Shanghai
China
Shanghai
China
Shanghai
China
Shanghai
China
Member: $49
Non-Member: $99
Registrants will receive the presentation recording and PDFs of Webinar #7.
Taylor Zhao
Manager, Programs & Committees
[email protected]
Silicon Carbide (SiC) MOSFETs exploit the material’s favorable properties, which allow for highly efficient power devices with reduced form-factor and cooling requirements. Having been commercially introduced in 2011, SiC MOSFETs have gone through several generations of improvements and are currently offered in planar and trench configurations by major semiconductor chip manufacturers. This webinar will provide an impartial overview of planar/trench design and fabrication aspects, highlight their key competitive advantages, and provide an independent overview of what real-world converters require in terms of application-specific performance parameters. Exemplary applications to be discussed include aviation, servo drivers, energy storage, and traction drives.
United States
Join us online for the seventh webinar in the Silicon Carbide Series.
With the world's growing reliance on semiconductor chips, the industry needs a more reliable solution to improve and innovate at a rapid pace while addressing manufacturing challenges such as temperature, chemistry, and mechanical issues.
One critical equipment in the industry is vacuum Pendulum Valves, a vacuum equipment incorporating plasma that are widely used in the semiconductor manufacturing process. The form, fit and function of these valves pose multiple challenges for the seals required in the valve's assemblies. Greene Tweed engineers have analyzed the most commonly used pendulum valves and broken down the various sealing challenges and have also created solutions to the challenges.
Join us to learn about the 6 W's—Who, What, When, Where, Why, & How—of these pendulum valve solutions.
Join our webinar where Greene Tweed engineers will discuss the most commonly used pendulum valves, the various sealing challenges and solutions to address them.
United States
Register today to join our live webinar in collaboration with Greene Tweed!
Members: $475
Non-Members: $590
Students: $99
Note: Travel-related expenses are not included.
Cancellations received on or before August 16, 2025 are fully refunded with a $100 processing fee. Refunds will not be issued for cancellations (including no-shows) made after August 16, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to:
Michelle Fabiano
Sr. Manager, Programs & Committees
[email protected]
Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
+1 (408) 942-0400
Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
+1 (408) 719-1966
Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.
Contact Tim Janes | [email protected] | +1 720-939-4992
SEMI is proud to partner with the following media and associations to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.
Speakers represent the MEMS and sensors supply chain and adjacent industries. The conference will explore cutting-edge topics including photonics, digital twins and AI, machine learning, environmental sensors, quantum sensors, entrepreneurialism, innovation and collaboration. The programming is curated to appeal to the “NextGen” MEMS and sensors professionals through programming features of the conference that include networking, problem-solving, and skill development.
Gain insights as we dive into the following topics:
This conference is open to all MEMS & sensors professionals interested in NextGen technology.
Michelle Fabiano
Sr Manager, Programs & Committees
[email protected]
Tim Janes
Account Manager, Events
[email protected]
Thank you to these industry leaders for their time, expertise, and support of the MSNG conference.
SEMI HQ
673 South Milpitas Boulevard
Seminars 1 & 2
Milpitas, CA 95035
United States
Session Sponsor—TDK USA
Presented by the Consulate General of Canada in San Francisco
Sponsor—Bosch
Sponsor—SILEX
Sponsor—Teledyne MEMS
The Computer History Museum (CHM) is a computer museum in Mountain View, California. The museum presents stories and artifacts of Silicon Valley and the Information Age, and explores the computing revolution and its impact on society. Transportation will be provided.
MEMS & Sensors NextGen—MSNG 2025 is the leading NextGen sensor technology technical conference for NextGen professionals related to designing, building, and using sensors.
Let your LinkedIn connections know you’re attending MSNG!
Spread the word and share our social media content with your connections so that they can join you there, too.
Breakfast Forum Pricing:
Registration is final. No refunds provided. No substitutions.
Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982
Become a Sponsor
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Pacific Northwest Breakfast Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
Powering the AI Era: Infrastructure, Integration & Policy
There has never been a more pivotal moment for the semiconductor industry. As AI adoption accelerates across every sector, the demands on infrastructure, technology integration, and policy frameworks have intensified. Companies across the Pacific Northwest and beyond are navigating rapid capacity expansion, new technical challenges, and the workforce transformation required to support the AI era.
This year’s SEMI Pacific Northwest Breakfast Forum brings together leaders from industry, government, academia, and regional organizations to explore how we build the resilient, intelligent, and scalable semiconductor ecosystem the AI future requires.
Join us as we examine energy infrastructure readiness, advanced packaging innovation, economic signals, and regional workforce development initiatives—all essential to powering the next decade of growth.
Intel - RA1
2501 NE Century Blvd
Hillsboro, OR 97124
United States
Host—Intel
Organized by Technology Association of Oregon
Organizer: SEMI Pacific Northwest Chapter
Hosted by Intel
IN-PERSON
The decisions made at the design stage of today's greenfield fabs will shape U.S. semiconductor performance for the next two decades. This webinar explores how organizations can move beyond traditional automation toward adaptive and ultimately autonomous fabs—starting with the foundational design of the built environment. Focusing on greenfield projects, Siemens experts will outline how early integration of power distribution, building systems, and automation technologies enables scalable, resilient, and future-ready facilities. Attendees will learn why designing autonomy requires a holistic approach—one that connects infrastructure, process, and production through a unified technology stack. The webinar will address challenges in adapting global fab designs to U.S. markets, highlighting the need for local expertise, regulatory alignment, and lifecycle planning. It will also explore how digitalization, predictive maintenance, and connected ecosystems drive efficiency in brownfield sites. Join the webinar and discover how to design facilities ready for autonomous, high-performance fabs.
Key takeaways:
Shift from automation to autonomy starts with design
Future fabs require rethinking the built environment upfront—not just layering automation later.
Early integration is critical for scalability and resilience
Aligning power distribution, building systems, and automation from the start enables flexible, future-ready facilities.
A unified technology stack connects infrastructure to production
Achieving autonomy depends on a holistic approach that links physical infrastructure, processes, and operations end-to-end.
Localization and lifecycle planning are key for U.S. fabs
Adapting global designs requires navigating local regulations, leveraging regional expertise, and planning for long-term operations.
Digitalization drives performance across both greenfield and brownfield sites
Technologies like predictive maintenance and connected ecosystems improve efficiency and enable continuous optimization.
This webinar is in collaboration with
United States
Ben Green is a Senior Digitalization Consultant at Siemens Digital Industries, where he leads strategic customer engagements focused on digital transformation and industrial innovation. He works with manufacturers to develop and execute digitalization strategies that integrate automation, control systems, and advanced software solutions. With nearly two decades of experience at Siemens, Ben has held a variety of customer-facing roles spanning sales, business development, and technical consulting. He previously led the Siemens Industrial Automation Solution Partner Program, collaborating with system integrators across the United States. Ben specializes in helping organizations define a clear vision for their digital future and translating that vision into practical, actionable steps that deliver measurable results. Ben holds a B.S. focused in Industrial Distribution from Texas A&M University.
Matthew Hamilton leads Siemens Smart Infrastructure's Semiconductor Vertical segment. A mechanical engineer by training, Matthew began his career in product development and manufacturing before spending a decade delivering complex energy and infrastructure programs at scale. His eight years at Siemens have centered on executive-level engagement with large-scale, mission-critical facilities where power resilience, decarbonization, and built-environment performance converge. His technical depth spans MV/LV power distribution, microgrid integration, solar and battery storage, central utility plants, building automation, fire and life safety, and enterprise digitalization — giving him a distinctive lens on how energy architecture and built-environment strategy shape fab performance, resilience, and the long path toward operational autonomy. Matthew holds a B.S. in Mechanical Engineering from the University of California Santa Barbara and an MBA in Finance from the Graduate School of Management at the University of California, Davis.
Register now to join the live webinar in collaboration with Siemens!
Become a Sponsor
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the SEMI Arizona Breakfast Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
Arizona’s semiconductor ecosystem is at an inflection point—poised to transform rapid growth into sustainable global leadership. This forum convenes industry executives, policymakers and innovators to define strategies for making Arizona the premier global semiconductor resource. The SEMI Arizona Breakfast Forum is where Arizona’s semiconductor current and future playbook is defined, designed to mobilize leadership towards actionable strategies helping evolve Arizona’s semiconductor industry into an international winning playbook.
Arizona’s Rapid Rise as America’s Semiconductor Headquarters has attracted major global companies, with more than 60 expansions and over $200 billion in new investments since 2020, including TSMC, Intel, and ASM, all of whom are expanding operations or building new fabs in AZ due to strong business climate, strategic location and infrastructure. Statewide commitment through the Arizona Semiconductor Task Force, and the National Semiconductor Economic Roadmap (NSER) are enhanced by targeted incentives to attract companies and federal-state-industry alignments reinforce Arizona as a national leader in the next era of US semiconductor sovereignty.
Karen Popp—Sr. Program Manager, Programs & Committees
[email protected]
Edwards Vacuum
2411 E. Germann Rd.
Chandler, AZ 95286
United States
Arizona is evolving from rapid expansion to ecosystem integration, ensuring every piece of the value chain connects efficiently. All the fundamental components, from research institutions to logistics and infrastructure partners to materials suppliers, packaging facilities to fabs are fundamental elements to this integration.
Arizona is leading the way in becoming the most resilient, efficient semiconductor hub in North America. Through diversified sourcing, regional collaboration, logistics optimization, and flexible, shock-resistant supply models, Arizona will lead the way. Deployment of automated mitigation workflows, enabling alternate-site activation and faster recovery. Strong emphasis on transparent supplier collaboration, including exchange of validated data across tiers down to parts and materials.
Arizona’s strategic success depends upon its ability to produce, attract, and retain top-tier semiconductor talent. This plan includes investment in semiconductor training programs, securing next-gen engineering talent, research partnerships, on-the-job R&D exposure, and providing retraining and upscaling pathways.
Investment in semiconductor training programs, securing next-gen engineering talent, research partnerships, on-the-job R&D exposure, and providing retraining and upscaling pathways.
The winning strategy will continue to require accelerated investments in R&D, creating new labs and testing capabilities, advanced packaging pilot lines, next-gen university research facilities, and sustainable infrastructure. Arizona is positioned to attract investments and to remain a market leader in 2026, 2030, and beyond.
Steven G. Zylstra, President and CEO, Arizona Technology Council and SciTech Institute
Richard Simoncic, Chief Operating Officer, Microchip Technology
