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United States Smarter Fabs Tile Business Executive Technical Training

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Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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REGISTRATION

PRICING

  • Member: $49
  • Non-Member: $99

STUDENTS

  • Must have a valid Student ID.
  • Contact Michelle Fabiano, [email protected]
    for a student registration code.

This is an online recorded event; therefore, you will receive the content recording following the event.  We are not processing refunds or cancellations.

Michelle Fabiano
Email: [email protected] 
Mobile: +1.310.930.7669 

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Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

As the semiconductor industry pushes the boundaries of performance, efficiency, and miniaturization, advanced packaging has emerged as a critical enabler of next-generation microelectronics. This virtual forum brings together leading voices from across the ecosystem to explore how backend manufacturing is driving innovation and collaboration in advanced packaging technologies.

Topics Include—

  • The evolving role of backend manufacturing in enabling heterogeneous integration and chiplet architectures
  • Key challenges and opportunities in scaling advanced packaging solutions

  • Collaborative models for building a robust ecosystem—from academia to industry

  • Workforce development and infrastructure needs to support future growth

  • Insights into government and industry initiatives shaping the future of microelectronics manufacturing

Whether you're a technologist, strategist, or policymaker, this forum offers a unique opportunity to gain actionable insights into the future of semiconductor packaging and the collaborative efforts driving it forward.

Participate in a U.S. Time Zone:

  • Pacific: 9am–11:00am
  • Mountain: 10am–12:00pm
  • Central: 11am–1:00pm
  • Eastern: 12pm–2:00pm

Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!
 

United States

WEDNESDAY, NOVEMBER 12

9:00 am - 9:05 am
Andrea Valencia, EMD Electronics
Chair, SEMI Texas Chapter
Andrea Valencia
Marketing & Communications
EMD Electronics

Welcome & Opening Remarks​

9:05 am - 9:30 am
Jan Vardeman
Jan Vardaman
Founder & President
TechSearch International

Advanced Packaging Options and the Role of Chiplets

9:30 am - 9:55 am
Larry Dunn, Texas Institute for Electronics
Larry Dunn, PhD
Co-Founder & Senior Director of Business Development
The Texas Institute for Electronics (TIE)

Texas Institute of Electronics and Next-Generation Microelectronics Manufacturing Overview

9:55 am - 10:15 am
Jason Conrad
Jason Conrad
Chief Operating Officer
Arizona State University Knowledge Enterprise

Arizona State University - A Leader in Advanced Packaging

10:15 am - 10:35 am
Lihong Cao, ASE Group
Lihong Cao, PhD
Senior Director, Engineering & Technical Promotion
ASE Group

Empowering AI through Advanced Packaging for Chiplet and Heterogeneous Integration

10:35 am - 10:55 am
Amit Shah, Hyperion
Amit Shah
Director of Sales & Marketing
Hyperion Technologies

Creating a US Fabrication Capabilities for Leading Edge IC-Substrate and 3D-Interconnect Fabrics

10:55 am - 11:00 am
Chase Farnsworth
Chase Farnsworth
Project Development Executive
Mortenson & Chair, SEMI Arizona Committee

Closing Remarks

Workforce Development

The SEMI Arizona & Texas Chapters Present
Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2 REGISTER NOW
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC #27- recorded Business Executive Technical
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A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. 

This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins. 

ABOUT THE SPEAKERS

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.

Peter Doerschuk, PhD

Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
Headshot of Peter
Peter Doerschuk, PhD
Professor
Cornell Engineering
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.

10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-Demand
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Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

United States

SCM

Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.

Choose your session:

9:00 am - 10:00 am Off Add to Calendar 2025-09-23 09:00:00 2025-09-23 10:00:00 2025 Semiconductor Supply Chain survey: Insights for strategy and capabilities Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.Choose your session:US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Speakers

 

Henry Marcil

Partner

McKinsey & Company

Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech)

Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor

 

Kushal Jolapara

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines

Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors

Dan Peacock

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects

Leads Operations projects at Foundries, IDMs, and equipment clients

 

Event Contact:

Krish Dharma

[email protected]

Agenda

•    Lead times throughout the semiconductor value chain
•    Landscape and trends in purchasing agreements and LTAs
•    Demand forecasts, backlogs, and end markets
•    Market outlook, opportunities, and threats
•    New for 2025: Organizational capabilities in supply chain management

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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States standards watch banner image dec 2019 upw Business Technical

Overview

The IRDS Roadmap has identified near-term challenges related to measurements of particles, trace metals and organics in liquid chemicals at levels required to meet the needs of the industry.  The identified challenges are measurement of 10 nm and smaller particles, sub ppt measurement of metallic impurities, measurement of particle precursors and trace organics and online speciation of trace organics.  The focus of the workshop will be on recent advances in analytical methodology and instrumentation that will enable the industry to meet these challenges. 

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

9:00 am
PT
Paul Trio
Director, Standards
SEMI

Welcome

Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific
9:05 am - 9:15 am
don hadder
Don Hadder
OTF Planar Staff IC
Intel

Chemical Quality and Consistency Requirements for the Semiconductor Industry

9:15 am - 9:45 am
Aaron_Hineman
Aaron Hineman
Inorganic Product Line Leader, Americas
PerkinElmer

Analysis of Challenging Semiconductor Chemicals by ICP-MS

9:45 am - 10:15 am
Daniel Wiederin headshot
Daniel Wiederin
President
Elemental Scientific

Addressing IRDS Yield Enhancement Challenges in Liquid Chemical Metrology

10:15 am - 11:00 am
Gary Van Schooneveld headshot
Gary Van Schooneveld
President
CT Associates, Inc.
Derek Oberreit headshot
Derek Oberreit
Chief Technology Officer
Kanomax Holdings
Marie Tripp Headshot
Dr. Marie Tripp
VP of Customer Relations
UNISERS AG

Metrology for Detection of Particle Precursor and Sub-10 nm Particles In Liquids and On-Wafer

11:00 am - 11:30 am
Larry Zazzera headshot
Larry Zazzera, Ph.D.
Corporate Scientist
CT Associates, Inc.
Greg Haugstad headshot png
Greg Haugstad, Ph.D.
Principal Researcher and Technical Director, CharFac
Dept. of Chemical Engineering, University of Minnesota

Identification of Organic Particle Precursors using FTIR-ATR, SERS and AFM-IR

11:30 am
Suhas Ketkar headshot
Suhas Ketkar
Elemental Scientific

Closing Remarks

Standards

SEMI Analytical Workshop

9:00 am - 11:30 am Off Add to Calendar 2025-10-08 09:00:00 2025-10-08 11:30:00 SEMI Liquid Chemicals Analytical Workshop SEMI Analytical Workshop In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

Event format
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This event is over. Contact Laura Nguyen for additional information.

To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step

United States F47 Ad Business Technical

Overview

Since 2018, the SEMI Voltage Sag Task Force—comprising Fabs, Utilities, OEMs, Tool Suppliers, and EPRI—has collaborated to address a persistent challenge: why do tools remain vulnerable to voltage sags despite the implementation of SEMI F47?

Over seven years, the task force has investigated the power quality environment, tool susceptibility, testing methodologies, and mitigation strategies. This deep dive has led to actionable recommendations for strengthening the SEMI F47 standard and improving tool resilience in future builds.

What to Expect

Join us for a comprehensive workshop that will:

  • Review the task force’s findings and collaborative efforts
  • Share insights from key stakeholders
  • Present proposed revisions to the SEMI F47 standard
  • Discuss how these updates can enhance tool performance and reliability

In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States

2:30 pm
PT
Paul Trio
Director, Standards
SEMI

Welcome Remarks

2:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephens
Program Manager
EPRI

SEMI F47 Background & Voltage Sag Immunity Task Force Review

Biography
Mark will present the background of the 7-year effort, the findings from the work , proposed updates and pathways towards improvements and will close out with a summary and next steps.

2:50 pm

Baselining PQ Data from Semiconductor Fabs

3:05 pm
Zack Pike
Zachary Pike
SMTS Facilities Electrical Engineer
GlobalFoundries

Insights from Global Foundries

Biography
Zack will present on Global Foundries experiences with semiconductor tool shutdowns, efforts toward improvement and the types of voltage sags that are still causing tool downtime.

2:20 pm
Clay Burns
Clayton Burns
Principal Engineer, Transmission Planning & Asset Management
National Grid

Experiences from National Grid

Biography
Clay will discuss the power quality environment, relay concepts such as area of vulnerability, and the need for including some level of three-phase voltage sag testing.

3:35 pm
Mark Stephens EPRI
Task Force Leader
Mark Stephen
Program Manager
EPRI

Key Findings from Research and Testing

3:50 pm

Proposed Updates to the SEMI F47 Standard from Task Force Work

4:05 pm

Facilities Korea TC Chapter Input

4:15 pm

Voltage Sag Generator Readiness

4:25 pm - 4:30 pm

Summary and Next Steps

Standards

Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop

This is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design.

2:30 pm - 4:30 pm Off Add to Calendar 2025-10-08 14:30:00 2025-10-08 16:30:00 Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights WorkshopThis is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design. In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
[email protected]

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United States http://flex.semi.org/ 425x187@2_Flex_event_Tile Business Expositions Technical

Phoenix, AZ
United States

- APHI CAST EHS NBMC SCM Smart MFG Smart Mobility Smart MedTech Smart Data & AI SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Standards Workforce Development Off Add to Calendar 2026-02-24 00:00:00 2026-02-26 00:00:00 Flex 2026 Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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Germany Japan South Korea Taiwan United States ESDA Advocacy Webinar Tile 800x800 Business Technical
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Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A staff will present on SEMI’s advocacy efforts, how you can interface with our team in DC, and how we work with member companies to advance key legislative and advocacy priorities in specific policy areas including:

  • Trade and Export Controls
  • Tax Policy
  • CHIPS Implementation
  • Workforce Development

United States

APHI ESD Alliance SiPAT

The ESD Alliance, a SEMI Technology Community, is hosting a free webinar, "SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry," to share how this team can help you navigate global trade complexities and stay ahead of evolving policy challenges. 

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles REGISTER NOW
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States Masterclass #28 Business Executive Technical
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Improved materials are required for progress in fields including printed electronics, semiconductors, aerospace & defense, energy, and life sciences/medical care.  Developing such materials and chemicals involves considerations of performance, cost, manufacturability, safety, and stability.  Scaling production of new materials is a very different challenge than making 50 grams in a laboratory.  Transitioning/commercializing new materials is a separate effort where intellectual property, regulation, quality control, system documentation, supply chain development, and business relationships become key.  This talk will address these aspects of introducing a new material into our enterprise.

ABOUT THE SPEAKER:

Larry Takiff, PhD

Larry Takiff is co-Founder and President of Akita Innovations LLC, a small business in Massachusetts that develops and produces novel chemicals and materials for government and commercial customers.  He founded Akita in 2012 with Lawrence Hancock after working at Polaroid Corporation, Aprilis Inc., and Nomadics/ICx/FLIR Systems.  He is a chemist by training and a businessman by necessity.  At Akita, he has initiated and led projects in materials R&D and pilot production for a variety of government agencies/DoD components and for commercial partners.  Currently he is leading an effort to scale production of a decontamination fluid for the Defense Threat Reduction Agency (DTRA), and a FlexTech project to advance the TRL/MRL of a dielectric ink for printed electronics, as well as several Phase II SBIR development projects.

United States

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Larry Takiff, PhD
President
Akita Innovations LLC
Gity Samadi
Moderator
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.

10:00 am - 11:30 am Off Add to Calendar 2025-11-12 10:00:00 2025-11-12 11:30:00 FEMC#28 Development, Scaling, and Transition of Novel Chemicals & Materials Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success. United States SEMI.org [email protected] America/Los_Angeles public Watch on-demand
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