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San Francisco, CA
United States

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development Off Add to Calendar 2026-10-13 00:00:00 2026-10-15 00:00:00 SEMICON West 2026 San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public
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Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Paul Cohen ([email protected]) with a picture of your student ID to receive your discount code.

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The chips powering today’s cell phones, cars, computers, and more can contain billions of transistors. Designing these chips requires a team of engineers with expertise in various aspects of the design flow, along with Electronic Design Automation (EDA) tools that are needed to implement and verify these complex designs.

This Master Class is intended for non-technical staff that wish to understand the basics of semiconductor chip design. It provides an appreciation of the complex design flows and an understanding of some of the terminology used by chip design teams.

For students, the course will introduce some of the rewarding challenges and career opportunities available in the design and EDA industries.

In this class we will cover basic information about digital chips, then introduce some of the key steps and tools used during the design flow. We will also discuss some of the tradeoffs of different implementation methodologies and some of the challenges presented by various critical applications such as devices used in medical and automotive systems.
 

10:00 am - 10:05 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI

Welcome and Introduction

10:05 am - 11:30 am
Paul Cohen
Paul Cohen
Sr. Manager, ESDA
SEMI

Introduction to Chip Design and EDA

Biography

Course Overview
• Introduction to electronic devices
• Overview of digital logic and chip design history
• Semiconductor manufacturing basics
• Chip design and verification flow
• Implementation choices
• Heterogenous integration
• Interface to manufacturing
• Emerging challenges

Smart MFG ESD Alliance FOA SOI

Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed. 

10:00 am - 11:30 am Off Add to Calendar 2025-06-25 10:00:00 2025-06-25 11:30:00 ESD Alliance Master Class: Introduction to Design and EDA Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed.  SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now to Watch the Recorded Event
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Tokyo Electron U.S. Celebrates its New Headquarters in the Heart of Austin 

The semiconductor equipment manufacturer has operated in the U.S. for over 30 years.

Austin, Texas, April 16th, 2025 –Toshiki Kawai, Tokyo Electron (TEL) President & CEO cut the ribbon at the company’s new TEL | RiverSouth HQ, signaling a new era for the organization that has played a crucial part in the U.S. semiconductor and technology landscape for over three decades. 

“With Tokyo Electron's pivotal role in the U.S. semiconductor industry, it is only fitting that our office is located in the dynamic center of Austin,” said Bobby Shirai, President of Tokyo Electron U.S. Holdings. “The U.S. has long been a hub for intellectual and research capital and serves as the beating heart of global technology. We are a partner and ally committed to America’s innovative tech future.” 

Tokyo Electron U.S. manages 19 sites, employing nearly 3,400 people across the United States, with over 600 employees in Austin. The company leads the world in patents within the semiconductor production equipment industry, underscoring its commitment to innovation and excellence.

Texas Secretary of State Jane Nelson, the Consulate-General of Japan in Houston Zentaro Naganuma, Samsung Austin Semiconductor. Vice President Jon Taylor, Austin Chamber of Commerce President & CEO Jeremy Martin, and President and Tokyo Electron America President Mark Dougherty also joined the opening and recognized how the importance of the new headquarters will be in facilitating greater collaboration across sectors. 

About Tokyo Electron U.S.

Tokyo Electron (TEL) U.S. is the American subsidiary of Tokyo Electron and U.S. headquarters and one of the world’s leading producers of semiconductor production equipment. Headquartered in Austin, Texas for over 30 years, TEL U.S. is proud to employ almost 3,600 people across the United States who are contributing to technological innovation in semiconductors. Learn more about how TEL’s research and development stands at the cutting edge of innovation for Technology Enabling Life: About TEL | Tokyo Electron Ltd.

 

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How Will Agentic AI Change Chip Design and Verification?” features EDA and emerging agentic AI company executives and entrepreneurs discussing changes within chip design and verification as agentic AI tools become more mainstream. Panelists will distill the excitement surrounding the innovation in chip design and verification, collaboration between traditional EDA and agentic AI startups and broader implications for technological advancements.

Cadence Design Systems
2655 Seely Avenue
Building 10
San Jose, CA 95134
United States

5:30 pm - 6:45 pm

Registration and Networking with Dinner and Beverages

6:45 pm - 7:00 pm
Julie Rogers
Julie Rogers
Executive Director
ESD Alliance
Chuck Alpert
Chuck Alpert
Fellow
Cadence

Welcome and Speaker Introductions

7:00 pm - 8:30 pm
Ed Sperling
Moderator
Ed Sperling
Editor-in-Chief
Semiconductor Engineering
Dave Kelf
Dave Kelf
CEO
Breker Verification Systems
Wally Rhines
Walden Rhines
CEO
Silvaco
Vince Wong
Vince Wong
Head of AI Development
Verific
Shelly Henry
Shelly Henry
CEO
Moores Lab AI
Ann Wu
Ann Wu
CEO
Silimate
Cindy Cui
Cindy Cui
VP of Global Customer Success
ChipAgents
ESD Alliance

Join ESDA for our Executive Outlook event, "How Will Agentic AI Change Chip Design and Verification?"

5:30 pm - 8:30 pm Off Add to Calendar Disabled America/Los_Angeles
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DuPont’s semiconductor materials innovation recognized in category for AI-driven advancements

WILMINGTON, Del., April 8, 2025 – DuPont (NYSE:DD) today announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.

The Ikonic™ 9000 CMP pad series is a new expansion to DuPont’s Ikonic™ CMP product family, developed to enhance productivity and sustainability in semiconductor manufacturing processes for advanced chips. Ikonic™ 9000 pads have been recognized alongside other semiconductor innovations for AI and high-performance computing.

“Customers frequently turn to DuPont to tackle their next-generation technology challenges through advanced semiconductor materials,” said Sang Ho Kang, Vice President and General Manager, DuPont Semiconductor Technologies. “The development of Ikonic™ 9000 series pads is a successful outcome from addressing two critical needs for advanced node manufacturing—enhanced performance and more sustainable operations.”

Ikonic™ 9000 pads offer a high removal rate in CMP that leads to increased process throughput, and an advanced groove design aimed at maximizing slurry efficiency. At advanced fabrication nodes for chips supporting AI and high-performance computing, increased process complexity makes CMP efficiency especially important.

Additionally, the pads exhibit a longer operational life due to low wear rates, allowing for less frequent replacements and reduced downtime, optimizing production workflows. These features not only improve productivity, but also minimize waste, creating a more sustainable solution for semiconductor fabs.

“We are excited to see such a strong industry response to the launch of Ikonic™ 9000 pads, because they represent the start of a new wave of CMP innovation for performance, efficiency and sustainability,” said Randal King, Ph.D., Vice President of R&D/Technology, DuPont Electronics & Industrial. “DuPont is proud to be driving innovation across multiple new CMP pad and subpad families, and we look forward to launching more next-generation CMP pads to support advanced computing and AI.”

The Edison Awards™ is an annual competition honoring excellence in new product and service development, marketing, human-centered design, and innovation. Winners were selected from thousands of submissions and announced at the Edison Awards Gala in Fort Meyers, Florida on Thursday, April 3, 2025.

Ikonic™ 9000 series CMP pads have been successfully placed at advanced technology nodes. Customers interested in learning more about Ikonic™ 9000 CMP pads or other opportunities to drive sustainability enhancements in their CMP processes should contact their DuPont account manager.

sigma design logo

Sigma Design Joins SEMI to Support Semiconductor and Electronics Industries

(April 1, 2025) - Camas, WA - Sigma Design, Inc., a leader in product development and engineering, is pleased to announce its membership in SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain.

By joining SEMI, Sigma Design gains access to an extensive network of industry leaders, market insights, and collaborative connections that enhance opportunities to deliver support services for semiconductor manufacturing, material handling and testing. This membership aligns with Sigma Design’s commitment to advancing technology and contributing to the growth of the semiconductor ecosystem.

Sigma Design is committed to driving innovation and excellence in support of the semiconductor industry. “Joining SEMI represents a significant step in that journey," said Yehudit Dagan, Director of Sales and Marketing at Sigma Design. “This membership will enable us to stay at the forefront of industry trends, enhance our support services for other SEMI members, and strengthen our ties with this community.”

As a SEMI member, Sigma Design looks forward to leveraging the organization’s resources to support the growth of the semiconductor ecosystem and reinforce its position as a trusted partner in the industry.

About Sigma Design

As product development experts, we are driven by new challenges. We design, engineer, build, and test solutions for our partners' success. Sigma Design is a full-service product development and engineering firm dedicated to solving complex challenges. With a focus on quality, efficiency, and innovation, Sigma Design provides end-to-end product development solutions that encompass design, engineering, manufacturing, testing, and staffing services. Committed to excellence, we exceed client expectations with our dedicated approach. Challenges Accepted. Solutions Delivered.

 

For more information, visit www.sigmadzn.com

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

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Andrew Fung, A. M. Fitzgerald and Associates

Andrew O. Fung, Ph.D., Director of Business Development, A.M. Fitzgerald & Associates LLC 

Dr. Fung advances product development programs for MEMS-enabled microsystems. He has 25 years of multinational experience in industry teams and research, with broad awareness of integrated microsystems. His track record covers technology innovation, collaborative research, community building, fundraising, and mentorship. Prior to joining AMFitzgerald, Dr. Fung was Team Leader of MEMS, Nanofabrication, and Integration at CMC Microsystems, and Scientific Advisor to Aterica Health Inc. Dr. Fung received his B.A.Sc. in Electrical Engineering from University of Waterloo and Ph.D. in Biomedical Engineering from University of California, Los Angeles.

United States

NBMC FlexTech MSIG

Hosted by SEMI MSIG

The global medical device market is poised to benefit from miniature sensors that enable increasing instrumentation for data acquisition. Wearable health monitors, precision surgical tools, active implantables, and point-of-care diagnostics continue to drive demand for sensorization. As medtech companies race to innovate, MEMS-based solutions are revolutionizing patient care—enabling real-time monitoring, improving clinical outcomes, and reducing healthcare costs. Join A.M. Fitzgerald & Associates in this webinar to explore cutting-edge intersections of MEMS and healthcare, from wearable biosensors and intelligent implants to breakthrough microfluidic diagnostics. This session will highlight emerging technology opportunities and key challenges, providing actionable insights for medtech innovators looking to accelerate product development and scale MEMS-enabled devices successfully. 

What You’ll Learn: 

✔ Market trends shaping the future of MEMS in medtech 

✔ How MEMS sensors are transforming patient monitoring and intervention 

✔ Strategies for overcoming design, manufacturing, and regulatory hurdles 

✔ Examples of A.M. Fitzgerald innovations in MEMS-enabled medtech products 

 

Who Should Attend? 

Medtech executives, product managers, R&D leaders, engineers, innovators, and MEMS enthusiasts eager to see how MEMS technology is being integrated into next-generation healthcare solutions. 

 

Don’t miss this opportunity to gain a competitive edge in the fast-evolving medtech landscape! 

Register Now to secure your spot.

8:00 am - 9:00 am Off Add to Calendar 2025-05-07 08:00:00 2025-05-07 09:00:00 A.M. Fitzgerald Webinar - Empowering Tomorrow’s Precision MedTech with Sensor Solutions Hosted by SEMI MSIGThe global medical device market is poised to benefit from miniature sensors that enable increasing instrumentation for data acquisition. Wearable health monitors, precision surgical tools, active implantables, and point-of-care diagnostics continue to drive demand for sensorization. As medtech companies race to innovate, MEMS-based solutions are revolutionizing patient care—enabling real-time monitoring, improving clinical outcomes, and reducing healthcare costs. Join A.M. Fitzgerald & Associates in this webinar to explore cutting-edge intersections of MEMS and healthcare, from wearable biosensors and intelligent implants to breakthrough microfluidic diagnostics. This session will highlight emerging technology opportunities and key challenges, providing actionable insights for medtech innovators looking to accelerate product development and scale MEMS-enabled devices successfully. What You’ll Learn: ✔ Market trends shaping the future of MEMS in medtech ✔ How MEMS sensors are transforming patient monitoring and intervention ✔ Strategies for overcoming design, manufacturing, and regulatory hurdles ✔ Examples of A.M. Fitzgerald innovations in MEMS-enabled medtech products  Who Should Attend? Medtech executives, product managers, R&D leaders, engineers, innovators, and MEMS enthusiasts eager to see how MEMS technology is being integrated into next-generation healthcare solutions.  Don’t miss this opportunity to gain a competitive edge in the fast-evolving medtech landscape! Register Now to secure your spot. United States SEMI.org [email protected] America/Los_Angeles public Register here
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United States

Standards

Flexible Hybrid Electronics North America TC Chapter

Spring Meeting

Date: Tuesday, April 29, 2025

Time: 08:00-10:00 Pacific Time

via Virtual Meeting

 

AGENDA

(subject to change) 

Last updated: March 28, 2025

8:00 am - 10:00 am Off Add to Calendar 2025-04-29 08:00:00 2025-04-29 10:00:00 Flexible Hybrid Electronics North America TC Chapter Spring Meeting Flexible Hybrid Electronics North America TC ChapterSpring MeetingDate: Tuesday, April 29, 2025Time: 08:00-10:00 Pacific Timevia Virtual Meeting AGENDA(subject to change) Last updated: March 28, 2025 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Voting Instructions

To Vote During TC Chapter Meetings

  1. Open a separate Web browser and go to:  https://svm.semi.org/
  2. Click “Login”
  3. Enter your Standards Membership username and password (same login you use for voting on ballots)
  4. Find the meeting room you wish to attend under “Room Name”
  5. Click “Go” to enter the meeting room.

 

NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".

 

Contact

Please email staff contact below for virtual information:

Laura Nguyen
Sr. Coordinator, International Standards
 

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Invitations and Registration

REGISTRATION FOR GCSW is CLOSED.  

All sessions are free of charge to Semiconductor Climate Consortium (SCC) and Energy Collaborative (EC) members.  Others will be admitted by invitation on a case-by-case basis.  Multiple attendees (up to 3) from your company are welcome, but must be invited. Exceptions can be made to the 3 persons limit to have the RIGHT people, with direct responsibility for subjects being discussed.

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Objective of GCS Workshops

A gathering of the semiconductor value chain in one place to most efficiently share solutions and tools and workshop solutions, thereby optimizing your time and resources dedicated to addressing the specific challenges we face. The GCS Workshops are co-hosted by SEMI, the Semiconductor Climate Consortium, Apple, and Google. 

The Workshops are focused on revealing the right details and data that will support action on decarbonization recommendations. The Workshops will NOT focus solely on the issue and roadblocks, but rather the solutions, including (1) sharing examples of successful paths, (2) provide possible tools you need to help address the gaps, and (3) active workshopping on further solution spacing towards emission reductions. We have identified leaders with the experience and knowledge to move toward answers during each Workshop. 

Bring your experience, critical thinking skills, and share with your fellow sustainability travelers.

Workshop Themes and Layout

5/15 – Opening + Facilities Abatement Tours (Tours are now full)

5/16 (AM) - Manufacturing Scope 1 Emissions – brownfield abatement retrofits, low GWP gas substitution and emission measurements reduction solutions, toolkits, roadblocks

5/16 (PM) - Manufacturing Energy Efficiency – fab/subfab interoperability, toolkits and ROI calculations

5/19 (AM) - Renewable Energy Education & Advocacy – global state-of-play, market breakouts for education and solution short listing

5/19 (PM) - Manufacturing Scope 3 Materials Decarbonization – partner paths, impacts and tools

5/20 (AM) - Data & Reporting Alignment – ROI and roadblocks + Closing (PM)

Synergies with the Semiconductor Climate Consortium 

Many themes of the GCS Workshops are outcomes of the discoveries in the SCC Working Groups and previous Supplier Day presentations.  The GCS Workshops will allow for greater depth of discussions and face-to-face solutioning opportunities.  With the right information and the right audience, attendees will depart with tools to operationalize for action.  Across the ecosystem, we want to see those benefits show up in our Scope 3 calculations. 

Microsoft Offices & Sands Convention Center
Singapore
Singapore

12:00 pm - 1:00 pm

Registration & Networking Lunch

Meet and connect with key industry stakeholders, policy leaders, and Microsoft’s sustainability leadership.

1:00 pm - 1:10 pm
Mousumi Bhat
Mousumi Bhat, PhD
VP SEMI Sustainability
SEMI

SEMI Global Climate Summit Workshops: Welcome

1:10 pm - 1:25 pm
Giorgio Fortunato
Giorgio Fortunato
Google

Energy in the APAC Region: Outlook & Strategies

1:30 pm - 1:45 am
susannah calvin
Susannah Calvin
Environment & Supply Chain Innovation
Apple, Inc.

Journey to Carbon Neutral - Supply Chain Focus

1:45 pm - 2:05 pm
Leslie Esparza
Leslie Esparza
Director, Responsible Sourcing
Microsoft
Leo Aspauza
Microsoft
William Hudson
Moderator
Will Hudson
Microsoft

Reflections on Microsoft Supplier Days & Looking Forward

2:05 pm - 2:15 pm
Mousumi Bhat
Mousumi Bhat, PhD
VP, Global Sustainability
SEMI

Overview of GCSW Workshops

2:15 pm - 6:30 pm

Facilities Abatement Tours

(Tours are full and no longer available to new registrants.)

Workshop 1: Manufacturing Fab Scope 1 Emissions

8:30 am - 8:50 am

Breakfast and Networking

8:50 am - 9:20 am
Beth Elroy
Beth Elroy
Vice President, Global EHS & Sustainability
Micron

Collaborative solutions for emissions challenges

9:20 am - 9:35 am
Cristal Phwan
Cristal Phwan
APAC Sustainability Team Manager
GlobalFoundries

Fabs Deploying new abatement tech; brownfield retrofits

9:35 am - 9:50 am
Robin Sim
Robin Sim
Facility Manager - Operation & Hookup Program
STMicroelectronics

Innovative ways to complete brownfield retrofits while minimizing fab disruption

9:50 am - 10:05 am
Hak Joon Kim
Dr. Hak Joon Kim
Principal Researcher
Korea Institute of Machinery and Materials (KIMM)

New abatement tech for both greenfield & brownfield fabs

10:05 am - 10:20 am
Haein Cho
Dr. Haein Cho
Samsung

Samsung's journey to net zero & Scope 1 strategies

10:20 am - 10:45 am

Workshop 1

- Retrofits: Learnings; forward-looking; benchmark projects; modular approaches
- Abatement Technology / Performance Roadmap: accelerating timelines; trends; alignment

10:45 am - 11:15 am
Scott Clendenning
Scott Clendenning, PhD
Intel
Gottfried Wastlbauer
Dr. Gottfried Wastlbauer
Head of Positioning & Business Model
Electronics business of Merck KGaA, Darmstadt, Germany

Low GWP Gases

11:15 am - 11:40 am

Workshop 2: Risk assessment & Methodology

11:40 am - 12:40 pm
Dr. Shou Nam Lee
Dr. Shou-Nan Li
ITRI
Rahul Singh
Dr. Rahul Singh
Manager, Emissions Analysis
Micron
Troy Boley
Troy Boley
President
Spectrum
Jonghan Lee
Jonghan Lee
SK Hynix

Emissions Measurement

12:40 pm - 1:05 pm

Workshop 3: Real-time monitoring, calibration variation, regulatory

1:05 pm - 1:30 pm

Readouts & Lunch Break

Workshop 2: Manufacturing Energy Efficiency – fab/subfab interoperability, toolkits and ROI calculations

1:30 pm - 2:00 pm
Kevin Chan
Kevin Chan
Lead, Artificial Intelligence
Micron

IDM perspective, state of the art sensor deployment & best practices for energy efficiency

2:00 pm - 2:15 pm
James Oh
James Oh
Aveva

Immediate Opportunities around Energy Efficiency

2:15 pm - 2:30 pm
John Golightly
John Golightly
VP of Sustainability
ASM

ASM Energy Efficiency Story

Net Zero Operations through Innovation and Collaboration

2:30 pm - 3:00 pm

EE Workshop 1: Sensor Deployment for Equipment

From energy sensor to harmonics & power quality detection and remediation

3:00 pm - 3:45 pm
Shaun Crawford
Shaun Crawford
Product Manager
Applied Materials
Stefanie Hammer
Stefanie Hammer
General Manager
Algorismic
Michael Neel
Michael Neel
Director of Marketing
Inficon

Operations Energy Efficiency Opportunities, Process and Recommendations

State-of-the-art Sub-Fab Interoperability

3:45 pm - 4:15 pm
TBD

EE Workshop 2: Communication & Interoperability

4:15 pm - 4:45 pm
Slava Libman
Slava Libman
FTD Solutions
James Oh
James Oh
Aveva
Mark da Silva
Mark da Silva
SEMI Smart Manufacturing

Current Solutions - Data Aggregation & Dashboard: Case Study

4:45 pm - 5:15 pm
Teh Seimens
Teh Tiack Ein
Head of Presales, Southeast Asia
Siemens Digital Industries Software
Arul
Arul Ambikapathi
Lam Research
Mark da Silva
SEMI Smart Data AI Initiative

Future Solution - Digital Twin (Design, Build, Operate & Maintain a Fab)

5:15 pm - 5:45 pm

Workshop 3: Data Management & Reporting

5:45 pm - 6:00 pm

Read out

Workshop 3: Renewable Energy Education & Advocacy – global state-of-play, market breakouts for education and solution short listing

8:00 am - 8:30 am

Networking & Breakfast

8:30 am - 9:00 am
Low - EMA
Xin Wei Low
Assistant Chief Executive
EMA

The Net Zero Imperative and Singapore's Role

9:00 am - 9:20 am
William Hudson
Will Hudson
Asia Pacific Sustainability Policy Director
Microsoft

One Goal, One Grid; Unlocking Clean Power Together

9:20 am - 9:50 am
Ali Izadi
Ali Izadi-Najafabadi
Head of APAC
Bloomberg NEF

Global state of play on accessible RE

9:50 am - 10:10 am
Michael Thomas
Mike Thomas
Managing Director
Lantau Group

Friendly Policies to Renewable Energy

10:10 am - 10:20 am
Eric Gibbs
Clean Energy Buyers Association

Procurement Hub

10:30 am - 12:00 pm

Breakouts/Workshop: RE Education & Awareness

Two parallel sessions will be held.
Group A - Room 3111: South Korea (45 min) and Japan (45 min)
Group B - Room 3112: Singapore/Malaysia (45 min) and Taiwan (45 min)

10:30 am - 11:15 pm
Seiya Miyake
Seiya Miyake
Renewable Energy Promoting Organization, Inc.
Shawn Woo
3 Degrees

How to Procure: Japan

11:15 am - 12:00 pm
Oursan Jin
Ousam Jin
CREF

How to Procure: South Korea

10:30 am - 11:15 am
Henry Eu
Asia Clean Energy Consortium (ACEC)
Greg Thomassin
Gregory Thomassin
Business Development
Total Energies
Michael Thomas
Mike Thomas
LTG

How to Procure: Singapore/Malaysia

11:15 am - 12:00 pm
Jung Choi
Jung Choi
Regional Manager for Asia-Pacific
CRS
Wei In
Wei-In Lin
Apala

How to Procure: Taiwan

12:00 pm - 12:15 pm

Workshop Readout

12:30 pm - 1:00 pm
Albert Sutaru
Albert Sutanto
Manager SE Asia Markets and Global EACs Sourcin
Mt. Stonegate

Achieving 100% RE in Asia: Market Highlights and Corporate Sourcing

(a working lunch)

1:00 pm - 1:20 pm
Robbert Slooten
Robbert Slooten
Manager, Renewable Energy and Carbon Advisory
Schneider Electric
Bess Ng
Bess Ng
Associate Principle, Sustainability Business
Schneider Electric

How to leverage the power of buyers’ groups for renewable electricity adoption in key markets - Korea, Singapore, and Japan

(a working lunch)

Workshop 4: Manufacturing Scope 3 Materials Decarbonization – partner paths, impacts and tools

1:30 pm - 1:50 pm
Han Chen
Han Chen
Asia Clean Energy Policy
Apple

The importance of scope 3 for Apple and the Path Forward Together

1:50 pm - 2:20 pm
Sebastian Goke, McKinsey & Company
Sebastian Goeke
Associate Partner
McKinsey & Company

Gaining transparency on Fab Scope 3 upstream emissions

2:20 pm - 2:50 pm
Christof Witte
Christof Witte
Partner
McKinsey & Company

How to drive upstream FAB decarbonization

2:50 pm - 3:10 pm
Stehanie Cotton
Stephanie Cottin
Sustainability and Safety Director & Chief of Staff to COO
Soitec

Examples of upstream suppliers taking accountability, decarbonizing

3:10 pm - 3:40 pm
Frank Bartels
Frank Bartels
Director Global Marketing and Product Management, Semiconductor Materials
BASF

Smart decarbonization of wet process solutions

3:40 pm - 4:00 pm
Corinna Wolf
Corinna Wolf
Head of Global Sustainability
Infineon

How to hold your supply chain accountable, educate them on decarbonization, and implement solutions

4:00 pm - 4:15 pm
Handy Ko
Handy Ko
Director of Materials Management
TSMC

Responsible Supply Chain Management

4:15 pm - 4:35 pm
Photo of Speaker Jordan Davis blond hair brown eyes
Jordan Davis
Responsible Business Alliance

GHG Survey; Inventory and tool for supplier outreach

Advancing Supplier Emissions Reporting: RBA’s Emissions Management Tool

4:35 pm - 4:50 pm
Marijn Vervoorn
Marijn Vervoorn
Director Sustainability Strategy
ASML

Change Management

4:50 pm - 5:40 pm

Workshop - Scope 3 - Materials | Gases | Chemicals | Wafers decarbonization

• Are these the right problems?
• What are 3 solutions that you can commit to working on this year?
• Where do you need help from the consortium or customers?
• What can we collectively commit to for 2030?

Workshop 5: Data & Reporting Alignment – ROI and roadblocks

8:30 am - 9:00 am
Joe Palazzo
Joe Palaazo
Technical PM - Environmental Sustainability
Google

Big Picture & Objective

9:00 am - 9:30 am
Claus Cremers
Director Automotive Ecosystems, Siemens, AG
Member of the Board of Catena-X

Industry Case Study

9:30 am - 9:50 am
Sue Sung Trinity
Sue Sung
Director - ESG Global Services
Trinity Consultants

Scope 1 Data Audits

9:50 am - 10:10 am
Slava-Libman
Slava Libman
FTD Solutions

Scope 2 Reporting

10:10 am - 10:30 am
Jason Guan
Jason Guan
TFS / BASF
Rollinist Li
TFS

The power of collaboration in GHG management

10:30 am - 11:00 am
Karsten Schischke
Karsten Schischke
Group Manager Policy, Ecodesign and Circular Materials
Fraunhofer IZM

Product Carbon Footprints: Why we need to agree on system-level and component-level calculation and reporting rules

11:00 am - 11:30 am

Live Survey & Roundtable

Closing & Next Steps / Readout

11:30 am - 12:30 pm

Close out & Next Steps

- EHS Sustainability

Plan now to attend the Global Climate Summit (GCS) Workshops in Singapore!  We invite you - and every leading company in the semiconductor value chain – to identify and send the right people to collaborate with your customers and vendors alike on finding solutions to the sector’s emission challenges. The event will be spread over 4 days to take advantage of 2 other important events:  Microsoft Supplier Days and SEMICON SouthEast Asia.

8:00 pm - 5:30 pm Off Add to Calendar 2025-05-15 20:00:00 2025-05-20 17:30:00 Global Climate Summit (GCS) Workshops Singapore Plan now to attend the Global Climate Summit (GCS) Workshops in Singapore!  We invite you - and every leading company in the semiconductor value chain – to identify and send the right people to collaborate with your customers and vendors alike on finding solutions to the sector’s emission challenges. The event will be spread over 4 days to take advantage of 2 other important events:  Microsoft Supplier Days and SEMICON SouthEast Asia. Microsoft Offices & Sands Convention Center Singapore Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore
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MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing solutions focusing on speed, accuracy, safety, and ergonomics.

The next-generation epoxy dispenser represents an ultra-high-speed, flexible solution with multiple dispensing methods and materials, including silver-filled epoxies, conformal coating, sintering paste, thermal grease, and UV adhesive, among others. The system is highly configurable for complex applications, such as microwave modules, optical modules, hybrid circuits, multichip modules, advanced packaging, and semiconductor packaging. Moreover, it offers precise process control and is 35% more energy efficient than previous systems.

Our customers now have two options from this new product. The MRSI-175Ag is our standard option for 25µm accuracy. The MRSI-175Ag+ is an available option that achieves 10µm accuracy.

Francesca Navarro, Product Manager, MRSI Mycronic, expressed enthusiasm about the launch: “We are excited to introduce the next generation high precision epoxy dispenser and remain committed to ongoing innovation to meet the needs of our customers.”

For further details regarding MRSI and the next generation epoxy dispenser please visit www.mrsisystems.com or reach out to [email protected].

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com