Seoul
South Korea

TRANSFORM TOMORROW

The future of the semiconductor industry starts here.
Join us at SEMICON Korea 2026 to shape tomorrow together.

Hours

• February 11, 2026 | 10:00-17:00 (Last entry 16:30)
• February 12, 2026 | 10:00-17:00 (Last entry 16:30)
• February 13, 2026 | 10:00-16:00 (Last entry 15:30)

Venue

• COEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)
• Westin Seoul Parnas
• Grand InterContinental Seoul Parnas

Scale

• 550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)

SEMICON Korea 2026

Registration

Early Bird Pricing (until March 25, 2025)
$375 members
$525 non-members

Regular Pricing (After March 25, 2025)
$525 members
$699 non-members

MDM2 members please contact Michelle Fabiano, [email protected], for discount information.

Complimentary student registration is available but has limited capacity. Students can Register here to be contacted about complimentary attendance after March 15th.

Cancellation Policy

Cancellations received on or before March 25, 2025, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 25, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

Register Now

Collaborators

Day 1 | Innovation Forum 

Hear the latest advances from FlexTech and NBMC alongside technical presentations from researchers and technology leaders developing tomorrow's semiconductor innovations.

Day 2 | Technical Gap Analysis 

Participate in collaborative breakout sessions that examine technology gaps, explore roadmaps, and help shape future FlexTech and NBMC research priorities. Your expertise will directly contribute to discussions that influence future Request for Proposal (RFP) directions.

Day 3 | AI for Metrology Workshop 

This workshop brings together industry, academia, and standards leaders to explore how AI can connect metrology, failure analysis, and test data across the semiconductor supply chain. As chiplets, heterogeneous integration, and advanced packaging drive complexity, AI-assisted defect localization and root-cause analysis backed by non-destructive modalities and targeted physical characterization are becoming essential to closing the loop from electrical failure back to physical origin.

Industry Tours

Take advantage of exclusive industry tours at SkyWater Technology and NeoCity Academy

Including with registration are breakfasts, breaks, lunches and receptions.

In collaboration with:

• Navid Asadi - Associate Professor, University of Florida
• Matthew Walsh - Chief Engineer, NSF Florida Semiconductor Engine

Highlights from Flex 2026

See some highlights from last year's FLEX Technology Summit. With a powerful speaker line-up, incredible networking, fascinating innovations, and amazing people.

NeoCity
194 NeoCity Way
Kissimmee, FL 34744
United States

Join us for a three-day workshop uniting SEMI Technology Coalitions: FlexTech, NBMC, and CAST

The workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will feature AI for Metrology (AI4MT) sessions

Yashobhoomi
Delhi
India

Tokyo
Japan

Munich
Germany

Phoenix, AZ
United States

San Francisco, CA
United States

Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry. 

In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration. 
 

United States

Arsalan Alam, PhD

Member of Technical Staff (MTS), 3D Stacking Technology Group

AMD Packaging

2nd Generation 3D V-Cache™ Enablement

Andrea Chacko, PhD

Director of Packaging Solutions

Brewer Science

Dongshun Bai, PhD

Business Development Director and Senior Technologist of Packaging Solutions

Brewer Science

Enabling Heterogeneous Integration through Material Design

The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.

Andrea Maret

Senior Knowledge Manager

Entegris

Webinar Moderator

Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.

Heterogenous Integration finds its place

Webinar
10:00 am - 11:00 am PT
Zoom

INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY

Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on the path to $1T in semiconductor revenue.  

A significant amount of both markets is concentrated in the Midwestern United States. SEMIEXPO in the Heartland will bring these two key markets together and provide an opportunity for collaboration and growth.

Smart Manufacturing

• The program will focus on the deployment of Industry 4.0 or Smart Manufacturing tools, technologies, and methods for the semiconductors required for this growing market. 

Smart Mobility

• The program will unite stakeholders in the semiconductors/sensors and mobility ecosystems to identify and address technical issues and supply chain dynamics that are best addressed collectively. 

Ways to Participate

• Exhibit
• Sponsor
• Speak
• Attend

MAKE YOUR MARK AT THE INAUGURAL SEMIEXPO HEARTLAND

Plan Now to Exhibit or Sponsor. Contact—
Shane Poblete | +1 202-847-5983  | [email protected]

STAY INFORMED: SEMIEXPO HEARTLAND—SEH Interest Form

Indiana Convention Center
100 S Capitol Ave
Detroit, MI
United States

SEMIEXPO Heartland

NEW EVENT!
April 1–2, 2025
Indiana Convention Center, Indianapolis, IN

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

Watch on-demand

Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers.  How can we standardize it and gain the efficiencies that standards brought to the frontend?  SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb.  This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.

United States

3:00 pm - 3:05 pm

Alan Weber

Vice President, New Product Innovations

Cimetrix

Opening Remarks

Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.

Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.

3:05 pm - 3:15 pm

Brian Rubow

Director of Solutions Engineering

Cimetrix

SECS/GEM

Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.

3:15 pm - 3:25 pm

Albert Fuchigami

Senior Software Developer

PEER Group

EDA/Interface A

Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.

3:25 pm - 3:35 pm

Stacy Ajouri

Senior Member of Technical

Texas Instruments

Mark Roos

CEO

Roos Instruments

RITdB

Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.

Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.

3:35 pm - 3:45 pm

Dave Huntley

Product Manager Assembly Products

PDF Solutions

Traceability and E142

Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.

He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.

3:45 pm - 3:55 pm

Alan Weber

Vice President, New Product Innovations

Cimetrix

Closing Remarks

Standardizing the Semiconductor Manufacturing Backend

Taming the Wild West of Semiconductor Backend Manufacturing

3:00-4:00 PM (PT)
Zoom

A CAST technology community webinar