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Belgium France Germany Ireland Italy United States CLimate Risk Webinar Business Executive
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The SEMI Sustainability Initiative Environmental Risk Mitigation and Reporting (ERMR) working group has been meeting for a year to collaborate on how companies in our industry should respond to the realization of our impact on climate and the growing need for reporting. The ERMR teamed up with Nasdaq to benchmark the industry using Nasdaq's Nasdaq Sustainable Lens™, an AI-powered ESG intelligence platform, to analyze and assess the maturity level of each segment of the semiconductor value chain based on publicly available sustainability and climate information of 100 leading semiconductor companies against TCFD recommendations. 

 

The study identifies strengths, gaps and challenges faced by the industry in implementing recommendations of the Taskforce on Climate-related Financial Disclosures (TCFD). It also offers recommendations on industry best practices to enhance climate disclosure maturity.  Download the report here.

United States

9:00 am - 9:05 am
Mousumi Bhat
Mousumi Bhat, PhD
Vice President
SEMI Sustainability

Introduction

9:05 am - 9:20 am
Alua Suleimenova
Leader, ERMR WG
Alua Suleimenova
Senior Sustainability Program Manager
Marvell

Environmental Risk Mitigation and Reporting in the Semiconductor Industry

9:20 am - 9:30 am
Michael Stiller
Michael Stiller
New Growth Initiatives
Nasdaq

How Nasdaq Benchmarked our Industry

9:30 am - 9:40 am
Jami Haaning
Jami Haaning
ESG Director
Lam Research

Lam Research – TCFD-aligned Governance Structure Supports Net Zero Goals

9:40 am - 9:50 am
Mark Didden ASML
Mark Didden
Senior Manager Sustainability Strategy
ASML

ASML – Climate Scenario Analysis Helps to Prepare Business for Climate Risk

9:50 am - 10:00 am

Questions & Answers

Sustainability

SEMI and Nasdaq are pleased to present this webinar featuring the 5 key takeaways from the recently-released report:  A Rising Tide: Building a Climate-Resilient Semiconductor Value Chain (to be linked to download page).  The report spotlights the maturity of the semiconductor value chain as it moves toward greater climate resilience and develops climate risk mitigation strategies.

 

The webinar features the authors and contributors to the report in a conversation about the status of the industry's outlook on its climate resilience, including case studies with companies analyzing and reporting on their positions.  

 

If you are responsible for or contribute to your company's risk analysis or mitigation strategies, join us for this opportunity to learn how others are approaching this topic, as well as new AI tools to make your job easier

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
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Learning Objectives:

  • Gain a comprehensive understanding of the semiconductor industry and the manufacturing process, design and eco-system of the semiconductor industry and understand the jargon, tools, and materials used in the design and fabrication of an IC
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Who Should Attend:

  • New personnel entering the field
  • Any one wanting an understanding of semiconductor manufacturing

Course Topics:

  • Basic electronics and microelectronics terms and definitions
  • Microelectronics and the role of integrated circuits
  • Define process nodes : explanation of process nodes and how they relate to device performance and cost
  • Device physics and transistor operation: understanding of the physical principles behind device operation and the functioning of transistors
  • Crystal growth and wafer prep: overview of crystal growth techniques used in semiconductor manufacturing
  • Explanation of wafer preparation techniques and materials used
  • FDSOI, fin fets, gate all around (GAA) transistors
  • Circuit design and layout
  • Mask making techniques and materials used in lithography
  • Clean rooms
  • Lithographic techniques
  • Plasma etch, wet etch and cleaning processes
  • Ion implantation
  • Diffusion techniques
  • RTP, CVD, ALD, ALE techniques and their impact on device performance
  • Electro-plating, sputtering
  • Testing
  • Wire bonding
  • Packaging techniques
  • Metrology tools and applications
  • The major players in the semiconductor ecosystem

Instructor:

Denny headshot

Denny Frye 

Course Instructor

PT International, LLC

Biography

 

Germany

- Workforce Development

The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.

Limited time offer!

  • Members: $995 $795
  • Non-members: $1095 $895
  • Students/Veterans: $895 $695

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

Off Add to Calendar 2024-06-18 00:00:00 2024-06-19 00:00:00 Overview of Semiconductor Manufacturing Webinar (EU) The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.Limited time offer!Members: $995 $795Non-members: $1095 $895Students/Veterans: $895 $695* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin Register Now
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Belgium France Germany Ireland Italy 360x317_Event_Calendar_Ad_SU_IntroSemiconductorDesign_EU_v1@2x Business Technical
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To meet the projected worldwide demand for semiconductor devices, the semiconductor industry is demanding technical and non-technical staff and personnel to be well versed in the key elements of integrated circuit (IC) fabrication and design. By taking this course, participants will learn how integrated circuits are designed and fabricated. Essential knowledge for non-technical professionals working in the industry will be obtained. This has been a popular training among those working in our field. In fact, over 120,000 people have taken this course since 1978!

Learning Objectives:

  • Review of the semiconductor industry and technology in laypeople terms. 
  • Understand the basics of semiconductor devices and how they work.
  • Identify the processing technologies and the equipment used to produce them, materials used, and circuit design techniques.

Who Should Attend:

  • New employees in:
    • Manufacturing
    • Engineering
    • Finance
    • Sales
    • Marketing
    • Semiconductor tool personal
    • Material suppliers
    • Training
    • Operators
    • Customer service
    • Attorneys
  • Anyone wanting a basic understanding of the semiconductor industry.  

Course Topics: 

  • Electronic fundamentals
  • Crystal growth and wafer types (Si, SiGe, SOI, SiG, SiC, GaAs)
  • Transistor types such as (bipolar, nMOS, pMOS, CMOS, bi-CMOS, FitFet, Gate All Around transistors)
  • High-k and low-k materials
  • Metal gates and High k gate oxide
  • Basic design and layout concepts
  • Mask making, wafer processing, materials used for fabricating the wafer, tools used for processing the wafer, contamination control, clean room standards, test, assembly, packaging, metrology
  • Various types of semiconductor devices and applications such as memories, MEMS, microprocessors, DSP, analog and power ICs, Etc. 

Instructor:
 

Denny headshot

Denny Frye 

Course Instructor

PT International, LLC

Biography

 

Germany

Workforce Development

Discover the essential secrets behind semiconductor devices! Dive into the intricate world of integrated circuit fabrication and design with our comprehensive course. Ideal for both technical and non-technical professionals, this training has been a cornerstone for the industry for over four decades, attracting over 120,000 eager learners since 1978. Join us and equip yourself with the vital knowledge needed to thrive in the semiconductor industry.

Limited time offer!

  • Members: $845 $645
  • Non-members: $945 $745
  • Students/Veterans: $745 $545

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

9:30 am - 5:30 pm Off Add to Calendar 2024-06-17 09:30:00 2024-06-17 17:30:00 Introduction to Semiconductor Design and Fabrication for Non-Techies Webinar (EU) Discover the essential secrets behind semiconductor devices! Dive into the intricate world of integrated circuit fabrication and design with our comprehensive course. Ideal for both technical and non-technical professionals, this training has been a cornerstone for the industry for over four decades, attracting over 120,000 eager learners since 1978. Join us and equip yourself with the vital knowledge needed to thrive in the semiconductor industry.Limited time offer!Members: $845 $645Non-members: $945 $745Students/Veterans: $745 $545* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin Register Now
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REGISTRATION

Register for free to access the on-demand webinar.

United States REGISTER NOW FOR ON-DEMAND Silvaco Webinar Drupal Thumbnail 690x448 Business Executive

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at this virtual webinar.

Contact Eric Rude, [email protected] to learn about available sponsorship opportunities.

This webinar presents a comprehensive methodology for the design and optimization of a 1200V Silicon Carbide (SiC) Double-Diffused Metal-Oxide-Semiconductor Field-Effect Transistor (DMOS FET) utilizing Silvaco's TCAD platform. Adhering to industry best practices, the construction of an accurate digital twin is also presented, ensuring conformity to real-world performance characteristics. Moreover, we outline strategies to streamline simulation workflows, emphasizing techniques to boost design efficiency and productivity.

In parallel, this webinar explores the transformative impact of Machine Learning (ML) on traditional device design practices. By harnessing ML algorithms, a fundamental shift occurs in the approach towards device design, enabling process and device engineers to extract insights from vast datasets, optimize performance, and expedite the design iteration process.

Additionally, the necessity of incorporating compact modeling into the design flow is underscored. Compact modeling serves as a crucial component in capturing device behavior accurately, enabling efficient circuit-level simulations and facilitating rapid prototyping of devices. The integration of compact modeling enhances the design process, facilitating a more holistic understanding of device behavior and performance characteristics.

Through the integration of TCAD, simulation optimization, ML techniques, and compact modeling, this webinar demonstrates a synergistic approach towards device design, fostering innovation, precision, and efficiency.

This Virtual Webinar is from 10:00-11:00am PT.

United States

Virtual Webinar | Wednesday, June 25, 2024 | Pacific Time

10:00 am
David Green, Silvaco
David Green, PhD
Senior Staff Field Applications Engineering
Silvaco
Bogdan Tudor, Silvaco
Bogdan Tudor, PhD
Head of Device Characterization
Silvaco
10:45 am
Nathan Bozeman, Silvaco
Nathan Bozeman
Director of Marketing
Silvaco
David Green, Silvaco
David Green, PhD
Senior Staff Field Applications Engineering
Silvaco
Bogdan Tudor, Silvaco
Bogdan Tudor, PhD
Head of Device Characterization
Silvaco
Thomas Jokinen, Silvaco
Thomas Jokinen, PhD
TCAD Product Marketing Engineer
Silvaco

Q&A Panel Discussion

10:55 am

Closing Remarks

NOW AVAILABLE ON-DEMAND

Register now to access the free on-demand webinar in collaboration with Silvaco!

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Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Watch Now 800x800 Earth Month Lightning Talks Business Executive
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United States

9:00 am - 9:02 am
Wojtek Osowiecki
Lam Research & Co-Leader SEMI CESI Working Group

Welcome

9:02 am - 9:10 am
John Niggley
Tualatin Facilities Manager
Lam Research

The power of facilities management for sustainability

9:10 am - 9:18 am
Gregory Woods
Sr. Equipment Engineer Plasma
ASML

Environmental Stewardship: An ERG Perspective

9:18 am - 9:26 am
Patrick McCrummen
Community Impact Leader
DuPont

Empowering people to thrive

9:26 am - 9:34 am
Ron McCune
Sr. Director, Strategic Planning
TEL

Raising Awareness on People, Planet and Profit through internal campaigns

9:34 am - 9:42 am
Werner Haberstock
Advantest

Employee activities at Advantest - Planet vs Plastic, beach clean-up, tree planting, and more!

9:42 am - 9:50 am
Paola Gonzalez Aguirre
Entegris

Sustainable Packaging solutions

9:50 am - 9:58 am
Laurens Polgar
NXP

Sustainability Portfolio

9:58 am - 10:00 am
Justin Harris
Climate Equity Collaborative & Co-Leader, CESI

Wrap Up & Follow Up

Sustainability

Discover how other semiconductor companies center climate and social impact during Earth Month.  Explore the transformative potential of employee initiatives in enhancing environmental sustainability, employee-driven climate action, equity, and advancing their goals with this webinar recorded April 19, 2024.  You will find great ideas for using in your company to build employee morale and bond over taking action to protect, clean and plan for a cleaner, healthier tomorrow. 

 

During the first-ever SEMI Earth Month Lightning Talks, organized by the Climate Equity and Social Impact (CESI) working group. speakers from across our industry presented on the initiatives and achievements of ESG innovation, and employee impact.  They discussed new climate equity activities, with some great technology innovation thrown in. 

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
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Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $75

Students:  Free

Contact [email protected] with a picture of your student ID to receive your discount code.

Belgium France Germany Ireland Italy United States FEMC 18 Tile Recorded Business Executive Featured Speakers
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Bio

The Department of Defense needs non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath. Currently, fieldable instruments for gas analysis are large (>0.5 cubic feet), expensive (>$50,000), and slow. Hand-held devices are limited to identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOC sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interfacing necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein-level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ/tissue-based, cell-based, and protein-based modalities.

ABOUT THE SPEAKER

Dr. Elisabeth Steele is a biomedical engineer at Blue Halo serving as a Lead Scientist and Team Lead supporting sensor development at the Air Force Research Laboratory (AFRL). Her expertise is in neural tissue engineering and electrophysiology with recent focus in the design and testing of biohybrid gas sensors inspired by insect olfaction. Dr. Steel conducted neuromodulation research as a post-doctoral fellow with Dr. Tim Bruns at the University of Michigan. Additionally, she served as a Technical Sales Engineer with NeuroNexus Technologies, the industry leader in microelectrode array technology for neuroscience electrophysiology applications. She received her PhD (2018) and M.S. (2013) in Biomedical Engineering from Wayne State University in Detroit, Michigan. She completed her B.S. in Bioengineering in 2007 from University of Toledo.  
 

United States

Dr. Elisabeth Steele
Dr. Elisabeth Steele
Lead Scientist and Team Lead
UES
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar features Dr. Elisabeth Steele of UES covering the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Watch Now!
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Registration

Registration

Early-bird Registration Close: Friday, May 24 / 5:00pm in KST

[Early Bird]

· SEMI Member: KRW 308,000
· Non-Member: KRW 363,000

[Regular]

· SEMI Member: KRW 385,000
· Non-Member: KRW 385,000

 

※ Registration fee includes lunch and reception.

Registration
South Korea Registration SMC-Korea-2024-Banners-squre.jpg Business Technical

OVERVIEW

  • Date: May 29(Wed), 2024
  • Time: 09:00 - 18:30
  • Venue: Convention Hall 2, 3F, Suwon Convention Center

 

NOTICE

  • Simultaneous interpretation will be provided
  • Presentation files agreed by speakers will be provided to attendees.

 

SPONSORS

SMC-Korea-2023-Sponsor_DW.jpg SMC-Korea-2023-Sponsor_DP.jpg SMC-Korea-2023-Sponsor_JSR.jpg SMC-Korea-2023-Sponsor_ET.jpg
SMC-Korea-2023-Sponsor_DS_0.jpg Air LiquideHuntsman
 
line_2.jpg

 

CONTACT

Convention Hall 2, 3F, Suwon Convention Center
Suwon-si
Gyeonggi-do
South Korea

10:00 am - 10:05 am
 Hyun-Dae (H. D.) Cho - President, SEMI Korea
HD Cho
President
SEMI Korea

Welcome

10:05 am - 10:35 am
seongtae oh
Seong Tae Oh
Fellow
TEL

Process Technologies for Continuous Scaling of Logic Devices

The rapid growth of AI, big data, IoT, and 5/6G communication necessitates the sophisticated computing power and efficiency of semiconductor devices, driving demand for various components such as HPC, GPU, ASIC, FPGA, and HBM. Semiconductor device and equipment industries are also challenging various new technologies to accommodate such diversifying applications and proceed with sustainable development in the era of AI and ICT.
According to the roadmap over the next 10 years, semiconductor technologies are expected to develop into the scaling technologies to further extend the existing Moore's Law and hybrid device technologies that integrate legacy nodes and advanced nodes into one. Therefore, in this presentation, we will look at the latest logic technology roadmap and introduce new process technologies to implement it.

※ Biography

10:35 am - 11:00 am
Wonho Yeon
Wonho Yeon
Research Fellow
KIEP

Supply Chain Management

11:00 am - 11:25 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting

Localization Challenges of the Materials Supply Chain

11:25 am - 11:50 pm
Stefan CHITORAGA
Stefan CHITORAGA
Technology and Market Analyst- Packaging & Assembly
Yole Group

Material Trends in Advanced Packaging & Power Module Packaging (video recording)

11:50 am - 1:00 pm

Lunch

1:00 pm - 1:25 pm
Dr. Montray C. Leavy
Montray C. Leavy
Deputy CTO
Entegris

Materials Innovation Advancing the Angstrom Era

Materials innovation within the Semiconductor industry has been a driving force since the planar 2D MOSFET to the current 3D gate-all-around (GAA) transistor architectures and will continue its criticality as we embark on 500-layer flash memory designs and Angstrom level critical interconnect dimensions. To achieve these once incomprehensible levels of lateral and vertical scaling, device design engineers and manufacturers are increasingly relying on disruptive materials innovation to enable the density and performance gains required at each successive technology node. As the performance requirements for the most advanced devices become more challenging, materials have shown to have an increased contribution to device performance over scaling and design. This has led to a greater portion of the periodic table being incorporated into semiconductor processing.

The integration of new materials, such as novel photoresists, interconnect metals & alloys, ultra-pure polymers, chemically modified polymer membranes, and formulated chemicals, into the chip fabrication increases process complexity and makes yield ramps more challenging. With more process steps in the overall device build, speed to yield and process integrity are more critical than ever to achieve technology qualification schedules. This presentation will focus on Entegris’ approach to materials innovation, the integration of these novel materials coupled with co-optimized solutions enabling industry technology roadmaps and yield requirements while preserving integrity of delivery and process control.

※ Biography

1:25 pm - 1:50 pm
Sadaaki Katoh
Sadaaki Katoh
JOINT2 Team Manager
Resonac

Advanced Packaging Materials and Evaluation Platform at Resonac

Resonac has started Packaging Solution Center as new R&D center to propose one-stop solution for customers in 2018 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package in October, 2021.

2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package.
The presentation will cover the significance and strengths of JOINT2, and updates on research and development.

※ Biography

1:50 pm - 2:15 pm
seonjun heo.png
Seongjun Heo
Process Engineering Director
Lam Research

Dry Resist for Holistic EUV Patterning

EUV lithography infrastructure has become the critical element of semiconductor industry to enable the device scaling down. It consists of not only light source, optical system but also masks, photoresist. The EUV stochastic effects present challenges to optimizing EUV resist resolution, line edge roughness, and sensitivity simultaneously. To overcome these challenges, Lam introduced the new dry resist combined with the new dry development technology.

Lam’s EUV dry resist, coupled with ASML’s EUV scanners and Lam’s holistic patterning solutions, will extend the patterning roadmap (Moore’s Law) for the next 10 years and beyond by offering a high-resolution, high-fidelity, defectivity-free, and greener solution for ≤32nm pitch L/S, and ≤40nm pitch pillar and contact hole EUV patterning in the fab. EUV dry resist technology also has been validated demonstrating superior dose-to-defectivity for <32nm pitch L/S, well suited for logic applications. Lam’s EUV dry resist is uniquely suited for future HiNA EUV patterning thanks to robust resist thickness scaling while maintaining high etch selectivity and high contrast.

※ Biography

2:15 pm - 2:30 pm

Break

2:30 pm - 2:55 pm
김용성
Yongsung Kim
TL
SK hynix

Sustainability Challenges of the Semiconductor Industry

As demand for chips surge, the semiconductor industry is struggling to reduce its environmental footprint. While the environmental impacts of semiconductor (and electronic products that depend on them) have mostly been liked to ‘manufacturing’ and ‘use’ phases of products which consume a significant amount of water and energy, the attention is shifting to the 'material extraction’ and ‘end-of-use’ phases of products following concerns over the e-waste issue. In this presentation, I will focus on the latest findings of the global e-waste challenge, what this means from the materials perspective, and its implications to product design and manufacturing. I will also introduce SK hynix's strategy and targets towards improving the circularity of products, and our partnership with customers/vendors to achieve a common goal.

2:55 pm - 3:20 pm
Eun-Ho Sohn
Eunho Sohn
Head of Interface Materials and Chemical Engineering Research Center
KRICT

Trends in Regulation of PFASs (per- and polyfluoroalkyl substances) and Technological Development Strategies

Fluorine compounds exhibit exceptional physical properties that set them apart from other organic materials. Consequently, they have been utilized as core materials to enhance the functionality, performance, and value of products across various key industries including electrical and electronics, semiconductors, displays, and automobiles.
However, on March 22nd of last year, the European Chemicals Agency (ECHA) issued a report imposing restrictions on the usage of over 10,000 types of per- and polyfluoroalkyl substances (PFASs) across all industries, sparking significant upheaval within the sector.
In this presentation, we will learn in detail about the definition of PFAS, and the content, progress, and schedule of PFAS regulations in Europe and the United States, and contemplate the direction of future technology development.

※ Biography

3:20 pm - 3:45 pm
김광섭
Karl Kim
APAC Semiconductor Marketing Manager
Syensqo

Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain

As semiconductors become more advanced and the fabrication processing conditions more extreme, the essentiality of a sustainable and secure fluorinated material supply chain plays a vital role in the future of semiconductor manufacturing. The principles of developing this supply chain are directly aligned to support the sustainability and emission roadmaps of the semiconductor industry. Syensqo will introduce the following content:
1) Priorities when Specifying Materials for a Sustainable Supply Chain
2) The Key to Sustainability - Application Segmentation
3) Case Studies

※ Biography

3:45 pm - 4:10 pm
dupont_Jae Hwan Sim
Jae Hwan Sim
R&D manager/Korea R&D EUV team leader
DuPont

Innovating Safe and Sustainable by Design: Strategies and Steps toward Reduction of Substances of Concern in Photolithography Materials

Growing scientific evidences suggest that certain per- and polyfluoroalkyl substances (PFAS) pose global environmental and health risks. In response, global governments are contemplating measures to limit the use of these chemicals in various industries. However, specific types of PFAS are indispensable and no substitutes are currently available for most chip manufacturing applications in the semiconductor industry. Aligned with the objective of Safer and Sustainable by Design, DuPont has launched a comprehensive program to reduce PFAS usage in photoresist and associated lithography materials. In this presentation, we will provide an overview of DuPont's innovative initiatives and technical challenges encountered in this endeavor.

※ Biography

4:10 pm - 4:35 pm
Floris Buijzen
Floris Buijzen
Senior Director Product Management
Corbion

CORBION: PURASOLV® ELECT for a more Sustainable Semiconductor Manufacturing

Solvents are used extensively in the semiconductor manufacturing process. Solvents are estimated to be responsible for around 7% of the Scope 3 emissions of the semiconductor industry. The typical solvents that are used are produced from fossil resources and with that not in line with net zero ambitions. For more than 20 years Corbion has been supplying biobased ethyl lactate to the semiconductor industry under it’s brand name PURASOLV® ELECT, meeting the stringent requirements of the industry. Typical applications are photoresist for i/g-line / KrF / ArF / EUV, RRC, Edge bead removal and as thinner. Biobased ethyl lactate is sustainable and safe by design: it is produced from renewable resources, non-toxic and safe to workers, biodegradable and offers a significant carbon footprint reduction compared to incumbent solvents. Switching to biobased ethyl lactate thus enables more sustainable semiconductor manufacturing.

※ Biography

4:35 pm - 4:50 pm

Break

4:50 pm - 5:20 pm
ki ill moon
Ki-Ill Moon
VP
SK hynix

Technology and Future of Semiconductor Packaging Materials

The technological advancement of semiconductor materials is a key factor along with the technological advancement of the process. And recently, the importance of Advanced PKG is increasing, and SK Hynix has achieved the result of improving product performance by developing MR-MUF materials. This proves the importance of materials. In the future, there are more packaging challenges for high-speed memory products such as HBM, and I plan to announce Need for material development to satisfy them.

※ Biography

5:20 pm - 5:50 pm
Seongjun Park
Sungjun Park
Executive Vice President and Head of Material Development Team
Samsung Electronics

Big Challenges for Small Worlds

The number of transistors in semiconductor chip has been increased twice every two years for more than 50 years, following the famous Moore’s Law and somehow, it was taken to be granted. In reality, it was a big accomplishment with an unimaginable amount of efforts and collaborations, including the development of new materials.

New material has been developed and introduced to improve the performance and capacity of electronic devices through smaller design rules. New Photo Resists (PR) for higher resolution with smaller defects and higher uniformity were developed. And Precursors were also developed to meet the process challenges for the smaller design rules, such as higher aspect ratios. High etch selective Etchant and CMP Slurry with low scratch were requested. And the requirements in new materials are getting tougher and stronger with the evolution of AI, which needs more computing power than ever. Even materials that has never been expected in industry and has been studied only in academia are being actively considered.

Even the worse, the surrounding situation for material development and manufacturing is getting tougher. Environmental regulations are getting tighter. Gases with high global warming potential were begun to be replaced. Recently, EU announced banning PFAS materials in near future and US raised bars for PFAS materials. And carbon zero policy is coming to us slowly but firmly.

In this talk, we will discuss the current status and future direction of material research. We will discuss the development directions to improve the performance of devices and to consider environmental regulations. And we will discuss the virtue of working together as a big one-team to overcome all the obstacles mentioned above in the world of extreme technology.

※ Biography

5:50 pm - 6:30 pm

Networking Reception

EMG

Materials Resilience: Navigating Challenges, Embracing Opportunities

Currently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.
These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts.

10:00 am - 6:30 pm Off Add to Calendar 2024-05-29 10:00:00 2024-05-29 18:30:00 SMC Korea 2024 Materials Resilience: Navigating Challenges, Embracing OpportunitiesCurrently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts. Convention Hall 2, 3F, Suwon Convention Center Suwon-si Gyeonggi-do South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
United States Register Pulsus webinar Business Technical Featured Speakers
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Arjen Janssens, Senior Director PLD, Lam Research Corporation

 

Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.

 

 

Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.

United States

arjen janssens
Dr. Arjen Janssens
MSIG

And yes, we’ve got a solution for that.

MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.

Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.

In this webinar, discover Lam Research’s solution a pioneering approach to thin film deposition.

8:00 am - 9:00 am Off Add to Calendar 2024-03-27 08:00:00 2024-03-27 09:00:00 Enabling PiezoMEMS applications for today and tomorrow And yes, we’ve got a solution for that.MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition. United States SEMI.org [email protected] America/Los_Angeles public
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Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #3.

Taylor Zhao
Manager, Programs & Committees
[email protected]

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SiC—Silicon Carbide Webinar #3: Bidirectional SiC and GaN Switch Technology

There are numerous mass volume power applications where it is necessary to control the flow of bidirectional power, including electric vehicles (vehicle to grid, vehicle to home, and vehicle to vehicle), distributed and grid-tie power systems using regenerated energy and/or energy storage components, and solid-state circuit breaker protection. Silicon carbide (SiC) and gallium nitride (GaN) based bidirectional power switches can enable these applications with their compelling advantages of high efficiency, high blocking voltage capability, and low system weight and volume.  In particular, monolithic switches that allow for bidirectional symmetric conduction and voltage blocking with a chip area close to that of a similarly rated unidirectional switch are ideally suited to fuel a revolution in power electronics technology. Today, monolithic bidirectional (MBD) power semiconductor switches are not commercially available. Instead, back-to-back (anti-series) connection schemes of unidirectional power MOSFETs or IGBTs are typically used, resulting in a 4X penalty in chip area and high cost. However, various types of SiC and GaN bidirectional concepts are being investigated including bonded-wafer bidirectional IGBTs, monolithic dual-gate bidirectional GaN switches, and monolithic back-to-back connected SiC MOSFETs and JFETs.


In this presentation, the semiconductor technology of SiC and GaN bidirectional switches will be reviewed including their operating principles, and their lateral and vertical geometry configurations. The performance advantages of MBD switches will be highlighted. Promising MBD devices reported to date will be analyzed, and the key bidirectional switch applications of solid-state circuit breakers and current-source-inverters will be discussed. As SiC and GaN devices approach mass commercialization propelled by insertion in electric vehicles and consumer electronics, respectively, fabrication of SiC/GaN MBD switches is becoming economically viable enabling their wide adoption in key volume applications. 

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level 
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online for the third webinar in the Silicon Carbide Series as we review the semiconductor technology of SiC and GaN bidrectional switches, analyze promising MBD devices, and discuss the key bidrectional switch applications of solid-state circuit breakers and current-source-inverters. 

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1
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For general questions and inquiries, please contact [email protected]

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Updated time:

Day 1: 8:30 am - 5:30 pm PT
Day 2: 8:30 am - 12:30 pm PT

Registration will be closed at 12:00am on May 7.

Learning Objectives:

  • Gain a comprehensive understanding of the semiconductor industry and the manufacturing process, design and eco-system of the semiconductor industry and understand the jargon, tools, and materials used in the design and fabrication of an IC
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Who Should Attend:

  • New personnel entering the field
  • Any one wanting an understanding of semiconductor manufacturing

Course Topics:

  • Basic electronics and microelectronics terms and definitions
  • Microelectronics and the role of integrated circuits
  • Define process nodes : explanation of process nodes and how they relate to device performance and cost
  • Device physics and transistor operation: understanding of the physical principles behind device operation and the functioning of transistors
  • Crystal growth and wafer prep: overview of crystal growth techniques used in semiconductor manufacturing
  • Explanation of wafer preparation techniques and materials used
  • FDSOI, fin fets, gate all around (GAA) transistors
  • Circuit design and layout
  • Mask making techniques and materials used in lithography
  • Clean rooms
  • Lithographic techniques
  • Plasma etch, wet etch and cleaning processes
  • Ion implantation
  • Diffusion techniques
  • RTP, CVD, ALD, ALE techniques and their impact on device performance
  • Electro-plating, sputtering
  • Testing
  • Wire bonding
  • Packaging techniques
  • Metrology tools and applications
  • The major players in the semiconductor ecosystem

Instructor:

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Denny Frye 

Course Instructor

PT International, LLC

Biography

 

SEMI Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035
United States

- Workforce Development

The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.

Limited time offer!

  • Members: $1295 $1195
  • Non-members: $1495 $1395
  • Students/Veterans: $1195 $1095

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
* Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day.

Off Add to Calendar 2024-05-08 00:00:00 2024-05-09 00:00:00 Overview of Semiconductor Manufacturing The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.Limited time offer!Members: $1295 $1195Non-members: $1495 $1395Students/Veterans: $1195 $1095* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]* Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day. SEMI Headquarters 673 S Milpitas Blvd Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public Register Today