a dedicated cadre of FDA TAP Advisors proactively provide solutions-focused engagement that is tailored to each TAP Innovator’s needs in advancing devices to market and patient access. In this seminar, FDA TAP Advisors will discuss this pilot program and provide participants input on when in their regulatory journey TAP may be an option for them.
ABOUT THE SPEAKERS:
Kimberly Knish, MS, CCRP, RAC Kimberly is a TAP Advisor within FDA’s Center for Devices and Radiological Health, Total Product Life Cycle (TPLC) Advisory Program (TAP). In this role, she establishes and cultivates a wide network of synergistic relationships across the entire medical technology innovation ecosystem and integrates ecosystem, sponsor, and lead reviewer input into strategic planning options intended to reduce stakeholder risk and maximize the opportunities of timely commercial rollout and sustainable patient access. She brings to the FDA 30 years of medical technology industry experience within clinical affairs, regulatory affairs, health economics, reimbursement and quality systems. She has been involved with all phases of medical device development (concept through obsolescence) involving device types from Class III implantables to wearables and remote monitors. Therapeutic expertise spans cardiovascular, nervous, digestive, endocrine, respiratory, and skeletal systems. Kimberly holds a B.A. degree in Biology from the College of St. Benedict, a M.S. degree in Management from Cardinal Stritch University and has professional certifications in clinical research (CCRP) and regulatory affairs (RAC).
April Marrone, PhD, MBA April is a Senior Advisor in the FDA/CDRH Total Product Lifecycle Program (TAP) since November 2023. Prior to her current role, April has served on the Obesity and Hepatobiliary Devices Team as the acting Assistant Director, Team Lead, Lead Reviewer, and chemistry consultant since 2014. In addition to supervisory, leadership, and medical device review responsibilities, April has promoted improvement in product manufacturing and quality through developing device specific FDA guidance documents, creating review tools to ensure consistency and quality in device review, and publishing external manuscripts on topics relevant to the FDA and industry on topics in the obesity and hepatobiliary device space. April has served as a Commissioner Fellowship Program (CFP) preceptor, mentor to new reviewers and advisors, and has developed and instructed Reviewer Certification Program courses.
Prior to joining CDRH in 2014, April was a Commissioner Fellow at FDA’s National Center for Toxicology Research (NCTR) and has served on the CFP Advisory Board. During her tenure at the NCTR, April did research to develop novel epigenetic approaches to safely assess the safety and carcinogenicity of FDA regulated products. Prior to joining the FDA, April was a post-doctoral scientist at the University of Pittsburgh, Children’s Hospital of Pittsburgh where she studied epigenetic regulation of congenital kidney disease in a mouse model. April also completed post-doctoral training at the Max Planck Institute for Biophysical Chemistry where she studied genetic and epigenetic regulation of neuromuscular disease. April has a PhD in Chemistry and BS in Physics from the University of Central Florida and an MBA from Florida Institute of Technology.
Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2025 SEMI EHS Summit.
Industry experts will present on the regulatory matters that will impact the industry in 2025 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing.
Topics will include:
US Regulatory Landscape under second Trump Administration and global impact
US EPA New Chemical Authorization Process
Europe: PFAS restriction, F-Gas restriction, GENESIS Consortium, REACH restriction, etc.
US EPA Technology Transition Rule
UN Plastics Treaty and related policies
US EPA TSCA New Substances of Concern
PFAS taxonomy
Overview of SEMI EHS activities, including SEMI PFAS Initiative
Attend, network and strategically prepare your company. This is an in-person event only.
EHS Summit 2025
Regulations, Rules, Allocations & Proposals
8:30 am - 3:30 pm
Off
Add to Calendar2025-02-11 08:30:002025-02-11 15:30:002025 EHS SummitPlan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2025 SEMI EHS Summit.Industry experts will present on the regulatory matters that will impact the industry in 2025 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. Topics will include:US Regulatory Landscape under second Trump Administration and global impactUS EPA New Chemical Authorization ProcessEurope: PFAS restriction, F-Gas restriction, GENESIS Consortium, REACH restriction, etc.US EPA Technology Transition RuleUN Plastics Treaty and related policiesUS EPA TSCA New Substances of ConcernPFAS taxonomyOverview of SEMI EHS activities, including SEMI PFAS Initiative Attend, network and strategically prepare your company. This is an in-person event only.SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
From Concept to Reality: Advancing Digital Twin in Semiconductor Manufacturing
This event is now sold out. Please register if you'd like to receive access to presentation materials.
SEMI Member: $225
Non-Members: $295
Cancellations received on or before November 17, 2023 will be fully refunded. After this date, only substitutions will be accepted.
Please email your cancellation request to Agnes Cobar at [email protected]. Refunds will not be issued for cancellations (including no-shows) made after November 17th, 2023.
Substitutes are only accepted with written permission from the original registrant.
Digital Twin technology has gained significant traction in a variety of industries and is now in its early stages of adoption by the semiconductor industry. In this workshop, we will hear from across the ecosystem (OEMs, Platforms, end users, and more) as to the various levels of Digital Twins needed, the development challenges, opportunities, and recommendations. The development of full tool or full-process level semiconductor digital twins is challenging but has the potential to significantly improve the productivity & quality of operations.
Primarily beneficial for developers, and end-users of DT’s to attend so that we can understand the challenges, and scope of development effort required to create and deploy such DT systems in manufacturing.
Hosted by the SEMI Smart Manufacturing Initiative.
SEMI HQ 673 S Milpitas Blvd. Milpitas, CA95035 United States
Morning, Day 1: December 4, 2024
8:00 am
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12:20 pm
Equipment Level Digital Twins (Equipment Makers)
Digital twins from equipment makers are virtual replicas of their physical products. They are created using data collected from sensors on the equipment, as well as from design and engineering drawings.
8:00 am
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9:00 am
Registration & Breakfast
9:00 am
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9:15 am
Mark Da Silva
SEMI
Welcome All
9:15 am
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9:40 am
Supika Mashiro
Sr. Expert/TEL, Co-chair of the IRDS Factory Integration IFT (Focus Team)
TEL
Emergence of Digital Twin technology in the IRDS Factory Integration focus roadmap
9:40 am
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10:05 am
Ala Moradien
Director, CAE Programs and Digital Twin Initiatives
Applied Materials
AppliedTwin™: A Digital Twin Platform for Semiconductor Manufacturing, Use Case in Sustainability
10:05 am
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10:30 am
Joe Ervin
Senior Director and Product Line Head, Semiverse™ Solutions
Lam Research
A Single Digital Twin for Semiconductor Manufacturing? Semiverse™ Solutions and Building the Digital Family
10:30 am
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10:45 am
Coffee Break
10:45 am
-
11:10 am
Sean Glazier
Software Engineer IV
Onto Innovation
Building a digital twin model is EASY. Getting the model deployed and used every day, now that’s the challenge
11:10 am
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11:35 am
Basil Milton
Senior Manager, Ball Bonder Process R&D
Kulicke & Soffa
Digital Twin Improvements for Wire Bond Process Optimization
11:35 am
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12:20 pm
Moderator
Mark Huntington
McKinsey
Open Forum/Panel/Breakout
12:20 pm
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1:30 pm
Lunch
Afternoon, Day 1: December 4, 2024
1:30 pm
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5:00 pm
Chamber Process, Operations & Planning Level Digital Twin (Solution Providers)
Solution providers offer a variety of products and services to help companies implement and manage digital twins (physics-based process models for components or sub-systems).
1:30 pm
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1:55 pm
Sarbajit Ghosal
Lead Research Engineer
SC Solutions, Inc.
Fast, Physics-based Models for Real-time Process Control And Monitoring
1:55 pm
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2:20 pm
Norman Chang
Ansys/IEEE Fellow and Chief Technologist of Electronics, Semiconductor, and Optics BU
Ansys Inc.
Enabling ML-augmented Digital Twin for Semiconductor Manufacturing
2:20 pm
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2:45 pm
Holland Smith
Director of Technical Marketing, INFICON IMS (Intelligent Manufacturing Systems)
INFICON
The Operations Digital Twin: Why Every Factory Needs One, and Why Many Don't Have One (Yet)
2:45 pm
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3:00 pm
Coffee Break
3:00 pm
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3:25 pm
Chandra Reddy
Senior Technical Staff Member, AI Applications
IBM Research
Generative AI enabled Digital Twins
3:25 pm
-
3:50 pm
Jon Herlocker
Founder & CEO
Tignis
Practical Machine Learning Applications for the Process Modelling and Optimization of Manufacturing Process Tools and Process Lines
3:50 pm
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4:15 pm
Ken Smerz
CEO
Zelus
Digital Twin Creation and Application
4:15 pm
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5:00 pm
Moderator
John Behnke
GM FPS Product Line
INFICON
Open Forum/Panel/Breakout
5:00 pm
-
7:00 pm
Networking Reception
Morning, Day 2: December 5, 2024
8:00 am
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12:20 pm
DT Adoption & Implementation (Device Makers)
As a device maker, a digital twin is a critical tool for improving productivity, quality, and efficiency. A digital twin is a virtual representation of your physical devices or fab, and it can be used to simulate and optimize operations.
8:00 am
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9:00 am
Breakfast
9:00 am
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9:05 am
Mark Da Silva
SEMI
Day 2 - Welcome
9:05 am
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9:30 am
Prof. Phillip Wong
Professor of Electrical Engineering, Willard R. and Inez Kerr Bell Professor in the School of Engineering Stanford University
Stanford
A Vision for the Future Semiconductor Fab
9:30 am
-
9:55 am
Steven J Meyer
General Manager and Sr. Principal Engineer, Advanced Industrial Systems
Intel Corporation
High Value from Digital Twins in Semiconductor Manufacturing
9:55 am
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10:20 am
Jae Y. Park
VP of Technology
Samsung
AI Powered Digital Twin: Transforming Smart Manufacturing
10:20 am
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10:45 am
Coffee Break
10:45 am
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11:10 am
Rosa Javadi
Principal Engineer
Jabil
Smart Manufacturing Technology for Complex Integrated Systems
11:10 am
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11:35 am
Amit Lal
Professor
Cornell University
Peter Doerschuk
Professor
Cornell University
Ben Davaji
Assistant Professor
Northeastern University
Digital Twin Frameworks for an Academic Research and Development Cleanroom
11:35 am
-
12:20 pm
Moderator
Bobby Mitra
Deloitte
Open Forum/Panel Discussion - Developing Full Process Level Digital Twin – Challenges
12:20 pm
-
1:30 pm
Lunch
Afternoon, Day 2: December 5, 2024
1:30 pm
-
5:00 pm
DT Connectivity and Platform Integration (Cloud, Facilities, & Supply Chain)
Solution providers offer a variety of products and services to help companies implement and manage digital twins including integration, connectivity, & security including horizontal integration across the supply chain.
1:30 pm
-
1:55 pm
Rad Desiraju
Director , WW Industry Advisory
Microsoft
Unlocking Innovation with Digital Twins
1:55 pm
-
2:20 pm
Gautham Unni
Head of Solutions & Business Development (Semiconductor)
AWS
Accelerate your Digital Twin journey with AWS
2:20 pm
-
2:45 pm
David Gross
Portfolio Development Executive, Manufacturing Digitalization, Semiconductor Industry
Siemens
Srividya Jayaram
Principal Product Engineering ManagerSiemens EDA
Siemens EDA
Siemens: Accelerating technology From Design to HVM
2:45 pm
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3:00 pm
Coffee Break
3:00 pm
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3:25 pm
Slava Libman
CEO
FTD Solutions INC
Digital Twins Enabling Environmental Sustainability
3:25 pm
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3:50 pm
Becky Kelderman
Manager
Rockwell Automation
The Nimble Supply Chain with Digital Twin
3:50 pm
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4:15 pm
Ram Walvekar
VP and PLM Head, Digital Transformation Unit
HCL Technologies
Integrated Cognitive Digital Twin for Semiconductor Equipment
4:15 pm
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5:00 pm
Paul Trio - Moderator
SEMI
Required Standards for Digital Twin Technology - Open Forum/Panel/Breakout
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Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities, and discover its transformative power in enhancing operational productivity and quality. Calling all DT developers and end-users: collaborate, learn, and pave the way for DT's integration into manufacturing!
This event is now sold out. Please register if you'd like to receive notifications about available spaces or access to presentation materials.
From Concept to Reality: Advancing Digital Twin in Semiconductor Manufacturing
[IN-PERSON EVENT]
December 4-5, 2024
8:00 AM – 5:00 PM PT
8:00 am - 5:00 pm
Off
Add to Calendar2024-12-04 08:00:002024-12-05 17:00:00From Concept to Reality: Advancing Digital Twin in Semiconductor ManufacturingJoin us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities, and discover its transformative power in enhancing operational productivity and quality. Calling all DT developers and end-users: collaborate, learn, and pave the way for DT's integration into manufacturing!
This event is now sold out. Please register if you'd like to receive notifications about available spaces or access to presentation materials.SEMI HQ 673 S Milpitas Blvd. Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
On-demand