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China India Japan Malaysia Singapore South Korea Taiwan United States Vietnam (Asia) Understanding, July Training

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

 

Instructor

Denny Frye 

PT International, LLC

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $895
  • Non-Members: $995

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:00 am - 4:30 pm Off Add to Calendar 2025-07-17 09:00:00 2025-07-18 16:30:00 Overview of Semiconductor Manufacturing (Virtual Training, Asia) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $895Non-Members: $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Sold Out
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Due to scheduling conflicts we need to postpone the event and we will announce the rescheduled event when we are able. Thank you for your interest and for more information about Chips & Childcare, please reach out to Michelle Williams at [email protected]. We look forward to welcoming you to the future webinar!

The SEMI Foundation is committed to helping companies address the child care needs of the employees who build and facilitate their fabs.  In partnership with Policy Equity Group, a nationally recognized organization with extensive child care expertise, SEMI has engaged with companies in several states to problem-solve child care issues and identify tailored solutions.  

United States

10:00 am
Michelle Williams
Michelle Williams-Vaden
Executive Director
SEMI Foundation

Welcome: The Importance of Addressing Employee Child Care Needs

10:05 am
Jeffrey Capizzano
Jeffrey Capizzano
CEO
Policy Equity Group

Framing Child Care Challenges for the Semiconductor Industry Employer Supports & Resources

Dahlin cropped
Melissa Dahlin, PhD
Senior Director
Policy Equity Group
10:15 am
Karyn Olsson Cropped
Karyn Olsson
Public Relations
Calumet Technologies

Industry Insights: Evaluating Employee Needs to Identify Child Care Solutions

10:30 am
Andi Zolkiewski TSMC AZ
Andi Zolkiewski, MBA
Human Resources
TSMC AZ

Industry Insights: Identifying Child Care Partnerships Through Child Care Market Analysis

10:45 am - 11:00 am

Q&A

Workforce Development Off Add to Calendar Disabled America/Los_Angeles
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Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #7.

Taylor Zhao
Manager, Programs & Committees
[email protected]

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United States REGISTER NOW New - SiC Webinar 7 800x800 Tile Business Technical Training

SiC—Silicon Carbide Webinar #7: 

SiC Planar and Trench MOSFETs: Design, Fabrication, and Key Applications

Silicon Carbide (SiC) MOSFETs exploit the material’s favorable properties, which allow for highly efficient power devices with reduced form-factor and cooling requirements. Having been commercially introduced in 2011, SiC MOSFETs have gone through several generations of improvements and are currently offered in planar and trench configurations by major semiconductor chip manufacturers. This webinar will provide an impartial overview of planar/trench design and fabrication aspects, highlight their key competitive advantages, and provide an independent overview of what real-world converters require in terms of application-specific performance parameters. Exemplary applications to be discussed include aviation, servo drivers, energy storage, and traction drives.

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
  • Webinar #5—SiC Edge Termination Technology
  • Webinar #6—Basal Plane Dislocation Defects and the Impact on Device Performance

 

Meet the Speaker

View David Levett's Biography

View Victor Veliadis's Biography

United States

Victor Veliadis, PowerAmerica
Moderator
Victor Veliadis
Executive Director & CTO
PowerAmerica
David Levett, Power Converter Consulting
David Levett, PhD
Design Engineer
Power Converter Consulting

Join us online for the seventh webinar in the Silicon Carbide Series.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1
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United States MMRL Tile

Abstract

The successful development of MEMS (Micro-Electro-Mechanical Systems) products requires a structured approach that balances innovation with manufacturability, cost, and time to market. The MEMS Manufacturing Readiness Levels (MMRL) Guide provides a comprehensive framework to navigate this process, from initial concept through high-volume production.

In this webinar, we will explore how MMRL facilitates efficient MEMS development by defining commonly accepted readiness levels, best practices, and key decision points. Attendees will gain insights into:

  • The MMRL framework and its role in MEMS product development
  • Best practices for reducing risks and accelerating time to market
  • Strategies for ensuring performance, quality, and cost targets are met
  • Real-world applications and lessons learned from implementing MMRL

Join us to learn how MMRL can streamline your MEMS development process, improve collaboration, and drive successful product commercialization.

 

Speakers

 

Michelle Bourke | Managing Director of Strategic Marketing and Specialty Technologies, Lam Research

Michelle Bourke received her B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University in Scotland, UK. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 she entered the semiconductor capital equipment industry as a technologist and has since accrued more than 25 years of experience in semiconductor technology, strategy, and new product development. She is a specialist in fabrication technologies for MEMS, Power Devices, RF Electronics and Optoelectronics.

Michelle is a frequent presenter at leading industry forums and also serves on many committees and industry councils. In November of 2018, she was inducted into the SEMI MEMS and Sensors Industry Group Hall of Fame and in 2020 she was a Silicon Valley YWCA Tribute to Women Honoree. Michelle is currently Chair of the Semi MEMS Manufacturing Working Group, Co-chair of the SEMI MEMs Standards Committee and a Director on the Transducers Research Foundation Board where she is the Chair of Fund Raising and Development Committee.

Michelle joined Lam Research in 2015 and is currently Managing Director of Strategic Marketing in Lam’s Customer Support Business Group.

 

Mary Ann Maher, SoftMEMS

Mary Ann Maher | CEO, SoftMEMS LLC

Mary Ann Maher is the CEO of SoftMEMS LLC. She received her Ph.D. degree in 1989 from Caltech in the area of semiconductor device modeling. She has held positions at the Swiss Center for Electronics and Microtechnology (CSEM), Tanner Research and MEMSCAP Inc. She founded SoftMEMS LLC in 2004. She has over 30 years of experience in the field of computer aided design for MEMS.

 

 

 

Rob Pugliese | Principal Engineer, HP Inc.

Rob Pugliese is a Principal Engineer at HP Inc. in Corvallis Oregon.  Rob has held several  engineering roles in inkjet printhead development in his 32 years at HP, from etching and deposition engineer to yield improvement, printhead architecture design and life science fluid dispensing, as well as a rotation in engineering management. He is currently working in the MEMS section of the Microfluidics Technology Incubation lab, where he guides development of new microfluidic devices, curates the technology development process, and leads the tooling/capability strategy for the MEMS fab. Rob has a Ph.D. in Chemical Engineering from the University of Massachusetts at Amherst.

 

 

Tyler Harrison | Design Engineer, Teledyne MEMS

Dr. Tyler Harrison is the lead Design Engineer at Teledyne MEMS in Edmonton, Canada. His undergraduate background in Computer Engineering led to a PhD program focused on ultrasound and photoacoustic systems design and integration, all at the University of Alberta. After graduating, a postdoctoral position shared between the University of Alberta and Micralyne Inc (now Teledyne MEMS) led to full time MEMS development work in 2016. Since then, he’s filled a variety of Engineering roles helping develop new processes and translate customer concepts to fabricated devices. In his tenure at Teledyne MEMS, he’s led several initiatives to automate and error-proof layout processes, standardize process control monitoring, and use data-driven approaches to improve first-run performance on new devices.

 

 

 

Tim Maloney | Senior Director of Business Development, Polar Semiconductor 

Tim Maloney is the Senior Director of Business Development at Polar Semiconductor in Bloomington, Minnesota. With over 25 years of experience in the semiconductor industry, Tim has led initiatives across process engineering, factory operations, technology transfers, and supply chain management. In his current role, he is instrumental in Polar Semiconductor’s transformation into a U.S.-based open foundry specializing in power and sensor devices. His career includes leadership roles at Motorola Semiconductor, onsemi, Seagate Technology, SkyWater Technology, and Polar Semiconductor. Tim holds a background in Industrial Engineering from the University of Wisconsin-Madison and Arizona State University.

United States

MSIG Standards 8:00 am - 9:00 am Off Add to Calendar 2025-03-12 08:00:00 2025-03-12 09:00:00 New SEMI MEMS Standard: Guide to MEMS Manufacturing Readiness Levels [Webinar] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register here
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Join Us

Complete the form below to sign up for our live webinar.

United States REGISTER NOW Greene Tweed 2025 Webinar 690x448 Tile Business Executive

With the world's growing reliance on semiconductor chips, the industry needs a more reliable solution to improve and innovate at a rapid pace while addressing manufacturing challenges such as temperature, chemistry, and mechanical issues. 

One critical equipment in the industry is vacuum Pendulum Valves, a vacuum equipment incorporating plasma that are widely used in the semiconductor manufacturing process. The form, fit and function of these valves pose multiple challenges for the seals required in the valve's assemblies.  Greene Tweed engineers have analyzed the most commonly used pendulum valves and broken down the various sealing challenges and have also created solutions to the challenges. 

Join us to learn about the 6 W's—Who, What, When, Where, Why, & How—of these pendulum valve solutions.

  • Who—Anyone running a vacuum plasma chamber, etch and/or deposition  
  • What—The pendulum valves, specifically the seals in the valve  
  • Where—Every fabricator in the world
  • When—Now, as there are, tens of thousands that are currently operating
  • Why—The prevalent sealing challenges for pendulum valves
  • How—The sealing solutions and how we develop them, and the case study behind it to show in the 'How' part as well 

Join our webinar where Greene Tweed engineers will discuss the most commonly used pendulum valves, the various sealing challenges and solutions to address them.  

United States

Virtual Webinar | Tuesday, March 4, 2025 | Pacific Time

9:00 am
Carmen Quartapella, Greene Tweed
Carmen Quartapella
Senior Engineer, Design & Analysis
Greene Tweed

Register today to join our live webinar in collaboration with Greene Tweed!

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 2
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United States Understanding Semiconductor Technology and Business Training
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Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:30 am - 5:00 pm Off Add to Calendar 2025-06-02 09:30:00 2025-06-02 17:00:00 Understanding Semiconductor Technology and Business (Virtual Training, US) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
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Regular Pricing

Members: $475

Non-Members: $590

Students: $99

  • Breakfast, Breaks, Lunches
  • Networking Reception
  • Design Skills-Building Workshop (Pre-Event)
  • Intel Museum Tour and Transportation
  • Lunch & Learn Packet (Post-Conference Distribution)
  • Proceedings (Post-Conference Distribution)

Note: Travel-related expenses are not included.

Cancellations received on or before August 16, 2025 are fully refunded with a $100 processing fee.  Refunds will not be issued for cancellations (including no-shows) made after August 16, 2025, and only substitutions are accepted with a written note from the registered attendee.  Please email your cancellations or substitutions on company letterhead to:

Michelle Fabiano
Sr. Manager, Programs & Committees
[email protected]

+
United States MEMS & Sensors NextGen 360x317x NEW Business Technical

Travel

Local Hotels Near SEMI HQ:

Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
+1 (408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
+1 (408) 719-1966

Robert Bosch Logo 170x65
Consulate General of Canada Logo 170x65
Lam Research
Silex Microsystems Logo 170x65
TDK Logo 170x65
Teledyne MEMS Logo 170x65

 

BECOME A SPONSOR FOR MSNG 2025!

Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

View our Sponsorship Brochure

Contact Tim Janes | [email protected] | +1 720-939-4992

 

 

Industry & Media Partners

SEMI is proud to partner with the following media and associations to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.

 

Speakers represent the MEMS and sensors supply chain and adjacent industries. The conference will explore cutting-edge topics including photonics, digital twins and AI, machine learning, environmental sensors, quantum sensors, entrepreneurialism, innovation and collaboration. The programming is curated to appeal to the “NextGen” MEMS and sensors professionals through programming features of the conference that include networking, problem-solving, and skill development.

 

TOPICS

Gain insights as we dive into the following topics:

  • Environmental Sensors
  • Innovation
  • Photonics MEMS and Sensing Technology
  • Quantum Sensors
  • Digital Twins and AI for MEMS Design
  • AI & Machine Learning in MEMS and Sensor Device Operation

 

WHO SHOULD ATTEND

This conference is open to all MEMS & sensors professionals interested in NextGen technology.

  • Technologists​
  • Engineers ​
  • Startups | Founders
  • Academia | Students | Professors ​
  • Market Analysts | Market Researchers
  • Investors: VCs | Angel Investors | MEMS and Sensors Technology Investors

 

EVENT CONTACT

Michelle Fabiano
Sr Manager, Programs & Committees
[email protected]
 

SPONSORSHIP OPPORTUNITIES

Tim Janes 
Account Manager, Events 
[email protected]

 

MSNG 2025 PLANNING ALLIANCE

Thank you to these industry leaders for their time, expertise, and support of the MSNG conference.
 

SEMI HQ
673 South Milpitas Boulevard​
Seminars 1 & 2​
Milpitas, CA 95035
United States

TUESDAY, SEPTEMBER 16, 2025

1:30 pm - 2:20 pm

Registration

2:20 pm
Paul Carey
Paul Carey
Director, MSIG
SEMI Americas

Welcome Remarks

2:30 pm - 5:30 pm

MEMS Design Workshop: Unlock the Future of MEMS Design with Cloud-Native Multiphysics Simulation

Gerry Harvey Headshot
Gerry Harvey
Quanscient

Instructor

Abhishek Deshmukh, Quanscient
Abhishek Deshmukh
Quanscient

Instructor

Alex Stockrahm
Quanscient

Instructor

WEDNESDAY, SEPTEMBER 17, 2025

7:30 am - 8:30 am

Registration & Breakfast

8:30 am - 8:40 am
Paul Carey
Paul Carey
Director, MSIG
SEMI Americas

Welcome Remarks

8:40 am - 9:10 am
David Horsley, Institute of NanoSystems Innovation, Northeastern University
David Horsley
Professor, Startup Founder, Advisor & Angel Investor
Institute for NanoSystems Innovation, Northeastern University

Keynote—Crossing the Chasm: from Academic Lab to Consumer Pockets

Session 1— Environmental Sensors & Monitoring

Session Sponsor—TDK USA

TDK Logo 170x65
9:10 am
Pierre-Damien Berger, CEA Leti
Pierre-Damien Berger
MEMS Industrial Partnerships Manager
CEA Leti

Session Chair Welcome

9:15 am
Nishit Goel, TDK USA
Nishit Goel, PhD
Senior Staff Engineer
TDK USA

Fragrance Sensing for a Fragmented Market

9:40 am
Shiyao Shan_GE
Shiyao (Shawn) Shan, PhD
Lead Engineer
GE Vernova Advanced Research Center

System Approach in Boosting Sensitivity, Selectivity, and Stability of Modern Environmental and Industrial Gas sensors to Deliver Broad Societal Impact

10:05 am - 10:35 am

Networking Break

Session 2—Universities & Industry Enabling Innovation: Panel Discussion

Presented by the Consulate General of Canada in San Francisco

Consulate General of Canada Logo 170x65
10:35 am
John Busch, Berkeley Skydeck
John Busch
Co-Chair
Berkeley Skydeck

Moderator

10:40 am - 10:45 am
Rahul Devaskar, Canadian Consulate of San Francisco
Rahul Devaskar
Senior Investment Officer
Canadian Consulate of San Francisco, and Silicon Valley

Consulate General of Canada Sponsor Message

Philippe Lanctôt Headshot
Philippe Lanctôt
Director of Business Development
C2MI
Michelle Kiang, MTM Ventures
Michelle Meng-Hsiung Kiang
Founder
MTM Ventures
Bharath Rajagopalan, STMicroelectronics
Bharath Rajagopalan
Director, Strategic Market Development
STMicroelectronics
Valentin Antoine, TDK
Valentin Antoine
Investment Analyst
TDK Ventures
11:45 am - 1:00 pm

Networking Lunch

Session 3—Photonics MEMS and Sensing Technology

1:00 pm
Anson Yeganegi, TDK USA
Anson Yeganegi
Director of Business Development
TDK USA

Session Chair Welcome

1:05 pm
Kevin Yasumura, Google
Kevin Yasumura
Principal Engineer | Director of MEMS and Optical Switching Development
Google

MEMS Optical Circuit Switching for AI Applications

1:30 pm
Lia Li,  Zero Point Motion
Ying Lia Li
CEO
Zero Point Motion

MEMS Reimagined: Photonic Readout and On-Chip Compute for Inertial Sensing

1:55 pm
Pierre-Damien Berger, CEA Leti
Pierre-Damien Berger
MEMS Industrial Partnerships Manager
CEA Leti

Enabling High Efficiency Sensing with Optomechanical Devices

2:20 pm
Pierre Delbos_Yole Group
Pierre Delbos
Business Development Manager
EV Group

From Concept to Market: Manufacturing Platforms for Next-Gen Photonic MEMS

2:45 pm - 3:15 pm

Networking Break

Sponsor—Bosch

Robert Bosch Logo 170x65

Session 4—Pioneer Pitch: Sensors & Startups

3:15 pm
Marcellino Gemelli, Robert Bosch LLC
Marcellino Gemelli
Business Development, Bosch Sensortec GmbH
Robert Bosch

Session Chair Welcome

3:20 pm

Pioneer Pitch: Sensors & Startups

Jaehyung James Lee
Jaehyung James Lee
Co-founder and CEO
Stratio Technology

Unlocking the Power of SWIR: Ge-based SWIR Sensors and Infrared-AI for Breakthrough Industrial Applications

Jérôme Michon_InSpek
Jérôme Michon
Co-founder and CEO
InSpek

InSpek: OneProbe, Multiple Sensors

Ramesh Chandrasekhar, Aynak
Ramesh Chandrasekhar
CEO and Founder
Aynak

Sensory Eyewear: Designed to Hear, Crafted to be Seen

William Xander, Truthkeep
William Xander
CEO and Founder
Truthkeep

The Missing Piece of Your Strategic Advantage

Saewook Lee, Applied Ventures
Saewook Lee
Senior Director
Applied Ventures

Venture Capitalist

David Lam Headshot
David Lam
Senior Advisor
BRV Capital Management
Michelle Kiang, MTM Ventures
Michelle Meng-Hsiung Kiang
Founder
MTM Ventures

Paul Pickering, Silicon Catalyst
Paul Pickering
Managing Partner
Silicon Catalyst
5:00 pm - 6:30 pm

Networking Reception with Group Introductions & Student Poster Session

Sponsor—SILEX

Silex Microsystems Logo 170x65

THURSDAY, SEPTEMBER 18, 2025

7:30 am - 8:30 am

Registration & Breakfast

8:30 am
Paul Carey
Paul Carey
Director, MSIG
SEMI Americas

Welcome Remarks

8:35 am
Marcellino Gemelli, Robert Bosch LLC
Marcellino Gemelli
Business Development, Bosch Sensortec GmbH
Robert Bosch LLC

Keynote—A Novel Customer Discovery Approach for Sensor Submodules in Distribution Channels

Session 5—Quantum Sensors

9:05 am
Pierre Delbos_Yole Group
Pierre Delbos
Business Development Manager
EV Group

Session Chair Welcome

9:10 am
Amirhossein Ghods, Mesa Quantum
Amirhossein Ghods
Vice President of Photonics
Mesa Quantum

Advanced VCSELs for Scalable Quantum Sensing Applications

9:35 am
Christopher Chua
Christopher Chua
Associate Director & Principal Research Scientist
SRI

Narrow Linewidth PIC-based Blue-UV Semiconductor Lasers for Optical Atomic Clocks

10:00 am
Paul Morton, Headshot
Paul Morton
CTO Photonics
Infleqtion

Photonic Integration for Miniaturization of a 2-photon Rb Optical Atomic Clock

10:25 am - 10:55 am

Networking Break

Session 6—Digital Twins and AI for MEMS Design

10:55 am
Benyamin Davaji, Northeastern University
Benyamin Davaji, PhD
Assistant Professor
Northeastern University

Session Chair Welcome

11:00 am
Prith Banerjee
Prith Banerjee
Senior Vice President, Simulation and Analysis Incubation
Synopsys

Challenges & Opportunities of Digital Twins in Asset-Intensive Industries

11:25 am
Andy Cai, COMSOL
Andy Cai
Applications Manager
COMSOL, Inc.

Digital Twins and Simulation Apps

11:50 am
Michael Munsey Headshot
Michael Munsey
Vice President Semiconductor and Electronics Industries
Siemens Digital Industries Software

Creating the Digital Twin for Semiconductor Design to Manufacturing

12:15 pm - 1:30 pm

Networking Lunch

Sponsor—Teledyne MEMS

Teledyne MEMS Logo 170x65

Session 7—AI & Machine Learning in MEMS & Sensor Device Operation

1:30 pm
Mary Ann Maher, SoftMEMS
Mary Ann Maher
CEO
SoftMEMS

Session Chair Welcome

1:35 pm
Juan Mejia Santamaria, TDK
Juan Mejia Santamaria
Principal Engineer and Team Lead
TDK USA Corporation

Going Beyond Sensors Everywhere

2:00 pm
Jonathan Russo, Femtosense Headshot
Jonathan Russo
Program Manager
Femtosense

AI Speech Enhancement and the Future of Hearables

2:25 pm
Nathan Francis, Headshot
Nathan Francis
Head of Business Development
AI Zip

From Data to Decisions: Smart MEMS with Local AI Processing

2:50 pm
Paul Carey
Paul Carey
Director, MSIG
SEMI Americas

Closing Remarks & Introduction to the Tour

3:00 pm - 6:30 pm

Computer History Museum Tour

The Computer History Museum (CHM) is a computer museum in Mountain View, California. The museum presents stories and artifacts of Silicon Valley and the Information Age, and explores the computing revolution and its impact on society. Transportation will be provided.

- MSIG Workforce Development

MEMS & Sensors NextGen—MSNG 2025 is the leading NextGen sensor technology technical conference for NextGen professionals related to designing, building, and using sensors. 

2:30 pm - 6:30 pm Off Add to Calendar 2025-09-16 14:30:00 2025-09-18 18:30:00 MEMS & Sensors NextGen MEMS & Sensors NextGen—MSNG 2025 is the leading NextGen sensor technology technical conference for NextGen professionals related to designing, building, and using sensors.  SEMI HQ 673 South Milpitas Boulevard​ Seminars 1 & 2​ Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

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Let your LinkedIn connections know you’re attending MSNG! 

Spread the word and share our social media content with your connections so that they can join you there, too.

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REGISTRATION

Attendance is free, but registration is required by March 10, 2025.

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SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry 

Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.

Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by Missouri S&T.

  • Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductors Industry. 
  • Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can prepare for them through job searches, interviews, resumes, and more.
  • Meet with professionals and executives during our speed mentoring, mock interview, and networking sessions.

All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.

  • Enjoy free food, free swag, and giveaways.
  • Students can come and go.

EVENT is FREE but registration is required. Registration deadline coming soon! 

Missouri University of Science and Technology
MO
United States

MONDAY, MARCH 17, 2025 (Times in CST)

9:00 am - 9:30 am

Check-In

9:30 am - 9:40 am
David Borrok
Missouri S&T

Welcome

9:30 am - 9:40 am
Mike Seacrist
MEMC

SEMI Midwest Chapter Introduction

9:40 am - 10:00 am
David Lipke
Missouri S&T

Missouri S&T Educational Opportunities

10:00 am - 10:20 am
Joyce Lowes
Director, R&D Emerging Materials Group
Brewer Science

Semiconductors 101: A Brief History of the Semiconductor Industry & Career Pathways

10:20 am - 10:40 am
Evan Anderson
Director of Process Engineering
SkyWater

Open Industry Talk - SkyWater

10:40 am - 11:00 am
Sherwin Tang
Sr Technology Development Manager
TSMC

Open Industry Talk - TSMC

11:00 am - 11:20 am
HR
Brewer Science

Personal Branding + Resume Best Practices

11:20 pm - 11:40 am
Sarah Vehige
Workforce Development/HR
MEMC

Interview Like a Pro: Perfect Your Pitch

11:40 am - 12:00 pm

Students Pick Up Boxed Lunches

12:00 pm - 12:40 pm
Samual Insall
Brewer Science
Chris Mark
Wafer Cleaning Process Engineer
MEMC

Ask Me Anything Panel Discussion—A Day in the Life of a Semiconductor Engineer

12:00 pm - 12:20 pm

Job & Internship Opportunities

12:20 pm - 2:00 pm

Network with Exhibiting Industry Leaders

2:00 pm

Closing Remarks

Workforce Development

[PDS] Professional Development Seminar
—Organized by SEMI Midwest Chapter
—Collaboration with Missouri S&T

This FREE seminar will help students meet the demands of today's high tech workforce and be successful in their careers. 

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Registration

Breakfast Forum Pricing:

  • Member: $100
  • Non-member: $125

Registration is final. No refunds provided. No substitutions.

Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982

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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Pacific Northwest Breakfast Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

Powering the AI Era: Infrastructure, Integration & Policy

There has never been a more pivotal moment for the semiconductor industry. As AI adoption accelerates across every sector, the demands on infrastructure, technology integration, and policy frameworks have intensified. Companies across the Pacific Northwest and beyond are navigating rapid capacity expansion, new technical challenges, and the workforce transformation required to support the AI era.

This year’s SEMI Pacific Northwest Breakfast Forum brings together leaders from industry, government, academia, and regional organizations to explore how we build the resilient, intelligent, and scalable semiconductor ecosystem the AI future requires.

Join us as we examine energy infrastructure readiness, advanced packaging innovation, economic signals, and regional workforce development initiatives—all essential to powering the next decade of growth.

Intel - RA1
2501 NE Century Blvd
Hillsboro, OR 97124
United States

7:30 am - 8:00 am

Check-In & Networking Breakfast

Host—Intel

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8:00 am - 8:05 am
Damian Scandiffio, Acara Solutions
Damian Scandiffio
Co-Chair of SEMI Pacific Northwest Chapter
Acara Solutions
Matt Kleinke, Siltronic
Matt Kleinke
Co-Chair of SEMI Pacific Northwest Chapter
Siltronic

SEMI Pacific Northwest Chapter Welcome Remarks

8:05 am - 8:15 am
Dave Bloss 2025
David Bloss
Corporate VP, Technology & Manufacturing Group General Manager, Global Sourcing for Equipment and Materials
Intel

Opening Remarks

8:15 am - 8:30 am
Tim Knopp
Tim Knopp
Chief Prosperity Officer
State of Oregon

Keynote—Oregon State Prosperity Outlook

8:30 am - 9:05 am

Energy Infrastructure Fireside Chat

Organized by Technology Association of Oregon

Senator Janeen Sollman Headshot
Janeen Sollman
State Senator
Oregon State Senate, District 15
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Isaac Barrow
Senior Manager, Data Centers and Growth
Portland General Electric

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Skip Newberry
President & CEO
Technology Association of Oregon (TAO)
9:05 am - 9:25 am
Tyler Osborn Intel
Tyler Osborn
Director of Strategic Programs, Advanced Packaging Technology Development
Intel

Advanced Packaging for AI @ Intel

9:25 am - 9:45 am
Bob Johnson, Gartner
Bob Johnson
VP Analyst
Gartner

Economic Outlook

9:45 am - 10:05 am

Networking Break

10:05 am - 10:25 am
Karl Leeser Lam
Karl Leeser
Corporate VP of Engineering, Deposition Products Group
Lam Research

Enabling the AI Era …And Investing in the Pacific Northwest

10:25 am - 11:10 am

Workforce Development & University Initiatives Panel

Shannon Carney_ Business Oregon
Moderator
Shannon Carney
Advanced Manufacturing Program Coordinator
Business Oregon
Kyle Ritchey-Noll, Business Oregon Council Headshot
Kyle Ritchey-Noll
Education & Workforce Policy Director
Oregon Business Council

Panelists

Jose Garcia, Analog Devices
José Garcia
Managing Director
Analog Devices/SAMU
Robert Sanger
Robert Sanger
Program Manager, Workforce Training & Operations
SEMI Foundation
Christie Dudenhoefer_ Oregon State University
Christie Dudenhoefer
Executive Director, Semiconductor Economic Development and CorMic Regional Innovation Officer
Oregon State University
Tina Guldberg
Tina Guldberg
Associate Vice President Economic Development and Strategic Relations
University of Oregon
11:10 am - 11:15 am
Damian Scandiffio, Acara Solutions
Damian Scandiffio
Co-Chair of SEMI Pacific Northwest Chapter
Acara Solutions
Matt Kleinke, Siltronic
Matt Kleinke
Co-Chair of SEMI Pacific Northwest Chapter
Siltronic

Closing Remarks

11:15 am

Adjourn

Organizer: SEMI Pacific Northwest Chapter

Hosted by Intel

IN-PERSON

7:30 am - 11:15 am Off Add to Calendar 2026-04-30 07:30:00 2026-04-30 11:15:00 Pacific Northwest Chapter Breakfast Forum—Powering the AI Era: Infrastructure, Integration & Policy Organizer: SEMI Pacific Northwest ChapterHosted by IntelIN-PERSON Intel - RA1 2501 NE Century Blvd Hillsboro, OR 97124 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 2
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Press Release: Kurt J. Lesker Company Announces Groundbreaking Report in an ALD first!

Jefferson Hills, PA – January 8th, 2024 – Kurt J. Lesker Company is proud to announce the successful publication of our latest Atomic Layer Deposition (ALD) technology in JVSTA. This groundbreaking innovation, featuring our patented Precursor Focusing Technique (PFT) and Ultra-High Purity (UHP) process capability, marks a significant milestone in our commitment to advancing next-generation applications.

The new ALD research and development (R&D) represents the first successful demonstration of scandium nitride (ScN) deposition using plasma-enhanced atomic layer deposition (PEALD) on silicon, sapphire, and magnesium oxide substrates under UHP conditions. This innovative process utilizes a new scandium precursor, bis(ethylcyclopentadienyl)scandium-chloride [ClSc(EtCp)2], combined with N2-H2 plasma species, allowing for the deposition of conformal, high-quality ScN films at relatively low temperatures (200−300°C).

"We are thrilled by the prospects of this breakthrough, which underscores our dedication to innovation and excellence in the field of ALD," said Kurt Lesker IV. "This achievement is a testament to the hard work and expertise of our team, and we look forward to leveraging this technology to drive sustainable business growth."

The ScN films produced by this process exhibit high crystalline quality and excellent electrical properties, with high mobility and low resistivity. This makes them suitable for advanced electronic applications, including thermoelectric applications and as an interlayer for epitaxial gallium nitride (GaN) growth. The ability to conformally coat high aspect ratio (HAR) structures is particularly valuable for applications in 3D embedded memory and piezoelectric microelectromechanical systems (piezoMEMS).

The new ALD breakthrough positions Kurt J. Lesker Company as a leader in the ALD market, providing a significant competitive edge. KJLC’s unique UHP technology equips researchers to meet the challenges of next generation 3D nanotechnology. 

The new ALD publication, in JVSTA, will be featured on www.lesker.com and stay tuned for more updates as we continue to push the boundaries of ALD technology.

For more information, please visit our website or contact our marketing team.