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SEMI Members: $25
Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members: $50

Students: Contact Paul Cohen ([email protected]) for student pricing.

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Germany Taiwan United States ESDA Savage on Security 3 360.jpg Technical

Designing functionally correct, high-performance, and provably secure system-on-chips (SoCs) has become a strategic imperative for modern computing infrastructure. Yet traditional design and verification methodologies are increasingly strained by escalating complexity, massive design scales, heterogeneous integration, and rapidly evolving security threats. Ensuring correctness, scalability, comprehensiveness, and adaptability across the full SoC lifecycle now exceeds the practical limits of conventional toolchains and human-centric workflows.

The emergence of large language models (LLMs) introduces a transformative opportunity for SoC design automation. Beyond natural language understanding and code generation, advanced LLMs demonstrate capabilities in architectural reasoning, specification refinement, vulnerability analysis, and design-space exploration. However, monolithic models alone are insufficient for the multidisciplinary and iterative nature of chip design. An agentic paradigm—where specialized LLM-driven agents collaborate within a coordinated framework—enables modular reasoning, cross-layer verification, security validation, and adaptive decision-making throughout the design process.

This talk will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. The framework integrates design synthesis, threat modeling, formal reasoning, runtime monitoring strategies, and hardware–software co-verification into a cohesive workflow. Looking ahead, such agentic systems point toward a future of self-optimizing, security-aware, and continuously verified silicon—where AI-driven design environments not only accelerate innovation but also fundamentally redefine how we conceive, build, and trust next-generation microelectronic systems.

 

United States

Sep 10, 2026 ESD Alliance

This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification.

ESD Alliance Webinar: Gen-AI for Chip Design and Security

A Look Into the Future

9:00 am - 10:00 am Off Add to Calendar 2026-09-10 09:00:00 2026-09-10 10:00:00 ESD Alliance Webinar: Gen-AI for Chip Design and Security This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. United States SEMI.org [email protected] America/Los_Angeles public May 27, 2026 America/Los_Angeles Register Now

Japan standards Technical

SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Jun 19, 2026 Standards

Automation Technology Japan TC Chapter Meeting 

Date: Friday, June 19, 2025

Time: 1:30 PM - 3:00 PM (JST)

via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)

Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed.

 

AGENDA

 

Standards Contact Information:

Nahoko Koga

Coordinator, Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

 

Questions? Contact your local staff coordinator: Click here

1:30 pm - 3:00 pm Off Add to Calendar 2026-06-19 13:30:00 2026-06-19 15:00:00 Automation Technology Japan TC Chapter Meeting Automation Technology Japan TC Chapter Meeting Date: Friday, June 19, 2025Time: 1:30 PM - 3:00 PM (JST)via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed. AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public May 12, 2026 Asia/Tokyo

Japan standards Technical

SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi
Chiyoda-ku, Tokyo
1010005
Japan

Jun 5, 2026 Standards

3D Packaging & Integration  Japan TC Chapter Meeting 

Date: Friday, June 5, 2026

Time: 2:00 PM - 4:00 PM JST

via OVTCCM/ SEMI Japan Office (Hybrid)

 

AGENDA

 

Standards Contact Information:

Akiko Yoshida

Manager, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 4:00 pm Off Add to Calendar 2026-06-05 14:00:00 2026-06-05 16:00:00 3D Packaging & Integration Japan TC Chapter Meeting 3D Packaging & Integration  Japan TC Chapter Meeting Date: Friday, June 5, 2026Time: 2:00 PM - 4:00 PM JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Akiko YoshidaManager, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1010005 Japan SEMI.org [email protected] Asia/Tokyo public May 4, 2026 Asia/Tokyo

United States AI Techniques in Semiconductor MFG Business Executive Technical

Suggested Hotels:

Embassy Suites by Hilton Milpitas Silicon Valley

901 East Calaveras Boulevard

Milpitas, CA 95035

(408) 942-0400

 

Courtyard by Marriott Milpitas Silicon Valley

1480 Falcon Dr.

Milpitas, CA 95035

(408) 719-1966

 

Embassy Suites by Hilton Milpitas Silicon Valley Courtyard by Marriott Milpitas Silicon Valley

Sponsorship Opportunities

Enhance your brand with our exclusive sponsorship packages. For details, contact:

Karim Somani
Email: [email protected]

_{^{AI Techniques in Semiconductor Manufacturing}}

Core Objectives:

This workshop is designed to help participants understand:

• The real-world deployment, impact, and lessons learned from AI techniques

• Strategies for building observable and scalable multi-agent workflows

• The industry transition from restrictive data silos toward autonomous discovery.

• Methods for achieving tangible business results and automation through diverse AI applications 

We’ve curated a technical agenda featuring Topics such as:

• Agentic AI

• Gaussian Process Regression

• Time Series Modeling

• Bayesian Optimization

• And more...

You will walk away with actionable insights on:

• Yield Enhancement through Edge-Driven Defect Detection and Classification
  • Demonstrates how edge AI leverages real-time sensor and image data—through virtual metrology, anomaly detection, and SPC-integrated feedback loops—to enable early defect detection, classification, and yield optimization.
• From Prediction to Action: Causal AI for Real-Time Root-Cause Analysis in Semiconductor Manufacturing

  • How causal AI unifies multi-modal fab data into an intelligence layer to move beyond predictive alerts toward rapid root cause identification, prescriptive actions, and continuous improvement—significantly reducing RCA time and improving yield and operational efficiency.

• From Data Silos to Autonomous Discovery: Agentic AI in Semiconductors

  • Agentic AI in semiconductor workflows as autonomous, decision-making systems (beyond RAG) that orchestrate multi-agent reasoning across complex fab data—requiring robust data foundations, domain-grounded algorithms, SME-driven knowledge (including reasoning traces), and structured evaluation frameworks (agentic harness) to ensure reliable, scalable deployment.

• Making Sense of Equipment Time‑Series Data: From Signals to Insight
  • Introduces how semiconductor equipment time-series data (sensor signals, traces, run-to-run data) can be processed and modeled to uncover equipment behavior over time, enabling engineers to detect drift, changes, and anomalies for improved monitoring and troubleshooting.
• Achieving Business Results from Air-gapped Agentic AI Automation in Semiconductor Manufacturing - Lessons from the Field
  • Highlights real-world deployment of agentic AI in fabs, demonstrating how autonomous systems are driving yield, capacity, and operational gains across engineering workflows (FDC, yield, test, maintenance) while navigating constraints like data privacy and legacy integration—along with practical adoption strategies and hands-on use cases.
• And more...

 

SEMI HQ
673 S Milpitas Blvd.
Milpitas, CA 95035
United States

Aug 5, 2026 - Aug 6, 2026 Smart MFG

 

The SEMI Smart Manufacturing Initiative is hosting a two-day workshop titled "AI Techniques in Semiconductor Manufacturing" at SEMI HQ in Milpitas, CA, on August 5–6, 2026. This event is part of a continuing series focused on integrating advanced AI into the semiconductor landscape. The workshop is designed to help participants understand: The real-world deployment, impact, and lessons learned from AI techniques. Strategies for building observable and scalable multi-agent workflows. The industry transition from restrictive data silos toward autonomous discovery. Methods for achieving tangible business results and automation through diverse AI applications.

AI Techniques in Semiconductor Manufacturing

[IN-PERSON EVENT]
Aug 5-6, 2026

8:00 am - 5:00 pm Off Add to Calendar 2026-08-05 08:00:00 2026-08-06 17:00:00 AI Techniques in Semiconductor Manufacturing  The SEMI Smart Manufacturing Initiative is hosting a two-day workshop titled "AI Techniques in Semiconductor Manufacturing" at SEMI HQ in Milpitas, CA, on August 5–6, 2026. This event is part of a continuing series focused on integrating advanced AI into the semiconductor landscape. The workshop is designed to help participants understand: The real-world deployment, impact, and lessons learned from AI techniques. Strategies for building observable and scalable multi-agent workflows. The industry transition from restrictive data silos toward autonomous discovery. Methods for achieving tangible business results and automation through diverse AI applications. SEMI HQ 673 S Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public May 29, 2026 America/Los_Angeles Register Now

Registration

• SEMI Member:  $249

• Non-Members:  $349

 

Cancellation Policy

Cancellation Policy:

Cancellation request received on or before August 12 will be eligible for a refund. After this date, only substitutions will be accepted.  Please email your cancellation request to Agnes Cobar at [email protected]. Substitutions will only be accepted with written permission from the originally registered attendee.

Event Contact

For questions, please contact Pushkar Apte at [email protected]

+

Register Now

United States FOC 2026 Tile Business Executive Technical

Artificial intelligence (AI) continues to grow rapidly, driving unprecedented transformation. And for all the hype, the best is yet to come! But AI's energy footprint is growing rapidly and the global “data center gold rush” is already straining energy grids and natural resources around the world. This is a formidable challenge that cannot be ignored.

For industry, this is a strategic business imperative. AI access costs are mounting, and there is increasing stakeholder pressure to show ROI on AI investments. Competitive advantage derives from running AI systems as efficiently as possible, maximizing performance and minimizing energy consumption. And for the next big application of physical AI, efficiency becomes absolutely critical.

No entity can address this alone. The SEMI Smart Data-AI Initiative has been working to build a meaningful collaboration across the entire AI ecosystem to “bend the curve.” In this workshop, together with our alliance partner San Jose, we bring together distinguished leaders across the spectrum to share insights and chart the future course. Please join us at this exciting interactive event.

Mexican Heritage Plaza
1700 Alum Rock Ave
San Jose, CA 95116
United States

Sep 9, 2026 Smart Data & AI

Future of AI Computing

Bending the Curve for Power & Performance
[In-Person Event]

8:00 am - 6:45 pm Off Add to Calendar Disabled Jun 12, 2026 America/Los_Angeles

Alliance Partner

The SEMI Smart Data-AI Initiative is organizing this workshop with our Alliance Partner, the City of San Jose. We are uniting the entire AI ecosystem including devices, materials, packaging, photonics, quantum, architectures and algorithms. Please join us in this exciting interactive workshop.

Register Now

Japan Standards Technical

SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi
Chiyoda-ku, Tokyo
1000005
Japan

May 21, 2026 Standards

Liquid Chemicals Japan TC Chapter Meeting 

Date: Thursday, May 21, 2026

Time: 3:30 pm - 5:30 pm JST

Venue: SEMI Japan Office + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

Liquid Chemicals Japan TC Chapter Meeting

3:30 pm - 5:30 pm Off Add to Calendar 2026-05-21 15:30:00 2026-05-21 17:30:00 Liquid Chemicals Japan TC Chapter Meeting Liquid Chemicals Japan TC Chapter Meeting Date: Thursday, May 21, 2026Time: 3:30 pm - 5:30 pm JSTVenue: SEMI Japan Office + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Apr 19, 2026 Asia/Tokyo

Japan standards Technical

Otemachi PLACE HALL & CONFERENCE
Otemachi PLACE East Tower
2-3-1 Otemachi,
Chiyoda-ku, Tokyo
1000004
Japan

May 21, 2026 Standards

Physical Interfaces & Carriers Japan TC Chapter Meeting 

Date: Thursday, May 21, 2026

Time: 9:00 am - 12:00 pm JST

Venue: Room 102 @ Otemachi PLACE HALL & CONFERENCE + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

Physical Interfaces & Carriers Japan TC Chapter Meeting

9:00 am - 12:00 pm Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 12:00:00 Physical Interfaces & Carriers Japan TC Chapter Meeting Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Thursday, May 21, 2026Time: 9:00 am - 12:00 pm JSTVenue: Room 102 @ Otemachi PLACE HALL & CONFERENCE + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here Otemachi PLACE HALL & CONFERENCE Otemachi PLACE East Tower 2-3-1 Otemachi, Chiyoda-ku, Tokyo 1000004 Japan SEMI.org [email protected] Asia/Tokyo public May 13, 2026 Asia/Tokyo

SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Register now

Belgium Germany Singapore Taiwan United States FEMC31 Business Executive Technical

This comprehensive course will cover the underlying fundamentals, the interrelationship between materials and processes, and the hardware used in printed electronics.  The masterclass will also explore how printed electronics can be applied currently in example applications including practical aspects of the technology, its highlights and challenges and scalability.  We will also explore emerging new technologies at the cutting edge of FHE, semiconductor packaging, photonics and quantum materials.  Throughout the course there will be opportunities for Q/A and discussions and case studies based on participant's interest.

ABOUT THE SPEAKER

J. Devin MacKenzie, PhD
Dr. Devin MacKenzie is the Washington Research Foundation Professor and an Assoc. Prof. of Materials Science and Engineering and Mechanical Engineering at UW. He is also the Technical Director of the Washington Clean Energy Testbeds, a lab that provides open-access to world-class advanced manufacturing and characterization tools for printed optoelectronics, sensors and energy device research and scale-up. Devin also has 25 years of entrepreneurial experience in sustainable materials and manufacturing of semiconductors, optoelectronics and energy devices. Prior to UW he was CEO and co-founder of printed battery company, Imprint Energy (acquired CCL/Avery), Previously, as the CTO of Add-Vision, Inc. (acquired Sumitomo Chemical), Dr. MacKenzie led R&D for roll-to-roll printed flexible OLEDs at Add-Vision with licensing in Europe and Asia. Prior to Add-Vision, he led printed silicon RF device and product engineering at Kovio, Inc. a Si Valley MIT spin-out (acquired Thin Film Electronics). Dr. MacKenzie also co-founded, Plastic Logic, from Cambridge University as a postdoc and subsequently a visiting scientist in Physics at the Cavendish Laboratory. Prior to that he worked at Bell Labs and NASA. Dr. MacKenzie has authored over 240 publications and patents that have been licensed globally and has been cited over 12,900 times in fields ranging from rare earth-doped nitrides to quantum materials. He holds Ph.D, MS, and undergraduate degrees in Materials Science and Engineering from the University of Florida and the Massachusetts Institute of Technology.

United States

J. Devin MacKenzie, PhD

Washington Research Foundation Professor of Clean Energy, Associate Professor

University of Washington

Moderator

Gity Samadi, PhD

Sr. Director, R&D Programs

SEMI

Sep 30, 2026 NBMC Smart MedTech FlexTech

Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.

Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials

Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices

Flexible Electronics Master Class #31

10:00 am - 12:00 pm Off Add to Calendar 2026-09-30 10:00:00 2026-09-30 12:00:00 FEMC#31 Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials United States SEMI.org [email protected] America/Los_Angeles public May 20, 2026 America/Los_Angeles REGISTER NOW

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Thank you to our sponsors:  

 

 

                                            

 

United States

May 21, 2026 EHS SMG Sustainability EMG FOA Standards

Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. 

The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.

Reports can be downloaded HERE.

Water Management Strategies Webinar

Procedures, Baselines, Savings & Solutions Maturity Scale

9:00 am - 10:00 am Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 10:00:00 Water Management Strategies Webinar Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE. United States SEMI.org [email protected] America/Los_Angeles public May 13, 2026 America/Los_Angeles Register Here

Registration

Regular Pricing
$249 Members
$349 Non-Members

Cancellation Policy

Cancellations received on or before July 27, 2026, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after July 27, 2026, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to [email protected].

Register Here!

United States 2026MedTech_Summit Technical

SEMI Headquarters
673 S. Milpitas Boulevard
Milpitas, CA 95035
United States

Aug 27, 2026 Smart MedTech

This Smart MedTech Summit brings together semiconductor and medical device leaders to address shared challenges, strengthen supply chain collaboration, and enable the next generation of medical devices. Designed for leaders at the forefront of a rapidly evolving landscape, it provides a focused forum for dialogue and cross-industry collaboration.
Participants will engage with peers and experts to exchange perspectives and gain actionable insights into how advanced semiconductor technologies are enabling smarter, more connected medical solutions.
 

Semiconductor-MedTech Ecosystem Summit

A Smart MedTech event sponsored by GlobalFoundries

8:00 am - 6:00 pm Off Add to Calendar 2026-08-27 08:00:00 2026-08-27 18:00:00 Semiconductor-MedTech Ecosystem Summit This Smart MedTech Summit brings together semiconductor and medical device leaders to address shared challenges, strengthen supply chain collaboration, and enable the next generation of medical devices. Designed for leaders at the forefront of a rapidly evolving landscape, it provides a focused forum for dialogue and cross-industry collaboration.Participants will engage with peers and experts to exchange perspectives and gain actionable insights into how advanced semiconductor technologies are enabling smarter, more connected medical solutions.  SEMI Headquarters 673 S. Milpitas Boulevard Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public Jun 12, 2026

test

America/Los_Angeles Register Here!