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In Person

Registration for the Global Executive Summit is closed.  Please contact Heidi Hoffman at [email protected] with any questions.  

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SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight.  View the hotels and rates HERE.

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Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to: 

  • Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
  • Define clear deliverables and next-phase commitments that unlock scale and momentum
  • Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results

This Summit is not about what we could do — it’s about what we will do, and who will lead.

Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees.  Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.

Okura Hotel
Tokyo
Japan

Monday, December 15, 2025

9:00 am - 9:20 am

Coffee & Registration

9:25 am - 9:30 am
 Masahiko (Jim) Hamajima - President, SEMI Japan
Jim Hamajima
President
SEMI Japan

9:30 am - 9:45 am
Ajit Manocha, SEMI
Ajit Manocha
CEO & President
SEMI
Carolin Seward, Google
Carolin Seward
VP of Custom Silicon Sourcing and Operations
Google

GES Opening

9:45 am - 10:25 am
Carolin Seward, Google
Moderator
Carolin Seward
Google
Jinman Han
Jinman Han
President
Samsung Foundry
Jens Liebermann
Jens Liebermann
Senior VP of Global Business
BASF
Sundeep Bajikar
Sundeep Bajikar
Corp. VP Head of Corp Strategy
Applied Materials
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration

Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?

10:25 am - 10:40 am
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Spotlight: AMD on the role of Silicon Design for Energy Efficiency

Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.

10:40 am - 11:10 am
Anne Meegan
Moderator
Anna Meegan
Director of Sustainability
Google Platforms & Devices
Angela Baker
Angela Baker
VP Sustainability
Qualcomm
Dharmesh Jani
Dharmesh Jani
Director, AI Infra Ecosystem & Partnerships
Meta
Cooper Elsworth
Cooper Elsworth
Sr. TPM, Advanced Energy Labs
Google

End-User Panel: The Decarbonization Imperative

Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.

11:10 am - 11:25 am

Break

11:25 am - 11:30 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Overview of Priority Initiatives

Priority Initiative: Fab Upstream Materials

11:30 am - 11:40 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Opening Remarks

From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.

11:40 am - 12:10 pm
Bessima
Bessma Aljarbou
Head of Strategy of Environment & Supply Chain Innovation
Apple, Inc.

Keynote: Apple's Supply Chain Engagement

Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.

12:10 pm - 12:40 pm
Handy Ko TSMC
Handy Ko
Director, Materials Management
TSMC

From Ambition to Action: A Fab's Role in Upstream Decarbonization

Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.

12:40 pm - 12:55 pm
Andrea Jorissen
Andrea Jorissen
Supplier Carbon Solutions
Apple, Inc.

Solutions Enablement & Calls-to-Action

Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.

12:55 pm - 1:55 pm

Networking & Lunch

Priority Initiative: Clean Electricity

1:55 pm - 2:05 pm
Rebecca Green
Rebecca Green
Partner
ERM
Ken Haig
Ken Haig
Senior Director Government Affairs
Microsoft

Opening Remarks

Setting the stage for collective action on clean electricity in Asia.

2:05 pm - 2:30 pm
Patrick Tan
Patrick Tan
Head of Wider Asia, APAC
Aurora Energy Research

From Visibility to Viability: Developer Insights on Building a Net Zero Future

Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.

2:30 pm - 2:55 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy
Microsoft

Keynote: Clean Electricity Policy Action & Urgency

Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.

2:55 pm - 3:25 pm
YS Kim SK HYNIX
Yong Sung Kim
Head of Clean Energy
SK Hynix

Deep Dive: A Clean Semiconductor Partnership in Korea

Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.

3:25 pm - 3:40 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy, Asia Pacific
Microsoft

Calls to Action

From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.

3:40 pm - 4:10 pm

Break

4:10 pm - 4:50 pm
Rebecca Green
Moderator
Rebecca Green
ERM
Josh Seidenfeld
Josh Seidenfeld
Supply Chain Clean Energy Lead
Google
Chikako Matsumoto
Chikako Matsumoto
Director, Managing Executive Officer
Sumitomo Mitsui Trust Group
Rei Ushikubo
Rei Ushikubo
Director and Head of the Carbon-Free Solutions Division
Shizen Energy
Daisuke Tsujimoto
Daisuke Tsujimoto
Executive Officer, CSO
Renova Inc.

Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.

How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.

4:50 pm - 5:00 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
Vice President, Sustainability
SEMI

Day 1 Closing Remarks and Look Ahead

Reflect on the day's takeaways and action items.

5:00 pm - 6:00 pm

Member-to-Member Meetings / Break

6:00 pm - 6:30 pm

Networking Reception

Join us for Networking in the Orchard Foyer

6:30 pm - 8:30 pm
Alison Drury
Alison Drury
Global Technology Industry Lead
ERM

Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”

A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.

Tuesday, December 16, 2025

8:30 am - 9:15 am

Coffee & Networking

9:15 am - 10:00 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Day 2 Opening

Opening remarks will summarize Day 1 and preview Day 2.

9:30 am - 10:00 am
Lora Ho
Lora Ho
SVP Strategy & ESG
TSMC

TSMC Keynote

Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.

10:00 am - 10:15 am

Break

Priority Initiative: Gas Substitution

10:15 am - 10:25 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Opening Remarks

Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan

10:25 am - 10:45 am
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research

Equipment Perspective: Scaling Low-GWP Gas Substitution

Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing

10:45 am - 11:05 am
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

imec’s Gas Assessment Platform for Sustainability (GAPS) 

Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution

11:05 am - 11:35 am
Bruce Gall Google
Moderator
Bruce Gall
Google
Rachel Potter EMD
Rachel Potter
VP of Specialty Gas
EMD / Merck
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption

Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases

11:35 am - 11:45 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Calls to Action

From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.

11:45 am - 12:45 pm

Networking Lunch

Priority Initiative: Abatement

12:45 pm - 1:10 pm
Beth Elroy
Elizabeth Elroy
VP Sustainability
Micron

Opening Remarks & Keynote

Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.

1:10 pm - 1:50 pm
Josh Robbins
Moderator
Josh Robbins
Google
Phil Kester
Phil Kester, PhD
Senior Chemical Engineer
Guild Associates
HK KIM KIMM
Dr. Hak-Joon Kim
Korea Institute of Machinery & Materials

F-GHG Catalyst Development & Funding Vehicles

Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.

1:50 pm - 2:20 pm
Yong Keong Goh
Moderator
Yong Keong Goh
Senior Manager
Micron
Martin Tollner
Martin Tollner
President, Semiconductor Division
Edwards
Morihara Kanken
Atsushi Morihara
Chief Technical Officer
Kanken
Rene Reichardt
Rene Reichardt
CEO
DAS EE
Jong Pil Yoon
Jong Pil Yoon
President
EcoEnergen

F-GHG and Nitrous Oxide Abatement Technology Panel

Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.

2:20 pm - 2:30 pm
Kongyeong Goh
YongKeong Goh
Micron
Josh Robbins
Joshua Robbins
Google

Closing Remarks: Abatement

Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.

2:30 pm - 2:45 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Calls to Action Summary & Closing

Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.

- Sustainability

Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry.

9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States standards watch banner image dec 2019 upw Business Technical

Overview

The IRDS Roadmap has identified near-term challenges related to measurements of particles, trace metals and organics in liquid chemicals at levels required to meet the needs of the industry.  The identified challenges are measurement of 10 nm and smaller particles, sub ppt measurement of metallic impurities, measurement of particle precursors and trace organics and online speciation of trace organics.  The focus of the workshop will be on recent advances in analytical methodology and instrumentation that will enable the industry to meet these challenges. 

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

9:00 am
PT
Paul Trio
Director, Standards
SEMI

Welcome

Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific
9:05 am - 9:15 am
don hadder
Don Hadder
OTF Planar Staff IC
Intel

Chemical Quality and Consistency Requirements for the Semiconductor Industry

9:15 am - 9:45 am
Aaron_Hineman
Aaron Hineman
Inorganic Product Line Leader, Americas
PerkinElmer

Analysis of Challenging Semiconductor Chemicals by ICP-MS

9:45 am - 10:15 am
Daniel Wiederin headshot
Daniel Wiederin
President
Elemental Scientific

Addressing IRDS Yield Enhancement Challenges in Liquid Chemical Metrology

10:15 am - 11:00 am
Gary Van Schooneveld headshot
Gary Van Schooneveld
President
CT Associates, Inc.
Derek Oberreit headshot
Derek Oberreit
Chief Technology Officer
Kanomax Holdings
Marie Tripp Headshot
Dr. Marie Tripp
VP of Customer Relations
UNISERS AG

Metrology for Detection of Particle Precursor and Sub-10 nm Particles In Liquids and On-Wafer

11:00 am - 11:30 am
Larry Zazzera headshot
Larry Zazzera, Ph.D.
Corporate Scientist
CT Associates, Inc.
Greg Haugstad headshot png
Greg Haugstad, Ph.D.
Principal Researcher and Technical Director, CharFac
Dept. of Chemical Engineering, University of Minnesota

Identification of Organic Particle Precursors using FTIR-ATR, SERS and AFM-IR

11:30 am
Suhas Ketkar headshot
Suhas Ketkar
Elemental Scientific

Closing Remarks

Standards

SEMI Analytical Workshop

9:00 am - 11:30 am Off Add to Calendar 2025-10-08 09:00:00 2025-10-08 11:30:00 SEMI Liquid Chemicals Analytical Workshop SEMI Analytical Workshop In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

Event format
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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States F47 Ad Business Technical

Overview

Since 2018, the SEMI Voltage Sag Task Force—comprising Fabs, Utilities, OEMs, Tool Suppliers, and EPRI—has collaborated to address a persistent challenge: why do tools remain vulnerable to voltage sags despite the implementation of SEMI F47?

Over seven years, the task force has investigated the power quality environment, tool susceptibility, testing methodologies, and mitigation strategies. This deep dive has led to actionable recommendations for strengthening the SEMI F47 standard and improving tool resilience in future builds.

What to Expect

Join us for a comprehensive workshop that will:

  • Review the task force’s findings and collaborative efforts
  • Share insights from key stakeholders
  • Present proposed revisions to the SEMI F47 standard
  • Discuss how these updates can enhance tool performance and reliability

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

2:30 pm
PT
Paul Trio
Director, Standards
SEMI

Welcome Remarks

2:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephens
Program Manager
EPRI

SEMI F47 Background & Voltage Sag Immunity Task Force Review

Biography
Mark will present the background of the 7-year effort, the findings from the work , proposed updates and pathways towards improvements and will close out with a summary and next steps.

2:50 pm

Baselining PQ Data from Semiconductor Fabs

3:05 pm
Zack Pike
Zachary Pike
SMTS Facilities Electrical Engineer
GlobalFoundries

Insights from Global Foundries

Biography
Zack will present on Global Foundries experiences with semiconductor tool shutdowns, efforts toward improvement and the types of voltage sags that are still causing tool downtime.

2:20 pm
Clay Burns
Clayton Burns
Principal Engineer, Transmission Planning & Asset Management
National Grid

Experiences from National Grid

Biography
Clay will discuss the power quality environment, relay concepts such as area of vulnerability, and the need for including some level of three-phase voltage sag testing.

3:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephen
Program Manager
EPRI

Key Findings from Research and Testing

3:50 pm

Proposed Updates to the SEMI F47 Standard from Task Force Work

4:05 pm

Facilities Korea TC Chapter Input

4:15 pm

Voltage Sag Generator Readiness

4:25 pm - 4:30 pm

Summary and Next Steps

Standards

Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop

This is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design.

2:30 pm - 4:30 pm Off Add to Calendar 2025-10-08 14:30:00 2025-10-08 16:30:00 Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights WorkshopThis is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design. In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

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United States http://flex.semi.org/ 425x187@2_Flex_event_Tile Business Expositions Technical

Phoenix, AZ
United States

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development Off Add to Calendar 2026-02-24 00:00:00 2026-02-26 00:00:00 Flex 2026 Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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REGISTER NOW

Attendance is free, but registration is required by October 24, 2025.

United States PDS Generic Thumbnail 690x448x Training
Mortenson
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SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry 

Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.

Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by the University of Illinois Urbana-Champaign. Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductor Industry.

  • Listen to professionals in the industry talk about their roles and find out the skillset needed for a career in high tech. 
  • Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can connect with employers in the industry.
  • Learn how to optimize your resume and boost your interview skills to land a job in the semiconductor industry.

All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.

  • Enjoy free lunch and snacks, free swag, and giveaways at Employer Tables.
  • Students can come and go.

EVENT is FREE but registration is required. Register by October 24th, 2025! 

University of Illinois Urbana-Champaign
Campus Instructional Facility
1405 West Springfield Avenue
Champaign, IL 61821
United States

FRIDAY, NOVEMBER 7, 2025 (Times in CST)

11:00 am

Student Check-In

11:15 am
Andy Stapleton, Mortenson
Andy Stapleton
Vice President at Mortenson
SEMI Midwest Chapter
Dr. Nancy Sottos, UIUC
Dr. Nancy Sottos
Department Head Materials Science and Engineering
University of Illinois at Urbana-Champaign

Welcome & SEMI Midwest Chapter Introduction

11:20 am
Laurel Passantino
Laurel Passantino
Assistant Dean for Research and Strategic Research Planning
University of Illinois Urbana-Champaign

Semiconductor Engineering at University of Illinois Urbana-Champaign

11:30 am
Dave Chapek, Polar Semiconductor
Dave Chapek
Director of Operations Engineering - Front End of Line
Polar Semiconductor

Semiconductors 101: A Brief History of the Semiconductor Industry & Career pathways

12:00 pm

Free Lunch for Students

12:30 pm
Brendan Aird, IBM Semiconductors
Brendan Aird
Global Strategic Technology Business Development Executive
IBM Semiconductors
Nicholas Cys TSMC AZ
Nicholas Cys
Senior Process Integration Engineer
TSMC AZ
Maggie Kamman Polar Semiconductor
Maggie Kamman
Process Engineer II
Polar Semiconductor
Anna Albert TEL
Anna Albert
Technical Support Engineer II
Tokyo Electron America (TEL)

Ask Me Anything (Panel): A Day in the Life of a Semiconductor Industry Professional

1:20 pm
John Mahlmeister
John Mahlmeister
Assistant Director, Engineering Career Services
The Grainger College of Engineering

Personal Branding & Resume Best Practices

1:50 pm
Laura Tarr Polar Semiconductor
Laura Tarr
Recruiter
Polar Semiconductor

Interview Like a Pro: Perfect Your Pitch

2:20 pm

Job & Internship Opportunities - Sponsors & Exhibitors - 3-Minute Elevator Pitch

Participating companies will pitch their internship & job opportunities

2:50 pm

Break / Room Change

Move to Room 4029 for Networking

3:00 pm

Network with Exhibiting Industry Leaders

4:00 pm

Adjourn

Workforce Development

[PDS] Professional Development Seminar
—Organized by SEMI Midwest Chapter

This FREE seminar will help students meet the demands of today's high tech workforce and be successful in their careers. 

11:00 am - 4:00 pm Off Add to Calendar Disabled America/Chicago
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Thank You to Our ESGS 2026 Sponsors

Silver

Brooks Instruments 170x65

Bronze

Become a Sponsor

View the 2026 ESGS Sponsorship Brochure

Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

Contact Tim Janes at +1.720.939.4992 or [email protected]

The Electronic Specialty Gases & Systems Conference (ESGS) provides a forum of engagement and learning around the market, technology trends, and market drivers for electronic gases. The conference includes sections focusing on developments in the bulk, rare and specialty gas markets that are critical to the continued growth of the electronics industry.

The conference is designed for executives, buyers, product managers, and strategic planners from the electronic gases value chain including end-users, producers, and equipment suppliers. The conference features knowledgeable experts in the industry, who understand the key developments and challenges unique to this market.


2026 Agenda Coming Soon 

Hyatt Regency Phoenix
122 N 2nd St
Phoenix, AZ 85004
United States

TUESDAY, NOVEMBER 4, 2025

7:00 am - 8:00 am

Breakfast

8:00 am - 8:05 am
Ed Hall
Edwin Hall
Sr. Manager, Market Data/Standards
SEMI

Opening Remarks

8:05 am - 8:15 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Opening Remarks

8:15 am - 9:00 am
Takashi Hayakawa - TEL
Takashi Hayakawa
TOKYO ELECTRON LIMITED

Keynote: Concept & Vision of Future Wafer Fab Equipment

9:00 am - 9:45 am
Laura Matz, Merck KGaA
Laura Matz
Chief Science and Technology Officer
Merck KGaA, Darmstadt, Germany

The Glue Layer of Semiconductors: How AI Powers New Materials

9:45 am - 10:15 am
Erin Lavigne
Erin Lavigne
Senior Director of EUV Technology Strategy and Partnerships
NY CREATES

NY Creates Advanced Patterning Technology Development Programs

10:15 am - 11:00 am

Networking Break

11:00 am - 11:30 am
Jamie Girard, Girard Government Relations
Jamie Girard
Principal
Girard Government Relations

Keynote: Certain Uncertainty: U.S. Semiconductor Public Policy in 2025 & Beyond

11:30 am
Duncan Meldrum, Hilltop Economics
Duncan Meldrum
Chief Economist and Founder
Hilltop Economics

Economic Uncertainty and the Outlook Economic Growth and Semiconductors: Looking at Risks

12:00 pm - 1:15 pm

Lunch

Vapor Phase Materials and Electronics Specialty Gases

1:15 pm - 1:20 pm
Venkat Pallam
Venkat Pallam
Deputy CTO & Technology Director, Thin Film Processing
Air Liquide

Opening Session Remarks

1:20 pm - 1:50 pm
Joseph Rivers
Joseph Rivers
Senior Director
Entegris

Enabling the Molybdenum Ecosystem

1:50 pm - 2:20 pm
Tan Lu
Tan Lu
Global Product Manager
Air Liquide

Green Electronic Specialty Materials (ESM)

2:20 pm - 2:50 pm
Jeff Catlin - Photronics
Jeff Catlin
Senior Vice President of Global Sales
Photronics

Tier 2 Perspectives: ESGS Supply Chain Challenges and Opportunities

2:50 pm - 3:35 pm

Networking Break

Contamination Control and Yield

3:35 pm - 3:40 pm
Sarah Vogt
Sarah Vogt
Director, Gas Purification Technology
Entegris

Opening Session Remarks

3:40 pm - 4:10 pm
Mike Tseng
Mike Tseng
IMQR Manager
TSMC

Supply Chain Quality for Advanced Semiconductor Manufacturing

4:10 pm - 4:40 pm
Chris Ebert, Linde
Chris Ebert
Associate Director, Product Development Analytical Laboratory
Linde
Florian Adler
Florian Adler
Lead Scientist & Technical Product Manager
Process Insights
4:40 pm - 5:10 pm
Christopher Derrick
Christopher Derrick
ASNA Territory Manager
ASNA Global

SEMI Semiconductor Components and Instruments & SubSystems (SCIS) Technology Coalition

5:10 pm - 5:20 pm
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

WEDNESDAY, NOVEMBER 5, 2025

New Technology Developments

7:00 am - 8:00 am

Breakfast

8:00 am - 8:10 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Opening Day Remarks

8:10 am - 8:15 am
Jared Piette
Jared Piette
Product Manager
Linde

Opening Session Remarks

8:15 am - 8:45 am
Wojciech Osowiecki
Wojtek Osowiecki, PhD
Product Marketing Engineer
Lam Research

Akara® and ALTUS® Halo: How New Lam Research Products Enable Next-Gen Materials in the Semiconductor Industry

8:45 am - 9:15 am
Jongjoon Kim Resonac
Jongjoon Kim
Sales Manager - Electronics Wafer Process Materials
Resonac America

Resonac’s CO₂ Reduction Roadmap in High-Purity Gas Business

9:15 am - 9:45 am
Oleg Byl
Oleg Byl
R&D Manager
Linde

Selective Si Etching with Fluorine and Additive Compositions

9:45 am - 10:30 am

Networking Break

10:30 am - 11:00 am
Laura Nereng
Laura Nereng
VP of Business Development
SKYRE

Advancing Decarbonization Through Electrochemical-Based Solutions to Reliably Produce Low-Cost Hydrogen from Waste Streams, Green Hydrogen and Fuels and Chemicals

11:00 am - 11:30 am
Kibyung Park
Kibyung Park 
Samsung Electronics

Isotropic Dry Cleaning Technologies Using Gases and Radical

11:30 am - 12:00 pm
Dawood Abugharbieh - Exentec
Dawood Abugharbieh, PhD
Sr. Vice President - Sales & Marketing
Exentec
Ben Green
Benjamin Green
Sr. Digitalization Consultant
Siemens

Adaptive Approach to Digital Twins

12:00 pm - 1:00 pm

Lunch

Facilities and Infrastructure

1:00 pm - 1:05 pm
Kurtis Fairley
Kurtis Fairley
Director, Technical Programs North America
Edwards Vacuum

Opening Session Remarks

1:05 pm - 1:35 pm
Saurav Bhattacharjee
Saurav Bhattacharjee
Technical Design Lead
Micron
Doug Tervo
Doug Tervo
Senior Process Gas Engineer
Micron

Innovations in Electronic Specialty Gas Systems

1:35 pm - 2:05 pm
John Makin, Ebara Technologies
John Makin
Product & Strategic Marketing Manager
Ebara Technologies

Integrated Vacuum & Abatement Systems

2:05 pm - 2:35 pm
Scott Balaguer
Scott Balaguer
ISRL

Bridging the SubFAB Gap: A Call for Collaborative Innovation in Gas Systems and Materials Handling

2:35 pm - 3:20 pm

Networking Break

Sustainability

3:20 pm - 3:25 pm

Opening Session Remarks

3:25 pm - 3:55 pm
Bruce Ernst
Bruce Ernst
Founder
Orizaba

The American Innovation and Manufacturing (AIM) Act: Status and Implications for the U.S. Semiconductor Industry

3:55 pm - 4:25 pm
James Amano
James Amano
Senior Director, EHS
SEMI

Update on SEMI EHS Advocacy

4:25 pm - 4:30 pm
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

6:00 pm - 8:00 pm

Conference Reception

THURSDAY, NOVEMBER 6, 2025

Market Review and Updates

7:00 am - 8:00 am

Breakfast

8:00 am - 8:10 am
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Opening Day Remarks

8:10 am - 8:40 am
Inna Skvortsova, SEMI
Inna Skvortsova
Research Manager, Market Intelligence
SEMI

SEMI Fab Capacity and Materials Market Outlook

8:40 am - 9:10 am
Phil Kornbluth
Phil Kornbluth
Founder & President
Kornbluth Helium Consulting

Helium Market Overview, Outlook & Trends

9:10 am - 9:40 am
Andy Tuan, Linx Consulting
Andy Tuan
Managing Director
Linx Consulting

Electronic Specialty Gases (ESG) Market Update

9:40 am - 10:15 am

Networking Break

Gas Metrology

10:15 am - 10:20 am
Jesus Chavez
Jesus Chavez
Supply Chain Engineer - Yield Strategic Sourcing
Intel

Opening Session Remarks

10:20 am - 10:50 am
Florian Adler
Florian Adler
Lead Scientist & Technical Product Manager
Process Insights

Real-Time Impurity Measurements for Electronic-Grade Oxygen with Modern Analytical Systems

10:50 am - 11:20 am
  Daniel Merriman
Daniel Merriman
Senior Advisor to Marketing
Thermo Fisher Scientific

Advancing High Purity Gas Analysis for Semiconductor Manufacturing: Achieving part-per-trillion detection with APIMS

11:20 am - 11:50 am
Joseph Ha
Joseph Ha
Global Market Segment Director, Purity & Specialty
Servomex
Andrew Wright, Servomex
Andrew Wright, PhD
Senior Scientist
Servomex
11:50 am - 12:00 pm
Mike Corbett
Mike Corbett
Managing Partner
Linx Consulting

Closing Remarks

12:00 pm - 1:00 pm

Lunch

Advanced Metrology Workshop

1:00 pm - 1:05 pm
Nithin Yathapu
Nithin Yathapu
Director, Yield Strategy
Intel

Opening Session Remarks

1:05 pm - 1:30 pm
Stephen Hermens
Stephen Hermens
Technologist, Facilities Chemical Engineer
Intel

Keynote: IDM Perspectives on Next Generation Metrology Requirement

1:30 pm - 1:50 pm
Scott Hoover, KLA
Scott Hoover
Director of Yield Solutions
KLA

Turning Variability into Insight: A Holistic Approach to Optical Inspection

1:50 pm - 2:10 pm
Raghu Nayak
Raghu Nayak
Director of Business Development & New Product Introduction
Zeiss

Metrology for 3D Devices

2:10 pm - 2:30 pm
James Amano
James Amano
SEMI

Regulatory Updates: US-EU considerations on PFAS

2:30 pm - 3:00 pm

Coffee Break

3:00 pm - 3:10 pm
imec

From Chips to Atoms: A Tour Inside imec’s Materials and Components Analysis Lab (Video)

3:10 pm - 3:30 pm
Ganesh Vanamu, Nova
Ganesh Vanamu
Director of Strategic Marketing
Nova

Advanced Logic Device Architectures - Challenges & Solutions in Materials Metrology

3:30 pm - 3:50 pm
Thomas Phely-Bobin
Thomas Phely-Bobin
VP, Engineering, R&D, and Applications, Liquid Microcontamination Control
Entegris

Advanced Metrology for the Development and Manufacturing of Critical Filtration and Purification Products

3:50 pm - 4:10 pm
Ripudaman Shekhawat
Ripudaman Shekhawat
Senior Field Application Engineer
Elemental Scientific

Online Monitoring of PPQ-Level Metals, Nanoparticles, and Molecular Organic Impurities in Semiconductor Process Chemicals

4:10 pm - 4:30 pm
Marshall R Allin
Marshall R Allin
Technical Sales Specialist
Thermo Fisher Scientific

Innovations in Instrumentation from Thermo Fisher Scientific, Addressing Challenges in Elemental Analysis and Other Techniques

4:30 pm - 5:20 pm

Panel: Forward Looking Collaborative Inspection, Metrology & Analytical Solutions in Angstrom Era

Elemental Scientific, Entegris, Intel, KLA, NIST, Nova, Thermo Fisher Scientific, Zeiss

5:20 pm - 5:30 pm
Nithin Yathapu
Nithin Yathapu
Director, Yield Strategy
Intel

Closing Remarks

-

Driving Innovation Across the Electronic Gases Ecosystem

ESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event.

Off Add to Calendar 2026-11-10 00:00:00 2026-11-12 00:00:00 ESGS 2026—Electronic Specialty Gases & Systems Conference Driving Innovation Across the Electronic Gases EcosystemESGS 2026 will take place at a new venue—the Hyatt Regency Phoenix—from November 10–12, building on the overwhelming success and momentum of last year’s event. Hyatt Regency Phoenix 122 N 2nd St Phoenix, AZ 85004 United States SEMI.org [email protected] America/Phoenix public America/Phoenix 1
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REGISTRATION

Registration
  • Early-Bird Registration Deadline: Wed, July 9, 5PM (KST)
  • Group Registration Deadline: Fri, July 4, 5PM (KST)
  • Registration fee includes a boxed lunch provided at the venue.  

 

[Group]

  • SEMI Member : KRW 275,000
  • Non Member: KRW 330,000
    * Group registration fee applies to groups of five or more from the same company.
    * For group registration inquiries, please contact SEMI Korea Program Team([email protected]).

[Early Bird]

  • SEMI Member: KRW 308,000
  • Non Member: KRW 363,000

[On site]

  • SEMI Member: KRW 385,000
  • Non Member: KRW 385,000
Registration
South Korea APS2025_banner Business Technical

OVERVIEW

  • Date: July 16(Wed), 2025
  • Time: 09:00 - 17:00
  • Venue: Convention Hall 2, 3F, Suwon Convention Center
  • Language: Korean (Simultaneous interpretation will NOT be provided.)
  • Organizer: SEMI Korea  

 

SPONSORS

 

 

NOTICE

  • The agenda is subject to change at the discretion of the speakers.
  • Presentation files agreed by speakers will be provided to attendees after the event through SEMI registration website.

 

CONTACT

  • SEMI Korea Program Team ([email protected])
  • Simultaneous interpretation will NOT be provided.

Convention Hall 2, 3F, Suwon Convention Center
South Korea

9:00 am - 9:30 am
Choon Lee
Choon Lee
Intel

System Level Advanced Packaging

Rapidly evolving progress of AI and HPC has significantly increased computational and memory needs such as higher performance, lower power consumption, and wider memory bandwidth with reduced latency. An end application of AI/HPC comes down to Datacenter construction. Meeting the challenge of delivering this processing power in the datacenter requires systematic innovation from the device to the datacenter level. It starts with integrating highly optimized, domain-specific accelerators which should be integrated into advanced 2.5D and 3.5D packaging that minimize losses and power for high-speed communication while taking advantage of workload power management. AI computing introduces significant challenges for energy consumption and thermal management. Power delivery network is crucial for CPU, GPU and NPU power and performance of which solution can be DTC, IVR, mtal-insulator-metal (MIM) capacitor and thin film inductor, backside power rail, etc..  While Moore’s law has continued to yield transistor scaling necessary for these applications, the ever growing demand from models for AI training and inference pushes Si scaling in conjunction with the advent of advanced interconnects via disaggregation and reaggregation of chips in advanced packaging.  
We will discuss with examples and the challenges of utilizing packaging elements to their full potential and discuss how co-optimization is crucial to achieving the best results for any given set of system requirements and constraints.  

※Biography

9:30 am - 10:00 am
TaeKyeong Hwangv
TaeKyeong Hwang
Amkor Technology Korea

Advanced Packages for AI/HPC

10:00 am - 10:30 am
신상훈
SangHoon Shin
Assistant Professor,
Hanyang University

Advanced Packaging and Reliability: Technologies Shaping the Next Generation

Advanced semiconductor packaging is now central to enabling continued performance scaling as conventional transistor scaling slows. This seminar introduces cutting-edge trends in advanced packaging, including 2.5D and 3D integration, fan-out wafer-level packaging, chiplet-based architectures, and glass interposers for optical I/O in AI and HPC systems. These technologies offer enhanced performance, form factor reduction, and system-level integration capabilities critical for future computing platforms.
Leveraging prior industry experience, this talk highlights real-world applications and challenges in designing and qualifying advanced SoC packages. Examples include CoWoS-based AI chip packaging, hybrid bonding techniques, and thermal design optimization for high-power systems.
As packaging structures become increasingly complex, reliability emerges as a critical bottleneck. The seminar explores major failure mechanisms such as thermal-mechanical fatigue, electromigration, interfacial delamination, and Through Glass Via (TGV) degradation. Reliability analysis methods including FEA-based stress modeling, time-to-failure prediction, and advanced failure diagnostics will be introduced.
By combining packaging innovation with reliability engineering, the talk aims to provide a comprehensive perspective on the technological and practical issues that must be addressed to enable robust, high-performance semiconductor systems in the AI and data-driven era.

※ 연사정보

10:30 am - 11:00 am
Sang Hyun Han
Sang Hyun Han
NOVA

Pushing the Boundaries: Challenges and Opportunities in Panel-Level Packaging Technology

As the AI era progresses, semiconductor devices are increasingly adopting 3D architectures to boost performance and power efficiency. At the same time, system technology co-optimization (STCO) is advancing through the use of chiplets and advanced wafer-level packaging. As the industry integrates more chips into chiplets, the size of interposers continues to grow. However, wafer-level packaging faces limitations in accommodating large interposers due to the constraints of 300mm wafer shapes and temporary carriers.
This trend is driving a shift toward panel-level packaging (PLP) to support higher packaging unit counts. Despite its potential, PLP still faces significant challenges—particularly in terms of process development and process control.
This paper explores the technical trends in panel-level packaging, focusing on the current challenges and potential solutions related to process control.

※ Biography

11:00 am - 11:20 am

Break

11:20 am - 12:30 pm
All speakers

Panel Discussion

1:30 pm - 2:00 pm
Jinho_An
Jinho An
Senior Director/ Technologist,
Applied Materials

Presentation New Innovations Enabling Fine Pitch D2W Hybrid Bonding

Heterogenous integration and advanced packaging is behind the technology that is enabling today’s AI and high-performance computing. This is done through complex architecture that utilizes platforms including microbumps, through silicon vias (TSV), high density fanout and hybrid bonding (HB). The integration of chiplets using any combination of these technologies is allowing the industry to extend the Moore’s law and overcome limitations of the Von Neumann architecture. Hybrid bonding is an especially appealing technology that helps improve power and performance (higher I/O density), as well as thermal management. Sub-10 ㎛pitch die-to-wafer (D2W) HB is already in production1) for 3DIC and the industry working on HB technology for High Bandwidth Memory as well2). However, there are continuous challenges for D2W that require new innovation in both processing and metrology & inspection (M&I), and also unique challenges for both logic and memory applications specific to its integration. The presentation will discuss how logic and memory HB technologies are different and what process and M&I technologies are needed to facilitate HVM of the HB technology across different applications. Process challenges including low temperature bonding, die warpage management and dicing will be discussed, while M&I challenges include the transition to e-beam technology for HB enablement.

1) R. Agarwal et al., “3D Packaging for Heterogeneous Integration”, IEEE ECTC, July 2022
2) Lee et al., “A Study on D2W Cu Bonding Technology for HBM Multi-die Stacking”, IEEE ECTC, May 2024

※Biography

2:00 pm - 2:30 pm
Taehong Min
Taehong Min
Samsung Electro-mechanics

Trend and Technology of Glass Package Substrate

2:30 pm - 3:00 pm
이동환
Dong Hwan Lee
Samsung SDI

Design and Development of High Thermal Conductive Molding Compounds for Advanced Packaging Applications

The ongoing miniaturization and increased integration density in electronic circuit systems, particularly in advanced technologies such as DRAMs for Through-Silicon Via (TSV) and High Bandwidth Memory (HBM), have elevated thermal management to a critical challenge in microelectronic packaging. The functional performance, operational lifespan, and reliability of electronic devices fundamentally depend on efficient thermal dissipation. As power densities escalate, enhancing the thermal conductivity of EMCs has become imperative for effective heat removal from increasingly complex electronic components. Consequently, research efforts focused on developing epoxy resins with superior thermal conductivity and identifying appropriate high-conductivity fillers represent the most viable approaches to addressing thermal management challenges in contemporary microelectronic systems.
Recently, we have successfully developed a high-performance epoxy molding compound (EMC) that solves critical thermal management challenges in advanced microelectronic packaging applications. Not only do these compounds provide extremely safe protection of integrated circuits from moisture, mobile ion contaminants and adverse environmental conditions, including temperature fluctuations, humidity and mechanical stress, but the enhanced thermal and mechanical properties of EMC formulations address the heat dissipation requirements of advanced technologies such as small electronic circuit systems, especially TSV and HBM applications.

3:00 pm - 3:30 pm
Prof. Yunhyeok Im
Prof. Yunhyeok Im
Georgia Institute of Technology

Next-Generation Thermal Strategies: The Liquid Cooling Revolution for AI Chips

3:30 pm - 3:50 pm

Break

3:50 pm - 5:00 pm
All Speakers

Panel Discussion

Next-generation semiconductor packaging technologies are advancing rapidly in response to the explosive growth of high-performance semiconductor markets, including AI chips and HBM. At the Advanced Packaging Summit 2025, industry leaders from top global companies will share the latest developments and insights in advanced packaging technologies. The morning session will spotlight core technologies such as SLP and PLP, while the afternoon session will feature in-depth presentations on essential next-generation packaging technologies including hybrid bonding, glass substrates, materials for heat control, and liquid cooling solutions. Each session will also include panel discussions to encourage broad and practical exchanges of technical experiences, offering valuable opportunities for networking. We invite you to explore the future direction of next-generation semiconductor packaging with global industry experts and expand both your insights and business horizons at this premier event.

9:00 am - 5:30 pm Off Add to Calendar 2025-07-16 09:00:00 2025-07-16 17:30:00 Advanced Packaging Summit 2025 Next-generation semiconductor packaging technologies are advancing rapidly in response to the explosive growth of high-performance semiconductor markets, including AI chips and HBM. At the Advanced Packaging Summit 2025, industry leaders from top global companies will share the latest developments and insights in advanced packaging technologies. The morning session will spotlight core technologies such as SLP and PLP, while the afternoon session will feature in-depth presentations on essential next-generation packaging technologies including hybrid bonding, glass substrates, materials for heat control, and liquid cooling solutions. Each session will also include panel discussions to encourage broad and practical exchanges of technical experiences, offering valuable opportunities for networking. We invite you to explore the future direction of next-generation semiconductor packaging with global industry experts and expand both your insights and business horizons at this premier event. Convention Hall 2, 3F, Suwon Convention Center South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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United States Image Training

Don't miss this chance to grow your knowledge, build your network, and accelerate your journey in the semiconductor industry.  

 

Course Options: 

PFAS Compounds in Semiconductor Environment: Half Day Course

  • Per- and Polyfluoroalkyl substances (PFAS) are a group of over 15,000 compounds which have been used in a variety of different industries due to their unique properties. Over the past two decades, their presence in water and the human body has become of increasing concern, with studies linking certain PFAS to adverse effects in the organisms studied. This has led to increasing consumer awareness, litigation, and the regulation of PFAS compounds. This course provides an in-depth review of PFAS compounds, their history, market drivers, regulations, current uses in the semiconductor industry, and methods for sampling and analysis, over the entire semiconductor value chain.

Semiconductor Device Manufacturing in a Cleanroom (Best Practices to Improve Product Reliability and Yield)

  • This course is designed for people who utilize cleanrooms. Semiconductor device manufacturing is a complex process that involves working in a cleanroom with a wide range of specialized equipment and materials. Many challenges must be overcome to meet production goals. This course provides the fundamentals and thought processes to improve your production reliability and yield. This course is intended for mechanical engineers, process engineers, test engineers, quality assurance engineers, and technicians.

Overview of Semiconductor Manufacturing

  • This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Phoenix Convention Center
100 N 3rd St
Phoenix, AZ 85004
United States

SEMI U

Finish your show experience with SEMI U training sessions! 

Learn from experienced industry leaders across a wide range of topics. Choose a course that aligns with your goals and gain valuable insights to advance your role in the dynamic world of semiconductors.

Following the overwhelming success of last year’s inaugural trainings—where 125+ industry professionals, both seasoned and new, participated in five pre-show sessions—we’re expanding! This year, we’re offering three sessions the last day of the show to meet the growing training demand as the industry’s talent gap continues to widen. 

 

8:00 am - 4:00 pm Off Add to Calendar 2025-10-09 08:00:00 2025-10-09 16:00:00 Trainings at SEMICON West Finish your show experience with SEMI U training sessions! Learn from experienced industry leaders across a wide range of topics. Choose a course that aligns with your goals and gain valuable insights to advance your role in the dynamic world of semiconductors.Following the overwhelming success of last year’s inaugural trainings—where 125+ industry professionals, both seasoned and new, participated in five pre-show sessions—we’re expanding! This year, we’re offering three sessions the last day of the show to meet the growing training demand as the industry’s talent gap continues to widen.   Phoenix Convention Center 100 N 3rd St Phoenix, AZ 85004 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
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Don't miss this chance to grow your knowledge, build your network, and accelerate your journey in the semiconductor industry.  

 

Course Options: 

Advanced Packaging (Chiplets, WLP, Flip Chip, 3D Stacking)

  • This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes. Topics include area packaging- ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies – chip & wire, tape automated bonding, and flip chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues.

Basic Electronics & Troubleshooting

  • This course provides students with a fundamental understanding of electronics and troubleshooting techniques. Topics covered include current, voltage, resistors, capacitors, inductors, diodes, and transistor fundamentals. Students will learn to differentiate between AC and DC power, understand digital and analog circuits, and interpret electronic component datasheets.  The course offers a comprehensive overview of the theory, operation, and applications of essential testing equipment, including the Volt-Ohm-Meter, Digital Multi-Meter, and Oscilloscope. Through hands-on training, students will build breadboard circuits and develop troubleshooting skills using multi-meters.

Fundamentals of Atomic Layer Deposition (ALD)

  • Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). This course provides a practical introduction to Atomic Layer Deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing as it relates to ALD and ALE are heavily discussed.

Fundamentals of EUV

  • This course provides attendees with an overview of the fundamentals, current status, and technical challenges of EUV Lithography. The course will begin with a review of lithography in general drawing parallels between EUV and DUV lithography. The course will then go on to review EUV specific challenges/solutions including sources (lithography and metrology), optics, metrology, masks, and patterning materials. Two areas where EUV specific challenges are particularly significant are patterning materials and photomasks; this course will cover these two areas in more detail including topics such as resist stochastics, radiation chemistry, reflective thick masks, off-axis mask illumination, phase shift masks, and mask stochastics.

Fundamentals of Microsystems (MEMs) Fabrication and Applications

  • This introductory course is designed to educate people from any background that are new to Microsystems Fabrication and Applications, no prior knowledge is expected. We begin with some historical applications to set the stage for diving into how these devices are made.

Plasma Etching, ALE, & RIE

  • This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed.

Understanding Semiconductor Technology & Business

  • The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in. The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Wet Processing in the Semiconductor Industry

  • This one-day course provides a working knowledge of surface conditioning and cleaning techniques used in the manufacture of integrated circuits. Fundamentals of the techniques used for cleaning the wafer surface will be discussed. Practical applications and methods for cleaning will be presented. Upon completing this course participants will have an understanding of all types of cleaning processes used in IC manufacturing; surface conditioning for pre-diffusion clean, in particular pre-gate oxide clean, post-etch and post-implant photoresist removal, particle removal, post-CMP clean. Participants will be able to understand the cleaning roadmaps and limitations of clean technologies as the node sizes decrease. The course participant should be able to make informed decisions on the surface conditioning and cleaning processes and techniques to utilize for IC manufacturing. Course topics include surface conditioning and cleaning technologies, processes and equipment, wet, plasma, and dry cleaning, surface conditioning and cleaning techniques, cleaning technologies, effects, and challenges.

Phoenix Convention Center
100 N 3rd St
Phoenix, AZ 85004
United States

SEMI U

Start your show experience with SEMI U training sessions! 

Learn from experienced industry leaders across a wide range of topics. Choose a course that aligns with your goals and gain valuable insights to advance your role in the dynamic world of semiconductors.

Following the overwhelming success of last year’s inaugural trainings—where 125+ industry professionals, both seasoned and new, participated in five pre-show sessions—we’re expanding! This year, we’re offering eight sessions the day before the show to meet the growing training demand as the industry’s talent gap continues to widen. 

 

8:30 am - 5:30 pm Off Add to Calendar 2025-10-06 08:30:00 2025-10-06 17:30:00 Pre-Show Trainings at SEMICON West Start your show experience with SEMI U training sessions! Learn from experienced industry leaders across a wide range of topics. Choose a course that aligns with your goals and gain valuable insights to advance your role in the dynamic world of semiconductors.Following the overwhelming success of last year’s inaugural trainings—where 125+ industry professionals, both seasoned and new, participated in five pre-show sessions—we’re expanding! This year, we’re offering eight sessions the day before the show to meet the growing training demand as the industry’s talent gap continues to widen.   Phoenix Convention Center 100 N 3rd St Phoenix, AZ 85004 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
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