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United States

Standards

Flexible Hybrid Electronics North America TC Chapter

Spring Meeting

Date: Tuesday, April 29, 2025

Time: 08:00-10:00 Pacific Time

via Virtual Meeting

 

AGENDA

(subject to change) 

Last updated: March 28, 2025

8:00 am - 10:00 am Off Add to Calendar 2025-04-29 08:00:00 2025-04-29 10:00:00 Flexible Hybrid Electronics North America TC Chapter Spring Meeting Flexible Hybrid Electronics North America TC ChapterSpring MeetingDate: Tuesday, April 29, 2025Time: 08:00-10:00 Pacific Timevia Virtual Meeting AGENDA(subject to change) Last updated: March 28, 2025 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

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Please email staff contact below for virtual information:

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Invitations and Registration

REGISTRATION FOR GCSW is CLOSED.  

All sessions are free of charge to Semiconductor Climate Consortium (SCC) and Energy Collaborative (EC) members.  Others will be admitted by invitation on a case-by-case basis.  Multiple attendees (up to 3) from your company are welcome, but must be invited. Exceptions can be made to the 3 persons limit to have the RIGHT people, with direct responsibility for subjects being discussed.

Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Interested in Attending? Business Executive Expositions
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Objective of GCS Workshops

A gathering of the semiconductor value chain in one place to most efficiently share solutions and tools and workshop solutions, thereby optimizing your time and resources dedicated to addressing the specific challenges we face. The GCS Workshops are co-hosted by SEMI, the Semiconductor Climate Consortium, Apple, and Google. 

The Workshops are focused on revealing the right details and data that will support action on decarbonization recommendations. The Workshops will NOT focus solely on the issue and roadblocks, but rather the solutions, including (1) sharing examples of successful paths, (2) provide possible tools you need to help address the gaps, and (3) active workshopping on further solution spacing towards emission reductions. We have identified leaders with the experience and knowledge to move toward answers during each Workshop. 

Bring your experience, critical thinking skills, and share with your fellow sustainability travelers.

Workshop Themes and Layout

5/15 – Opening + Facilities Abatement Tours (Tours are now full)

5/16 (AM) - Manufacturing Scope 1 Emissions – brownfield abatement retrofits, low GWP gas substitution and emission measurements reduction solutions, toolkits, roadblocks

5/16 (PM) - Manufacturing Energy Efficiency – fab/subfab interoperability, toolkits and ROI calculations

5/19 (AM) - Renewable Energy Education & Advocacy – global state-of-play, market breakouts for education and solution short listing

5/19 (PM) - Manufacturing Scope 3 Materials Decarbonization – partner paths, impacts and tools

5/20 (AM) - Data & Reporting Alignment – ROI and roadblocks + Closing (PM)

Synergies with the Semiconductor Climate Consortium 

Many themes of the GCS Workshops are outcomes of the discoveries in the SCC Working Groups and previous Supplier Day presentations.  The GCS Workshops will allow for greater depth of discussions and face-to-face solutioning opportunities.  With the right information and the right audience, attendees will depart with tools to operationalize for action.  Across the ecosystem, we want to see those benefits show up in our Scope 3 calculations. 

Microsoft Offices & Sands Convention Center
Singapore
Singapore

12:00 pm - 1:00 pm

Registration & Networking Lunch

Meet and connect with key industry stakeholders, policy leaders, and Microsoft’s sustainability leadership.

1:00 pm - 1:10 pm
Mousumi Bhat
Mousumi Bhat, PhD
VP SEMI Sustainability
SEMI

SEMI Global Climate Summit Workshops: Welcome

1:10 pm - 1:25 pm
Giorgio Fortunato
Giorgio Fortunato
Google

Energy in the APAC Region: Outlook & Strategies

1:30 pm - 1:45 am
susannah calvin
Susannah Calvin
Environment & Supply Chain Innovation
Apple, Inc.

Journey to Carbon Neutral - Supply Chain Focus

1:45 pm - 2:05 pm
Leslie Esparza
Leslie Esparza
Director, Responsible Sourcing
Microsoft
Leo Aspauza
Microsoft
William Hudson
Moderator
Will Hudson
Microsoft

Reflections on Microsoft Supplier Days & Looking Forward

2:05 pm - 2:15 pm
Mousumi Bhat
Mousumi Bhat, PhD
VP, Global Sustainability
SEMI

Overview of GCSW Workshops

2:15 pm - 6:30 pm

Facilities Abatement Tours

(Tours are full and no longer available to new registrants.)

Workshop 1: Manufacturing Fab Scope 1 Emissions

8:30 am - 8:50 am

Breakfast and Networking

8:50 am - 9:20 am
Beth Elroy
Beth Elroy
Vice President, Global EHS & Sustainability
Micron

Collaborative solutions for emissions challenges

9:20 am - 9:35 am
Cristal Phwan
Cristal Phwan
APAC Sustainability Team Manager
GlobalFoundries

Fabs Deploying new abatement tech; brownfield retrofits

9:35 am - 9:50 am
Robin Sim
Robin Sim
Facility Manager - Operation & Hookup Program
STMicroelectronics

Innovative ways to complete brownfield retrofits while minimizing fab disruption

9:50 am - 10:05 am
Hak Joon Kim
Dr. Hak Joon Kim
Principal Researcher
Korea Institute of Machinery and Materials (KIMM)

New abatement tech for both greenfield & brownfield fabs

10:05 am - 10:20 am
Haein Cho
Dr. Haein Cho
Samsung

Samsung's journey to net zero & Scope 1 strategies

10:20 am - 10:45 am

Workshop 1

- Retrofits: Learnings; forward-looking; benchmark projects; modular approaches
- Abatement Technology / Performance Roadmap: accelerating timelines; trends; alignment

10:45 am - 11:15 am
Scott Clendenning
Scott Clendenning, PhD
Intel
Gottfried Wastlbauer
Dr. Gottfried Wastlbauer
Head of Positioning & Business Model
Electronics business of Merck KGaA, Darmstadt, Germany

Low GWP Gases

11:15 am - 11:40 am

Workshop 2: Risk assessment & Methodology

11:40 am - 12:40 pm
Dr. Shou Nam Lee
Dr. Shou-Nan Li
ITRI
Rahul Singh
Dr. Rahul Singh
Manager, Emissions Analysis
Micron
Troy Boley
Troy Boley
President
Spectrum
Jonghan Lee
Jonghan Lee
SK Hynix

Emissions Measurement

12:40 pm - 1:05 pm

Workshop 3: Real-time monitoring, calibration variation, regulatory

1:05 pm - 1:30 pm

Readouts & Lunch Break

Workshop 2: Manufacturing Energy Efficiency – fab/subfab interoperability, toolkits and ROI calculations

1:30 pm - 2:00 pm
Kevin Chan
Kevin Chan
Lead, Artificial Intelligence
Micron

IDM perspective, state of the art sensor deployment & best practices for energy efficiency

2:00 pm - 2:15 pm
James Oh
James Oh
Aveva

Immediate Opportunities around Energy Efficiency

2:15 pm - 2:30 pm
John Golightly
John Golightly
VP of Sustainability
ASM

ASM Energy Efficiency Story

Net Zero Operations through Innovation and Collaboration

2:30 pm - 3:00 pm

EE Workshop 1: Sensor Deployment for Equipment

From energy sensor to harmonics & power quality detection and remediation

3:00 pm - 3:45 pm
Shaun Crawford
Shaun Crawford
Product Manager
Applied Materials
Stefanie Hammer
Stefanie Hammer
General Manager
Algorismic
Michael Neel
Michael Neel
Director of Marketing
Inficon

Operations Energy Efficiency Opportunities, Process and Recommendations

State-of-the-art Sub-Fab Interoperability

3:45 pm - 4:15 pm
TBD

EE Workshop 2: Communication & Interoperability

4:15 pm - 4:45 pm
Slava Libman
Slava Libman
FTD Solutions
James Oh
James Oh
Aveva
Mark da Silva
Mark da Silva
SEMI Smart Manufacturing

Current Solutions - Data Aggregation & Dashboard: Case Study

4:45 pm - 5:15 pm
Teh Seimens
Teh Tiack Ein
Head of Presales, Southeast Asia
Siemens Digital Industries Software
Arul
Arul Ambikapathi
Lam Research
Mark da Silva
SEMI Smart Data AI Initiative

Future Solution - Digital Twin (Design, Build, Operate & Maintain a Fab)

5:15 pm - 5:45 pm

Workshop 3: Data Management & Reporting

5:45 pm - 6:00 pm

Read out

Workshop 3: Renewable Energy Education & Advocacy – global state-of-play, market breakouts for education and solution short listing

8:00 am - 8:30 am

Networking & Breakfast

8:30 am - 9:00 am
Low - EMA
Xin Wei Low
Assistant Chief Executive
EMA

The Net Zero Imperative and Singapore's Role

9:00 am - 9:20 am
William Hudson
Will Hudson
Asia Pacific Sustainability Policy Director
Microsoft

One Goal, One Grid; Unlocking Clean Power Together

9:20 am - 9:50 am
Ali Izadi
Ali Izadi-Najafabadi
Head of APAC
Bloomberg NEF

Global state of play on accessible RE

9:50 am - 10:10 am
Michael Thomas
Mike Thomas
Managing Director
Lantau Group

Friendly Policies to Renewable Energy

10:10 am - 10:20 am
Eric Gibbs
Clean Energy Buyers Association

Procurement Hub

10:30 am - 12:00 pm

Breakouts/Workshop: RE Education & Awareness

Two parallel sessions will be held.
Group A - Room 3111: South Korea (45 min) and Japan (45 min)
Group B - Room 3112: Singapore/Malaysia (45 min) and Taiwan (45 min)

10:30 am - 11:15 pm
Seiya Miyake
Seiya Miyake
Renewable Energy Promoting Organization, Inc.
Shawn Woo
3 Degrees

How to Procure: Japan

11:15 am - 12:00 pm
Oursan Jin
Ousam Jin
CREF

How to Procure: South Korea

10:30 am - 11:15 am
Henry Eu
Asia Clean Energy Consortium (ACEC)
Greg Thomassin
Gregory Thomassin
Business Development
Total Energies
Michael Thomas
Mike Thomas
LTG

How to Procure: Singapore/Malaysia

11:15 am - 12:00 pm
Jung Choi
Jung Choi
Regional Manager for Asia-Pacific
CRS
Wei In
Wei-In Lin
Apala

How to Procure: Taiwan

12:00 pm - 12:15 pm

Workshop Readout

12:30 pm - 1:00 pm
Albert Sutaru
Albert Sutanto
Manager SE Asia Markets and Global EACs Sourcin
Mt. Stonegate

Achieving 100% RE in Asia: Market Highlights and Corporate Sourcing

(a working lunch)

1:00 pm - 1:20 pm
Robbert Slooten
Robbert Slooten
Manager, Renewable Energy and Carbon Advisory
Schneider Electric
Bess Ng
Bess Ng
Associate Principle, Sustainability Business
Schneider Electric

How to leverage the power of buyers’ groups for renewable electricity adoption in key markets - Korea, Singapore, and Japan

(a working lunch)

Workshop 4: Manufacturing Scope 3 Materials Decarbonization – partner paths, impacts and tools

1:30 pm - 1:50 pm
Han Chen
Han Chen
Asia Clean Energy Policy
Apple

The importance of scope 3 for Apple and the Path Forward Together

1:50 pm - 2:20 pm
Sebastian Goke, McKinsey & Company
Sebastian Goeke
Associate Partner
McKinsey & Company

Gaining transparency on Fab Scope 3 upstream emissions

2:20 pm - 2:50 pm
Christof Witte
Christof Witte
Partner
McKinsey & Company

How to drive upstream FAB decarbonization

2:50 pm - 3:10 pm
Stehanie Cotton
Stephanie Cottin
Sustainability and Safety Director & Chief of Staff to COO
Soitec

Examples of upstream suppliers taking accountability, decarbonizing

3:10 pm - 3:40 pm
Frank Bartels
Frank Bartels
Director Global Marketing and Product Management, Semiconductor Materials
BASF

Smart decarbonization of wet process solutions

3:40 pm - 4:00 pm
Corinna Wolf
Corinna Wolf
Head of Global Sustainability
Infineon

How to hold your supply chain accountable, educate them on decarbonization, and implement solutions

4:00 pm - 4:15 pm
Handy Ko
Handy Ko
Director of Materials Management
TSMC

Responsible Supply Chain Management

4:15 pm - 4:35 pm
Photo of Speaker Jordan Davis blond hair brown eyes
Jordan Davis
Responsible Business Alliance

GHG Survey; Inventory and tool for supplier outreach

Advancing Supplier Emissions Reporting: RBA’s Emissions Management Tool

4:35 pm - 4:50 pm
Marijn Vervoorn
Marijn Vervoorn
Director Sustainability Strategy
ASML

Change Management

4:50 pm - 5:40 pm

Workshop - Scope 3 - Materials | Gases | Chemicals | Wafers decarbonization

• Are these the right problems?
• What are 3 solutions that you can commit to working on this year?
• Where do you need help from the consortium or customers?
• What can we collectively commit to for 2030?

Workshop 5: Data & Reporting Alignment – ROI and roadblocks

8:30 am - 9:00 am
Joe Palazzo
Joe Palaazo
Technical PM - Environmental Sustainability
Google

Big Picture & Objective

9:00 am - 9:30 am
Claus Cremers
Director Automotive Ecosystems, Siemens, AG
Member of the Board of Catena-X

Industry Case Study

9:30 am - 9:50 am
Sue Sung Trinity
Sue Sung
Director - ESG Global Services
Trinity Consultants

Scope 1 Data Audits

9:50 am - 10:10 am
Slava-Libman
Slava Libman
FTD Solutions

Scope 2 Reporting

10:10 am - 10:30 am
Jason Guan
Jason Guan
TFS / BASF
Rollinist Li
TFS

The power of collaboration in GHG management

10:30 am - 11:00 am
Karsten Schischke
Karsten Schischke
Group Manager Policy, Ecodesign and Circular Materials
Fraunhofer IZM

Product Carbon Footprints: Why we need to agree on system-level and component-level calculation and reporting rules

11:00 am - 11:30 am

Live Survey & Roundtable

Closing & Next Steps / Readout

11:30 am - 12:30 pm

Close out & Next Steps

- EHS Sustainability

Plan now to attend the Global Climate Summit (GCS) Workshops in Singapore!  We invite you - and every leading company in the semiconductor value chain – to identify and send the right people to collaborate with your customers and vendors alike on finding solutions to the sector’s emission challenges. The event will be spread over 4 days to take advantage of 2 other important events:  Microsoft Supplier Days and SEMICON SouthEast Asia.

8:00 pm - 5:30 pm Off Add to Calendar 2025-05-15 20:00:00 2025-05-20 17:30:00 Global Climate Summit (GCS) Workshops Singapore Plan now to attend the Global Climate Summit (GCS) Workshops in Singapore!  We invite you - and every leading company in the semiconductor value chain – to identify and send the right people to collaborate with your customers and vendors alike on finding solutions to the sector’s emission challenges. The event will be spread over 4 days to take advantage of 2 other important events:  Microsoft Supplier Days and SEMICON SouthEast Asia. Microsoft Offices & Sands Convention Center Singapore Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore
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New Tab 1
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Call for Papers
Technology Showcase
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Off

MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing solutions focusing on speed, accuracy, safety, and ergonomics.

The next-generation epoxy dispenser represents an ultra-high-speed, flexible solution with multiple dispensing methods and materials, including silver-filled epoxies, conformal coating, sintering paste, thermal grease, and UV adhesive, among others. The system is highly configurable for complex applications, such as microwave modules, optical modules, hybrid circuits, multichip modules, advanced packaging, and semiconductor packaging. Moreover, it offers precise process control and is 35% more energy efficient than previous systems.

Our customers now have two options from this new product. The MRSI-175Ag is our standard option for 25µm accuracy. The MRSI-175Ag+ is an available option that achieves 10µm accuracy.

Francesca Navarro, Product Manager, MRSI Mycronic, expressed enthusiasm about the launch: “We are excited to introduce the next generation high precision epoxy dispenser and remain committed to ongoing innovation to meet the needs of our customers.”

For further details regarding MRSI and the next generation epoxy dispenser please visit www.mrsisystems.com or reach out to [email protected].

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

ALD enables lead-free MCP production with precise thin-film deposition, enhancing manufacturing yields, device performance, and lifetime value. Exosens chose Beneq’s P400A batch and TFS 500 ALD systems for their scalability, precision, and ability to support development from R&D to production.

Espoo, Finland, 06-Mar 2025 – Beneq and Photonis Scientific, part of the Exosens Group, have announced a significant advancement in Microchannel Plate (MCP) technology. This collaboration focuses on replacing traditional lead-based materials with ALD-enabled solutions, driving sustainable MCP manufacturing and unlocking new commercial opportunities for this versatile detection technology.

Unlocking New Potential in MCP Technology
Microchannel Plates (MCPs) are essential components in a variety of high-performance detection systems, from medical imaging and mass spectrometry to neutron imaging and scientific instrumentation. Historically manufactured using lead-silicate glass, MCPs are now transitioning to lead-free alternatives to comply with environmental regulations and improve long-term sustainability.

ALD technology plays a central role in this shift by enabling precise, conformal deposition of thin films. This approach decouples the properties of the glass substrate from those of the conductive and electron emissive coatings, allowing each to be independently optimized. The result is better performance, higher manufacturing yields, and greater flexibility to tailor MCPs to the demands of growing commercial markets.

Sustainability and Performance Gains with ALD
ALD enables MCP manufacturers to eliminate hazardous materials while achieving higher performance benchmarks. Lead-free MCPs produced using ALD deliver key benefits, such as enhanced stability, reduced noise, lower operational voltages, and minimized power consumption. ALD also supports advanced MCP designs that maintain performance under harsh conditions and extend device lifespan by up to 10 times compared to conventional methods.

“The introduction of ALD into MCP production marks a significant step forward for the industry,” said Ulrich Laupper, President and Executive General Manager of the Exosens Ultimate Detection Business Unit. “By leveraging ALD technology, we can align sustainability with high-performance detection solutions, addressing today’s market needs while preparing for future applications.”

Enabling Growth in MCP Markets with Beneq’s ALD Solutions
Photonis Scientific partnered with Beneq for its customizable TFS 500 ALD system, which supports MCP development at all stages—from R&D and pilot production to full-scale manufacturing. Beneq’s modular tool designs enable precise control over deposition parameters, meeting the rigorous requirements of MCP coatings while ensuring scalability and cost-efficiency.

“Beneq’s ALD tools provide the flexibility and precision we need to refine MCP coatings and scale our production,” said Till Cremer, R&D Scientist at Photonis Scientific. “Their tailored solutions have allowed us to unlock new potential in MCP technology and enhance its value for commercial applications.”

By fostering collaborations like this, Beneq is working to establish a growing market for ALD-enabled MCP technologies. The ability to tailor performance parameters such as operational stability, noise reduction, and power efficiency is positioning MCPs as a key detection technology across a wide range of industrial, medical, and scientific fields.

About Photonis
Photonis is a leading product brand of Exosens, a high-tech company with more than 85 years of experience in the innovation, development, manufacture and sale of high-end electro-optical technologies. Photonis offers its customers photo-detection and low light conditions imaging solutions for extremely demanding environments such as Defense & Security, Nuclear Safety, Life Science and Industrial & Non-Destructive testing. Photonis is internationally recognized as a leading brand and a major innovator in its fields with production and R&D sites in Europe and North America. For more information: exosens.com

About Beneq
Beneq is the home of Atomic Layer Deposition (ALD). Founded in 1984, Beneq introduced the first industrial ALD production and continues to lead the market with solutions for R&D, semiconductor fabrication, and advanced manufacturing. Beneq’s product portfolio includes tools for lab-scale research (TFS 200, TFS 500), high-volume production (Transform®, Prodigy™), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).

Beneq’s Development Service accelerates the adoption of new ALD processes, while its Coating Service offers streamlined, state-of-the-art ALD production capabilities. Beneq’s mission is to enable groundbreaking applications with ALD technology, providing unparalleled precision and scalability for researchers and manufacturers worldwide.

Brewer Science Showcases Water Quality Sensor Innovations at NextFlex Innovation Days 2025
Dr. Brewer’s Keynote Address Challenges the Industry to Rethink the Future of Hybrid Electronics

Santa Clara, California – March 19, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will showcase its latest innovations in water quality sensor technology at NextFlex Innovation Days 2025. As a founding member of NextFlex, Dr. Terry Brewer, has been invited to present the keynote address and commemorate the consortium’s 10th anniversary.

Brewer Science's Water Quality Sensor Provide Real-Time Detection
Visit Brewer Science’s exhibition booth to learn about the latest developments in water quality sensors, designed to provide real-time detection of contaminants such as heavy metals and nitrates. Leveraging advanced printed electronics and next-generation materials, these sensors offer:
• Real-time monitoring: Instantaneous data collection and analysis for proactive water quality management.
• High precision: Detection capabilities at parts-per-billion levels, ensuring exceptional accuracy.
• Customizable analytes: Adaptability to detect a wide range of water contaminants and minerals, catering to diverse industry needs. Brewer Science is exploring the potential to detect other contaminants like per- and polyfluoroalkyl substances (PFAS) in the future.

Dr. Terry Brewer’s Keynote Address Challenges the Industry to Rethink the Future of Hybrid Electronics
Dr. Terry Brewer will deliver a keynote address reflecting on NextFlex's decade-long journey and envisioning the future of hybrid electronics. His speech will be multidimensional, drawing parallels between technological evolution and the resilience of nature—particularly the Northern Fir tree. Just as the Northern Fir thrives by adapting to its environment and efficiently managing resources without a central processor, the future of hybrid electronics must embrace decentralized, intelligent design to create smarter, more adaptable systems.

Dr. Brewer will emphasize how, while the semiconductor industry's relentless push for miniaturization has yielded remarkable breakthroughs, it has also created opportunities to explore alternative pathways. He will highlight Brewer Science’s development of printed sensors, such as the Inflect™ line of sensors—a compact device measuring approximately 1 mm—that enables real-time, on-site detection of contaminants like lead in water. Much like the Northern Fir processes vast amounts of environmental data without a single controlling entity, hybrid electronics can empower distributed intelligence in sensors, reducing reliance on traditional, time-consuming analysis.

By rethinking how we integrate materials, sensors, and microelectronics, Brewer Science—alongside NextFlex—is helping to shape a future where technology mirrors the efficiency and adaptability of nature itself.

Connect with Dr. Adam Scotch at Brewer Science’s Exhibition Booth
Attendees will also have the opportunity to engage with Dr. Adam Scotch, Director of R&D for Printed Electronics at Brewer Science, who will be present at the exhibition booth. Dr. Scotch will provide insights into the company's research and development efforts, discuss the practical applications of their water quality sensors, and explore potential collaborations to further advance flexible hybrid electronics (FHE) technologies.

Brewer Science’s participation in NextFlex Innovation Days 2025 underscores its dedication to pioneering solutions that address critical environmental challenges through technological innovation. The company remains committed to pushing the boundaries of what’s possible in flexible hybrid electronics, contributing to a smarter and more connected world. Learn more about Brewer Science’s Water Quality Sensor capabilities on their website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

DuPont Announces CEO and Non-Executive Chair for the Planned Independent Electronics Company
Intended spin-off of Electronics remains on track for November 1, 2025, completion

WILMINGTON, Del., Mar. 17, 2025 – DuPont (NYSE:DD) today announced Jon Kemp, President, DuPont Electronics & Industrial will be the Chief Executive Officer and a member of the board of directors for the future independent Electronics public company that will be created following its intended spin-off from DuPont. As a focused independent company, Electronics will be a global leader in materials and technology solutions for the semiconductor and electronics industries.

“Jon is a great choice for the CEO of the future Electronics company," said Ed Breen, DuPont Executive Chairman. “With his proven leadership and extensive experience in the electronics sector, Jon is uniquely positioned for the role. I believe his ability to drive growth and generate returns will ensure that as a pure-play, public company, Electronics will continue to create shareholder value.”

“For decades, our team has focused on driving innovations that advance the electronics industry,” said Jon Kemp. “We are entering a pivotal time where advanced computing and connectivity will require new technologies and integrated solutions. As a leader in materials science and engineering, the future Electronics company will be a vital partner in advancing our customers' growth strategies. I am proud to be part of this journey and lead the team as we take this next leap forward.”

Michael Stubblefield, President & CEO of Avantor, will become Chairman of the board of directors for the planned independent Electronics public company, effective with the spin-off. “Michael is a proven executive with a wealth of global management experience,” said Alexander M. Cutler, DuPont's Lead Independent Director. “He is well-versed in technology and customer-centric innovation and will be a strong partner with Jon as we launch this exciting new company.”

DuPont intends to appoint a Chief Financial Officer for the future Electronics company who will be an external hire with a proven track record of performance at a publicly traded company.

Biographical Information
Over a two-decade career with DuPont, Jon Kemp has been focused on driving strategic business growth from his early roles in business development and marketing to commercial and business leadership positions. During the DowDuPont merger, he was the head of strategy, M&A and procurement for the Specialty Products Division. For the past six years Mr. Kemp has served as President of the $6 billion Electronics & Industrial segment within DuPont. He serves on the International Board of Directors for SEMI, where he chairs the Board of Industry Leaders. He holds a Bachelor of Arts in Economics from the University of Utah and an MBA from the Darden School of Business at the University of Virginia.

Michael Stubblefield is President and CEO of Avantor, a leading life science tools company and global provider of mission-critical products and services to the life sciences and advanced technology industries. Prior to joining Avantor in 2014, Mr. Stubblefield was a Senior Expert for the Chemicals Practice of McKinsey & Company, a management consulting firm, from 2013 to 2014. Previously, he held a variety of leadership roles at Celanese Corporation, a technology and specialty materials company, from 1994 to 2012. He holds a Bachelor of Science in Chemical Engineering from the University of Utah, as well as an M.B.A. from Texas A&M University-Corpus Christi.

Click here to download Media Kit: https://dupont.mediavalet.com/galleries/82f459db-c62f-467d-9235-b8ff52b…

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

On January 15, 2025, DuPont announced it is targeting November 1, 2025, for the completion date for the intended separation of the Electronics business (the “Intended Electronics Separation”). The Intended Electronics Separation will not require a shareholder vote and is subject to satisfaction of customary conditions, including final approval by DuPont's Board of Directors, receipt of tax opinion from counsel, the filing and effectiveness of a Form 10 registration statement with the U.S. Securities and Exchange Commission, applicable regulatory approvals and satisfactory completion of financing.

Cautionary Statement about Forward-Looking Statements
This communication contains “forward-looking statements” within the meaning of the federal securities laws, including Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. In this context, forward-looking statements often address expected future business and financial performance and financial condition, and often contain words such as “expect,” “anticipate,” “intend,” “plan,” “believe,” “seek,” “see,” “will,” “would,” “target, “outlook,” “stabilization,” “confident,” “preliminary,” “initial,” and similar expressions and variations or negatives of these words. All statements, other than statements of historical fact, are forward-looking statements, including statements regarding outlook, expectations and guidance. Forward-looking statements address matters that are, to varying degrees, uncertain and subject to risks, uncertainties, and assumptions, many of which that are beyond DuPont’s control, that could cause actual results to differ materially from those expressed in any forward-looking statements.

Forward-looking statements are not guarantees of future results. Some of the important factors that could cause DuPont’s actual results to differ materially from those projected in any such forward-looking statements include, but are not limited to: (i) the ability of DuPont to effect the Intended Electronics Separation and to meet the conditions related thereto; (ii) the possibility that the Intended Electronics Separation will not be completed within the anticipated time period or at all; (iii) the possibility that the Intended Electronics Separation will not achieve its intended benefits; (iv) the impact of Intended Electronics Separation on DuPont’s businesses and the risk that the separation may be more difficult, time-consuming or costly than expected, including the impact on DuPont’s resources, systems, procedures and controls, diversion of management’s attention and the impact and possible disruption of existing relationships with customers, suppliers, employees and other business counterparties; (v) the possibility of disruption, including disputes, litigation or unanticipated costs, in connection with the Intended Electronics Separation; (vi) the uncertainty of the expected financial performance of DuPont or the separated company following completion of the Intended Electronics Separation; (vii) negative effects of the announcement or pendency of the Intended Electronics Separation on the market price of DuPont’s securities and/or on the financial performance of DuPont; (viii) the ability to achieve anticipated capital structures in connection with Intended Electronics Separation, including the future availability of credit and factors that may affect such availability; (ix) the ability to achieve anticipated credit ratings in connection with the Intended Electronics Separation; (x) the ability to achieve anticipated tax treatments in connection with the Intended Electronics Separation and completed and future, if any, divestitures, mergers, acquisitions and other portfolio changes and the impact of changes in relevant tax and other laws; and (xi) other risk factors discussed in DuPont’s most recent annual report and subsequent current and periodic reports filed with the U.S. Securities and Exchange Commission. Unlisted factors may present significant additional obstacles to the realization of forward-looking statements. Consequences of material differences in results as compared with those anticipated in the forward-looking statements could include, among other things, business or supply chain disruption, operational problems, financial loss, legal liability to third parties and similar risks, any of which could have a material adverse effect on DuPont’s consolidated financial condition, results of operations, credit rating or liquidity. You should not place undue reliance on forward-looking statements, which speak only as of the date they are made. DuPont assumes no obligation to publicly provide revisions or updates to any forward-looking statements whether as a result of new information, future developments or otherwise, should circumstances change, except as otherwise required by securities and other applicable laws.

Belgium China France Germany Ireland Italy Japan Singapore South Korea Taiwan United States 360x317 EM2025 tile Business Executive Training
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United States

8:00 am - 8:05 am
Host
Kenneth Guertin
SEMI

Welcome

8:05 am - 8:20 am
Vrushali Gaud
Google

Keynote: Low Carbon Energy in the Semiconductor Sector

8:20 am - 8:45 am

Member Lightning Talks!

Werner Haberstock, Advantest
Robin Connell, Applied Materials
Amanda Shing, Lam Research
Lélia Devinoy, NXP
Clea Edwards, STMicroelectronics
David Sandal, Tokyo Electron

8:50 am - 8:55 am
Justin Haris
SEMI

SEMI Forest for Empowering Youth and Communities

8:55 am - 9:00 am

Closing & Announcements

Sustainability

Join the Climate & Social Impact working group in celebrating Earth Month 2025, themed "Our Power, Our Planet"!  The webinar will feature an update on the worldwide state of low-carbon energy, and particularly the status of the semiconductor ecosystem in using renewables and other sources of power.  In addition, several SEMI members will present a lightning round of their progress and programs in the renewables and social impact space.  A great place for gathering ideas on how you as a professional can have an impact.

8:00 am - 9:00 am Off Add to Calendar 2025-04-24 08:00:00 2025-04-24 09:00:00 Earth Month Webinar 2025 Join the Climate & Social Impact working group in celebrating Earth Month 2025, themed "Our Power, Our Planet"!  The webinar will feature an update on the worldwide state of low-carbon energy, and particularly the status of the semiconductor ecosystem in using renewables and other sources of power.  In addition, several SEMI members will present a lightning round of their progress and programs in the renewables and social impact space.  A great place for gathering ideas on how you as a professional can have an impact. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States standards-500w.jpg

Virtual, Pacific Time
United States

Standards

Liquid Chemicals North America TC Chapter

Spring Meeting

Date: Tuesday, April 8, 2025

Time: 13:00-15:00 Pacific Time

via Virtual Meeting

 

AGENDA

(subject to change) 

Last updated: March 8, 2025

1:00 pm - 3:00 pm Off Add to Calendar 2025-04-08 13:00:00 2025-04-08 15:00:00 Liquid Chemicals North America TC Chapter Spring Meeting Liquid Chemicals North America TC ChapterSpring MeetingDate: Tuesday, April 8, 2025Time: 13:00-15:00 Pacific Timevia Virtual Meeting AGENDA(subject to change) Last updated: March 8, 2025 Virtual, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Voting Instructions

To Vote During TC Chapter Meetings

  1. Open a separate Web browser and go to:  https://svm.semi.org/
  2. Click “Login”
  3. Enter your Standards Membership username and password (same login you use for voting on ballots)
  4. Find the meeting room you wish to attend under “Room Name”
  5. Click “Go” to enter the meeting room.

 

NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".

 

Next Meetings

Save the Date!

North America Summer Meetings
June 2-3, 2025 @ SEMI HQ, Milpitas, California

 

Contact

Please email staff contact below for virtual information:

Laura Nguyen
Sr. Coordinator, International Standards
 

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Preliminary agenda

  • Climate risk in 2025: why now and what’s next?

    • Regulation and Business Case Rationale

  • A Fireside chat: Risilience and SEMI member perspective: Lam Research

  • Strategic approach to climate risk evaluation and measurement

    • Risilience Case Study:  Semiconductor value chain company risk assessment

  • About the SEMI Environmental Risk Mitigation and Reporting Working Group

  • Q&A

 

To Register, Email Jordan Famularo, [email protected]

United States

- Sustainability

This exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.

Times

2 Sessions available for global business hours:

EMEA: April 1, 2025 - 5:00-5:45 pm CET

America:  April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific Time

Asia Pacific: April 2, 2025 8-8:45 am Singapore  

Off Add to Calendar 2025-04-01 00:00:00 2025-04-02 00:00:00 Navigating Climate Risk This exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.Times2 Sessions available for global business hours:EMEA: April 1, 2025 - 5:00-5:45 pm CETAmerica:  April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific TimeAsia Pacific: April 2, 2025 8-8:45 am Singapore   United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
Tab Order
Overview
Agenda
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New Tab 1
Travel
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This event has sold out!

If you would like to be put on the waitlist, please click on the interest form.

United States Agentic AI Business Executive Technical Training

Suggested Hotels:

Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

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Milpitas, CA
United States

Morning, Day 1: June 11, 2025

8:00 am - 8:45 am

Registration & Breakfast​

8:45 am - 12:15 pm

Session #1 – Overview of Agentic AI in Semiconductor Manufacturing

The session introduces Agentic AI and its applications in semiconductor manufacturing, addressing critical challenges like defect detection, yield enhancement, and process variability. Through real-world case studies, it will demonstrate how AI-driven solutions can significantly improve in fab efficiency and accuracy. The discussion will highlight the transformative potential of Agentic AI in optimizing semiconductor production, setting the stage for deeper exploration in future discussions.

8:45 am - 8:55 am
Anshu Bahadur
Anshu Bahadur
Sr Program Manager, Smart Manufacturing
SEMI

Welcome Remarks

8:55 am - 9:25 am
Shomit Ghose
Shomit Ghose
Partner at Clearvision Ventures
UC Berkeley

Keynote Speaker - Agentic AI: Opportunity, Technologies & Risks

9:25 am - 9:55 am
Eugen Solowjow
Eugen Solowjow
Head of AI & Robotics
Siemens

Keynote Speaker - Industrial Co-Pilots and Agentic AI

9:55 am - 10:25 am

Coffee Break

10:25 am - 10:55 am
Michael Passow
Michael Passow
AI/ML Leader for IBM Semiconductors
IBM

Real World Manufacturing Applications

10:55 am - 11:25 am
Garrett Schlenvogt
Garrett Schlenvogt
VP, Worldwide Field Applications Engineering
Silvaco

Leveraging Physics-Based Digital Twins for Efficient Semiconductor Manufacturing

11:25 am - 11:45 am
Sean Tropsa
Sean Tropsa
Principal Solution Consultant
SEEQ

Sponsor Presentation - SEEQ

SEEQ
11:45 am - 12:15 pm

Panel Discussion

12:15 pm - 1:15 pm

Lunch

Afternoon, Day 1: June 11, 2025

1:15 pm - 5:15 pm

Session #2 – Process Control with Agentic AI

The session will focus on leveraging Agentic AI for process optimization, including Smart FDC, YMS, ML Ops, and recipe optimization. Key topics will include look-ahead scheduling, line balancing, virtual metrology, and smart inspection strategies. Energy and gas management strategies are highlighted alongside AI-driven sampling optimization. Practical methods for seamlessly integrating AI into existing manufacturing systems will be explored, with an emphasis on streamlining operations to achieve autonomous manufacturing.

1:15 pm - 2:00 pm
Jon Herlocker
Jon Herlocker
VP & General Manager of Tignis, a Cohu Analytics Solution
Tignis

Keynote Speaker - Agentic AI in Process Control: A Practical Roadmap for Fab Transformation

2:00 pm - 2:30 pm
Christopher Nguyen
Christopher Nguyen
CEO & Co-Founder
Aitomatic

Autonomous Process Control & Optimization

2:30 pm - 3:00 pm
Brendon Choe
Brendon Choe
VP of Technology
Gauss Labs

Purpose-Specific Automatic Learning Machine for Fab-Wide Virtual Metrology

3:00 pm - 3:30 pm

Coffee Break

3:30 pm - 4:00 pm
John Bongaarts
John Bongaarts
Applied AI Consultant
Soliton Technologies

AI Agents as Troubleshooting Partners & Knowledge Managers

4:00 pm - 4:30 pm
Holland Smith
Dr. Holland M. Smith III
Director of Data Science
INFICON

Automate the Mundane or Achieve the Incredible (or Both): The Dawn of Agents in the Fab

4:30 pm - 5:00 pm

Panel Discussion

5:00 pm - 5:15 pm
John Behnke
John Behnke
Smart Manufacturing GM
INFICON

SEMI Smart Mfg NA Chapter introduction with the Smart Mfg Roadmap pyramid

5:15 pm - 7:15 pm

Networking Dinner Reception

Sponsored by SEEQ

SEEQ

Morning, Day 2: June 12, 2025

8:00 am - 9:00 am

Registration & Breakfast​

9:00 am - 1:00 pm

Session #3 – Predictive Maintenance in Semiconductor Fabs

The session will highlight the use of Agentic AI for equipment health monitoring and predictive maintenance in fabs and sub-fabs, exploring benefits such as cost savings, improved uptime, and enhanced operational efficiency. Key topics will include smart maintenance, prognosis health monitoring, anomaly detection and techniques for estimating the remaining useful life (RUL) of equipment. The session will emphasize AI's role in optimizing maintenance practices.

9:00 am - 9:30 am
Pugal Janakiraman
Pugal Janakiraman
Global Manufacturing CTO
Snowflake

Keynote Speaker – Agentic AI for Industry 4.0 (Smart Manufacturing)

9:30 am - 10:00 am
David Meyer
David Meyer
CEO
Lynceus

From Engineer Assistant to Virtual Engineer

10:00 am - 10:30 am
Kiran Karunakaran
Kiran Karunakran
CTO
Via Automation

AI Agents for Factory Maintenance: Using Factory Data for Automated Decisions

10:30 am - 11:00 am

Coffee Break

11:00 am - 11:30 am
Mayurakshi Dutta
Mayurakshi Dutta
Director Industry Advisor Semiconductor Industry
Microsoft

Predictive Maintenance in Semiconductor Fabs

11:30 am - 12:00 pm
David Duval
Edwards

Enhancing Predictive Maintenance Algorithms through Equipment Failure Analysis

12:00 pm - 12:30 pm
Maryia Kurdina
Maryia Kurdina
AI R&D Group Leader
Tokyo Electron Limited Technology and AI Design

AI agents in a few-shot learning for autonomous fault detection and prediction in semiconductor fabrication

12:30 pm - 1:00 pm
Viraj Modak
Viraj Modak
Sr. Solutions Architect
Nvidia
Vineeth Kalluru
Vineeth Kalluru
Senior Solutions Architect - Generative AI
Nvidia

Building observable and scalable Multi Agent Workflows for Predictive Maintenance

1:00 pm - 2:00 pm

Lunch

Afternoon, Day 2: June 12, 2025

2:00 pm - 5:00 pm

Session #4 – Data Integration & Supply Chain

Efficiency in supply chains can be significantly enhanced by deploying AI agents for fundamental tasks such as factory-level planning, floor scheduling, real-time dispatching, and monitoring manufacturing processes at remote or contract facilities. These agents can quickly issue alerts for variations in yields or shipping schedules, taking corrective actions, such as expediting or rerouting shipments to prevent delays. Given the complexity of extended global supply chains—especially those involving multiple fabrication, assembly, and testing cycles compounded by chiplet production and advanced packaging—AI agents substantially improve coordination and operational efficiency.

2:00 pm - 2:30 pm
Paul Schneider
Paul Schneider
Principal Engineer, Director
Intel

Agentic AI in Factory Planning & Scheduling Digital Twin Solutions

2:30 pm - 3:00 pm
Jeff David
Jeff David
VP of AI Solutions
PDF Solutions

Data Integration & Supply Chain - Challenges & Opportunities

3:00 pm - 3:30 pm
Sunil Pandit
Sunil Pandit
Senior Director
Accel4

Orchestrating Data for Agentic AI: Transforming Semiconductor Manufacturing

3:30 pm - 3:45 pm

Coffee Break

3:45 pm - 4:15 pm
Sebastian Steele
Sebastian Steele
Product Director
Flexciton

Agentic AI and Advanced Optimization for Production Planning and Scheduling

4:15 pm - 4:45 pm
Itzik Gilboa
Itzik Gilboa
CEO
Minds.ai

Multi-Agent Reinforcement Learning and Tool Processing Time Prediction for Optimized Semiconductor Manufacturing

4:45 pm - 5:00 pm

Wrap-Up

- Smart MFG

This workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge.

Off Add to Calendar 2025-06-11 00:00:00 2025-06-12 00:00:00 Agentic AI For Next-Generation Semiconductor Manufacturing This workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Registration—SOLD OUT!
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