ABSTRACT
New Surface Preparation System; Batch-Single Hybrid Equipment
TEL has developed the ZEXSTA(TM), a Batch-Single hybrid system that completes the Batch wet etching process and Single drying process in a continuous workflow. There are two types of semiconductor manufacturing equipment that require cleanliness and precision: Batch type and Single type. The Batch type, which can process many wafers at once, is characterized by excellent in-plane uniformity and productivity during high-temperature, long-duration processes, as well as superior particle removal capabilities when combined with megasonic technology. On the other hand, the Single type employs various washing and drying methods, offering excellent particle performance and suppression of pattern collapse in fine patterns. By leveraging their respective strengths, Batch and Single systems each play active roles as standalone equipment in their respective fields. NAND, a type of memory, has evolved from 2D to 3D structures with increased layer stacking. Accordingly, there is an anticipated higher demand for improved in-plane uniformity in long-duration wet etching processes and advanced drying technologies that better suppress pattern collapse in fine structures. Therefore, it is necessary to propose new functionalities that combine the advantages of both Batch and Single systems. By introducing ZEXSTA(TM), it is possible to transport wafers processed in batch directly to single processing for drying. This enables the achievement of both high in-plane uniformity and excellent drying performance during high-temperature and long-duration processes. Fig. 1(Left) shows that the ZEXSTA(TM) process offers better particle performance than either Batch processing alone or discontinuous processing involving Single processing after Batch drying. In addition, Fig. 1(Right) shows the collapse performance of pillar samples for each Single drying technique, such as IPA, SMD, and SCD. Drying technologies can be selected according to the susceptibility of pattern collapse. From the perspective of wafer reuse, this approach is expected to shorten conventional processes—from residue removal to contamination elimination—while achieving high particle specifications.
BIOGRAPHY
My name is Daiki Morimoto, and I am currently working in the Process Technology Department at Tokyo Electron Kyushu Ltd. In my role, I am primarily involved in the development and optimization of Batch and Single processes. My career as a process engineer began with the development of Batch processes. At present, I have gained experience in Batch-Single continuous process development, with a particular focus on wet etching processes and drying technologies.
Through my work, I have developed strong technical skills and a deep understanding of the challenges and innovations involved in Batch-Single Hybrid Equipment. I enjoy applying my expertise to improve process efficiency and product quality, contributing to advancements in the industry. I am passionate about continuous learning and staying updated with the latest technologies to drive better results. I look forward to the opportunity to gain various insights into surface preparation technology. Thank you for taking the time to learn about my background.