Printed Devices for High-Temperature Applications in Aerospace
Abstract
This presentation will start with an introduction on the use of additive, printed electronics to fabricate components and advanced packaging technologies for use in high-temperature Aerospace applications. The use of direct-write conformal printing for the manufacturing of circuits and passive electronic components will be discussed. Materials testing and reliability methods will be reviewed and examples of radiofrequency (RF) devices will be provided. Also, the fabrication of an all-additive, 3D package for embedding and interconnecting RF chips will be described in detail. In the second half of the talk, updates on a SEMI-FlexTech funded collaboration between GE Aerospace, Binghamton University, and the Georgia Institute of Technology will be provided. Results from material testing and qualification for operation at 1000 ºC environments will be discussed. In addition, test results obtained with a passive RF (wireless) temperature sensor will be presented to illustrate the functionality and advantages of the printed device. Next steps will be summarized, and lessons learned throughout the first half of the project will be discussed. This will lead to the identification of the main technical gaps encountered so far in the program. They will be presented to conclude the talk with the intent of contributing to follow-on discussions during the workshop.
Biography
Dr. Felippe Pavinatto is a Material Scientist and Engineer that has been working with additive electronics manufacturing for over 14 years in academia and industry. His expertise is centered on advanced materials, electronic inks formulation and direct-write, conformal, panel-based and roll-to-roll (R2R) printed electronics technologies. Over the years, Dr. Felippe has used his additive manufacturing specialization for developing scalable fabrication processes for flexible hybrid electronic (FHE) in the fields of bioelectronics, energy devices, and wearable electronics. Since joining GE Aerospace in early 2023, his research focus has been on high-temperature electronic inks, printed components and devices; conformal direct-write 3D printing manufacturing; and additive electronics packaging. Dr. Felippe has been committed throughout his career to generating innovative technologies and solutions to meet industrial demands via collaborative and multi-disciplinary research projects.