From Concept to Market: Manufacturing Platforms for Next-Gen Photonic MEMS
Abstract
Photonics is rapidly emerging as a cornerstone of next-generation sensing technologies, with promising applications in biomedical diagnostics, environmental monitoring, and beyond. Yet despite this momentum, the transition from concept to scalable device remains difficult - limited not by innovation, but by the lack of mature, flexible manufacturing solutions. In this talk, EV Group (EVG) will present how its advanced process platforms are helping to overcome key integration challenges in photonic MEMS development. We will explore the technical barriers of III-V and silicon co-integration, and how EVG’s die-to-wafer bonding capabilities enable the precise integration of active components. We will also introduce the ComBond® platform, which allows oxide-free, transparent, and even conductive bonding - critical for photonic device performance. Additionally, we will highlight our SmartNIL® nanoimprint lithography process for high-resolution passive photonic structures, and the role of the NILPhotonics® Competence Center in supporting R&D and prototyping.
This presentation will show how EVG’s platforms are helping to turn early photonic MEMS concepts into scalable, manufacturable solutions. By bridging the gap between R&D and production, we aim to support the industry in moving from innovation to real-world impact.
Biography
Pierre Delbos is Business Development Manager at EV Group (EVG), where he drives strategic growth in permanent bonding and MEMS technologies. His work focuses on building partnerships, expanding EVG’s customer base, and aligning the company’s solutions with the evolving needs of the semiconductor industry. Before joining EVG, Pierre was a Technology Market Analyst at Yole Group, where he worked closely with key players across the semiconductor value chain, providing strategic insights and consulting on MEMS and sensing technologies. He holds a master’s degree in Microelectronics and Photonics Engineering from Grenoble Institute of Technology, PHELMA (France)