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Add to Calendar2026-02-11 00:00:002026-02-13 00:00:00SEMICON Korea 2026TRANSFORM TOMORROWThe future of the semiconductor industry starts here.Join us at SEMICON Korea 2026 to shape tomorrow together. HoursFebruary 11, 2026 | 10:00-17:00 (Last entry 16:30)February 12, 2026 | 10:00-17:00 (Last entry 16:30)February 13, 2026 | 10:00-16:00 (Last entry 15:30)VenueCOEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)Westin Seoul ParnasGrand InterContinental Seoul ParnasScale550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)Seoul South KoreaSEMI.org[email protected]America/Los_Angelespublic
Early Bird Pricing (until March 25, 2025) $375 members $525 non-members
Regular Pricing (After March 25, 2025) $525 members $699 non-members
MDM2 members please contact Michelle Fabiano, [email protected], for discount information.
Complimentary student registration is available but has limited capacity. Students can Register here to be contacted about complimentary attendance after March 15th.
Cancellation Policy
Cancellations received on or before March 25, 2025, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 25, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].
Hear the latest advances from FlexTech and NBMC alongside technical presentations from researchers and technology leaders developing tomorrow's semiconductor innovations.
Day 2 | Technical Gap Analysis
Participate in collaborative breakout sessions that examine technology gaps, explore roadmaps, and help shape future FlexTech and NBMC research priorities. Your expertise will directly contribute to discussions that influence future Request for Proposal (RFP) directions.
Day 3 | AI for Metrology Workshop
This workshop brings together industry, academia, and standards leaders to explore how AI can connect metrology, failure analysis, and test data across the semiconductor supply chain. As chiplets, heterogeneous integration, and advanced packaging drive complexity, AI-assisted defect localization and root-cause analysis backed by non-destructive modalities and targeted physical characterization are becoming essential to closing the loop from electrical failure back to physical origin.
Industry Tours
Take advantage of exclusive industry tours at SkyWater Technology and NeoCity Academy
Including with registration are breakfasts, breaks, lunches and receptions.
NeoCity Academy 200 NeoCity Way Kissimmee, FL34744 United States
Monday, April 21 (Medtronic Tour)
2:00 pm
Medtronic Tour
(Tour sold out. Sign up for the waitlist.)
Join us for an exclusive one-hour tour of Medtronic’s facility, to explore its advanced operations in designing and manufacturing microelectronics for implantable medical devices.
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
3:05 pm
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3:20 pm
Break
3:20 pm
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4:10 pm
Breakout Sessions Readout
4:30 pm
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6:00 pm
Student Poster Networking Reception & Mayo Clinic Lab for Function Tour
Mayo Clinic
IERB Building
5951 E. Mayo Blvd
Phoenix, AZ 85054
Mayo Lab Tour: If you're interested, please sign up at the registration desk. Space is limited to 20 participants and will be available on a first-come, first-served basis.
Note: Transportation to this reception will not be provided. (2 minute drive.)
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
3:05 pm
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3:20 pm
Break
3:20 pm
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4:10 pm
Breakout Sessions Readout
5:00 pm
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7:00 pm
Networking Reception and Tours of Wexford Connect
Enjoy Networking, concurrent tours, and presentation content
850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004 https://850pbc.com
5:00 pm - 5:30 pm: Tours of Wexford Connect (Limited to 30 people)
6:15 pm - 7:00 pm: Panel Discussion:
Bridging Clinical Needs and Emerging Technology: Research, Implementation, and Scale. Moderator: Chris Yoo, General Partner, Xcellerant Ventures Panelists: Suman Bose, Assistant Professor of Biomedical Engineering, Mayo Clinic Hakan Ceylan, Assistant Professor and Principal Investigator, Mayo Clinic Ross Bundy, CEO, CRISPRQC Elsa Abruzzo, CEO, Anuncia Medical Allen Waziri, CEO and Co-Founder, iCE Neurosystems
Note: Transportation will not be provided. (30+ minute drive.)
Panel Discussion: The Arizona MDM2 Consortium - Investing in the Medical Technology Manufacturing Renaissance
Moderator: Chris Yoo, Founder and CEO and Regional Innovation Officer, MDM2 Consortium Panelists: Kiran Avancha, Chief Innovation Officer, HonorHealth Rochelle Rivas, District Director for Healthcare Innovation, Maricopa Community Colleges Alex Tessmer, Associate Director, BD Peripheral Intervention, Ideation
9:45 am
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10:10 am
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Aman Verma
Hospitalist
Mayo Clinic, Arizona
FIRESIDE CHAT: How can wearables and implantables improve care of the acutely ill patient?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Aman Verma, Hospitalist, Mayo Clinic, Arizona
10:10 am
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10:25 am
Break
10:25 am
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11:10 am
Moderator
Kiran Avancha
Chief Innovation Officer
Honor Health Innovations
Craig Norquist
Chief Innovation Officer
Honor Health
Matthew Anderson
Chief Medical Information Officer - Ambulatory
Honor Health
PANEL DISCUSSION: Health Data 2035: How do we Capture, Integrate, and Secure Health Data Streams From Wearables and Implantables to Improve Patient Care?
Moderator: Kiran Avancha, Chief Innovation Officer, Honor Health Innovations Panelists: Craig Norquist, Chief Innovation Officer, Honor Health Matthew Anderson, Chief Medical Information Officer - Ambulatory, Honor Health
11:10 am
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11:45 am
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Bart M. Demaerschalk
Vascular Neurologist
Mayo Clinic, Arizona
Chandan Krishna
Neuro-endovascular Neurosurgeon
Mayo Clinic - Arizona
FIRESIDE CHAT: Stroke Care 2035- How Can Digital Health Data Transform Stroke Care?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Bart M. Demaerschalk, Vascular Neurologist, Mayo Clinic, Arizona Chandan Krishna, Neuro-endovascular Neurosurgeon, Mayo Clinic, Arizona
11:45 am
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12:15 pm
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Nandita Khera
Oncologist, Associate Chair of Digital Health
Mayo Clinic
FIRESIDE CHAT: Real-Time Oncology - How Can Wearables and Implantables Reshape Oncology Care in 2035?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Nandita Khera, Oncologist, Associate Chair of Digital Health, Mayo Clinic
12:15 pm
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1:00 pm
Moderator
Randal Schulhauser
Founder and CEO
Schulhauser Associates LLC
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic
Allen Waziri
Neurosurgeon, Co-Founder iCE Neurosystems
iCE Neurosystems
Paul Gerrish
VP, Technology and Medtronic Fellow
Medtronic
Panel Discussion: The New Frontier of Long-Term Brain Monitoring: Brain Computer Interface Re-Imagined
Moderator: Randal Schulhauser, Founder and CEO, Schulhauser Associates LLC Panelists: Jonathon Parker, Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic Allen Waziri, Neurosurgeon, Co-Founder iCE Neurosystems, iCE Neurosystems Paul Gerrish, VP, Technology and Medtronic Fellow, Medtronic
Division Director, Integrative Health and Performance Sciences
BlueHalo
Deon Chen
Sr. Manager, HEOR Strategic Planning
BD
Panel Discussion: Digital Health Revolution: Insights and Innovations
Moderator: Douglas Kiehl, BioCrossroads/Purdue Panelists: Bharath Rajagopalan , Director – Strategic Marketing, Health & Wellness, STMicroelectronics Anirban Bandyopadhyay, Senior Director, Global Foundries Stephaney Shanks, Division Director, Integrative Health and Performance Sciences, BlueHalo Deon Chen, Sr. Manager, HEOR Strategic Planning, BD
4:30 pm
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7:00 pm
Evening Program Hosted by Venture Café
850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004 https://venturecafephoenix.org/
Venture Café Phoenix is a dynamic weekly gathering where entrepreneurs, innovators, and business leaders connect to exchange ideas and build meaningful relationships.
Note: Transportation to this program will not be provided (30+minute drive)
5:40 pm
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6:30 pm
Nandini Tandon
Co-Founder of Silicon Valley based VC in HealthTech
IndUS Setu Global Foundation
Jami Mei
VP of Business Development
Arizona Commerce Authority
Douglas E. Kiehl
Sr. Vice President
BioCrossroads
Mark Dydyk
Director of Engineering & Operations
Medtronic
Fireside Chat: Harnessing Semiconductor For transformational Advancements in HealthTech
Abstract Moderator: Nandini Tandon Panelists: Jami Mei, VP of Business Development, Arizona Commerce Authority Douglas E. Kiehl, Sr. Vice President, BioCrossroads Mark Dydyk, Director of Engineering & Operations, Medtronic
Join us for a three-day workshop uniting SEMI Technology Coalitions: FlexTech, NBMC, and CAST
The workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will feature AI for Metrology (AI4MT) sessions
FLEX Technology Workshop 2027
FHE & NBMC Gap Analysis | AI for Metrology
8:00 am - 6:00 pm
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Add to Calendar2027-02-16 08:00:002027-02-18 18:00:00Flex Technology Workshop 2027Join us for a three-day workshop uniting SEMI Technology Coalitions: FlexTech, NBMC, and CASTThe workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will feature AI for Metrology (AI4MT) sessionsNeoCity Academy 200 NeoCity Way Kissimmee, FL 34744 United StatesSEMI.org[email protected]America/New_Yorkpublic
America/New_York
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
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Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY
Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on the path to $1T in semiconductor revenue.
A significant amount of both markets is concentrated in the Midwestern United States. SEMIEXPO in the Heartland will bring these two key markets together and provide an opportunity for collaboration and growth.
Smart Manufacturing
The program will focus on the deployment of Industry 4.0 or Smart Manufacturing tools, technologies, and methods for the semiconductors required for this growing market.
Smart Mobility
The program will unite stakeholders in the semiconductors/sensors and mobility ecosystems to identify and address technical issues and supply chain dynamics that are best addressed collectively.
Ways to Participate
Exhibit
Sponsor
Speak
Attend
MAKE YOUR MARK AT THE INAUGURAL SEMIEXPO HEARTLAND
Plan Now to Exhibit or Sponsor. Contact— Shane Poblete | +1 202-847-5983 | [email protected]
NEW EVENT!
April 1–2, 2025
Indiana Convention Center, Indianapolis, IN
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Add to Calendar2026-04-29 00:00:002026-04-30 00:00:00SEMIEXPO Heartland 2026Indiana Convention Center 100 S Capitol Ave Detroit, MI United StatesSEMI.org[email protected]America/Detroitpublic
America/Detroit
Standardizing the Semiconductor Manufacturing Backend
About Collaborative Alliance of Semiconductor Test (CAST)
CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.
Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers. How can we standardize it and gain the efficiencies that standards brought to the frontend? SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb. This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.
United States
3:00 pm
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3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix
Opening Remarks
Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.
Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.
3:05 pm
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3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix
SECS/GEM
Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.
3:15 pm
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3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group
EDA/Interface A
Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.
3:25 pm
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3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments
RITdB
Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.
Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.
3:35 pm
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3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions
Traceability and E142
Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.
He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.
Standardizing the Semiconductor Manufacturing Backend
Taming the Wild West of Semiconductor Backend Manufacturing
3:00-4:00 PM (PT)
Zoom
A CAST technology community webinar
3:00 pm - 4:00 pm
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Add to Calendar2024-02-22 15:00:002024-02-22 16:00:00Standardizing the Semiconductor Manufacturing BackendUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
About Collaborative Alliance of Semiconductor Test (CAST)
CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.
