downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

South Korea

South Korea Learn More sk-2026 Business Executive Expositions Technical Training

Seoul
South Korea

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development

TRANSFORM TOMORROW

The future of the semiconductor industry starts here.
Join us at SEMICON Korea 2026 to shape tomorrow together.

 

Hours

  • February 11, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 12, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 13, 2026 | 10:00-16:00 (Last entry 15:30)

Venue

  • COEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)
  • Westin Seoul Parnas
  • Grand InterContinental Seoul Parnas

Scale

  • 550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)
Off Add to Calendar 2026-02-11 00:00:00 2026-02-13 00:00:00 SEMICON Korea 2026 TRANSFORM TOMORROWThe future of the semiconductor industry starts here.Join us at SEMICON Korea 2026 to shape tomorrow together. HoursFebruary 11, 2026 | 10:00-17:00 (Last entry 16:30)February 12, 2026 | 10:00-17:00 (Last entry 16:30)February 13, 2026 | 10:00-16:00 (Last entry 15:30)VenueCOEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)Westin Seoul ParnasGrand InterContinental Seoul ParnasScale550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths) Seoul South Korea SEMI.org [email protected] America/Los_Angeles public
Event format
Promote in calendar
Off

REGISTRATION

Registration
  • Early-bird Registration Close: 3 pm, Friday, May 12(KST)

Registration Fee

  • Early Bird (~ May 12)
    • SEMI Member: KRW 280,000
    • Non Member: KRW 330,000
  • On site
    • SEMI Member/ Student : KRW 330,000
    • Non Member: KRW 380,000

※ Group registration fee applies if more than 5 people are registered from one company. Please contact us by email ([email protected] ) for group registration.

Registration
South Korea Register Now SMC-Korea-2023-Banner_2023.03.14_square.jpg Business Technical

OVERVIEW

  • Date: May 17(Wed), 2023
  • Time: 09:00 - 17:30
  • Venue: Convention Hall 2, Suwon Convention Center

 

SPONSORS

SMC-Korea-2023-Sponsor_DW.jpg SMC-Korea-2023-Sponsor_DP.jpg SMC-Korea-2023-Sponsor_WM.jpg SMC-Korea-2023-Sponsor_MC.jpg
SMC-Korea-2023-Sponsor_LC.jpgSMC-Korea-2023-Sponsor_KT.jpgSMC-Korea-2023-Sponsor_ET.jpgSMC-Korea-2023-Sponsor_JSR.jpg
SMC-Korea-2023-Sponsor_AC.jpg SMC-Korea-2023-Sponsor_DS_0.jpg SMC-Korea-2023-Sponsor_SM_0.jpg SMC-Korea-2023-Sponsor_CO_1.jpg

line_2.jpg

 

line_6.jpg

NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Convention Hall 2, Suwon Convention Center
Suwon-si
Gyeonggi-do
South Korea

9:00 am - 9:05 am

Welcome

Keynote

9:05 am - 9:35 am
1_Namsung Kim_Applied Materials_Abstract_Biography_SMC Korea 2023.jpg
Namsung Kim
Senior Director
Applied Materials

GAA(Gate-All-Around) technology to enable continuous CMOS transistor scaling for energy efficient computing solution

Namsung Kim is a Senior Director in the Integrated Module Solutions (IMS) Group at Applied Materials. He is currently responsible for managing customer engagement programs, driving business growth, and leading cross-functional teams (various Business Units) to deliver the integrated materials/modules-base product solutions across leading-edge CMOS Logic and Memory technologies. Prior to this role, he has successfully led & accomplished the definition of CMOS Logic technology roadmap, its inflections of future technology nodes and delivered multiple product development paths by validating innovative pathway solutions.

He joined Applied Materials, Inc., USA in 2015, bringing over 20 years of semiconductor device/process integration experiences (various engineering/management positions) from both CMOS Logic (GlobalFoundries/IBM alliance in USA and SSMC in Singapore) and Memory (SK-Hynix, previously LG Semi., in Korea) industries. He earned a MS in electrical and computer engineering from the National University of Singapore. He has authored and co-authored more than 50 technical publications and holds over 40 patents in the field of advanced logic (FinFETs and GAA devices) and memory technologies.

※ Abstract

9:35 am - 10:05 am
Jeongdong Choe5.PNG
Jeongdong Choe
Senior Technical Fellow
TechInsights

Market & Technology Trends for Memory Devices including Materials

Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights. He has over 30 years of experience in the semiconductor industry, R&D, and reverse engineering on DRAM, NAND/NOR FLASH, SRAM/Logic, and Emerging Memory. He worked for SK Hynix and Samsung Electronics for over 20 years. He joined TechInsights and has been focusing on technology analysis of semiconductor processes, materials, devices, and architecture. He has written many articles on memory technology including roadmaps, technology trends, and detailed comparisons.

※ Abstract

10:05 am - 10:35 am
Profile.jpg
Inji Yeom
Associate Partner
Mckinsey & Company

Global Supply Chain

10:35 am - 10:50 am

Break

Session 1: Advanced Materials for Enabling Next-Generation Devices

10:50 am - 11:15 am
4_JMG_Air Liquide_Abstract_Biography SMC Korea 2023.jpg
Jean-Marc Girard
CTO and Sr. VP
Air Liquide

Precursors for Memory

Jean-Marc Girard Ph.D. is CTO and Sr. VP of Manufacturing Technologies at Air Liquide Advanced Materials (ALAM), and an Air Liquid Group Fellow. He has 25 years of experience of R&D and product development management in the field of semiconductor materials and process technology in Europe, Japan and the US, and is one of the founders and was the global director of ALOHA™ from 2005 to 2010 (Air Liquide’s original CVD/ALD materials product line).
Within ALAM, Jean-Marc globally manages the Research and Development for deposition & advanced dry etching materials, oversees strategic engagements and collaborations with leading customers and equipment companies, and supervises the Intellectual Property generation and portfolio management. Since 2021, Jean-Marc’s role has expanded to leading packaging and manufacturing technology developments efforts.

11:15 am - 11:40 am
5_Byunghee Kim_Lam Research_Abstract_SMC Korea 2023.jpg
Andy Kim
Sr. Director
Lam Research

Materials Trends in Semiconductor Manufacturing

“Byunghee Kim” has been Sr. Technologist in Lam Research since 2017.

Prior to joining Lam Research, “Kim” was director position for Samsung Electronics. During his 23 years at Samsung Electronics, “Kim” spent time doing module development, including gate, contact and BEOL.

“Kim” received a bachelor’s degree in chemistry from Yonsei Univ., Seoul, Korea and a master’s degree in MSE from Seoul Nat’l Univ., Seoul, Korea.

※ Abstract

11:40 am - 12:05 pm
6_Jeongsik Kim_Dongjin Semichem_Abstract_Biography_SMC Korea 2023.jpg
Jeongsik Kim
Genaral Manager
Dongjin Semichem

CAR Type EUV Resist Performance Improvement

Jeongsik Kim, received a MS degree in Organic Synthetic Chemistry from Sogang University(Korean) in 2006 and then joined Dongjin Semichem. He had developed the patterning process materials such as bottom antireflective coating(BARC), spin on hardmask(SOH), photoresist materials in Semiconductor Materials Business Division since 2006. In 2013, he had joined the advanced lithography program of IMEC(Belgium) as Dongjin Semichem assignee and researched the ArF immersion patterning and defectivity for two years. Currently, he is in charge of developing EUV photoresist at Dongjin Semichem.

※ Abstract

12:05 pm - 1:30 pm

Lunch

Session 2: GWP

1:30 pm - 1:55 pm
7_Sung Ho Kim_Merck_Abstract_Biography_SMC Korea 2023.png
Sung-Ho Kim
Head of Global Marketing
Merck KGaA, Darmstadt, Germany

Material Innovation for low-GWP Gas Development

Sung Ho Kim is the Head of Specialty Gases Marketing, Clean & Etch platform, Merck KGaA, Darmstadt, Germany where he drives the execution of product marketing strategy to meet with industry’s dry etch and chamber clean gas technical and commercial needs, and leads product life cycle management and NPI (New product introduction) initiatives to help customers to advance its dry etch and chamber clean process performance. He is a proven business leader with more than 20 years of experience in the semiconductor materials industry, with a wide range of leadership experience in product marketing, product management, and technical/engineering expertise. He is based in Pangyo, Korea. Sung-Ho received a bachelor's degree in Chemical Engineering from Seoul National University.

※ Abstract

1:55 pm - 2:20 pm
8_WonSeob Cho_BASF_Biography_SMC Korea 2023.jpg
WonSeob Cho
Head of BASF Electronic Materials R&D Center in Suwon
BASF

Aiming CO2 neutrality – Sustainable Solutions for IC Applications

Won-Seob Cho, Ph.D. presently serves as the Head of the BASF Electronics Materials R&D Center in Suwon, Korea. In this esteemed position, he is responsible for leading research teams dedicated to the development of advanced wet chemical solutions, such as advanced cleaning and electroplating methods. He boasts over 20 years of research and development experience, particularly in the formulation and electrochemical screening of solutions.

Prior to joining BASF a decade ago, He served as a Principal Researcher at Samsung SDI and Samsung Fine Chemicals, where he specialized in developing planarization and electroplating solutions. Notably, his research interests have recently expanded to encompass the Advanced Package field.

Won-Seob Cho holds a distinguished Ph.D. in Chemistry from the University of Texas at Austin and has also served as a postdoctoral fellow in Supramolecular Chemistry at the University of California at Los Angeles, further solidifying his scientific expertise.

※ Abstract

2:20 pm - 2:45 pm
9_Sang Uk Nam_KIET_Abstract_Biography_SMC Korea 2023_nam sanguk.jpg
Sang Uk Nam
Associate Research Fellow
KIET

Carbon Neutral Strategy of Korean Government and Role of Material Companies

Dr. Nam, Sang Uk is conducting various studies on the ICT (semiconductor, display) industry based on economics at the KIET (Korea Institute of Industrial Research), a national research institute.

Since joining the KIET in 2018, he has participated in various studies on ICT industry policies such as Japanese export regulations, development strategy of material, parts and equipment, global value chain, and digital transformation.

In the field of carbon neutrality, he participated in major reports such as the semiconductor and display industry's carbon neutral promotion strategy and policy tasks, and the impact of RE100 on Korea's major export industries.

※ Abstract

Session 3: Market Trends

2:45 pm - 3:10 pm
S4-1_Mark Thirsk.jpg
Mark Thirsk
Managing Partner
Linx Consulting

Materials still matter. Trends in materials demand and supply.

Mark Thirsk is Managing Partner of Linx Consulting, a leading management and strategic consulting company for electronic materials.

Mark Thirsk has experience spanning many materials and processes in wafer fabrication, combined with economic and business forecasting, strategic planning, technical marketing and M&A experience. Mark has worked in materials and equipment development, marketing, applications support, and production, as well as having expertise in business incubation, strategic development, and M&A. Mark is well placed to bring clarity and insight to market analysis from both a technical and commercial perspective. Additionally, Mark has been active in SEMI since 1999, volunteering in industry advocacy, education, and recruiting.

Mark has worked in the UK, Germany, Belgium, and the USA. Mark holds an Honours B.Sc. in Metallurgy and Materials Science from Birmingham University and an MBA

※ Abstract

3:10 pm - 3:35 pm
S6_TechSearch_E. Jan Vardaman(CFP)_picture.jpg
E. Jan Vardaman
President & Founder
TechSearch International

Advanced Packaging Technology & Market Trends

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow. She is a member of MEPTEC, SMTA, and SEMI. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

3:35 pm - 3:50 pm

Break

Session 4: Collaboration

3:50 pm - 4:20 pm
blank
Sungsu Kim
Project Leader
SK hynix

Advanced Packaging Material for Semiconductor

4:20 pm - 4:50 pm
13_Sam-Jong Choi_Samsung Electronics_Abstract_Biography_SMC Korea 2023.png
Samjong Choi
Corporate VP / Group Leader
Samsung Electronics

Re-visioning Material Technology for Sustainable Resource Utilization and Supply Chain

Sam-Jong Choi, Ph.D. has been working as a material expert at Samsung Electronics Semiconductor for over 30 years. He joined the company in 1991 and has been responsible as a material engineer and expert for Memory Manufacturing Technology Center in Samsung Electronics by now. He obtained a Ph.D in Electronic, Computer, and Telecommunication Engineering from Hanyang University in 2020.
In 2019, he was promoted to Group Leader for Memory Material Technology Group, where he oversaw the development of new materials and quality management for Samsung Electronics. In 2020, Samjong Choi was appointed as an Corporate VP at Samsung Electronics, where he continues to play a key role in the field of semiconductor material.
As an experienced engineer and leader, he brings a wealth of knowledge and expertise to his current role, making Samsung Electronics stay at the forefront of technological innovation in the global semiconductor material industry.

※ Abstract

4:50 pm - 5:30 pm

Networking Reception

APHI EMG

Semiconductor Materials for Sustainable Future

In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts!

Off Add to Calendar 2023-05-17 00:00:00 2023-05-17 00:00:00 SMC Korea 2023 Semiconductor Materials for Sustainable Future In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together. SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts! Convention Hall 2, Suwon Convention Center Suwon-si Gyeonggi-do South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
Event format
Promote in calendar
Off

글로벌 전자산업 공급망을 대표하는 산업 협회인 SEMI팹 전망 보고서(World Fab Forecast)’에 따르면 급격하게 증가하는 통신, 컴퓨팅, 헬스케어, 온라인 서비스, 차량용 반도체 등의 수요를 충족하기위해 올해 말까지 19개의 신규 팹이 착공되며, 2022년에는 10개의 팹이 추가로 더 착공될 것으로 보인다.

SEMICEO인 아짓 마노차(Ajit Manocha) "세계적인 칩 부족 문제를 해결하기위해 신설될 29개 팹의 장비 투자액은 향후 몇 년간 1,400억 달러를 넘어설 것으로 예상된다.”고 말했다. 이어 그는 "중장기적으로 전 세계 팹의 생산력 확대는 자율주행차, 인공지능, 고성능 컴퓨팅, 5G~6G 통신 등 새로운 애플리케이션에 따른 반도체 수요 증가에 부응할 것"이라고 덧붙였다.

2022년까지 중국과 대만에 각각 8, 북미 6, 유럽 및 중동 3, 일본과 한국에 각각 2개의 팹이(29) 착공될 예정이다. 300mm 웨이퍼를 생산하는 팹은 2021 15, 2022년에는 7곳이 착공에 들어간다. 나머지 7개의 팹은 100mm, 150mm, 200mm 웨이퍼를 생산하는 팹이다. 2022년까지 착공에 들어가는 팹의 전체 생산량은 월간 260만장 웨이퍼(200mm 웨이퍼 면적 기준)에 달할 것으로 전망된다.

그림1.jpg

 

2021년부터 2022년까지 착공되는 29개의 팹 중 15개는 파운드리 팹이며 200mm웨이퍼 기준 월간 생산량은 웨이퍼 3만에서 22만장 수준이다. 메모리 팹은 4개가 건설될 예정이며 200mm 웨이퍼 기준 월간 생산량은 10만에서 40만장 수준이다.

착공 후에 반도체 장비 설치까지는 보통 2년이 소요되기 때문에 올해 착공을 시작하는 팹 중 대다수는 2023년까지 반도체 장비 도입이 시작하지 않을 것으로 보인다. 하지만 일부 팹에는 이르면 내년 상반기부터 반도체 장비가 설치될 것으로 전망된다.

SEMI의 팹 전망 보고서에 따르면 내년에는 10개의 팹이 착공될 예정이지만 이 숫자는 칩 메이커의 결정 여부에 따라 더 증가할 수도 있다. 건설 예정인 팹의 생산량, 제품, 기술 등에 대한 자세한 내용은 SEMI 팹 전망 보고서를 통해 확인할 수 있다.

 

Brno, Czech Republic - July 10, 2026

Tescan, a pioneer in electron microscopy, announces the successful completion of its full acquisition by Shimadzu Corporation. As of July 7th, Tescan officially becomes a member of the Shimadzu Group, marking an important milestone in the company’s continued growth and evolution.

This step builds on the strong business alliance established in 2024 and reflects a shared commitment to advancing scientific discoveries and industrial innovations worldwide.
 

“For Tescan customers, this new chapter brings enhanced capabilities, broader expertise, and expanded access to integrated solutions, while preserving the agility, innovation, and customer focus that define the Tescan way,” said Sirine Assaf, CRO, Tescan. 

By combining Tescan’s leadership in surface analysis and electron microscopy technologies, including SEM, FIB-SEM, and TEM, with Shimadzu’s strengths in compositional and materials analysis, customers will benefit from:
 

  • More comprehensive solutions across research, development, and production workflows

  • Deeper application support through combined expertise in materials science, life sciences, and semiconductors

  • Accelerated innovation driven by joint R&D and shared technologies

  • Access to a larger global support network and enhanced service capabilities

  • Expanded product portfolio and future integrated offerings

Importantly, Tescan remains committed to maintaining its customer-centric approach, strong technical support and responsiveness, ensuring continuity in partnerships and daily operations.

Tescan’s growth will be further supported by Shimadzu’s global presence, particularly in Asia, alongside strengthened positions in Europe and the Americas. This will allow Tescan to:
 

  • Reach new markets and customers worldwide 

  • Scale manufacturing and service capabilities

  • Enhance operational efficiency while maintaining flexibility 

At the same time, Tescan will continue to operate from its headquarters in Brno, preserving its identity, expertise, and innovation culture. 

Since its founding in 1991, Tescan has delivered over 4,000 electron microscopes across more than 80 countries, supporting customers in both research and industrial environments. 

This acquisition reinforces Tescan’s long-term strategy to expand its technological leadership and deliver higher-value solutions, ensuring customers remain at the center of its development. 

The successful collaboration between Tescan and Shimadzu has already been demonstrated through the joint “Shimadzu by Tescan” SEM product line introduced in Japan. 

Building on this strong foundation, the integration marks a natural next step in deepening cooperation across technologies and markets. As part of this evolution, Tescan will adopt a new endorsed brand identity, “Tescan, A Shimadzu Company,” across its portfolio and communications. This reflects both the strength of the combined organizations and Tescan’s continued commitment to delivering innovative, customer-focused solutions under a globally recognized framework.

This acquisition is in fully synergy with Tescan and Shimadzu strategic plans and it makrs an acceleration of what Tescan already does best: delivering high-performance systems, application-driven innovation, and close collaboration with customers.

Tescan develops and manufactures advanced electron microscopy solutions for materials science, life sciences, semiconductor research, industrial R&D, and quality control. With a focus on imaging performance, automation, usability, and long-term collaboration, Tescan helps researchers see the invisible and accelerate discovery through reliable, future-ready microscopy workflows.

China India Japan Malaysia Singapore South Korea Taiwan Vietnam From Wafer to Chip Nov Asia Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI

 

Singapore

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • Singapore: 8:00 am - 12:00 pm 
  • San Francisco: 5:00 pm - 9:00 pm
Pricing                     
  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled Asia/Singapore
Event format
Promote in calendar
Off

Brooks Instrument Launches Ultra-Compact, High-Performance Mass Flow Controller

HATFIELD, Pa. (USA), June 18, 2026 — Brooks Instrument, a world leader in precision fluid measurement and control technology, announced the global launch of its new ultra-compact AMF Series™ Advanced Mass Flow Controller. About the size of a standard Post-it® Note pad, it has the smallest footprint of any mass flow controller (MFC) in its performance class.

Combining precise gas flow control, fast response, industry-leading 1000:1 turndown capability and advanced diagnostics, the AMF Series offers equipment manufacturers and end users more operating flexibility and improved reliability and process control without the limitations of traditional compact MFCs.

“Equipment designers historically have had to choose between compact dimensions and advanced capabilities,” said Steve Kannengieszer, Global Marketing Director. “With the AMF Series, we’re changing that trade-off. Customers can now integrate high-performance flow control and predictive diagnostics into the most space-constrained systems without sacrificing accuracy, reliability or process insight.”

Advanced Features in a Compact Footprint

As equipment size across industries continues to shrink while growing in complexity and throughput, maintaining stable and precise gas flow becomes increasingly critical. The AMF Series was developed specifically to address these challenges.

With a 1-inch x 3-inch x 3-inch footprint, the MFC fits easily inside compact gas cabinets. Despite its small size, the highly accurate AMF Series features advanced capabilities, including integrated EtherNet/IP™ digital communications and onboard diagnostics for predictive maintenance.

By providing actionable diagnostic data alongside accurate flow measurement and control, the AMF Series helps users identify potential issues before they impact production, reducing unplanned downtime and improving overall equipment effectiveness.

Easier Operation and More Uptime

In addition, the AMF Series was designed to maximize uptime and simplify operation with a universal USB-C service port and embedded web-based interface that streamlines in-situ commissioning and troubleshooting. Industry-leading long-term sensor stability helps reduce maintenance requirements and eliminate periodic recipe adjustments and recalibrations.

The AMF Series also supports multi-gas configurability and simplified ordering bundles, helping OEMs reduce system complexity while streamlining product selection and integration.

Wide Range of Use

The AMF Series is especially suitable for pilot-scale applications where precise low-flow gas control and equipment miniaturization are critical, including:
• Bioprocessing and laboratory-scale bioreactors
• Thin film coating and vacuum deposition systems
• Carbon capture, utilization, and storage (CCUS)
• Hydrogen and energy transition technologies
• Analytical instrumentation
• University and research laboratories
• Industrial gas processing

Demand for Smaller Instrumentation

“Across biotechnology, we’re seeing a shift toward smaller-scale development platforms that demand greater flexibility and precision from process instrumentation,” said Joe Sipka, Business Development Director, Biotechnology. “The AMF Series was developed for micro-dosing and pilot-scale systems and delivers a wealth of digital insights—including health indicators, reliability metrics and pedigree—that enable greater automation and support a path to prescriptive maintenance. Many of these same trends are emerging in adjacent applications, such as industrial coatings, where engineers are being asked to do more with increasingly compact systems. Developed directly from conversations with our customers, the AMF Series delivers the precise low-flow control, wide operating range and reliability needed to accelerate innovation while maximizing valuable equipment space.”

For more information about the AMF Series Advanced Mass Flow Controller, visit www.BrooksInstrument.com/product/AMF.

About Brooks Instrument:
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.

The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.

The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.

With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.

“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”

India Japan Malaysia Singapore South Korea Taiwan United States Vietnam Inside the Fab Oct 27 Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Basic Electronics and Microelectronics
  • Process Nodes
  • Device Physics and Transistor Operation
  • Crystal Growth and Wafer Preparation
  • Advanced Transistor Technologies
  • Circuit Design and Layout
  • Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Kalya Shubhakar
Kalya Shubhakar
Senior Lecturer
 

 

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Pricing                     
  • Members:  $399
  • Non-Members:  $449

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

3:00 pm - 7:00 pm Off Add to Calendar 2026-10-27 15:00:00 2026-10-30 19:00:00 Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia) 10/27 Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Pricing                     Members:  $399Non-Members:  $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore
Event format
Promote in calendar
Off

Registration

Registration

※ Early-bird Registration Deadline: July 8 (Wed), 2026, 17:00 PM (KST)  

 Early BirdOn-siteGroup
SEMI MemberKRW 308,000KRW 385,000KRW 275,000
Non-MemberKRW 363,000KRW 330,000

※ Group registration fee applies to groups of five or more from the same company.
※ For group registration inquiries, please contact SEMI Korea Program Team at [email protected].

Registration
South Korea APS 2026 Business Technical

OVERVIEW

  • Date: July 15(Wed), 2026
  • Time: 08:30 - 17:00
  • Venue: Convention Hall 1, 3F, Suwon Convention Center
  • Language: Korean/English (Simultaneous interpretation will be provided)
  • Organizer: SEMI Korea  

 

SPONSORS

  

 

NOTICE

  • The agenda is subject to change at the discretion of the speakers.
  • Presentation files agreed by speakers will be provided to attendees after the event through SEMI registration website.

 

CONTACT

Convention Hall 1, 3F, Suwon Convention Center South Korea
South Korea

8:30 am - 9:00 am

Welcome Reception

9:00 am - 9:30 am
Greg Roh
Greg Roh
Head of Research Center
Hyundai Motor Securities

2026 Outlook for the Advanced Packaging Industry

9:30 am - 10:00 am
Chee ping Lee
Chee ping Lee
Managing Director, Strategic & Technical Marketing, Advanced Packaging
Lam Research

Making 3DIC Manufacturable for AI: From Vertical Integration to Scalable Production

As AI systems push requirements for higher bandwidth, lower power, and increased integration density, 3D integrated circuits (3DIC) are moving rapidly from development to production. However, scaling 3DIC introduces complex application challenges across the manufacturing flow, where process interactions and control become critical.
This talk examines key 3DIC applications and process challenges, including high aspect ratio TSV etch, void free TSV fill, and dielectric deposition, required for reliable wafer and die level stacking. Emerging applications such as inter die gap fill for advanced chiplets integration and plasma dicing for improved yield, edge quality, and die strength further increase integration complexity and productivity demands.
The presentation highlights Lam Research innovations across etch, deposition and clean processes that enable tighter process windows, improved uniformity, and higher throughput. In addition, equipment intelligence and data driven control are increasingly essential to enhance yield learning and manufacturing productivity. Together, these advances are enabling scalable, high volume 3DIC manufacturing for next generation AI systems.

※ Biography

10:00 am - 10:30 am
Ingu Yin Chang
Yin Chang
ASE

Advanced Packaging: Enabling AI at Scale

The future of compute will not be defined by silicon alone. As AI reshapes industries and economies, advanced packaging has become the foundation of the next era of innovation, enabling unprecedented gains in performance, efficiency, and scale. During his keynote, Yin Chang will explore how breakthroughs in heterogeneous integration, chiplets, and advanced manufacturing are transforming bold AI ambitions into deployable systems, and why AI leadership will depend not only on compute power, but on the ability to integrate and manufacture at scale.

※ Biography

10:30 am - 11:00 am
Shinji Baba
Shinji Baba
Vice President / Head of ATJ R&D Center
Amkor Japan

Advanced Power Module Packaging Technologies

The rapid electrification of automotive and industrial systems is placing increasingly stringent demands on power semiconductor devices in terms of voltage capability, thermal performance, reliability, and system integration. This presentation reviews recent trends in power devices and power module packaging technologies aimed at improving performance while addressing cost and manufacturability constraints.
First, the fundamental differences between digital and power devices are outlined, followed by an overview of power device applications based on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, together with Amkor’s product portfolio.
Next, power module packaging technologies are discussed with a focus on key electrical and thermal challenges. Representative solutions, including advanced interconnects, cooling architectures, and embedded power modules, are introduced, along with a brief overview of Amkor’s technology roadmap.
Finally, the role of the Amkor Technology Japan R&D Center in supporting open innovation and global collaboration is briefly discussed.

※ Biography

11:00 am - 11:20 am

Networking Break

11:20 am - 12:30 pm

Panel Discussion

12:30 pm - 1:30 pm

Lunch

1:30 pm - 2:00 pm
minwoo rhee
Minwoo Lee
Master
Samsung Electronics

Advanced Packaging Technology for AI/HPC

The presentation explores advanced packaging technologies designed to meet the escalating performance and power efficiency demands of AI and High-Performance Computing (HPC). To overcome the limitations of traditional semiconductor architectures, System Technology Co-Optimization (STCO) is introduced as a critical framework for managing thermal crosstalk and enhancing heterogeneous integration. The discussion highlights key innovations, including Customized HBM (cHBM) for optimized base-die performance and Samsung's 2.xD packaging portfolio, which encompasses Cube S, Cube E, and Cube R. Specifically, the 2.3D Cube E leverages panel level packaging to enable larger interposers and increased HBM integration, significantly improving productivity and reducing silicon fab burdens. The technical achievements in PLP—such as precise warpage control and the realization of fine RDL patterns (2/2μm)—are detailed to demonstrate their viability for large-scale AI chips. Furthermore, the roadmap extends toward 3D integration and Co-Packaged Optics (CPO) to maximize bandwidth and energy efficiency. Finally, the importance of an ecosystem-wide collaboration is emphasized as the driver for future innovation in "More than Moore" technology. These advancements collectively provide a scalable path toward the next generation of AI hardware acceleration.

※ Biography

2:00 pm - 2:30 pm
YASUSHI ARAKI
Yasushi Araki
Corporate Officer, GM(General Manager) of R&D Div.
SHINKO ELECTRIC INDUSTRIES

Latest Development Status of Glass Core Build-up Substrate

Glass core substrates exhibit low CTE and significantly higher rigidity than conventional organic substrates and are therefore regarded as promising core materials for next-generation build-up packages. However, a major challenge lies in the occurrence of SeWaRe defects (delamination in glass), which arise from thermal stresses induced by the mismatch in the coefficients of thermal expansion (CTE) between the glass material and the build-up resin.
To mitigate this issue, we proposed a structure in which the corner regions of each individual piece are formed from resin. However, considering the thermal history during chip mounting, it became evident that the suppression effect was insufficient. Therefore, an edge‑protection material was applied to relieve the stress concentrated at the edges of each individual piece. As a result, it was confirmed that SeWaRe defects could be effectively suppressed even under thermal loading.
Through these efforts, we successfully developed a glass core build-up package substrate incorporating 11 layers of single‑sided copper wiring (22 layers in total).

※ Biography

2:30 pm - 3:00 pm
Sandeep Sane
Sandeep Sane
Vice President
Lightmatter

Beyond Moore's Law: How Silicon Photonics and Advanced Packaging Are Redefining HPC

AI and data-intensive workloads are outpacing what conventional semiconductor technology can deliver. Two innovations are stepping in to close the gap: Silicon Photonics, which brings optical-speed, low-power data transmission into the data center, and Advanced Packaging, which uses chiplets and 2.5D/3D integration to maximize performance and efficiency at the chip level.
This talk examines how these complementary technologies are reshaping HPC architecture—covering their current state, how they work in tandem, and the key technical and commercial barriers to large-scale adoption.

※ Biography

3:00 pm - 3:30 pm
Amit Oren
Amit Oren
Director CPO Packaging
NVIDIA

CPO Packaging: Challenges and Opportunities

Co-packaged optics (CPO) is emerging as a key enabler for scaling bandwidth while containing power and cost in next-generation AI and cloud infrastructure. By moving optical engines closer to the switch ASIC and shortening high-speed electrical reaches, CPO can reduce SerDes power, ease signal-integrity constraints, and increase overall front-panel bandwidth density. However, delivering these benefits at volume requires new approaches across package architecture, manufacturing, and system integration.
This presentation reviews the main packaging challenges that must be solved to industrialize CPO, including thermal management and heat spreading near high-power silicon, fiber attach and optical alignment tolerances, photonics/laser integration choices, high-density optical and electrical I/O, substrate and interposer selection, and reliability risks such as warpage, CTE mismatch, and contamination control. Test and rework strategy, yield learning, and supply-chain readiness (materials, assembly, and metrology) are highlighted as practical barriers to adoption.
The talk also outlines opportunities created by CPO packaging innovations—such as modular optical tiles, standardized fiber interfaces, advanced lid/heat-sink concepts, and co-design of electrical, mechanical, and optical domains—to unlock higher radix switches and lower system power. Attendees will leave with a structured view of technology tradeoffs, a roadmap of near-term versus long-term packaging options, and actionable considerations for bringing CPO from prototypes to deployable products.

※ Biography

3:30 pm - 3:50 pm

Networking Break

3:50 pm - 5:00 pm

Panel Discussion

Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era.

8:30 am - 5:00 pm Off Add to Calendar 2026-07-15 08:30:00 2026-07-15 17:00:00 ADVANCED PACKAGING SUMMIT 2026 Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era. Convention Hall 1, 3F, Suwon Convention Center South Korea South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
Event format
Promote in calendar
Off
Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
Highlighted content

SEMI
United States

9:00 am - 9:15 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
Ben Gross Headshot
Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
Jeff Rudnik Headshot
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
Event format
Promote in calendar
Off