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United States Overview of Semiconductor 4/21 Training
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Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Dates and Times

April 21 7:30 - 3:00 PT

April 22 7:30 - 1:30 PT

Pricing

Early Bird Special! $100 off

  • Members: $995 $895
  • Non-Members: $1,095 $995

 * Group pricing for up to 20+ attendees: $12,900
Any questions, please contact [email protected]

7:30 am - 3:00 pm Off Add to Calendar 2026-04-21 07:30:00 2026-04-22 15:00:00 Overview of Semiconductor Manufacturing (Americas) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.Dates and TimesApril 21 7:30 - 3:00 PTApril 22 7:30 - 1:30 PTPricingEarly Bird Special! $100 offMembers: $995 $895Non-Members: $1,095 $995 * Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Registration

& Virtual Access

Online registration is now closed!

Please register in person at the front desk or contact staff below for virtual access.

 

PLEASE NOTE

  • In addition, you must be a SEMI Standards Program Member to participate in the meetings.
  • Membership is FREE!
  • Fill out the Application Form to be a Standards Member.
United States standards-500w.jpg

SEMI HQ
673 South Milpitas Blvd
Milpitas, CA 95035
United States

- Standards

Join us for the SEMI Standards Meetings

IN-PERSON + VIRTUAL!
 

With SEMICON West moving to October in AZ this year, remember to save the dates for the new Winter and upcoming Summer meetings schedule! 

 

SEMI Standards will host 11 committees + over 40 task forces engaged in various standardization activities, including:

  • Environmental, Health, and Safety (EH&S)
  • Facilities
  • Gases
  • Information & Control
  • Liquid Chemicals
  • Metrics
  • MEMS/NEMS
  • Physical Interfaces & Carriers
  • Silicon Wafer
  • Traceability
  • 3D Packaging & Integration

Note | Some Technical Committees + Task Forces may meet virtually outside of this Meeting set.

FULL SCHEDULE | (PDF) or (Excel)

All meetings are in Pacific Time.
Subject to change, please check back frequently.
Last updated: Feb 24, 2025

Off Add to Calendar 2025-02-24 00:00:00 2025-02-27 00:00:00 North America Standards Winter Meetings Join us for the SEMI Standards MeetingsIN-PERSON + VIRTUAL! With SEMICON West moving to October in AZ this year, remember to save the dates for the new Winter and upcoming Summer meetings schedule!  SEMI Standards will host 11 committees + over 40 task forces engaged in various standardization activities, including:Environmental, Health, and Safety (EH&S)FacilitiesGasesInformation & ControlLiquid ChemicalsMetricsMEMS/NEMSPhysical Interfaces & CarriersSilicon WaferTraceability3D Packaging & IntegrationNote | Some Technical Committees + Task Forces may meet virtually outside of this Meeting set.FULL SCHEDULE | (PDF) or (Excel)All meetings are in Pacific Time.Subject to change, please check back frequently.Last updated: Feb 24, 2025 SEMI HQ 673 South Milpitas Blvd Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public

Next Meetings

Save the Date!

North America Summer Meetings
June 2-3, 2025 @ SEMI HQ, Milpitas, California

Contact

Kevin Nguyen
Manager, International Standards Operations
(EH&S, Silicon Wafer)

Laura Nguyen
Sr. Coordinator, International Standards
(Facilities, Gases, Liquid Chemicals, MEMS/NEMS, Physical Interfaces & Carriers, 3D Packaging & Integration)

Michelle Sun
Coordinator, International Standards
(Information & Control, Metrics, Traceability)

Munich, Germany – November 4, 2024 – SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion today announced the 2024 20 Under 30 Award Recipients, honoring exceptional young professionals who are driving innovation and success in the semiconductor industry. SEMI Europa 20Under30

This prestigious award highlights the most promising leaders under 30-years-old who are making significant contributions within the microelectronics supply chain, fostering a more diverse and inclusive environment in a critical sector.

"Recognizing the innovators of tomorrow is crucial for the growth and sustainability of our industry," said Laith Altimime, President of SEMI Europe. "The 20 Under 30 Award not only honors exceptional talent but also inspires a new generation to drive change and foster collaboration in the semiconductor sector. By proudly showcasing these talented individuals, SEMI Europe aims to foster a culture of recognition that empowers young professionals to pursue their ambitions and drive change."

2024 20 Under 30 Award Recipients

The 2024 award recipients represent a diverse range of roles and specializations within the European semiconductor landscape:

"As professionals in the semiconductor industry, it's our collective responsibility to nurture new talent as well as spark curiosity and passion for our dynamic field," said Stephan Haferl, CEO of Comet. "By supporting SEMI in honoring the young leaders who will shape our future, Comet proudly contributes to this mission."

Dan Collins, General Manager of KLA's SPTS Division, said, "We congratulate all the shortlisted individuals and feel it is important to recognize and celebrate these worthy winners as they continue their career journeys to shape this industry and lead it to a bright future."

"We are proud to partner with the SEMI 2024 20 Under 30 Award," said Olga Needham, Senior HR Director, Tokyo Electron Europe (TEL). "This award is dedicated to recognizing and empowering young leaders who are making significant contributions to their organization and customers. At TEL, we believe that by investing in the next generation, we are not only helping to shape the future but also creating opportunities for growth and innovation in our industry."

The 2024 20 Under 30 Award is sponsored by Comet Group, KLA and Tokyo Electron Europe (TEL), highlighting their commitment to nurturing emerging talent in the semiconductor field.

SEMI Europe will host the award ceremony during SEMICON Europa 2024, which will take place from November 12-15 at Messe München in Munich, Germany. Co-located with electronica, this premier exhibition and conference for the microelectronics supply chain will showcase keynotes from thought leaders in design, manufacturing, academia, and government. Registration is open.

For more information about the 20 Under 30 Award or to learn about future nomination opportunities, visit SEMI Europe 20 Under 30 Award. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: [email protected]

United States Laser Annealing Graphic Featured Speakers
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Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing

 

3D-Micromac, a leader in high-precision laser-based semiconductor processing and micromachining, has consistently adapted to meet evolving market demands. As the need for greater precision and efficiency in semiconductor and sensor technology grows, traditional production methods began to show their limitations. To address these challenges, 3D-Micromac has applied its laser technology expertise to develop selective laser annealing, offering innovative solutions that enhance both production quality and efficiency while also enabling the creation of entirely new products.

Laser annealing offers a transformative alternative to conventional annealing methods, particularly in the production of Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. Traditional techniques, such as large magnetic annealing furnaces, significantly limit the throughput for complex sensor designs and increase production costs. The furnace approach also introduces potential yield losses due to its inherent processing complexity.

In contrast, selective laser annealing enables heating only illuminated wafer areas and not the entire wafer to provide extremely precise process control and enable closer placement of sensors to logic elements, laying the foundation for an integrated, monolithic sensor design (Fig. 1). This laser-based sensor programming enables a one-step process, eliminating the need for additional production steps such as dicing or chip transfer, which results in higher throughput and reduced costs.

Another semiconductor processing application that benefits from laser annealing is ohmic contact formation, which is a critical and challenging step in manufacturing silicon carbide (SiC)-based power devices. Traditionally, rapid thermal processing (RTP) has been used to generate well-controlled silicide interfaces because of its small thermal budget, but even RTP limitations become evident as SiC devices become thinner. Pulsed laser sources offer extremely small thermal budgets which enable ohmic contact formation on thinned SiC substrates resulting in superior device performance.

Both of these applications have already been successfully implemented in industrial machining solutions by 3D-Micromac. This webinar will provide in-depth insights into the processes and results (Fig. 2), while also exploring potential new applications of selective laser annealing. This innovative approach enhances device quality and streamlines manufacturing, marking a significant shift towards more efficient and cost-effective production methods in the sensor and semiconductor industries.

 

Fig. 1. Comparison traditional approach vs. selective laser annealing approach in magnetic sensor annealing

 

Fig. 2. Result of backside annealing for ohmic contact formation: SEM of NixSiy interface showing outstanding homogeneity

 

 

 

FEATURED SPEAKER

 

Maurice Clair | Team Lead Technology & Innovation Management

Maurice Clair

Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department. In his current role, he serves as the technical lead for ohmic contact formation on SiC (silicon carbide) materials, a critical area in advancing semiconductor technologies.

Through his expertise in laser technologies, he has been instrumental in the development of innovative laser micromachining processes, including: laser trimming techniques for fine-tuning electronic components with both digital and analogue approaches and beam shaping for ultra-short pulsed lasers.

 

 

 

 

United States

MSIG Off Add to Calendar 2024-12-04 00:00:00 2024-12-04 00:00:00 Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing United States SEMI.org [email protected] America/Los_Angeles public Register
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SEOUL, Oct. 30, 2024 — DuPont (NYSE: DD) today announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category. The award recognizes DuPont’s development of polishing pads for advanced semiconductor fabrication and was presented at Samsung’s third annual Material-day (M-day) event.

Organized by Samsung Electronics' Materials Technology Group, M-day gathers semiconductor material suppliers and other supply chain partners to discuss materials and technology trends and celebrate outstanding achievements.

DuPont is an innovation leader in polishing pads, slurries and advanced cleans for chemical mechanical planarization (CMP) and continues to invest in the development of new products and features, including offerings for emerging technical performance needs, process efficiency and sustainability. Products such as CMP pads in the Ikonic™ pad family are enabling effective and consistent polishing of semiconductor wafers at the most advanced technology nodes, supporting semiconductor industry advancement for technologies including artificial intelligence (AI), 5G, and data centers.

“Innovation is a collaborative effort, where insight into process requirements and feedback from customers drives product development and optimization,” said Sanjay Kotha, Global Business Director, CMP Technologies, DuPont Electronics & Industrial. “We are honored to be selected for the Best Partner Award for innovation in CMP pads and truly value our relationship with Samsung Electronics. This recognition represents success for our team both for the technical achievements and for the strong collaboration, reflecting our commitment to be a Partner of Choice to our customers.”

At the 2023 M-day event, DuPont was honored by Samsung Electronics with the Best Partner Award in the Environmental, Social and Governance (ESG) category for contributions in establishing a sustainable supply chain by collaborating to develop more sustainable semiconductor materials.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

TOKYO ─ October 22, 2024 ─ SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologiesfrom Dec. 11-13 at Tokyo Big Sight. The event will feature the inaugural Advanced Design Innovation Summit (ADIS), with exhibitions and presentations focusing on next-generation chip design and verification, current challenges, and the future of the industry. SEMICON Japan 2024 will also feature presentations and executive panels on key industry topics with thought leaders from the semiconductor industry ecosystem, academia, and government. Registration is open.

semiconductor

 

Due to increased registration, the 2024 exhibition is expanding into the Tokyo Big Sight Conference Tower and halls 1-8 of the East Exhibition Hall.

 

SEMICON Japan 2024 Featured Speakers

 

​​Special Exhibits

  • The AI Summit & Startup will provide a comprehensive overview of AI – from the big picture, down to the latest technologies.

  • SEMICON Stadium will allow attendees to experience AI’s evolution first-hand by interacting with state-of-the-art robots.

  • SEMI Technology Pavilions will include a Quantum Computing Pavilion, Power Electronics Pavilion, SEMI Smart Mobility Pavilion, Ministry of the Environment Pavilion, and Disassembly Corner.

  • More exhibits and details will be announced.

 

Additional Conference Highlights 

  • Market and advocacy: Government officials, researchers, analysts, and industry specialists will discuss the latest semiconductor market trends. This includes The Challenges to a $1 Trillion Semiconductor Market opening session, Bulls & Bears session presented by Japan's top securities analysts, the Semiconductor Materials Forum, and the SEMI Market Forum.

  • Sustainability: SEMICON Japan 2024 will include a Sustainability Summit keynote session themed Semiconductors Supporting Global Environmental Conservation and World Economic Growth. In addition, the Sustainability Summit will include sessions on PFAS and greenhouse gases, as well as an additional session on combating climate change for Semiconductor Climate Consortium (SCC) member companies. 

  • Events for future industry leaders: As Generation Z breaks into the semiconductor industry, SEMICON Japan 2024 will feature Yoichi Ochiai's Jyonetsu Lab (Passion Lab), where Ochiai, a media artist, will discuss the future of digitization with students. Additionally, artist, founder, and CEO of Cradle, Sputniko!, will share insights on the active role women play in the semiconductor industry during her presentation, Understand the Importance of DE&I-Equity.

  • SEMI Global Standards Summit: Innovating Tomorrow: Standards for Future Factories: Advanced packaging, cybersecurity, supply chain, and critical materials need further industry collaboration on standardization. The inaugural SEMI Global Standards Summit aims to identify critical areas and work toward an industry standardization strategy for both a three-year and seven-year timeframe. 

 

Concurrent Events

  • The Advanced Packaging and Chiplet Summit (APCS) will return to Tokyo Big Sight to assemble top players in semiconductor packaging and board mounting, highlighting the packaging industry’s work to optimize power consumption, reliability, miniaturization, and cost. 

  • FLEX Japan 2024 will create an opportunity for collaboration between product vendors and device and material manufacturers who act as their suppliers. The event will highlight the role of printed electronics for a more sustainable society.

 

For more details, see the complete seminar schedule or visit the SEMICON Japan 2024 event website. 

 

About SEMI 

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

 

Association Contacts

Shuichi Sato/SEMI Japan

Phone: 81.3.3222.5757

Email: [email protected]

 

Samer Bahou/SEMI Corporate

Phone: 1.408.943.7870

Email: [email protected]

 

 

PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor and electronics ecosystems, today announced it will host an Executive Conference on the power of AI to transform semiconductor design and manufacturing. This event will take place on December 12, 2024, in downtown San Francisco, CA, following the 70th Annual IEEE International Electron Devices Meeting.

This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI/ML solutions across the global semiconductor industry.

Additional information including agenda, logistics, and registration, will be available in the coming weeks.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics ecosystems to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

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United States Plasma Etching, ALE, & Rie
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Course Description

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed. 

Learning Objectives

  • Understand the fundamentals of dry etching and the basic concepts of plasma etching
  • Understand the physics of rf glow discharges (both high and low density)
  • Understand the surface science aspects of RIE including the role of energetic ions
  • Recognize the factors which influence etching anisotropy
  • Define the steps of plasma-surface chemistry leading to etching

Topics Covered

  • Fluorocarbon plasma etching of Si and its compounds
  • Selectivity, loading effects, and aspect ratio dependent etching
  • Uniformity of etching, damage, feature charging issues, and particles
  • Etching of other materials (Al, organics, III-V compounds, etc)
  • Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
  • Issues in high density plasma etching, wall effects, and ion beam-based methods
  • Deep Reactive Ion Etching (DRIE)
  • Applications and processing etching using ALE
  • End point detection

Who Should Attend

This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field. 

Instructor

Richard Beaudry

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. 

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-02-04 08:00:00 2025-02-05 12:00:00 Plasma Etching, ALE, & RIE (Virtual Training, US & EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
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Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

+
On-demand
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_DAI_Analyzing AI_Driven_v1@2x Business Executive
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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
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United States Understanding Semiconductor Technology and Business
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

- SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-02-10 08:00:00 2025-02-11 12:00:00 Understanding Semiconductor Technology and Business (Virtual Training, US & EU) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
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