Wet-Etch Solutions Development for Advanced Node Devices
ABSTRACT
Wet etch applications are experiencing increased usage and are pivotal to ongoing integration improvements for leading edge 3D NAND, DRAM, and Logic structures. Our talk will cover the performance drivers for molybdenum, silicon germanium, and high selective nitride based etching applications. The complexities of advanced device integration are solved through deep market technology knowledge and digitally-driven research to provide integration-customized etching products.
BIOGRAPHY
Steve received his Ph. D. in Inorganic Chemistry from Purdue University in 2012 as a Robert R. Squires Fellow synthesizing and studying uranium organometallic compounds, and his B.S. in Chemistry from St. Norbert College in 2008. In early 2014, Steve completed a postdoctoral research position at Argonne National Laboratory studying heterogeneous and homogeneous transition metal catalysts in the catalysis group in the Chemical Sciences and Engineering division. He joined Cabot Microelectronics (now Entegris) as a slurry formulation scientist in 2014. Since that time Steve has held roles as a formulator, particle designer, chief solution designer, manager, Director of CMP R&D, and most recently, Director of specialty gas and etch R&D.