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In Person

United States Smarter Fabs Tile Business Executive Technical Training

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Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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https://www.semiconjapan.org SEMICON Japan Tile Expositions
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Tokyo
Japan

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Germany

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As part of this process, this session brings together top executives from industry leaders across the entire value-chain spectrum – including device design & fabrication, interconnects & system integration, hyperscale architectures & algorithms, novel materials, as well as emerging disruptive technologies like photonics and quantum. Attendees will have the rare opportunity to get a strategic perspective from these distinguished experts about the state-of-the-art and learn about exciting future trends propelling the industry towards $1 Trillion in revenue.

Phoenix, AZ
United States

Session 1

10:30 am - 10:35 am
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

10:35 am - 11:00 am
Rozalia Beica
Rozalia Beica
Field CTO Packaging Technology
Rapidus Design Solutions

The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration

11:00 am - 11:25 am
Krishna Saraswat
Krishna Saraswat
Rickey/Nielsen Professor, Emeritus
Stanford University

Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics

11:25 am - 11:50 am
Katharina Westrich
Katharina Westrich
Global VP of Electronics, Semiconductors & Simulation
Siemens AG

Challenging the Status Quo: From Chip Innovation to Compute Optimization

11:50 am - 12:15 pm
SriLatha Manne
Senior Fellow
AMD

AMD - Presentation Title TBD

12:15 pm - 12:40 pm
Rad Desiraju
Rad Desiraju
Director, WW Industry Advisory
Microsoft

Scaling AI - From Silicon to Systems

12:40 pm - 12:45 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Session 1 Wrap-up

Session 2

2:00 pm - 2:05 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

2:05 pm - 2:30 pm
Noriko Suzuki
Noriko Suzuki
Global Industry Leader - Electronics, Institute for Business Value
IBM

Next generation semiconductor to support AI resiliency

2:30 pm - 2:55 pm
Laura Matz
Laura Matz
Chief Science and Technology Officer
Merck KGaA, Darmstadt, Germany

Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials

2:55 pm - 3:20 pm
Kirk M. Bresniker
Kirk M. Bresniker
Chief Architect and Fellow/VP, HPELabs
Hewlett Packard Enterprise

HPE Labs - Computing Futures from AI to Quantum to GenZ

3:20 pm - 3:45 pm
Jürgen Hatheier
Jürgen Hatheier
Chief Technology Officer of EMEA & APAC,
Ciena

Ciena - Presentation Title TBD

3:45 pm - 4:10 pm
Subodh Kulkarni
Subodh Kulkarni
President and CEO
Rigetti

Rigetti - Presentation Title TBD

4:10 pm - 4:35 pm
Celia Merzbacher
Celia Merzbacher
Executive Director,
Quantum Economic Development Consortium

Quantum Economic Development Corporation (QEDC) - Presentation Title TBD

4:35 pm - 4:40 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Closing Remarks

The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.

10:30 am - 4:40 pm Off Add to Calendar 2025-10-07 10:30:00 2025-10-07 16:40:00 Future of Computing: Energy-Efficient Computing for AI and Beyond The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem. Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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Registration

Conference Pricing

SEMI Members: $1,500.00 (Use your corporate email address during log-in to be recognized as a SEMI Member.)

Non-Members: $1,800.00

Speakers and Students: $550.00

Cancellations received on or before April 26, 2026 will be refunded, less a $30 cancellation fee.

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

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Hotel

Wild Horse Pass

Limited rooms are available at the Wild Horse Pass Resort. Reserve your stay within our room block using the link below.

Deadline: Friday, April 17

Wild Horse Pass

Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

Contact Tim Janes at [email protected]

View Sponsorship Brochure 

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The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing. Formerly presented by Linx Consulting, SPCC continues its legacy of delivering high-quality technical content through invited presentations, peer-reviewed sessions, and poster presentations covering all aspects of cleaning science, process integration, materials, equipment, and metrology.

SPCC will feature invited business-focused presentations that examine macroeconomic, market, and structural trends shaping the global semiconductor industry that were formerly included in the Business Interface Conference (BIC). These sessions will provide attendees with valuable context on industry dynamics, supply chain, and strategic outlooks that complement the technical discussions at SPCC.

Now a unified conference, SPCC unites both business and technical aspects of industry into a comprehensive program that bridges technology development and business strategy, offering attendees enhanced opportunities for cross-disciplinary learning, collaboration, and networking with industry leaders, researchers, and decision-makers across the semiconductor ecosystem.

Join our premier technical forum with topics including—                                                                                                          

  • Cleaning Science
  • Equipment
  • Industry Dynamics
  • Materials
  • Metrology
  • Process Integration
  • Strategic Outlook
  • Supply Chain

Wild Horse Pass
5040 Wild Horse Pass Blvd
Chandler, AZ , AZ 85226
United States

MONDAY, MAY 18, 2026

Session 1

8:00 am - 9:00 am

Breakfast

9:00 am - 9:20 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Opening Remarks

9:20 am - 9:50 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

KEYNOTE—Semiconductor Industry Update

9:50 am - 10:10 am
Alma Vela Ramirez_IBM
Alma Vela Ramirez
Unit Process Engineer
IBM

Dummy Gate Poly Wet Etch Studies in GAA Nanosheet Flow

10:10 am - 10:30 am
Adara Yang
Shihui (Adara) Yang
Member of Technical Specialist
Micron

Enabling Novel Innovation in Containers Profile Sculpting for Cell Structure Improvement

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Gary Van Schooneveld
Gary Van Schooneveld
President
CT Associates

Particle Precursors and On-Wafer Defectivity: IRDS Collaborative Research Progress and Future Directions

11:20 am - 11:40 am
Tomoki Nara
Tomoki Nara
Research Scientist
Mitsubishi Chemical Corporation

Si/SiGe Selective Wet Etchant for BSPDN Application: Maximization of Selectivity in Single Wafer Spin Wet Processing

11:40 am - 12:00 pm
Deepak Kumar
Deepak Kumar
Technical Program Director
ACM Research

Optimization of Particle and Atmosphere Control in the SPM Process via Nozzle Cover

12:00 pm - 12:20 pm
Daiki Morimoto
Daiki Morimoto
Process Engineer
TEL

New Surface Preparation System; Batch-Single Hybrid Equipment

12:20 pm - 1:50 pm

Lunch

Session 2

1:50 pm - 2:20 pm
Duncan Meldrum, Hilltop Economics
Duncan Meldrum
Chief Economist
Hilltop Economics

Market Outlook

2:20 pm - 2:40 pm
Hsin-Yu Hsu
Hsin-Yu Hsu
R&D Engineer
Interuniversity Microelectronics Centre (IMEC)

Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al Stacks

2:40 pm - 3:00 pm
Chun-Ren (Jack) Ke
Chun-Ren (Jack) Ke
R&D Manager
Qnity Electronics

Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor Devices

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Nawaphorn Kuhakongkiat
Nawaphorn Kuhakongkiat
Researcher
Hiroshima University

Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface Control

3:50 pm - 4:10 pm
Soonmin Lee
Soonmin Lee
Master's Student
Hanyang University

An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration Scheme

4:10 pm - 4:30 pm
Wei-Shang Lo
Wei-Shang Lo
Advisory Scientist
IBM Research

Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures

4:30 pm - 4:50 pm
Ryotaro Maeda
Ryotaro Maeda
Engineer
Tokyo Electron Kyushu

Approaches to Further Enhance Cut Accuracy

4:50 pm - 5:10 pm
Hiroki Uoyama
Hiroki Uoyama
Manager
Micron Memory Japan, K.K

Advancements in Wafer Backside cleaning for DRAM Manufacturing

TUESDAY, MAY 19, 2026

Session 3

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 2 Opening Remarks

9:10 am - 9:50 am
Inna Skvortsova
Inna Skvortsova
Market Research Manager
SEMI

Day 2 Keynote—Navigating the AI-driven Cycle: Fab Investments and Materials Dynamics in a Fragmented World

9:50 am - 10:10 am
Srini Raghavan, ProSys Headshot
Srini Raghavan
Director of New Process Development
ProSys

Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging Structures

10:10 am - 10:30 am
Amir Taghavi
Amir Taghavi
Research Scientist
TEL

Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon Surface

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Tyler Duncan
Tyler Duncan
Research Scientist
TEL

Ab Initio Study of Confined HF Etching Mechanism on SiO2

11:20 am - 11:40 pm
Shih Chih lin
Shih-Chih Lin
PhD Candidate
University of Washington

WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process Optimization

11:40 am - 12:00 pm
Moeka Ajiki
Moeka Ajiki
Engineer
Fujimi

Challenges and Solution of Post Ceria CMP Clean

12:00 pm - 1:30 pm

Lunch

Session 4

1:30 pm - 2:00 pm
JC Yang
Ji Chul Yang, Ph.D.
Chief of Technology Executive
EBARA Precision Machinery

Advanced Topography Correction Planarization Technology for Yield Enhancement

2:00 pm - 2:20 pm
Gyeongwon Lee
Gyeongwon Lee
Graduate Student
Hanyang University

Controlling the Molybdenum Dissolution and Oxidation During Post-CMP Cleaning

2:20 pm - 2:40 pm
Mona Moukrati
Mona Moukrati
PhD Student
STMicroelectronics

Controlled Cracking-Induced Delamination for Polymer-Based Cleaning

2:40 pm - 3:00 pm
Shogo Onishi
Shogo Onishi
RD Technical Manager
Fujimi

Design of the Buffing Cleaning Solution for Chemical Mechanical Cleaning on Advanced Technology Node

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Suhas Ketkar
Suhas Ketkar
Marketing Leader
Elemental Scientific

Impact of Supply Chain Conditions on IPA Product Quality

3:50 pm - 4:10 pm
Dana Shoken
Dr. Dana Shoken
R&D Manager
CI-SEMI

Trace Water Measurement in Organic Solvent Systems for Semiconductor Manufacturing

4:10 pm - 4:30 pm
Allen Chan
Allen Chan, PhD
R&D Scientist, Balazs™ NanoAnalysis
Air Liquide

Thermal Vacuum Analysis and Identification of Contaminant Outgassing from Polymer Seals

4:30 pm - 4:50 pm
Sina Kaabipour
Sina Kaabipour
Postdoctoral Researcher
imec-USA

Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization Techniques

4:50 pm - 5:10 pm
Padraic O'Reilly
Padraic O'Reilly
Applications Scientist
Molecular Vista

IR-PiFM: Molecular Detection and Identification of Nanoscale Surface Contamination

6:30 pm - 8:00 pm

Networking & Poster Session Reception

WEDNESDAY, MAY 20, 2026

Session 5

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 3 Opening Remarks

9:10 am - 9:40 am
Ian Brown
Ian J. Brown, Ph.D.
President
SCREEN Advanced Technology Center of America

Wet Etching and Cleaning Trends: Scaling x 3D Integration

9:40 am - 10:00 am
Ashutosh Bhabhe
Ashutosh Bhabhe
CEO
14Si Solutions

Characterization of Particle Filtration Solutions in a Weak Acid

Siddarth Sampath
Siddarth Sampath
Director, Global WEC Filtration Applications
Entegris
10:00 am - 10:30 am

Networking Break

10:30 am - 11:00 am
Steven Kraft Entegris
Steven Kraft, Ph. D., PMP
Director of SG&E R&D Materials Solutions
Entegris

Wet-Etch Solutions Development for Advanced Node Devices

11:00 am - 11:20 am
Arim Woo
Arim Woo
Master's Student
Hanyang University

Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP Cleaning

11:20 am - 11:40 am
Sangita Kumari
Sangita Kumari
Principal Process Engineer
TEL Technology Center, America

Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL Integration

11:40 am - 12:00 pm
Hui Zhou
Hui Zhou
Principal Scientist
Huntsman USA

Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning Performance

12:00 pm - 1:30 pm

Lunch

Session 6

1:30 pm - 2:10 pm
Rebecca Routson
Rebecca Routson
Principal Director for CHIPS Test & Metrology
NIST

Day 3 Keynote—Measuring the Future: CHIPS Metrology Program Updates

2:10 pm - 2:30 pm
Diane Bijou
Diane Bijou
Researcher in Chemistry
Technic France

High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers

2:30 pm - 2:50 pm
Jim De Boer
Jim De Boer
Director, US Product and Operations
Trymax NexGen

TTV Optimization in Wet Chemical Thinning Using Integrated Metrology

2:50 pm - 3:20 pm

Networking Break

3:20 pm - 3:40 pm
Koji Nakata
Koji Nakata
Senior Researcher
Kurita Industries

Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional Water

3:40 pm - 4:00 pm
Chihiro Kobata
Chihiro Kobata
Engineer
JSR

Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOG

4:00 pm - 4:10 pm
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Closing Remarks

-

Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.

Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge.

Off Add to Calendar 2026-05-18 00:00:00 2026-05-20 00:00:00 SPCC 2026—Surface Preparation & Cleaning Conference Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge. Wild Horse Pass 5040 Wild Horse Pass Blvd Chandler, AZ , AZ 85226 United States SEMI.org [email protected] America/Phoenix public America/Phoenix
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Registration for the Global Executive Summit is closed.  Please contact Heidi Hoffman at [email protected] with any questions.  

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SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight.  View the hotels and rates HERE.

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Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to: 

  • Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
  • Define clear deliverables and next-phase commitments that unlock scale and momentum
  • Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results

This Summit is not about what we could do — it’s about what we will do, and who will lead.

Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees.  Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.

Okura Hotel
Tokyo
Japan

Monday, December 15, 2025

9:00 am - 9:20 am

Coffee & Registration

9:25 am - 9:30 am
 Masahiko (Jim) Hamajima - President, SEMI Japan
Jim Hamajima
President
SEMI Japan

9:30 am - 9:45 am
Ajit Manocha, SEMI
Ajit Manocha
CEO & President
SEMI
Carolin Seward, Google
Carolin Seward
VP of Custom Silicon Sourcing and Operations
Google

GES Opening

9:45 am - 10:25 am
Carolin Seward, Google
Moderator
Carolin Seward
Google
Jinman Han
Jinman Han
President
Samsung Foundry
Jens Liebermann
Jens Liebermann
Senior VP of Global Business
BASF
Sundeep Bajikar
Sundeep Bajikar
Corp. VP Head of Corp Strategy
Applied Materials
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration

Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?

10:25 am - 10:40 am
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Spotlight: AMD on the role of Silicon Design for Energy Efficiency

Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.

10:40 am - 11:10 am
Anne Meegan
Moderator
Anna Meegan
Director of Sustainability
Google Platforms & Devices
Angela Baker
Angela Baker
VP Sustainability
Qualcomm
Dharmesh Jani
Dharmesh Jani
Director, AI Infra Ecosystem & Partnerships
Meta
Cooper Elsworth
Cooper Elsworth
Sr. TPM, Advanced Energy Labs
Google

End-User Panel: The Decarbonization Imperative

Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.

11:10 am - 11:25 am

Break

11:25 am - 11:30 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Overview of Priority Initiatives

Priority Initiative: Fab Upstream Materials

11:30 am - 11:40 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Opening Remarks

From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.

11:40 am - 12:10 pm
Bessima
Bessma Aljarbou
Head of Strategy of Environment & Supply Chain Innovation
Apple, Inc.

Keynote: Apple's Supply Chain Engagement

Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.

12:10 pm - 12:40 pm
Handy Ko TSMC
Handy Ko
Director, Materials Management
TSMC

From Ambition to Action: A Fab's Role in Upstream Decarbonization

Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.

12:40 pm - 12:55 pm
Andrea Jorissen
Andrea Jorissen
Supplier Carbon Solutions
Apple, Inc.

Solutions Enablement & Calls-to-Action

Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.

12:55 pm - 1:55 pm

Networking & Lunch

Priority Initiative: Clean Electricity

1:55 pm - 2:05 pm
Rebecca Green
Rebecca Green
Partner
ERM
Ken Haig
Ken Haig
Senior Director Government Affairs
Microsoft

Opening Remarks

Setting the stage for collective action on clean electricity in Asia.

2:05 pm - 2:30 pm
Patrick Tan
Patrick Tan
Head of Wider Asia, APAC
Aurora Energy Research

From Visibility to Viability: Developer Insights on Building a Net Zero Future

Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.

2:30 pm - 2:55 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy
Microsoft

Keynote: Clean Electricity Policy Action & Urgency

Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.

2:55 pm - 3:25 pm
YS Kim SK HYNIX
Yong Sung Kim
Head of Clean Energy
SK Hynix

Deep Dive: A Clean Semiconductor Partnership in Korea

Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.

3:25 pm - 3:40 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy, Asia Pacific
Microsoft

Calls to Action

From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.

3:40 pm - 4:10 pm

Break

4:10 pm - 4:50 pm
Rebecca Green
Moderator
Rebecca Green
ERM
Josh Seidenfeld
Josh Seidenfeld
Supply Chain Clean Energy Lead
Google
Chikako Matsumoto
Chikako Matsumoto
Director, Managing Executive Officer
Sumitomo Mitsui Trust Group
Rei Ushikubo
Rei Ushikubo
Director and Head of the Carbon-Free Solutions Division
Shizen Energy
Daisuke Tsujimoto
Daisuke Tsujimoto
Executive Officer, CSO
Renova Inc.

Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.

How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.

4:50 pm - 5:00 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
Vice President, Sustainability
SEMI

Day 1 Closing Remarks and Look Ahead

Reflect on the day's takeaways and action items.

5:00 pm - 6:00 pm

Member-to-Member Meetings / Break

6:00 pm - 6:30 pm

Networking Reception

Join us for Networking in the Orchard Foyer

6:30 pm - 8:30 pm
Alison Drury
Alison Drury
Global Technology Industry Lead
ERM

Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”

A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.

Tuesday, December 16, 2025

8:30 am - 9:15 am

Coffee & Networking

9:15 am - 10:00 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Day 2 Opening

Opening remarks will summarize Day 1 and preview Day 2.

9:30 am - 10:00 am
Lora Ho
Lora Ho
SVP Strategy & ESG
TSMC

TSMC Keynote

Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.

10:00 am - 10:15 am

Break

Priority Initiative: Gas Substitution

10:15 am - 10:25 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Opening Remarks

Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan

10:25 am - 10:45 am
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research

Equipment Perspective: Scaling Low-GWP Gas Substitution

Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing

10:45 am - 11:05 am
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

imec’s Gas Assessment Platform for Sustainability (GAPS) 

Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution

11:05 am - 11:35 am
Bruce Gall Google
Moderator
Bruce Gall
Google
Rachel Potter EMD
Rachel Potter
VP of Specialty Gas
EMD / Merck
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption

Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases

11:35 am - 11:45 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Calls to Action

From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.

11:45 am - 12:45 pm

Networking Lunch

Priority Initiative: Abatement

12:45 pm - 1:10 pm
Beth Elroy
Elizabeth Elroy
VP Sustainability
Micron

Opening Remarks & Keynote

Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.

1:10 pm - 1:50 pm
Josh Robbins
Moderator
Josh Robbins
Google
Phil Kester
Phil Kester, PhD
Senior Chemical Engineer
Guild Associates
HK KIM KIMM
Dr. Hak-Joon Kim
Korea Institute of Machinery & Materials

F-GHG Catalyst Development & Funding Vehicles

Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.

1:50 pm - 2:20 pm
Yong Keong Goh
Moderator
Yong Keong Goh
Senior Manager
Micron
Martin Tollner
Martin Tollner
President, Semiconductor Division
Edwards
Morihara Kanken
Atsushi Morihara
Chief Technical Officer
Kanken
Rene Reichardt
Rene Reichardt
CEO
DAS EE
Jong Pil Yoon
Jong Pil Yoon
President
EcoEnergen

F-GHG and Nitrous Oxide Abatement Technology Panel

Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.

2:20 pm - 2:30 pm
Kongyeong Goh
YongKeong Goh
Micron
Josh Robbins
Joshua Robbins
Google

Closing Remarks: Abatement

Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.

2:30 pm - 2:45 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Calls to Action Summary & Closing

Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.

- Sustainability

Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry.

9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States standards watch banner image dec 2019 upw Business Technical

Overview

The IRDS Roadmap has identified near-term challenges related to measurements of particles, trace metals and organics in liquid chemicals at levels required to meet the needs of the industry.  The identified challenges are measurement of 10 nm and smaller particles, sub ppt measurement of metallic impurities, measurement of particle precursors and trace organics and online speciation of trace organics.  The focus of the workshop will be on recent advances in analytical methodology and instrumentation that will enable the industry to meet these challenges. 

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

9:00 am
PT
Paul Trio
Director, Standards
SEMI

Welcome

Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific
9:05 am - 9:15 am
don hadder
Don Hadder
OTF Planar Staff IC
Intel

Chemical Quality and Consistency Requirements for the Semiconductor Industry

9:15 am - 9:45 am
Aaron_Hineman
Aaron Hineman
Inorganic Product Line Leader, Americas
PerkinElmer

Analysis of Challenging Semiconductor Chemicals by ICP-MS

9:45 am - 10:15 am
Daniel Wiederin headshot
Daniel Wiederin
President
Elemental Scientific

Addressing IRDS Yield Enhancement Challenges in Liquid Chemical Metrology

10:15 am - 11:00 am
Gary Van Schooneveld headshot
Gary Van Schooneveld
President
CT Associates, Inc.
Derek Oberreit headshot
Derek Oberreit
Chief Technology Officer
Kanomax Holdings
Marie Tripp Headshot
Dr. Marie Tripp
VP of Customer Relations
UNISERS AG

Metrology for Detection of Particle Precursor and Sub-10 nm Particles In Liquids and On-Wafer

11:00 am - 11:30 am
Larry Zazzera headshot
Larry Zazzera, Ph.D.
Corporate Scientist
CT Associates, Inc.
Greg Haugstad headshot png
Greg Haugstad, Ph.D.
Principal Researcher and Technical Director, CharFac
Dept. of Chemical Engineering, University of Minnesota

Identification of Organic Particle Precursors using FTIR-ATR, SERS and AFM-IR

11:30 am
Suhas Ketkar headshot
Suhas Ketkar
Elemental Scientific

Closing Remarks

Standards

SEMI Analytical Workshop

9:00 am - 11:30 am Off Add to Calendar 2025-10-08 09:00:00 2025-10-08 11:30:00 SEMI Liquid Chemicals Analytical Workshop SEMI Analytical Workshop In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States F47 Ad Business Technical

Overview

Since 2018, the SEMI Voltage Sag Task Force—comprising Fabs, Utilities, OEMs, Tool Suppliers, and EPRI—has collaborated to address a persistent challenge: why do tools remain vulnerable to voltage sags despite the implementation of SEMI F47?

Over seven years, the task force has investigated the power quality environment, tool susceptibility, testing methodologies, and mitigation strategies. This deep dive has led to actionable recommendations for strengthening the SEMI F47 standard and improving tool resilience in future builds.

What to Expect

Join us for a comprehensive workshop that will:

  • Review the task force’s findings and collaborative efforts
  • Share insights from key stakeholders
  • Present proposed revisions to the SEMI F47 standard
  • Discuss how these updates can enhance tool performance and reliability

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

2:30 pm
PT
Paul Trio
Director, Standards
SEMI

Welcome Remarks

2:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephens
Program Manager
EPRI

SEMI F47 Background & Voltage Sag Immunity Task Force Review

Biography
Mark will present the background of the 7-year effort, the findings from the work , proposed updates and pathways towards improvements and will close out with a summary and next steps.

2:50 pm

Baselining PQ Data from Semiconductor Fabs

3:05 pm
Zack Pike
Zachary Pike
SMTS Facilities Electrical Engineer
GlobalFoundries

Insights from Global Foundries

Biography
Zack will present on Global Foundries experiences with semiconductor tool shutdowns, efforts toward improvement and the types of voltage sags that are still causing tool downtime.

2:20 pm
Clay Burns
Clayton Burns
Principal Engineer, Transmission Planning & Asset Management
National Grid

Experiences from National Grid

Biography
Clay will discuss the power quality environment, relay concepts such as area of vulnerability, and the need for including some level of three-phase voltage sag testing.

3:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephen
Program Manager
EPRI

Key Findings from Research and Testing

3:50 pm

Proposed Updates to the SEMI F47 Standard from Task Force Work

4:05 pm

Facilities Korea TC Chapter Input

4:15 pm

Voltage Sag Generator Readiness

4:25 pm - 4:30 pm

Summary and Next Steps

Standards

Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop

This is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design.

2:30 pm - 4:30 pm Off Add to Calendar 2025-10-08 14:30:00 2025-10-08 16:30:00 Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights WorkshopThis is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design. In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

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United States http://flex.semi.org/ 425x187@2_Flex_event_Tile Business Expositions Technical

Phoenix, AZ
United States

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development Off Add to Calendar 2026-02-24 00:00:00 2026-02-26 00:00:00 Flex 2026 Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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REGISTER NOW

Attendance is free, but registration is required by October 24, 2025.

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Mortenson
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SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry 

Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.

Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by the University of Illinois Urbana-Champaign. Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductor Industry.

  • Listen to professionals in the industry talk about their roles and find out the skillset needed for a career in high tech. 
  • Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can connect with employers in the industry.
  • Learn how to optimize your resume and boost your interview skills to land a job in the semiconductor industry.

All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.

  • Enjoy free lunch and snacks, free swag, and giveaways at Employer Tables.
  • Students can come and go.

EVENT is FREE but registration is required. Register by October 24th, 2025! 

University of Illinois Urbana-Champaign
Campus Instructional Facility
1405 West Springfield Avenue
Champaign, IL 61821
United States

FRIDAY, NOVEMBER 7, 2025 (Times in CST)

11:00 am

Student Check-In

11:15 am
Andy Stapleton, Mortenson
Andy Stapleton
Vice President at Mortenson
SEMI Midwest Chapter
Dr. Nancy Sottos, UIUC
Dr. Nancy Sottos
Department Head Materials Science and Engineering
University of Illinois at Urbana-Champaign

Welcome & SEMI Midwest Chapter Introduction

11:20 am
Laurel Passantino
Laurel Passantino
Assistant Dean for Research and Strategic Research Planning
University of Illinois Urbana-Champaign

Semiconductor Engineering at University of Illinois Urbana-Champaign

11:30 am
Dave Chapek, Polar Semiconductor
Dave Chapek
Director of Operations Engineering - Front End of Line
Polar Semiconductor

Semiconductors 101: A Brief History of the Semiconductor Industry & Career pathways

12:00 pm

Free Lunch for Students

12:30 pm
Brendan Aird, IBM Semiconductors
Brendan Aird
Global Strategic Technology Business Development Executive
IBM Semiconductors
Nicholas Cys TSMC AZ
Nicholas Cys
Senior Process Integration Engineer
TSMC AZ
Maggie Kamman Polar Semiconductor
Maggie Kamman
Process Engineer II
Polar Semiconductor
Anna Albert TEL
Anna Albert
Technical Support Engineer II
Tokyo Electron America (TEL)

Ask Me Anything (Panel): A Day in the Life of a Semiconductor Industry Professional

1:20 pm
John Mahlmeister
John Mahlmeister
Assistant Director, Engineering Career Services
The Grainger College of Engineering

Personal Branding & Resume Best Practices

1:50 pm
Laura Tarr Polar Semiconductor
Laura Tarr
Recruiter
Polar Semiconductor

Interview Like a Pro: Perfect Your Pitch

2:20 pm

Job & Internship Opportunities - Sponsors & Exhibitors - 3-Minute Elevator Pitch

Participating companies will pitch their internship & job opportunities

2:50 pm

Break / Room Change

Move to Room 4029 for Networking

3:00 pm

Network with Exhibiting Industry Leaders

4:00 pm

Adjourn

Workforce Development

[PDS] Professional Development Seminar
—Organized by SEMI Midwest Chapter

This FREE seminar will help students meet the demands of today's high tech workforce and be successful in their careers. 

11:00 am - 4:00 pm Off Add to Calendar Disabled America/Chicago
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