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United States Understanding Semiconductor Technology and Business Training
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Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Norris Conference Center
2525 W Anderson Ln. #365
Austin, TX 78757
United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $895
  • Non-Members: $995

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2025-04-28 08:30:00 2025-04-28 17:00:00 Understanding Semiconductor Technology and Business (Austin, TX) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $895Non-Members: $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Norris Conference Center 2525 W Anderson Ln. #365 Austin, TX 78757 United States SEMI.org [email protected] America/Chicago public America/Chicago Sold Out
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United States Overview of Semiconductor Manufacturing Training
Highlighted content

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

673 South Milpitas Blvd.
Milpitas, CA 95035
United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $1,195
  • Non-Members: $1,295

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2025-04-22 08:30:00 2025-04-23 17:00:00 Overview of Semiconductor Manufacturing (Milpitas, CA) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $1,195Non-Members: $1,295* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Sold Out
Event format
Promote in calendar
Off
United States Understanding Semiconductor Technology and Business Training
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

673 South Milpitas Blvd.
Milpitas, CA 95035
United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $895
  • Non-Members: $995

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2025-04-21 08:30:00 2025-04-21 17:00:00 Understanding Semiconductor Technology and Business (Milpitas, CA) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $895Non-Members: $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Sold Out
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United States SEMI Silicon Valley Forum Business Executive
ABB Logo 170x65

Become a Sponsor

Sponsoring the SEMI Silicon Valley Breakfast Forum offers unique opportunities to elevate your brand, connect with industry leaders, and influence the future of semiconductor innovation.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities. 

Data Centers, Eat Your Vegetables: Building Sustainable Foundations for the AI Era

The industry has been feasting on AI growth, performance, and scale, but now must focus on the less glamorous necessities—efficiency, sustainability, materials, power, water, circularity, and supply chain resilience. 

The AI boom has created unprecedented demand for compute, power, cooling, advanced materials, and infrastructure. While industry attention has focused on performance and scale, the next phase of growth will require discipline around resource efficiency, environmental impact, and long-term resilience. What are the "vegetables" the industry needs to consume today to ensure healthy growth tomorrow?
 

SEMI HQ
673 S. Milpitas Blvd.
Milpitas, CA 95035
United States

Friday, August 28, 2026 | Pacific Time

7:00 am - 8:00 am

Registration and Breakfast

8:00 am - 8:10 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:10 am - 8:20 am
Charlie Polidoro, IEEE
Charlie Polidoro
Silicon Valley Co-Chair
Inventec

Introduction

8:20 am - 9:20 am

Keynote Presentation

9:20 am - 9:50 am

The AI Diet—Why Broccoli Matters More than Ever

9:50 am - 10:20 am

The Energy Plate—Powering Growth Without Breaking the Grid

10:20 am - 10:50 am

Hidden Ingredients—Which Resources will Become the Industry’s Biggest Bottleneck Over the Next Decade?

10:50 am - 11:20 am

Networking Break

11:20 am - 11:50 am

Healthy Growth—Sustainability to Business Imperatives

11:50 am - 12:20 pm

Panel Discussion—From Chips to Chillers: The Sustainable Materials Stack Behind AI

12:20 pm - 12:30 pm
Janell Centers, Macquarie
Janell Centers
Marketing Manager
Macquarie

Closing Remarks

Presented by the SEMI Silicon Valley Chapter

 

7:30 am - 12:30 pm Off Add to Calendar 2026-08-28 07:30:00 2026-08-28 12:30:00 SEMI Silicon Valley Breakfast Forum Presented by the SEMI Silicon Valley Chapter  SEMI HQ 673 S. Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 2
REGISTER NOW
Event format
Promote in calendar
Off
United States Overview of Semiconductor Manufacturing
Highlighted content

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Biography

Embassy Suites by Hilton Scottsdale Resort
5001 N. Scottsdale Road
Scottsdale, AZ 85250
United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $1,295 
  • Non-Members: $1,395 
  • Students/Vets: $1,195 

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2024-10-22 08:30:00 2024-10-23 17:00:00 Overview of Semiconductor Manufacturing Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $1,295 Non-Members: $1,395 Students/Vets: $1,195 * For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Embassy Suites by Hilton Scottsdale Resort 5001 N. Scottsdale Road Scottsdale, AZ 85250 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
Event format

REGISTRATION

Registration
  • Early bird registration close: 5pm, Wednesday, September 4 KST
  • Registration fee includes lunch at the venue.

 

[Early Bird - Group (5 or more people from a company)]

  • SEMI Members: KRW 275,000
  • Non members: KRW 330,000

[Early bird]

  • SEMI Members: KRW 308,000
  • Non members: KRW 363,000

[Onsite]

  • SEMI Members: KRW 385,000
  • Non members: KRW 385,000
Registration
South Korea APS 썸네일.png Business Technical

OVERVIEW

  • Date: September 11(Wed), 2024  
  • Time: 09:00 - 17:30  
  • Venue: Convention Hall 3, 3F, Suwon Convention Center  
  • Language: Korean / English (Simultaneous interpretation will be provided)
  • Organizer: SEMI Korea 

 

SPONSORS

 

NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Convention Hall 3, 3F, Suwon Convention Center
South Korea

9:00 am - 9:30 am
김대우
Dae-Woo Kim
Samsung Electronics

The Journey of Semiconductor Industry and the Innovation of Advanced Packaging

Competition in the semiconductor industry is becoming fiercer and advanced package technology has become important for achieving low-power and high performance computing. As the Moore’s law reach the limitation, Si fabrication process need extremely high cost solutions such as multiple patterning and EUV (Extreme Ultra-Violet) lithography. In spite of high cost Si fabrication process, chip size is increased over the reticle size limit by adding more and more functional blocks for high performance computing. In particular, with the continuous demand for higher performance and capacity in memory products, the amount of data created, processed, stored and transferred is increasing tremendously. In order to overcome these challenges, advanced package based on RDL (Re-Distribution Layer), flip chip bonding, and TSV (Through Silicon Via) have been actively used for heterogeneous integration in electronic packages since the past decade. The heterogeneous integration and chiplet has been attracting a lot of attention since it enables higher bandwidth with low power consumption at reduced cost. 2.5D Si interposer architecture has been widely used for horizontal interconnection between logic to logic and logic to high bandwidth memory integration. 3D stacking architecture is for vertical interconnections enabling small form factor, increasing signal speed, reducing power consumption and power dissipation. In this talk, recent advanced package technology and key roadmap in Samsung Electronics will be shared for mobile and AI/HPC product.

※ Biography

9:30 am - 10:00 am
David Harame
David Harame
NYCREATES/AIM Photonics

Co-Process and Co-Development to Address Challenges in Co-Packaged Optics (CPO)

Co-Packaged Optics is the combination of photonic integrated circuits and electronic circuits at a system packaging level. The essential need is to get light in and out of the system, usually from optical fibers, with the least losses and ease of manufacturing. Photonic integrated circuits (PICs) are fabricated in CMOS semiconductor fabrication facilities, which allows manufacturers to take advantage of the large installed base of tools and processes. However, electronic packaging is currently not equipped to handle the challenges associated with packaging advanced photonic devices. In this presentation we explore some of these challenges for optical coupling such as sub-micron alignment tolerances, sensitivity to temperature variations, optical losses, and a lack of standards. The end objective is to have optical coupling look like electronic coupling. At NYCREATES/AIM Photonics, we have learned that the best results are obtained when the PIC manufacturing and packaging processes are co-designed to better achieve low-loss coupling, particularly between photonic integrated circuits and other elements in the system. A complete “end-to-end” approach includes customizing the PIC process, wafer manufacturing including interposers and heterogeneous integration, electronic photonic design automation, and electronic-photonic test, assembly and packaging capabilities. A complete approach will lead to reliable and affordable solutions that will ensure the manufacturing-readiness of this critical technology for decades to come.

※ Biography

10:00 am - 10:30 am
손호영
Ho-Young Son
SK hynix

Advanced Packaging Technology for HBM and 2.5D SiP

Rapid growth of generative AI at this moment has never been experienced for a few decades and it makes surprising impact to human experience and semiconductor industry as well. High bandwidth memory (HBM) which started from memory solution for high-end graphic applications has being emerged as a key driver accelerating the growth of AI industry due to remarkable advantages on the smaller latency between memory and GPU.

SK hynix has been the pioneer of HBM in all of history and firstly wrote a new record by the world-first development of HBM package in 2013. More remarkable footprint in the HBM history was the world-first adoption of the mass reflow bonding and molded underfill (MR-MUF) technology to the HBM 4Hi and 8Hi in 201, which nobody has never tried due to its notorious difficulties of process and material technologies. In this effort, SK hynix is providing a state-of-the-art of HBM products with highest memory bandwidth and memory capacity, highest power efficiency, and superior thermal dissipation ability and its package technology is a core competency leading the memory renaissance in the post-pandemic era.

In align with HBM technology innovation, there are continuous changes in 2.5D system-in-package (SiP) in order to improve the memory bandwidth and accommodate higher memory capacity. There has been many different types of proxy package structure to assure the HBM quality and reliability but it is obviously not certain whether HBM package can guarantee all the possible quality and reliability risks due to many possible changes of HBM and SiP packages in the future. In this paper, we would like to introduce several ways to evaluate the thermal and electrical characteristics of HBM and its package reliability.

※ Biography

10:30 am - 11:00 am
전진영
Jinyoung Jeon
ASMPT

Enabling the AI Era

The AI era has arrived and to enable and perpetuate it, the semiconductor advanced packaging (AP) industry needs to innovate in a torrid pace to keep in tandem the exponential growth of the Gen AI computing power.
Rising to the challenge, ASMPT has been leveraging its first mover market position in advanced packaging to continue innovating its end-to-end solutions to scale with the latest packaging architecture with the most demanding chiplet interconnects and heterogeneous integration formats.
Going forward, the AP industry shall undergo a “Power of N” transformation where interconnect pitch shall shrink rapidly along with thinner and bigger package formats, demanding new technologies in materials, process and equipment signaling a need for a complete and robust ecosystem to evolve for Gen AI to continue scaling.

※ Biography

11:00 am - 11:20 am

Break

11:20 am - 12:30 pm
All speakers

Panel Discussion

2:00 pm - 2:30 pm
SungSoon Park
SungSoon Park
Intel

The Role of Advanced Packaging Technology for AI

As artificial intelligence (AI) continues to advance, the demand for high-performance computing has never been greater. Advanced packaging technologies play a pivotal role in meeting these demands by enhancing the performance, power efficiency, and integration density. This presentation explores the impact of various advanced packaging solutions, including 2.5D with Si interposers, 2.3D with RDL interposers, and 3D packaging technologies, on the development and optimization of AI systems.
We will delve into the specifics of 2.5D packaging, where Si interposers enable the integration of heterogeneous dies side by side, allowing for high-bandwidth communication and reduced latency. The presentation will also cover 2.3D packaging with RDL interposers, which offer a cost-effective alternative by utilizing advanced RDL processes to achieve similar benefits as 2.5D, but with potentially lower manufacturing complexity and cost.
Furthermore, we will examine 3D advanced packaging technology, which stacks dies vertically to further enhance integration density and performance. This approach not only maximizes space efficiency but also minimizes interconnect lengths, leading to significant improvements in speed and power consumption which are critical factors for AI applications.
Through a comprehensive analysis, this presentation will highlight how these advanced packaging technologies contribute to the acceleration of AI innovation, enabling more powerful, efficient, and compact AI packaging solutions.

※ Biography

2:30 pm - 3:00 pm
Mooseong Kim
Mooseong Kim
LG Innotek

FCBGA Substrate Technologies for AI/ HPC

Big data, artificial intelligence (AI), and high-performance computing (HPC) underscore the critical importance of advanced packaging technologies. Over the past decade, significant progress in 2.5D and 3D heterogeneous integration has led to notable improvements in I/O capacity, performance, cost efficiency, power consumption, and signal speeds for large-scale data processing. 

In particular, 2.5D semiconductor packaging technologies such as EMIB and CoWoS are crucial for increasing I/O connections while reducing the interconnect length between logic and memory components, thereby enhancing performance and reducing latency. 

However, FCBGA substrates used in AI/HPC packaging face considerable technical challenges. These substrates often need to be larger than 100mm x 100mm and consist of more than 20 layers. Furthermore, incorporating advanced technologies like silicon capacitor embedding and bridge integration into large-body FCBGA substrates presents additional hurdles as the industry moves towards next-generation packaging solutions. 

This presentation thoroughly explores the latest technology trends in FCBGA substrates. 

※ Biography

3:00 pm - 3:30 pm
황태경
TaeKyeong Hwang
Amkor Technology Korea

Advanced Packages for Chiplet

3:30 pm - 4:00 pm
Bongyoung Yoo
Prof. Bongyoung Yoo
Hanyang University

Glass Substrates: Present and Future Potential

As the demand for higher performance, greater miniaturization, and improved thermal management continues to grow in the electronics industry, advanced packaging technologies are becoming increasingly critical. Glass substrates are emerging as a key material in this domain, offering unique advantages over conventional organic and silicon-based substrates. This talk explores the present and future potential of glass substrates in advanced packaging, focusing on their electrical, thermal, and mechanical properties that make them suitable for next-generation semiconductor devices.
It will also highlight recent innovations in glass substrate manufacturing, such as through-glass vias (TGVs) and surface modification techniques, which enhance the performance and reliability of electronic components.

※ Biography

4:00 pm - 4:20 pm

Break

4:20 pm - 5:30 pm
All Speakers

Panel Discussion

Semiconductor Integration & Packaging: Powering AI and HPC
The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and AI. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable powering AI and HPC systems. Topics covered at the summit include 2.5D packaging, Chiplet packaging, CPO, FCBGA substrate technology and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.

 

9:00 am - 5:30 pm Off Add to Calendar 2024-09-11 09:00:00 2024-09-11 17:30:00 Advanced Packaging Summit 2024 Semiconductor Integration & Packaging: Powering AI and HPCThe Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and AI. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable powering AI and HPC systems. Topics covered at the summit include 2.5D packaging, Chiplet packaging, CPO, FCBGA substrate technology and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.  Convention Hall 3, 3F, Suwon Convention Center South Korea SEMI.org [email protected] America/Los_Angeles public Discover APS 2025
Event format
Promote in calendar
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United States Understanding Semiconductor Technology and Business
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

 

Denny Frye 

PT International, LLC

Biography


Embassy Suites by Hilton Scottsdale Resort
5001 N. Scottsdale Road
Scottsdale, AZ 85250
United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $1,095 
  • Non-Members: $1,199
  • Students/Vets: $895

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2024-10-21 08:30:00 2024-10-21 17:00:00 Understanding Semiconductor Technology and Business Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $1,095 Non-Members: $1,199Students/Vets: $895* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Embassy Suites by Hilton Scottsdale Resort 5001 N. Scottsdale Road Scottsdale, AZ 85250 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
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United States Register Now Stay Connected https://semiexpo.semi.org/ SEMIEXPO_Heartland Business Expositions

INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY

Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on the path to $1T in semiconductor revenue.  

A significant amount of both markets is concentrated in the Midwestern United States. SEMIEXPO in the Heartland will bring these two key markets together and provide an opportunity for collaboration and growth.

Smart Manufacturing

  • The program will focus on the deployment of Industry 4.0 or Smart Manufacturing tools, technologies, and methods for the semiconductors required for this growing market. 

Smart Mobility

  • The program will unite stakeholders in the semiconductors/sensors and mobility ecosystems to identify and address technical issues and supply chain dynamics that are best addressed collectively. 

Ways to Participate

  • Exhibit
  • Sponsor
  • Speak
  • Attend

MAKE YOUR MARK AT THE INAUGURAL SEMIEXPO HEARTLAND

Plan Now to Exhibit or Sponsor. Contact
Shane Poblete | +1 202-847-5983  | [email protected]

 

STAY INFORMED: SEMIEXPO HEARTLAND—SEH Interest Form

 

Indiana Convention Center
100 S Capitol Ave
Detroit, MI
United States

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development Off Add to Calendar 2026-04-29 00:00:00 2026-04-30 00:00:00 SEMIEXPO Heartland 2026 Indiana Convention Center 100 S Capitol Ave Detroit, MI United States SEMI.org [email protected] America/Detroit public America/Detroit
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Registration

Registration

Early-bird Registration Close: Friday, May 24 / 5:00pm in KST

[Early Bird]

· SEMI Member: KRW 308,000
· Non-Member: KRW 363,000

[Regular]

· SEMI Member: KRW 385,000
· Non-Member: KRW 385,000

 

※ Registration fee includes lunch and reception.

Registration
South Korea Registration SMC-Korea-2024-Banners-squre.jpg Business Technical

OVERVIEW

  • Date: May 29(Wed), 2024
  • Time: 09:00 - 18:30
  • Venue: Convention Hall 2, 3F, Suwon Convention Center

 

NOTICE

  • Simultaneous interpretation will be provided
  • Presentation files agreed by speakers will be provided to attendees.

 

SPONSORS

SMC-Korea-2023-Sponsor_DW.jpg SMC-Korea-2023-Sponsor_DP.jpg SMC-Korea-2023-Sponsor_JSR.jpg SMC-Korea-2023-Sponsor_ET.jpg
SMC-Korea-2023-Sponsor_DS_0.jpg Air LiquideHuntsman
 
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CONTACT

Convention Hall 2, 3F, Suwon Convention Center
Suwon-si
Gyeonggi-do
South Korea

10:00 am - 10:05 am
 Hyun-Dae (H. D.) Cho - President, SEMI Korea
HD Cho
President
SEMI Korea

Welcome

10:05 am - 10:35 am
seongtae oh
Seong Tae Oh
Fellow
TEL

Process Technologies for Continuous Scaling of Logic Devices

The rapid growth of AI, big data, IoT, and 5/6G communication necessitates the sophisticated computing power and efficiency of semiconductor devices, driving demand for various components such as HPC, GPU, ASIC, FPGA, and HBM. Semiconductor device and equipment industries are also challenging various new technologies to accommodate such diversifying applications and proceed with sustainable development in the era of AI and ICT.
According to the roadmap over the next 10 years, semiconductor technologies are expected to develop into the scaling technologies to further extend the existing Moore's Law and hybrid device technologies that integrate legacy nodes and advanced nodes into one. Therefore, in this presentation, we will look at the latest logic technology roadmap and introduce new process technologies to implement it.

※ Biography

10:35 am - 11:00 am
Wonho Yeon
Wonho Yeon
Research Fellow
KIEP

Supply Chain Management

11:00 am - 11:25 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting

Localization Challenges of the Materials Supply Chain

11:25 am - 11:50 pm
Stefan CHITORAGA
Stefan CHITORAGA
Technology and Market Analyst- Packaging & Assembly
Yole Group

Material Trends in Advanced Packaging & Power Module Packaging (video recording)

11:50 am - 1:00 pm

Lunch

1:00 pm - 1:25 pm
Dr. Montray C. Leavy
Montray C. Leavy
Deputy CTO
Entegris

Materials Innovation Advancing the Angstrom Era

Materials innovation within the Semiconductor industry has been a driving force since the planar 2D MOSFET to the current 3D gate-all-around (GAA) transistor architectures and will continue its criticality as we embark on 500-layer flash memory designs and Angstrom level critical interconnect dimensions. To achieve these once incomprehensible levels of lateral and vertical scaling, device design engineers and manufacturers are increasingly relying on disruptive materials innovation to enable the density and performance gains required at each successive technology node. As the performance requirements for the most advanced devices become more challenging, materials have shown to have an increased contribution to device performance over scaling and design. This has led to a greater portion of the periodic table being incorporated into semiconductor processing.

The integration of new materials, such as novel photoresists, interconnect metals & alloys, ultra-pure polymers, chemically modified polymer membranes, and formulated chemicals, into the chip fabrication increases process complexity and makes yield ramps more challenging. With more process steps in the overall device build, speed to yield and process integrity are more critical than ever to achieve technology qualification schedules. This presentation will focus on Entegris’ approach to materials innovation, the integration of these novel materials coupled with co-optimized solutions enabling industry technology roadmaps and yield requirements while preserving integrity of delivery and process control.

※ Biography

1:25 pm - 1:50 pm
Sadaaki Katoh
Sadaaki Katoh
JOINT2 Team Manager
Resonac

Advanced Packaging Materials and Evaluation Platform at Resonac

Resonac has started Packaging Solution Center as new R&D center to propose one-stop solution for customers in 2018 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package in October, 2021.

2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package.
The presentation will cover the significance and strengths of JOINT2, and updates on research and development.

※ Biography

1:50 pm - 2:15 pm
seonjun heo.png
Seongjun Heo
Process Engineering Director
Lam Research

Dry Resist for Holistic EUV Patterning

EUV lithography infrastructure has become the critical element of semiconductor industry to enable the device scaling down. It consists of not only light source, optical system but also masks, photoresist. The EUV stochastic effects present challenges to optimizing EUV resist resolution, line edge roughness, and sensitivity simultaneously. To overcome these challenges, Lam introduced the new dry resist combined with the new dry development technology.

Lam’s EUV dry resist, coupled with ASML’s EUV scanners and Lam’s holistic patterning solutions, will extend the patterning roadmap (Moore’s Law) for the next 10 years and beyond by offering a high-resolution, high-fidelity, defectivity-free, and greener solution for ≤32nm pitch L/S, and ≤40nm pitch pillar and contact hole EUV patterning in the fab. EUV dry resist technology also has been validated demonstrating superior dose-to-defectivity for <32nm pitch L/S, well suited for logic applications. Lam’s EUV dry resist is uniquely suited for future HiNA EUV patterning thanks to robust resist thickness scaling while maintaining high etch selectivity and high contrast.

※ Biography

2:15 pm - 2:30 pm

Break

2:30 pm - 2:55 pm
김용성
Yongsung Kim
TL
SK hynix

Sustainability Challenges of the Semiconductor Industry

As demand for chips surge, the semiconductor industry is struggling to reduce its environmental footprint. While the environmental impacts of semiconductor (and electronic products that depend on them) have mostly been liked to ‘manufacturing’ and ‘use’ phases of products which consume a significant amount of water and energy, the attention is shifting to the 'material extraction’ and ‘end-of-use’ phases of products following concerns over the e-waste issue. In this presentation, I will focus on the latest findings of the global e-waste challenge, what this means from the materials perspective, and its implications to product design and manufacturing. I will also introduce SK hynix's strategy and targets towards improving the circularity of products, and our partnership with customers/vendors to achieve a common goal.

2:55 pm - 3:20 pm
Eun-Ho Sohn
Eunho Sohn
Head of Interface Materials and Chemical Engineering Research Center
KRICT

Trends in Regulation of PFASs (per- and polyfluoroalkyl substances) and Technological Development Strategies

Fluorine compounds exhibit exceptional physical properties that set them apart from other organic materials. Consequently, they have been utilized as core materials to enhance the functionality, performance, and value of products across various key industries including electrical and electronics, semiconductors, displays, and automobiles.
However, on March 22nd of last year, the European Chemicals Agency (ECHA) issued a report imposing restrictions on the usage of over 10,000 types of per- and polyfluoroalkyl substances (PFASs) across all industries, sparking significant upheaval within the sector.
In this presentation, we will learn in detail about the definition of PFAS, and the content, progress, and schedule of PFAS regulations in Europe and the United States, and contemplate the direction of future technology development.

※ Biography

3:20 pm - 3:45 pm
김광섭
Karl Kim
APAC Semiconductor Marketing Manager
Syensqo

Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain

As semiconductors become more advanced and the fabrication processing conditions more extreme, the essentiality of a sustainable and secure fluorinated material supply chain plays a vital role in the future of semiconductor manufacturing. The principles of developing this supply chain are directly aligned to support the sustainability and emission roadmaps of the semiconductor industry. Syensqo will introduce the following content:
1) Priorities when Specifying Materials for a Sustainable Supply Chain
2) The Key to Sustainability - Application Segmentation
3) Case Studies

※ Biography

3:45 pm - 4:10 pm
dupont_Jae Hwan Sim
Jae Hwan Sim
R&D manager/Korea R&D EUV team leader
DuPont

Innovating Safe and Sustainable by Design: Strategies and Steps toward Reduction of Substances of Concern in Photolithography Materials

Growing scientific evidences suggest that certain per- and polyfluoroalkyl substances (PFAS) pose global environmental and health risks. In response, global governments are contemplating measures to limit the use of these chemicals in various industries. However, specific types of PFAS are indispensable and no substitutes are currently available for most chip manufacturing applications in the semiconductor industry. Aligned with the objective of Safer and Sustainable by Design, DuPont has launched a comprehensive program to reduce PFAS usage in photoresist and associated lithography materials. In this presentation, we will provide an overview of DuPont's innovative initiatives and technical challenges encountered in this endeavor.

※ Biography

4:10 pm - 4:35 pm
Floris Buijzen
Floris Buijzen
Senior Director Product Management
Corbion

CORBION: PURASOLV® ELECT for a more Sustainable Semiconductor Manufacturing

Solvents are used extensively in the semiconductor manufacturing process. Solvents are estimated to be responsible for around 7% of the Scope 3 emissions of the semiconductor industry. The typical solvents that are used are produced from fossil resources and with that not in line with net zero ambitions. For more than 20 years Corbion has been supplying biobased ethyl lactate to the semiconductor industry under it’s brand name PURASOLV® ELECT, meeting the stringent requirements of the industry. Typical applications are photoresist for i/g-line / KrF / ArF / EUV, RRC, Edge bead removal and as thinner. Biobased ethyl lactate is sustainable and safe by design: it is produced from renewable resources, non-toxic and safe to workers, biodegradable and offers a significant carbon footprint reduction compared to incumbent solvents. Switching to biobased ethyl lactate thus enables more sustainable semiconductor manufacturing.

※ Biography

4:35 pm - 4:50 pm

Break

4:50 pm - 5:20 pm
ki ill moon
Ki-Ill Moon
VP
SK hynix

Technology and Future of Semiconductor Packaging Materials

The technological advancement of semiconductor materials is a key factor along with the technological advancement of the process. And recently, the importance of Advanced PKG is increasing, and SK Hynix has achieved the result of improving product performance by developing MR-MUF materials. This proves the importance of materials. In the future, there are more packaging challenges for high-speed memory products such as HBM, and I plan to announce Need for material development to satisfy them.

※ Biography

5:20 pm - 5:50 pm
Seongjun Park
Sungjun Park
Executive Vice President and Head of Material Development Team
Samsung Electronics

Big Challenges for Small Worlds

The number of transistors in semiconductor chip has been increased twice every two years for more than 50 years, following the famous Moore’s Law and somehow, it was taken to be granted. In reality, it was a big accomplishment with an unimaginable amount of efforts and collaborations, including the development of new materials.

New material has been developed and introduced to improve the performance and capacity of electronic devices through smaller design rules. New Photo Resists (PR) for higher resolution with smaller defects and higher uniformity were developed. And Precursors were also developed to meet the process challenges for the smaller design rules, such as higher aspect ratios. High etch selective Etchant and CMP Slurry with low scratch were requested. And the requirements in new materials are getting tougher and stronger with the evolution of AI, which needs more computing power than ever. Even materials that has never been expected in industry and has been studied only in academia are being actively considered.

Even the worse, the surrounding situation for material development and manufacturing is getting tougher. Environmental regulations are getting tighter. Gases with high global warming potential were begun to be replaced. Recently, EU announced banning PFAS materials in near future and US raised bars for PFAS materials. And carbon zero policy is coming to us slowly but firmly.

In this talk, we will discuss the current status and future direction of material research. We will discuss the development directions to improve the performance of devices and to consider environmental regulations. And we will discuss the virtue of working together as a big one-team to overcome all the obstacles mentioned above in the world of extreme technology.

※ Biography

5:50 pm - 6:30 pm

Networking Reception

EMG

Materials Resilience: Navigating Challenges, Embracing Opportunities

Currently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.
These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts.

10:00 am - 6:30 pm Off Add to Calendar 2024-05-29 10:00:00 2024-05-29 18:30:00 SMC Korea 2024 Materials Resilience: Navigating Challenges, Embracing OpportunitiesCurrently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts. Convention Hall 2, 3F, Suwon Convention Center Suwon-si Gyeonggi-do South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

Registration

Early Bird Pricing (ends August 13): Member $75 / Non-member $100

Regular Pricing: Member $100 / Non-Member $125

Student: $15

*Please contact Taylor Zhao ([email protected]) to receive a promo code

IMPORTANT SECURITY PROTOCOL:

  • Albany NanoTech Complex security protocol requires all non-U.S. citizens to complete a background check to attend this event at their site. To allow sufficient processing time, all non-U.S. citizens should register by August 25.
  • The Albany NanoTech Complex requires all attendees to check in at the Security. U.S. Citizens are required to provide a state-issued photo ID (e.g. Driver’s License), and non-U.S. citizens are required to provide a valid Passport and Permanent Resident Card (permanent residence only) at check-in.
United States SEMI Northeast Forum Business
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HOST SPONSOR

NY CREATES

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the SEMI Northeast Fall Forum. 

View Sponsorship Brochure

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

Host Sponsor— 

NY CREATES


Fabricating the Future: Emerging Technologies and the Workforce of Tomorrow

As advancements in AI, advanced packaging, and next-generation computing reshape the semiconductor landscape, the industry must prepare for both technological transformation and evolving workforce needs. The SEMI Northeast Fall Forum 2026 will bring together industry leaders, technology experts, and workforce advocates to explore emerging innovations driving the future of the semiconductor industry and the talent strategies needed to support continued growth. Through expert presentations, workforce-focused discussions, and an exclusive tour of the Albany Nanotech Complex, attendees will gain insight into the technologies, talent, and collaborations shaping the future of the semiconductor ecosystem.

The Northeast Fall Forum is co-located with the Northeast Professional Development Seminar (PDS), providing students with a unique opportunity to explore career paths in the high-tech industry. Through engaging presentations and valuable networking opportunities, attendees gain practical insights to help guide their career decisions and prepare for future success.

Participants of both the Fall Forum and PDS are invited to attend the Facility Tour and Networking Lunch, offering additional opportunities to connect with industry professionals and peers.

To learn more about the PDS event or explore exhibitor opportunities, please visit the Northeast PDS website.

Albany NanoTech Center
257 Fuller Rd
Albany, NY 12203
United States

Tuesday, September 15, 2026 | 11:30am–6:00pm Eastern Time

11:30 am

Facility Tour

12:30 pm

Networking Lunch & Visiting Exhibitors

2:00 pm

Welcome to Northeast Fall Forum

2:05 pm

Welcome Remarks from NY Creates

2:15 pm

Quantum Computing / Artificial Intelligence

2:40 pm

Advanced Packaging

3:05 pm

Networking Break

3:30 pm

SEMI Initiative Update

3:40 pm

Workforce Development Panel

4:55 pm

Closing Remarks

5:00 pm

Networking Hour with Panelists

The SEMI Northeast Chapter Presents

Fabricating the Future: Emerging Technologies and the Workforce of Tomorrow

11:30 am - 6:00 pm Off Add to Calendar 2026-09-15 11:30:00 2026-09-15 18:00:00 SEMI Northeast Fall Forum 2026 The SEMI Northeast Chapter Presents—Fabricating the Future: Emerging Technologies and the Workforce of Tomorrow Albany NanoTech Center 257 Fuller Rd Albany, NY 12203 United States SEMI.org [email protected] America/New_York public America/New_York Register Now
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