Off
Add to Calendar2026-02-11 00:00:002026-02-13 00:00:00SEMICON Korea 2026TRANSFORM TOMORROWThe future of the semiconductor industry starts here.Join us at SEMICON Korea 2026 to shape tomorrow together. HoursFebruary 11, 2026 | 10:00-17:00 (Last entry 16:30)February 12, 2026 | 10:00-17:00 (Last entry 16:30)February 13, 2026 | 10:00-16:00 (Last entry 15:30)VenueCOEX (Hall A, B, C, D, E, Grand Ballroom, Platz and ASEM Ballroom)Westin Seoul ParnasGrand InterContinental Seoul ParnasScale550 Exhibitors, 2409 booths (2025: 501 exhibitors, 2301 booths)Seoul South KoreaSEMI.org[email protected]America/Los_Angelespublic
[PDS] Professional Development Seminar—UC Santa Cruz
Registration
Attendance is free, but registration is required. Please complete the registration form if you wish to attend and to join our mailing list for future industry programs.
SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry
Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.
Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by UC Santa Cruz.
Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductors Industry.
Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can prepare for them through job searches, interviews, resumes, and more.
Meet with professionals and executives during our speed mentoring, mock interview, and networking sessions.
All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.
Enjoy free food, free swag, and giveaways.
Students can come and go.
EVENT is FREE but registration is required. Register by February 20!
University of California, Santa Cruz Stevenson Event Center 1156 High Street Santa Cruz, CA95064 United States
[PDS] Professional Development Seminar —Organized by SEMI Silicon Valley Chapter —Collaboration with University of California, Santa Cruz
This IN-PERSON seminar features an agenda that will help students meet the demands of today's high tech workforce and be successful in their careers.
Professional Development Seminar—UC Santa Cruz
9:45am–4:00pm Pacific Time
IN-PERSON
9:45 am - 4:00 pm
Off
Add to Calendar2026-02-27 09:45:002026-02-27 16:00:00[PDS] Professional Development Seminar—UC Santa Cruz[PDS] Professional Development Seminar—Organized by SEMI Silicon Valley Chapter—Collaboration with University of California, Santa CruzThis IN-PERSON seminar features an agenda that will help students meet the demands of today's high tech workforce and be successful in their careers. University of California, Santa Cruz Stevenson Event Center 1156 High Street Santa Cruz, CA 95064 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
2
Register
SEMI Professional Development Seminar [PDS]—Portland State University
Registration
Attendance is free, but registration is required. Please complete the registration form if you wish to attend and to join our mailing list for future industry programs.
SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry
Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.
Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by Portland State University. Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductor Industry.
ALL MAJORS WELCOME!
Learn about career opportunities and skill sets needed in high tech
Acquire valuable, practical information that will help you choose career directions and plan for success
Discover semiconductor jobs you didn't know existed and how you can connect with employers in the Industry
Learn how to optimize your resume and boost your interview skills and how to land a Job
Attendance is free, but registration is required. Register by October 15th, 2025
Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.
Enjoy free lunch and snacks, as well as free swag and giveaways at Employer Tables.
Students are welcome to come and go.
EVENT is FREE but registration is required. Please complete the registration form if you wish to attend and to join our mailing list for future industry programs.
Portland State University 1825 SW Broadway The Smith Memorial Union Ballroom Rooms 338/355 Portland, OR97201 United States
THURSDAY, OCTOBER 30, 2025 (PACIFIC TIME)
9:45 am
-
10:00 am
Student Check-In
10:00 am
-
10:15 am
Frank Goovaerts
Director of Student Career Success
Portland State University
Leonard Weitman
Principal
Weitman Consulting
Welcome & Introduction
10:15 am
-
10:45 am
Pamela Fischer-St. George
Strategic Planning Engineer
Semiconductors 101: Industry Overview and Career Pathways
10:45 am
-
11:30 am
Susie Martin
HR Director
Siltronic
Prepare to Go Pro: Resume & Interviewing Skills
Learn tips and tricks on how to land a job in Semiconductors and Q&A.
11:30 am
-
11:50 am
Students Pick up Boxed Lunches
Students will think of questions to ask panelists and get lunch.
11:50 am
-
12:30 pm
Damian Scandiffio
Moderator
Acara Solutions
Jillian Marks
EMD Electronics
Grant Stein
Siltronic
Ask Me Anything: A Day in the Life of a Semiconductor Engineer (PANEL)
SEMI Professional Development Seminar [PDS] —A professional development seminar organized by SEMI Pacific Northwest Chapter.
This IN-PERSON seminar features an agenda that will help students meet the demands of today's high-tech workforce and be successful in their careers.
SEMI Professional Development Seminar—Portland State University
Thursday, October 30, 2025
10:00am–3:00pm Pacific Time
IN-PERSON
10:00 am - 3:00 pm
Off
Add to Calendar2025-10-30 10:00:002025-10-30 15:00:00SEMI Professional Development Seminar [PDS]—Portland State UniversitySEMI Professional Development Seminar [PDS]—A professional development seminar organized by SEMI Pacific Northwest Chapter.This IN-PERSON seminar features an agenda that will help students meet the demands of today's high-tech workforce and be successful in their careers. Portland State University 1825 SW Broadway The Smith Memorial Union Ballroom Rooms 338/355 Portland, OR 97201 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
2
REGISTER NOW
[PDS] Professional Development Seminar—Oregon State University
Registration
Attendance is free, but registration is required. Please complete the registration form if you wish to attend and to join our mailing list for future industry programs.
SEMI Professional Development Seminar (PDS) in conjunction with Oregon State University—Getting Hired in the Semiconductor Industry
Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by Oregon State University and organized by SEMI Pacific Northwest. Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductor Industry.
All majors are welcome to attend in-person (preferred) or virtually
Learn about 10,000+ semiconductor jobs you didn't know existed
Meet with professionals and executives during the networking lunch and networking sessions
Learn how you can connect with 2,100+ employers in the microelectronics industry
Engage with a mentor to plan for career success—career development guidance, resume building, interview skills
Learn more on diversity, equity, and inclusion and environmental sustainability
Free coffee/tea, snacks, and lunch for in-person participants
Students are welcome to come and go
Swag & Giveaways, Amazon Gift Cards!
Oregon State University, Memorial Union Ballroom 2501 SW Jefferson Way Corvallis, OR97331 United States
Early-bird Registration Close: 3 pm, Friday, May 12(KST)
Registration Fee
Early Bird (~ May 12)
SEMI Member: KRW 280,000
Non Member: KRW 330,000
On site
SEMI Member/ Student : KRW 330,000
Non Member: KRW 380,000
※ Group registration fee applies if more than 5 people are registered from one company. Please contact us by email ([email protected] ) for group registration.
Convention Hall 2, Suwon Convention Center Suwon-si Gyeonggi-do South Korea
9:00 am
-
9:05 am
Welcome
Keynote
9:05 am
-
9:35 am
Namsung Kim
Senior Director
Applied Materials
GAA(Gate-All-Around) technology to enable continuous CMOS transistor scaling for energy efficient computing solution
Namsung Kim is a Senior Director in the Integrated Module Solutions (IMS) Group at Applied Materials. He is currently responsible for managing customer engagement programs, driving business growth, and leading cross-functional teams (various Business Units) to deliver the integrated materials/modules-base product solutions across leading-edge CMOS Logic and Memory technologies. Prior to this role, he has successfully led & accomplished the definition of CMOS Logic technology roadmap, its inflections of future technology nodes and delivered multiple product development paths by validating innovative pathway solutions.
He joined Applied Materials, Inc., USA in 2015, bringing over 20 years of semiconductor device/process integration experiences (various engineering/management positions) from both CMOS Logic (GlobalFoundries/IBM alliance in USA and SSMC in Singapore) and Memory (SK-Hynix, previously LG Semi., in Korea) industries. He earned a MS in electrical and computer engineering from the National University of Singapore. He has authored and co-authored more than 50 technical publications and holds over 40 patents in the field of advanced logic (FinFETs and GAA devices) and memory technologies.
Market & Technology Trends for Memory Devices including Materials
Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights. He has over 30 years of experience in the semiconductor industry, R&D, and reverse engineering on DRAM, NAND/NOR FLASH, SRAM/Logic, and Emerging Memory. He worked for SK Hynix and Samsung Electronics for over 20 years. He joined TechInsights and has been focusing on technology analysis of semiconductor processes, materials, devices, and architecture. He has written many articles on memory technology including roadmaps, technology trends, and detailed comparisons.
Session 1: Advanced Materials for Enabling Next-Generation Devices
10:50 am
-
11:15 am
Jean-Marc Girard
CTO and Sr. VP
Air Liquide
Precursors for Memory
Jean-Marc Girard Ph.D. is CTO and Sr. VP of Manufacturing Technologies at Air Liquide Advanced Materials (ALAM), and an Air Liquid Group Fellow. He has 25 years of experience of R&D and product development management in the field of semiconductor materials and process technology in Europe, Japan and the US, and is one of the founders and was the global director of ALOHA™ from 2005 to 2010 (Air Liquide’s original CVD/ALD materials product line).
Within ALAM, Jean-Marc globally manages the Research and Development for deposition & advanced dry etching materials, oversees strategic engagements and collaborations with leading customers and equipment companies, and supervises the Intellectual Property generation and portfolio management. Since 2021, Jean-Marc’s role has expanded to leading packaging and manufacturing technology developments efforts.
11:15 am
-
11:40 am
Andy Kim
Sr. Director
Lam Research
Materials Trends in Semiconductor Manufacturing
“Byunghee Kim” has been Sr. Technologist in Lam Research since 2017.
Prior to joining Lam Research, “Kim” was director position for Samsung Electronics. During his 23 years at Samsung Electronics, “Kim” spent time doing module development, including gate, contact and BEOL.
“Kim” received a bachelor’s degree in chemistry from Yonsei Univ., Seoul, Korea and a master’s degree in MSE from Seoul Nat’l Univ., Seoul, Korea.
Jeongsik Kim, received a MS degree in Organic Synthetic Chemistry from Sogang University(Korean) in 2006 and then joined Dongjin Semichem. He had developed the patterning process materials such as bottom antireflective coating(BARC), spin on hardmask(SOH), photoresist materials in Semiconductor Materials Business Division since 2006. In 2013, he had joined the advanced lithography program of IMEC(Belgium) as Dongjin Semichem assignee and researched the ArF immersion patterning and defectivity for two years. Currently, he is in charge of developing EUV photoresist at Dongjin Semichem.
Sung Ho Kim is the Head of Specialty Gases Marketing, Clean & Etch platform, Merck KGaA, Darmstadt, Germany where he drives the execution of product marketing strategy to meet with industry’s dry etch and chamber clean gas technical and commercial needs, and leads product life cycle management and NPI (New product introduction) initiatives to help customers to advance its dry etch and chamber clean process performance. He is a proven business leader with more than 20 years of experience in the semiconductor materials industry, with a wide range of leadership experience in product marketing, product management, and technical/engineering expertise. He is based in Pangyo, Korea. Sung-Ho received a bachelor's degree in Chemical Engineering from Seoul National University.
Head of BASF Electronic Materials R&D Center in Suwon
BASF
Aiming CO2 neutrality – Sustainable Solutions for IC Applications
Won-Seob Cho, Ph.D. presently serves as the Head of the BASF Electronics Materials R&D Center in Suwon, Korea. In this esteemed position, he is responsible for leading research teams dedicated to the development of advanced wet chemical solutions, such as advanced cleaning and electroplating methods. He boasts over 20 years of research and development experience, particularly in the formulation and electrochemical screening of solutions.
Prior to joining BASF a decade ago, He served as a Principal Researcher at Samsung SDI and Samsung Fine Chemicals, where he specialized in developing planarization and electroplating solutions. Notably, his research interests have recently expanded to encompass the Advanced Package field.
Won-Seob Cho holds a distinguished Ph.D. in Chemistry from the University of Texas at Austin and has also served as a postdoctoral fellow in Supramolecular Chemistry at the University of California at Los Angeles, further solidifying his scientific expertise.
Carbon Neutral Strategy of Korean Government and Role of Material Companies
Dr. Nam, Sang Uk is conducting various studies on the ICT (semiconductor, display) industry based on economics at the KIET (Korea Institute of Industrial Research), a national research institute.
Since joining the KIET in 2018, he has participated in various studies on ICT industry policies such as Japanese export regulations, development strategy of material, parts and equipment, global value chain, and digital transformation.
In the field of carbon neutrality, he participated in major reports such as the semiconductor and display industry's carbon neutral promotion strategy and policy tasks, and the impact of RE100 on Korea's major export industries.
Materials still matter. Trends in materials demand and supply.
Mark Thirsk is Managing Partner of Linx Consulting, a leading management and strategic consulting company for electronic materials.
Mark Thirsk has experience spanning many materials and processes in wafer fabrication, combined with economic and business forecasting, strategic planning, technical marketing and M&A experience. Mark has worked in materials and equipment development, marketing, applications support, and production, as well as having expertise in business incubation, strategic development, and M&A. Mark is well placed to bring clarity and insight to market analysis from both a technical and commercial perspective. Additionally, Mark has been active in SEMI since 1999, volunteering in industry advocacy, education, and recruiting.
Mark has worked in the UK, Germany, Belgium, and the USA. Mark holds an Honours B.Sc. in Metallurgy and Materials Science from Birmingham University and an MBA
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow. She is a member of MEPTEC, SMTA, and SEMI. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Re-visioning Material Technology for Sustainable Resource Utilization and Supply Chain
Sam-Jong Choi, Ph.D. has been working as a material expert at Samsung Electronics Semiconductor for over 30 years. He joined the company in 1991 and has been responsible as a material engineer and expert for Memory Manufacturing Technology Center in Samsung Electronics by now. He obtained a Ph.D in Electronic, Computer, and Telecommunication Engineering from Hanyang University in 2020.
In 2019, he was promoted to Group Leader for Memory Material Technology Group, where he oversaw the development of new materials and quality management for Samsung Electronics. In 2020, Samjong Choi was appointed as an Corporate VP at Samsung Electronics, where he continues to play a key role in the field of semiconductor material.
As an experienced engineer and leader, he brings a wealth of knowledge and expertise to his current role, making Samsung Electronics stay at the forefront of technological innovation in the global semiconductor material industry.
In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts!
SMC (Strategic Materials Conference) Korea 2023
May 17(Wed), 2023 | Convention Hall 2, Suwon Convention Center
Off
Add to Calendar2023-05-17 00:00:002023-05-17 00:00:00SMC Korea 2023Semiconductor Materials for Sustainable Future
In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2023 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) in terms of materials. Please join us in the insights of global experts!Convention Hall 2, Suwon Convention Center Suwon-si Gyeonggi-do South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
[PDS] Professional Development Seminar—Texas State University
Registration
Attendance is free, but registration is required. Please complete the registration form if you wish to attend and to join our mailing list for future industry programs.
SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry
Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for career success.
Industry volunteers will share what the high-tech industry looks for when they recruit for new graduates.
Prepare for the upcoming (February 19th) Engineering and Technology Job & Internship Fair
Learn about 10,000+ semiconductor jobs you didn’t know existed
Meet with and gain insights from industry professionals during the networking session
Learn how you can connect with 2,100+ employers in the microelectronics industry
Plan for career success—career development guidance, branding, interview skills, and internships
Lunch refreshments for in-person participants
Tours of Science and Engineering Lab; first floor RFM and Keysight Smart Lab, 4th floor
Texas State University, San Marcos Ingram School of Engineering Ingram Hall, Room 4104 San Marcos, TX78666 United States
FRIDAY, FEBRUARY 6, 2026 (Central Time)
12:00 pm
Andrea Valencia
MARCOM, Semiconductor Materials, EMD Electronics
Chair, SEMI Texas Chapter
Opening Remarks/Introduction—Refreshments/Lunch Available
12:05 pm
KT Moore
Vice President
Cadence
Industry Overview/Semiconductors 101
12:30 pm
Hanna Paddubrouskaya
Principal Research Scientist
Tokyo Electron America
A Day in the Life
12:45 pm
Internships
Michelle Londa, PhD
Professor of Practice Cooperative Education Coordinator SWE Advisor The Ingram School of Engineering
Texas State University, San Marcos
Interview Like a Pro
Virginia Jones
Director, Austin Operations
Brooksource
Preparing for Your Professional Career
1:15 pm
Moderator
Adrian Franco
Olsson
Ariful Haque, PhD
Assistant Professor, Ingram School of Engineering
Texas State University, San Marcos
Virginia Jones
Director, Austin Operations
Brooksource
Celeste Mullis
Quality Engineer
SACHEM
Panel—Ask Me Anything!
1:55 pm
Jean Richaud
Managing Partner and Co-Managing Director
Conation Technologies
James Gaitan
Outside Sales Representative
Valin Corporation
Sponsor Announcements
2:00 pm
Networking with Industry & Tours Available
Speed Networking
Tour of Science and Engineering Lab
Tour of Keysight Smart
Registration Fee: $985 Members | $1,185 Non-members
Students*: $100 *Current students (18 and above) are invited to register for a student pass. Please plan to have your student ID available when picking up your badge onsite.
(Airfare and hotel accommodations are not included)
All Keynotes, tutorial, panel discussion, technical and poster sessions
All conference materials (conference proceedings, attendee list, and approved PDF presentations)
Breakfast, Lunch, and networking breaks
All Networking Events (Welcome Reception, Poster Session Reception, and Networking Happy Hour)
Complimentary entry to the Women In Semiconductors (WiS) Program ($50 value)
Complimentary registration to the SEMI Standards Meetings (Registration Required)
Discount on SEMI U Workshop registration
Discount room rate at Hilton Albany
Cancellations refund request must be submitted in writing to Taylor Zhao ([email protected]) on or before April 10, 2026 and will be subject to a $150 processing fee. After April 10, only substitution requests will be accepted.
Substitution requests are welcome and will be accepted in writing from the original registrant by May 10, 2026. Email request to Taylor Zhao ([email protected]).
If you have any questions regarding the conference or registration, please contact Taylor Zhao ([email protected]).
Align your company with the ASMC, one of the most highly respected semiconductor manufacturing conferences in the industry. The attendees are an excellent audience to expand your brand image to new and existing markets.
CONTACT
Shane Poblete Director, Sales & Business Development - Expo and Events, SEMI Tel: +1 202-847-5983 Email: [email protected]
Media Sponsors
SEMI is proud to partner with the following media to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.
ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results and select ASMC manuscripts are published in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing.
The ASMC Committee is composed of industry professionals representing the microelectronics supply chain. All papers presented at the conference are peer-reviewed by the ASMC Technical Committee.
ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies.
We are excited to partner with SEMI University on Monday, May 11 and Thursday, May 14, 2026. Whether you're a seasoned professional looking to improve your skills or a newcomer eager to break into the industry, SEMI U specializes in semiconductor training, certifications, and the technical education to support your personal and professional growth.
SEMI University (SEMI U) is the premier learning platform designed for individuals passionate about advancing their careers in the global semiconductor and electronics industry. With over 800 courses available in multiple languages and flexible formats, SEMI U empowers you with knowledge to enhance your expertise, staying ahead in our rapidly evolving field.
We look forward to reuniting with Women in Semiconductors (WiS), to be held on Thursday, May 14, 2026 at the Albany Hilton, Albany, New York.
WHO SHOULD ATTEND?
Company leaders, managers, team members, HR professionals, academia and students. Regardless of gender, we encourage attendance by everyone who is interested in fostering a more diverse, equitable and inclusive semiconductor industry, and by anyone who is responsible for developing internal or external programs to support women.
The Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community - General Meeting is on Thursday, May 14, 11:30am-1:00pm.
WHO SHOULD ATTEND?
All SEMI SCIS members are welcome to attend.
To RSVP, or if you are a SEMI member interested in learning more about how to get involved with SCIS, please contact Christie Baker at [email protected] for more information.
The Semiconductor Manufacturing Cybersecurity Consortium (SMCC) Technology Community - Hybrid General Meeting is on Wednesday, May 13, 4-5 PM. Contact [email protected] for questions and RSVP at http://tiny.cc/smcc26
Join FuzeHub in partnership with SEMI and NY Creates on May 14–15, 2026 in Albany, NY for the Glass4Chips Summit 2026.
Hosted at NY Creates (May 14) and the Hilton Albany (May 15), this two-day summit will convene leaders from industry, government, academia, and national security to:
✔ Address adoption barriers ✔ Strengthen the domestic glass supply chain ✔ Define actionable next steps to secure U.S. leadership
WHO SHOULD ATTEND?
Semiconductor manufacturers and suppliers, startups and design houses, defense stakeholders, researchers, policymakers, and ecosystem strategists.
SMC3 - Register 3: 15% off (must register all 3 on same order)
SMC5 - Register 5: 20% off (must register all 5 on same order)
SMC10 - Register 10: 25% off (must register all 10 on same order)
NOTE: For Group Discounts, Attendees must be registered within the same order.
For more information, please contact Karen Popp, Senior Program Manager, at [email protected].
Registration is final. Cancellations will not be accepted. No refunds provided. Substitutions are only accepted with written permission from the original registrant.
Your health and safety are our top priority. The personal preference of the attendees to wear masks is respected at all SEMI events. SEMI Americas (“SEMI") monitors developing federal, state, and local health and safety recommendations as well as requirements regarding COVID to determine the most appropriate safety protocols for our in-person events.
Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives. Become a sponsor and brand your company to an influential audience at SMC.
CONTACT
Shane Poblete Director, Sales & Business Development - Expo and Events, SEMI Tel: +1 202-847-5983 Email: [email protected]
Materials Innovation in the AI Era: Powering Semiconductors to One Trillion Dollars and Beyond
Beyond the AI boom lies a challenge—and opportunity—that is far more foundational: ensuring the materials ecosystem underpinning a $2.5 trillion industry is resilient enough to support the next era of innovation. As artificial intelligence accelerates demand for advanced hardware, energy infrastructure, and high‑performance components, the pressure on global materials supply chains has never been greater.
This year, SMC explores how industries can achieve scale readiness through smarter design, diversified sourcing, sustainable processes, and breakthrough materials science. It invites leaders to look past the excitement of AI itself and toward the essential building blocks that will determine whether this technological revolution is secure and sustainable.
The Strategic Materials Conference—SMC offers valuable content and unprecedented networking opportunities for semiconductor industry professionals who share common strategic objectives on materials innovation, management, and business success.
Sessions
Market, Geopolitics & Outlook
Materials for Scalable AI Systems
Advanced Packaging & Materials Integration
From Labs to Fabs—Accelerating Materials Deployment at Industrial Scale
Quantum & Emerging Devices
Executive Panel–Strengthening the Supply Chain
REGISTRATION INCLUDES
Approved speaker PDF presentations
Breakfast, lunch, coffee breaks
Two networking receptions
Tabletop exhibits
WHO SHOULD ATTEND
SMC offers valuable content and unprecedented networking opportunities for semiconductor industry professionals who share common strategic objectives on materials innovation, management, and business success.
CEO ● CTO ● Presidents & General Managers ● Executive VP & Senior Executives ● Engineering & Fab Managers ● Academia ● Startup Founders ● Financial Analysts ● Market Researchers ● Consulting Firms ● Consortiums
Off
Add to Calendar2026-07-13 00:00:002026-07-15 00:00:00SMC 2026—Strategic Materials Conference Hayes Mansion 200 Edenvale Avenue San Jose, CA, CA 95136 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
1
※ Group registration fee applies to groups of five or more from the same company. ※ For group registration inquiries, please contact SEMI Korea Program Team at [email protected].
Convention Hall 1, 3F, Suwon Convention Center South Korea South Korea
8:30 am
-
9:00 am
Welcome Reception
9:00 am
-
9:30 am
Gun-chang Roh
Hyundai Motor Securities
Overview
9:30 am
-
10:00 am
Chee ping Lee
Lam Research
3DIC
10:00 am
-
10:30 am
Yin Chang
ASE
Advanced Packaging: Infusing AI at Scale
10:30 am
-
11:00 am
Shinji Baba
Amkor Japan
Advanced Power Module Packaging Technologies
The rapid electrification of automotive and industrial systems is placing increasingly stringent demands on power semiconductor devices in terms of voltage capability, thermal performance, reliability, and system integration. This presentation reviews recent trends in power devices and power module packaging technologies aimed at improving performance while addressing cost and manufacturability constraints.
First, the fundamental differences between digital and power devices are outlined, followed by an overview of power device applications based on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, together with Amkor’s product portfolio.
Next, power module packaging technologies are discussed with a focus on key electrical and thermal challenges. Representative solutions, including advanced interconnects, cooling architectures, and embedded power modules, are introduced, along with a brief overview of Amkor’s technology roadmap.
Finally, the role of the Amkor Technology Japan R&D Center in supporting open innovation and global collaboration is briefly discussed.
11:00 am
-
11:20 am
Networking Break
11:20 am
-
12:30 pm
Panel Discussion
12:30 pm
-
1:30 pm
Lunch
1:30 pm
-
2:00 pm
Minwoo Lee
Samsung Electronics
PLP
2:00 pm
-
2:30 pm
Yasushi Araki
Shinko
Glass Substrates
2:30 pm
-
3:00 pm
Sandeep Sane
Lightmatter
Photonics
3:00 pm
-
3:30 pm
Amit Oren
NVIDIA
CPO Packaging: Challenges and Opportunities
Co-packaged optics (CPO) is emerging as a key enabler for scaling bandwidth while containing power and cost in next-generation AI and cloud infrastructure. By moving optical engines closer to the switch ASIC and shortening high-speed electrical reaches, CPO can reduce SerDes power, ease signal-integrity constraints, and increase overall front-panel bandwidth density. However, delivering these benefits at volume requires new approaches across package architecture, manufacturing, and system integration.
This presentation reviews the main packaging challenges that must be solved to industrialize CPO, including thermal management and heat spreading near high-power silicon, fiber attach and optical alignment tolerances, photonics/laser integration choices, high-density optical and electrical I/O, substrate and interposer selection, and reliability risks such as warpage, CTE mismatch, and contamination control. Test and rework strategy, yield learning, and supply-chain readiness (materials, assembly, and metrology) are highlighted as practical barriers to adoption.
The talk also outlines opportunities created by CPO packaging innovations—such as modular optical tiles, standardized fiber interfaces, advanced lid/heat-sink concepts, and co-design of electrical, mechanical, and optical domains—to unlock higher radix switches and lower system power. Attendees will leave with a structured view of technology tradeoffs, a roadmap of near-term versus long-term packaging options, and actionable considerations for bringing CPO from prototypes to deployable products.
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era.
ADVANCED PACKAGING SUMMIT 2026
July 15(Wed), 2026 | Convention Hall 1, 3F, Suwon Convention Center
8:30 am - 5:00 pm
Off
Add to Calendar2026-07-15 08:30:002026-07-15 17:00:00ADVANCED PACKAGING SUMMIT 2026Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI semiconductors, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications, technical challenges, and possibilities for cross-industry collaboration, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era.Convention Hall 1, 3F, Suwon Convention Center South Korea South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
This workshop is designed to help participants understand:
The real-world deployment, impact, and lessons learned from AI techniques
Strategies for building observable and scalable multi-agent workflows
The industry transition from restrictive data silos toward autonomous discovery.
Methods for achieving tangible business results and automation through diverse AI applications
We’ve curated a technical agenda featuring Topics such as:
Agentic AI
Gaussian Process Regression
Time Series Modeling
Bayesian Optimization
And more...
You will walk away with actionable insights on:
Yield Enhancement through Edge-Driven Defect Detection and Classification
Demonstrates how edge AI leverages real-time sensor and image data—through virtual metrology, anomaly detection, and SPC-integrated feedback loops—to enable early defect detection, classification, and yield optimization.
From Prediction to Action: Causal AI for Real-Time Root-Cause Analysis in Semiconductor Manufacturing
How causal AI unifies multi-modal fab data into an intelligence layer to move beyond predictive alerts toward rapid root cause identification, prescriptive actions, and continuous improvement—significantly reducing RCA time and improving yield and operational efficiency.
From Data Silos to Autonomous Discovery: Agentic AI in Semiconductors
Agentic AI in semiconductor workflows as autonomous, decision-making systems (beyond RAG) that orchestrate multi-agent reasoning across complex fab data—requiring robust data foundations, domain-grounded algorithms, SME-driven knowledge (including reasoning traces), and structured evaluation frameworks (agentic harness) to ensure reliable, scalable deployment.
Making Sense of Equipment Time‑Series Data: From Signals to Insight
Introduces how semiconductor equipment time-series data (sensor signals, traces, run-to-run data) can be processed and modeled to uncover equipment behavior over time, enabling engineers to detect drift, changes, and anomalies for improved monitoring and troubleshooting.
Achieving Business Results from Air-gapped Agentic AI Automation in Semiconductor Manufacturing - Lessons from the Field
Highlights real-world deployment of agentic AI in fabs, demonstrating how autonomous systems are driving yield, capacity, and operational gains across engineering workflows (FDC, yield, test, maintenance) while navigating constraints like data privacy and legacy integration—along with practical adoption strategies and hands-on use cases.
And more...
SEMI HQ 673 S Milpitas Blvd. Milpitas, CA95035 United States
Morning, Day 1: December 4, 2024
8:00 am
-
9:00 am
Registration & Breakfast
9:00 am
-
12:30 pm
Session #1 - Data Needs for Digital Twins - Data Sources, Integration & Interoperability
This session will explore the critical data requirements for creating and maintaining digital twins. Integrating multi-modal data sources (sensors, enterprise systems, equipment, etc.) that feed into digital twins, ensuring that they accurately reflect their physical counterparts is a minimum necessity. This session will also cover data integration techniques (from various factory systems), and interoperability to support dynamic digital twins.
9:00 am
-
9:10 am
Mark da Silva
Senior Director, Smart Manufacturing
SEMI
Welcome Remarks
9:10 am
-
9:35 am
Michael Neel
Director of Marketing
Inficon
Keynote - Enabling Autonomous Operations Through Integrated Digital Twins
9:35 am
-
10:00 am
Robert Baseman
Senior Technical Staff Member
IBM
Semantic Models for Microelectronic Manufacturing & Development
10:00 am
-
10:25 am
David McKee
Technology Leader & Managing Partner
Counterpoint Tech/DTC
Journey to Twins: A toolkit for Capabilities & Data to Digital Twins
10:25 am
-
10:40 am
Coffee Break - Sponsored by INFICON
10:40 am
-
11:05 am
Rad Desiraju
Director, WW Industry Advisory
Microsoft
Overcoming Data Interoperability Challenges for Effective Digital Twins
11:05 am
-
11:30 am
Wei Zhao
Head of Process Integration
Athinia
Chris Han-Adebekun
VP, Business Development
Athinia
Building Process & Supply Chain Digital Twins through Integrated Data Assets and Secure Data Sharing
11:30 am
-
12:30 pm
Dave Henshall
Vice President of Business Development and Government Relations
Semiconductor Research Corporation
Chris Ritter
CTO
Idaho National Lab
Special Session - SmartUSA – Semiconductor Digital Twin Manufacturing USA Institute
12:30 pm
-
2:00 pm
Lunch
Afternoon, Day 1: December 4, 2024
2:00 pm
-
5:00 pm
Session #2 - Data Standards for Digital Twins: Managing Unclean Factory Data
This session will focus on the importance of data standards for digital twins in semiconductor manufacturing, particularly in the context of dealing with unclean factory data. It will explore the challenges associated with unclean data and discuss strategies for cleaning and standardizing to ensure seamless ingestion into digital twins at various levels. Best practices for data validation, transformation, and integration as well as how to implement robust data standards to enhance reliability and accuracy of digital twins.
Sponsored by - Seeq
2:00 pm
-
2:25 pm
Dr. Joseph Ervin
Product Line Head of Semiverse Solutions Group
Lam Research
Keynote - Addressing Future Challenges in the Stochastics Era of Patterning with EUV Dry Resist
New patterning technologies will be needed to advance the device roadmap to 2 nm and beyond. Minimum pitch scaling will be exceptionally difficult to achieve at these advanced nodes, even with EUV patterning. Stochastic effects using wet resists during EUV patterning become problematic at the nanoscale, and can lead to line collapse, bridging, unacceptable line edge roughness (LER) and line width roughness (LWR). These stochastic effects present challenges when optimizing the tradeoffs between EUV resist resolution, dose, sensitivity, line edge / line width roughness, defectivity and cost.
In this talk, we will review the basics of dry resist technology, including dry resist equipment requirements, process flows and process integration modeling. In addition, we will present data that documents the advantages of dry resist technology over wet resist technology, demonstrating superior image quality, scaling and yield. We will conclude the talk by demonstrating a digital twin of the process integration and usage of optimization to achieve improved LER/LWR characteristics.
2:25 pm
-
2:50 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions
Charting the Digital Twin Standardization Path: An Iterative Implementation and Abstraction Process
2:50 pm
-
3:15 pm
Brett Brimhall
Deloitte
3:15 pm
-
3:30 pm
Coffee Break - Sponsored by INFICON
3:30 pm
-
3:55 pm
Andres Torres
Engineer and Key Expert
Siemens
Feature Engineering as the bridge to Semantic Factory Data
3:55 pm
-
4:20 pm
Michael Bowcutt
Director of Sales Engineering for Romaric products at camLine
camLine USA
Control Software Integration with Digital Twins: How Virtual Data Aligns with Physical Reality
4:20 pm
-
5:20 pm
Moderator
Kenneth Smith
VP Growth Markets
Seeq
Sean Tropsa
Principal Analytics Engineer
Seeq
Panel: Harmonizing Standards for Semiconductor Digital Twins
5:30 pm
-
7:00 pm
Networking Reception - Sponsored by Sentient Cloud
Morning, Day 2: December 5, 2024
8:00 am
-
9:00 am
Registration & Breakfast
9:00 am
-
12:30 pm
Session #3 - Modeling High Complexity Semiconductor Processes
This session will explore the integration of digital twin technology in modeling high complexity semiconductor processes. As the semiconductor industry advances, the need for precise and efficient modeling techniques becomes crucial. Digital Twins offer a transformative approach to simulate and optimizes these processes, though challenges exist. Cases studies and future innovations will also be covered in this session.
9:00 am
-
9:05 am
Mark da Silva
Senior Director, Smart Manufacturing
SEMI
Welcome Remarks
9:05 am
-
9:30 am
Umesh Kelkar
Master/Vice President, Semiconductor Products Group
Applied Materials
Keynote: Key Enablers for Semiconductor Equipment and Process Digital Twins: Accelerated Computing (AC), Artificial Intelligence (AI) and Physics Modeling
9:30 am
-
9:55 am
Prith Bannerjee
Chief Technology Officer
Ansys
AI Driven Digital Twins for Semiconductor Manufacturing
9:55 am
-
10:20 am
Xi-Wei Lin
Executive Director, Applications Engineering
Synopsys
AI and Physics-based Models for Technological Development with High Complexity Semiconductor Processes
10:20 am
-
10:45 am
Coffee Break - Sponsored by PhysicsX
10:45 am
-
11:10 am
Amit Lal
Professor, Cornell University
Cornell
Peter Doerschuk
Professor
Cornell University
Ben Davaji
Assistant Professor
Northeastern University
Digital Twin Flow Using AI/ML Applied to Ferroelectric Memory
11:10 am
-
11:35 am
John Maculley
Semiconductor Industry Strategy Consultant
Dassault Systemes
Leveraging Virtual Twins and AI for Enhanced Fabrication Technology Co-Optimization in Semiconductor Manufacturing
11:35 am
-
12:30 pm
Pushkar Apte
Strategic Technology Advisor and Global Data-AI Lead
SEMI
Panel Discussion
12:30 pm
-
2:00 pm
Lunch - Sponsored by Dassault Systemes
Afternoon, Day 2: December 5, 2024
2:00 pm
-
5:00 pm
Session #4 - GenAI & AI/ML Role in the Development of Digital Twins - Implementation Strategies for DT
Integrating AI/GenAI & Digital Twins - Explore the cutting-edge integration of Generative AI (GenAI) and Artificial Intelligence/Machine Learning (AI/ML) in the creation and evolution of digital twins. This session will delve into how GenAI & AI/ML technologies are revolutionizing the simulation, prediction, and real-time replication of physical assets in semiconductors through case studies and practical applications.
2:00 pm
-
2:25 pm
Kamaljeet Ghotra
Senior Director, Go-To Market and Digital Strategy
PDF Solutions
Keynote - Accelerating Digital Twins with Gen AI
The rise of sophisticated AI tools, including generative AI, is revolutionizing the semiconductor industry by enabling the analysis of vast datasets to generate valuable insights. Executives in the sector see generative AI as a transformative force rather than just another tool. They believe it can deliver significant value, particularly in manufacturing, operations, and maintenance, its potential for process and equipment analysis, Predictive maintenance and smart diagnostics.
As fabs adopt smart manufacturing and virtual modeling it is pertinent for digital twins to leverage technologies like generative AI for data generation, Data Synthesis/Augmentation, Real Time Analysis, Model Optimization (AI enhanced physics models) , Rapid Prototyping and Accelerated Design and Development with data-driven model-based learning.
2:25 pm
-
2:50 pm
Peter Lendermann
CTO
D-SIMLAB
About Cross-Fertilization between Digital Twins and AI Techniques for Capacity Planning and WIP Flow Optimisation in Semiconductor Fabs
2:50 pm
-
3:15 pm
Kiran Karunakaran
Chief Technology Officer
Via Automation
Developing Explainable Digital Twins for the Semiconductor Industry Using GenAI, Knowledge Graphs, and ML Techniques
3:15 pm
-
3:30 pm
Coffee Break - Sponsored by PhysicsX
3:30 pm
-
3:55 pm
Mark Huntington
Managing Director of North America
PhysicsX
Real-Time Digital Twins for Semiconductor Manufacturing: Accelerating Multi-Physics Optimization with Physics-Based AI
3:55 pm
-
4:20 pm
Becky Kelderman
Solutions Sales Manager
Rockwell Automation
Advancing Industrial Data Architectures & Models for AI in Process Digital Twins
4:20 pm
-
5:20 pm
Moderator
Mithun Kamat
Partner
McKinsey
Panel - Rewiring organizations for AI / Digital twin: a business-backed view of successful implementation and challenges in adoption of Digital twins in the semiconductor industry
The SEMI Smart Manufacturing Initiative is hosting a two-day workshop titled "AI Techniques in Semiconductor Manufacturing" at SEMI HQ in Milpitas, CA, on August 5–6, 2026. This event is part of a continuing series focused on integrating advanced AI into the semiconductor landscape. The workshop is designed to help participants understand: The real-world deployment, impact, and lessons learned from AI techniques. Strategies for building observable and scalable multi-agent workflows. The industry transition from restrictive data silos toward autonomous discovery. Methods for achieving tangible business results and automation through diverse AI applications.
AI Techniques in Semiconductor Manufacturing
[IN-PERSON EVENT]
Aug 5-6, 2026
8:00 am - 5:00 pm
Off
Add to Calendar2026-08-05 08:00:002026-08-06 17:00:00AI Techniques in Semiconductor Manufacturing The SEMI Smart Manufacturing Initiative is hosting a two-day workshop titled "AI Techniques in Semiconductor Manufacturing" at SEMI HQ in Milpitas, CA, on August 5–6, 2026. This event is part of a continuing series focused on integrating advanced AI into the semiconductor landscape. The workshop is designed to help participants understand: The real-world deployment, impact, and lessons learned from AI techniques. Strategies for building observable and scalable multi-agent workflows. The industry transition from restrictive data silos toward autonomous discovery. Methods for achieving tangible business results and automation through diverse AI applications.SEMI HQ 673 S Milpitas Blvd. Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now
