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Water Management Strategies Webinar

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United States

9:00 am - 9:10 am

Welcome and Overview of the Water Management Working Group

9:10 am - 9:25 am

Leader, Water Solution Providers Cohort

Pascal Osten

DAS Environmental Expert GmbH

Procedures Guide

9:25 am - 9:35 am

Co-Lead, Fab, OSATs Cohort

Catherine Marsan-Loyer

C2MI

Water Savings Guide and Baseline-setting

9:35 am - 9:45 am

Co-Lead, Fab, OSAT Cohort

Jared Burdick

Sundt Corp.

Solutions Maturity Scale

9:45 am - 9:55 am

Q&A & WrapUp

May 21, 2026 EHS SMG Sustainability EMG FOA Standards

Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports. The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge.

The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.

Reports can be downloaded HERE.

Water Management Strategies Webinar

Procedures, Baselines, Savings & Solutions Maturity Scale

9:00 am - 10:00 am Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 10:00:00 Water Management Strategies Webinar Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports. The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE. United States SEMI.org [email protected] America/Los_Angeles public Jun 17, 2026 America/Los_Angeles Watch the recorded webinar

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Semiconductor-MedTech Ecosystem Summit

Registration

Regular Pricing
$249 Members
$349 Non-Members

Cancellation Policy

Cancellations received on or before July 27, 2026, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after July 27, 2026, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to [email protected].

United States Smart Medtech Summit 2026 Technical

Keynotes

Breaking Silos, Accelerating Innovation: Semiconductor & MedTech Converge Together

In a rare cross-industry gathering, MedTech pioneers and semiconductor innovators are coming together under one roof. The Semiconductor–MedTech Ecosystem Summit is designed to break down industry silos, connecting silicon innovators directly with medical device makers to accelerate the development of next-generation medical technology.

If you are building the future of medical devices, diagnostics, or connected care, this is where you secure your competitive advantage.

The Convergence: Three Focus Areas Driving the Next Frontier

By bringing these two massive industries together, we are accelerating the timeline for revolutionary healthcare. We will be diving deep into:

Wearables & Continuous Care: Changing the game for personalized healthcare by enabling clinical-grade, untethered monitoring that moves with the patient.
Advanced Medical Imaging: Pushing the boundaries of early detection through advanced imaging technologies that make the unseen visible.
Edge AI & Predictive Health: The invisible engine underpinning rapid advancements in both MedTech and silicon. We’ll explore how processing at the edge allows for the pinpointing of diagnoses and treatments long before traditional symptoms appear.

SEMI Headquarters
673 S. Milpitas Boulevard
Milpitas, CA 95035
United States

Marc Schaepkens

Chief Technology Officer, Advanced Imaging Solutions

GE Healthcare

Laura Matz

Chief Science & Technology Officer

Merck KGaA

Ahmad Bahai

Senior Vice President & Chief Technology Officer

Texas Instruments

Gregg Bartlett

Chief Technology Officer

GlobalFoundries

Breakfast & Registration

8:00 am - 9:00 am

Breakfast & Registration

Strategic Outlook

9:00 am - 9:15 am

Ajit Manocha

CEO

SEMI

Welcome Address

SEMI Perspective
Biography

9:15 am - 9:30 am

Michael Hogan

Chief Strategy Officer

GlobalFoundries

Welcome from GlobalFoundries

Biography

9:30 am - 9:50 am

Marc Schaepkens

Chief Technology Officer, Advanced Imaging Solutions

GE Healthcare

Keynote: No Chips, No Cure: Why Semiconductors Are the Invisible Infrastructure of Modern Healthcare

9:50 am - 10:05 am

Derrick Kiker

McKinsey & Company

The Life Sciences Growth Engine Runs on Silicon

Networking

10:05 am - 10:30 am

Break

Integration

10:30 am - 10:50 am

Laura Matz

Chief Science & Technology Officer

Merck KGaA

Keynote: Exploring Enabling Approaches for Precision Medicine throughout the Drug Development Process

10:50 am - 11:05 am

Joshua De Souza

Senior Principal Scientist

Medtronic

From Integration to Intervention: The Whole is Greater than the Sum of its Parts

11:05 am - 11:20 am

Paru Deshpande

VP Health Technologies

IMEC

Bioconvergence: How Semiconductor Innovation is Shaping the Future of Healthcare

11:20 am - 12:00 pm

Panel Discussion: The Role of Semiconductor in 5-10 Years in MedTech

Session Chair - Anirban Bandyopadhyay
Paru Deshpande | imec
Fritz Werder | Silicon Labs
Mohsen Askarinya | Medtronic
Lea Drye | FDA

Networking

12:00 pm - 1:00 pm

Lunch

Innovation

1:00 pm - 1:20 pm

Ahmad Bahai

Senior Vice President & Chief Technology Officer

Texas Instruments

Keynote: "Health Sciences, Semiconductor & AI" A Transformational Confluence

1:20 pm - 1:35 pm

Pieris Berreitter

Director of Engineering

Inference on the Edge: The Next Generation of Wearable Silicon for Healthtech

1:35 pm - 1:50 pm

Mauro Ferrari

Chief Executive Officer

BrYet

Microfabbed Silicon as a (Transformational) Pharmaceutical Material

1:50 pm - 2:30 pm

Panel Discussion: Disruptive Innovation in MedTech for Therapeutic and Diagnosis

Session Chair - Melissa Grupen-Shemansky
Vibhu Sharma | Philips
Bharath Rajagopalan | STMicroelectronics
Laura Matz | Merck KGaA
Gregg Bartlett | GlobalFoundries

Networking

2:30 pm - 2:45 pm

Break

Innovation

2:45 pm - 3:00 pm

Gregg Bartlett

Chief Technology Officer

GlobalFoundries

Keynote: Differentiating Technologies Driving Disruptive Innovations in MedTech

3:00 pm - 3:15 pm

Bharath Rajagopalan

Director of Strategic Marketing

STMicroelectronics

Semiconductor Innovations Enabling the Future of Healthcare

3:15 pm - 3:30 pm

Yusuf Haque

Cofounder & Chief Technology Officer

Exo Imaging

Democratization of Ultrasonic Medical Imaging & Challenges

3:30 pm - 3:45 pm

Girish Naganathan

Former CTO

EVP Dexcom

The Architecture of Full-Stack Personalized Medicine

3:45 pm - 4:00 pm

Wrap Up

SEMI

Networking

4:00 pm - 6:00 pm

Reception

Aug 27, 2026 Smart MedTech

Experience a one-of-a-kind convergence of silicon and clinical care. Connect directly with semiconductor foundries and MedTech OEMs on Aug 27 to accelerate next-gen medical devices.

Semiconductor-MedTech Ecosystem Summit

Architecting the Future of Connected Healthcare

8:00 am - 6:00 pm Off Add to Calendar 2026-08-27 08:00:00 2026-08-27 18:00:00 Semiconductor-MedTech Ecosystem Summit Experience a one-of-a-kind convergence of silicon and clinical care. Connect directly with semiconductor foundries and MedTech OEMs on Aug 27 to accelerate next-gen medical devices. SEMI Headquarters 673 S. Milpitas Boulevard Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public Aug 11, 2026 America/Los_Angeles

Recommended Hotels

Embassy Suites by Hilton Milpitas Silicon Valley

901 East Calaveras Boulevard

Milpitas, CA 95035

(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley

1480 Falcon Dr.

Milpitas, CA 95035

(408) 719-1966

Embassy Suites by Hilton Milpitas Silicon Valley Courtyard by Marriott Milpitas Silicon Valley

Event format

In Person

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Overview

Agenda

SMC (Strategic Materials Conference) Korea 2026

Registration

※ Early-bird Registration Deadline: May 7(Thu), 2026, 10: 00 AM (KST)

Registration Fee

Early Bird
- SEMI Member: KRW 308,000
- Non-Member: KRW 363,000
On site
- SEMI Member : KRW 385,000
- Non-Member: KRW 385,000
Group
- SEMI Member : KRW 275,000
- Non-Member: KRW 330,000
  ※ Group registration fee applies to groups of five or more from the same company.

※ For group registration inquiries, please contact SEMI Korea Program Team at [email protected].

South Korea SMC Korea 2026 Business Technical

OVERVIEW

Date: May 12(Tue), 2026 8:30-16:30 KST
Venue: Convention Hall 2, 3F, Suwon Convention Center
Language: Korean/English (Simultaneous interpretation will be provided)

NOTICE

The agenda is subject to change at the discretion of the speakers.
Presentation materials will be available for download after the conference via the SEMI Korea program registration website(https://semikrprogram.com), only for materials approved by the speakers for distribution.
Parking fees are not provided.

CONTACT

SEMI Korea Program Team ([email protected])

Suwon Convention Center
South Korea

8:30 am - 9:00 am

Welcome Reception

9:00 am - 9:25 am

Anand Murthy

VP, Advanced Technology Integration, Office of the CTO

Lam Research

How Wafer Processing Is Reshaping the 3D Era for AI

AI is fueling unprecedented growth and accelerating demand for advanced devices. Its requirements for performance, power, and area scaling are driving memory and logic devices toward 3D architectures.
At the heart of this 3D transformation, processing steps must enable taller, perpendicular structures as well as smaller features. Meeting these requirements calls for new deposition and etch capabilities that did not exist before, leading to breakthroughs needed in areas such as atomic-level deposition and etch (ALD and ALE), high-aspect-ratio processing, dry resist EUV patterning, and the adoption of new materials like molybdenum (Mo). As a result, the transition to 3D devices will drive increased intensity of deposition and etch processing.
This presentation will explore how deposition and etch are critical to unlocking the future of 3D devices, with increasing velocity required to meet the demands of AI-driven innovation.

9:25 am - 9:50 am

Ganesh Panaman

Head of Technology & Innovation and President of Intermolecular®

Merck

Integrated Materials Innovation in the AI Era

As the semiconductor industry navigates the challenges of dimensional and functional scaling in the artificial intelligence (AI) era, advanced materials science has emerged as a critical enabler for performance enhancement. Modern AI-centric architectures demand the integration of increasingly complex system-on-chip (SoC) designs with non-traditional material systems.
This work details a high-throughput methodology for the rapid down-selection and optimization of multi-element thin films, ensuring alignment with both physical and electrical key performance indicators (KPIs). Utilizing combinatorial physical vapor deposition (PVD) in conjunction with unit-cell electrical test vehicles, we systematically screen an expansive elemental compositional space to identify optimal candidates. Advanced machine learning (ML) algorithms are integrated into each phase of the development lifecycle—spanning precursor synthesis, process optimization, and heterogeneous integration—to satisfy the rigorous specifications of emerging device applications. The synergy between integrated materials engineering and AI-driven informatics significantly reduces the temporal gap between material discovery and device-level implementation.

9:50 am - 10:15 am

Sehui Han

Lab Leader

LG AI Research

AI for Scientific Discovery: EXAONE Discovery

Chemical and materials research faces increasing demands for data-driven automation and autonomous research systems due to vast exploration spaces and complex decision-making processes. In this talk, we introduce EXAONE Discovery as a Chemical Agentic AI system and present an integrated research framework designed to accelerate scientific discovery.
EXAONE Discovery is an agent-based system that tightly integrates property prediction, molecular generation, synthesis prediction, and literature/data extraction. Based on given research objectives, the system accumulates relevant data, generates candidate molecules using model-driven approaches, evaluates their properties, and derives feasible synthetic routes—automating the end-to-end discovery pipeline. Furthermore, it is designed to enable a closed-loop research paradigm by interfacing with autonomous laboratories, connecting design–prediction–synthesis–validation cycles. This allows hypotheses proposed by AI to be experimentally validated, with results continuously fed back into the system for iterative model improvement and optimization.
In this talk, we will demonstrate how this integrated approach enhances research productivity across various industrial use cases in materials discovery and optimization, and discuss future directions of Chemical Agentic AI.

10:15 am - 10:40 am

Peter Lee

Managing Director at Citigroup, Semiconductor Analyst

Citigroup

Global Memory Technology & Market Outlook

10:40 am - 11:05 am

Jung-il Hwang

Vice President

SK hynix

Materials Challenges and Path Forward for Future Memory Scaling

11:05 am - 11:25 am

Networking Break

11:25 am - 12:30 pm

Panel Discussion

12:30 pm - 1:30 pm

Networking Lunch

1:30 pm - 1:55 pm

Xiangyu Guo

Air Liquide

Emerging Etching Chemistry for Advanced Semiconductor Manufacturing

The rising technical demands for advanced semiconductor device manufacturing, and the industry’s ambitious net-zero commitments necessitate the development of novel etch chemistries that deliver both technical excellence and environmental sustainability. This talk will present an overview of the emerging etching chemistries developed by Air Liquide for variety-targeted applications. These innovative chemistries focus on delivering improved performance with unique technical merits to address current industry challenges. Exemplified by a novel low Global Warming Potential (GWP) designed for general dielectric etch, its synergistic integration with advanced abatement solutions, and a simplified Life Cycle Analysis (LCA) - from raw material extraction through processing, manufacturing, distribution, and use, this presentation aims to provide insights into a pathway towards more sustainable semiconductor manufacturing processes.

1:55 pm - 2:20 pm

Kirthi Rachakonda

Global Product Manager

Applied Materials

Enabling Advanced Metallization with Selective Deposition

As device architectures scale toward the angstrom era, metallization has emerged as one of the most critical bottlenecks to continued improvements in power and performance. Shrinking feature dimensions increase resistance, heighten reliability risks, and add complexity in interconnects and contacts. At these scales, traditional approaches which uniformly affect all wafer surfaces are increasingly ineffective. They rely heavily on lithography to define placement, and struggle to address tighter geometries and growing sensitivity to interfaces. Selective deposition is a solution which enables atomicscale control of where metals grow, placing material only where it is needed, without relying on patterning. It also enables monocrystalline metal growth, eliminating grain boundaries to minimize contact resistance.

This presentation will highlight how Applied Materials’ integrated materials solutions are enabling multiple inflections through area selective metallization. Selective Cobalt Capping technology encapsulates copper interconnects, improving adhesion, suppressing electromigration, and extending copper reliability to advanced nodes. Applied’s Selective Barrier eliminates a highly resistive interface at the interface of interconnect wiring. For contact fill, Applied developed Selective Tungsten (W) as a liner-less gap-fill solution that eliminates traditional liner/barrier layers and enables bottomup, seamfree metal fill. Finally, we introduce Selective Molybdenum (Mo) deposition that carries lowresistivity contact scaling forward as dimensions approach the fundamental scaling limits of W. Applied’s state-of-the-art atomic layer deposition tool for molybdenum delivers bottom-up, single-crystal Mo growth, enabling the next generation of contact scaling.

2:20 pm - 2:45 pm

JungHwan Hah

CEO

SK Trichem

Periodic Table & Device Evolution

2:45 pm - 3:10 pm

Kuntack Lee

Master

Samsung Electronics

Next Generation Cleaning Processes and Materials

Cleaning processes originally relied on wet etch based patterning. However, dry etching now performs the majority of the patterning work, so wet etching is no longer needed for most pattern creation steps. Consequently, the focus of cleaning has shifted from patterning to the removal of contaminants. To obtain a clean surface, we must eliminate unwanted contaminants without any side effects such as pattern damage, collapse, material loss, or corrosion.
However, in the current era of 3 D structured devices such as V NAND, GAA, and 3 D DRAM, lateral wet etching is essential for patterning 3 D devices, and the proportion of wet etching in cleaning processes is increasing. Additionally, different kinds of selectivity such as concentration selectivity and area selectivity, have become important, in addition to conventional material selectivity. Sometimes we have to remove a film uniformly even though there are seams and voids. In addition, pattern loading has become a critical factor in lateral removal processes. We must solve these loading issues to achieve better performance and yield.
From time to time we must use more flexible, multi step processes; therefore, premixed chemistry is not enough to meet our purpose. Due to the flexibility of dry (gas phase) cleaning, the portion of dry cleaning has been increasing sharply. Area selectivity has also become another challenge. We must etch without corner rounding or climbing, and we want to perform anisotropic etching.
Conversely, based on the generic clean roadmap, high aspect ratio cleaning and low consumption cleaning will remain continuous challenges. Super critical CO2 drying is a solution for pattern collapse in HAR patterns, yet a dryer that is milder than CO2 but better than conventional IPA dryer technology is still required. In terms of chemical reduction, the puddle process may be a solution, but some side effects related to temperature consistency and cleanliness differences due to fluid dynamics must be resolved before implementation.

3:10 pm - 3:30 pm

Networking Break

3:30 pm - 4:30 pm

Panel Discussion

4:30 pm

Adjourn

May 12, 2026 EMG

AI Enabled Materials Breakthroughs: From Molecules to Manufacturing

The transition toward an AI-driven technological landscape is redefining the paradigm of materials innovation across the semiconductor industry. In response, SMC (Strategic Materials Conference) Korea will spotlight next-generation semiconductor materials and process innovation strategies that enable and accelerate AI-driven advancements.

This conference brings together leading companies representing the global semiconductor ecosystem to share strategic directions and practical insights into materials innovation, from material design to real-world manufacturing processes.

The first session will focus on materials strategies for the AI era, exploring market and technology trends as well as AI-driven development approaches to provide a comprehensive view of next-generation semiconductor innovation. The second session will offer an in-depth exploration of process-ready materials essential for advanced semiconductor manufacturing, highlighting practical applications in areas such as photoresists, etching chemistry, and cleaning processes.

By convening key players across the semiconductor ecosystem, this conference provides a unique platform to gain a holistic perspective on the present and future of materials innovation in the AI era. Participants will have the opportunity to gain valuable technical insights while fostering collaboration and connections across the industry.

SMC (Strategic Materials Conference) Korea 2026

May 12(Tue), 2026 | Convention Hall 2, 3F, Suwon Convention Center

8:30 am - 4:30 pm Off Add to Calendar 2026-05-12 08:30:00 2026-05-12 16:30:00 SMC (Strategic Materials Conference) Korea 2026 AI Enabled Materials Breakthroughs: From Molecules to ManufacturingThe transition toward an AI-driven technological landscape is redefining the paradigm of materials innovation across the semiconductor industry. In response, SMC (Strategic Materials Conference) Korea will spotlight next-generation semiconductor materials and process innovation strategies that enable and accelerate AI-driven advancements. This conference brings together leading companies representing the global semiconductor ecosystem to share strategic directions and practical insights into materials innovation, from material design to real-world manufacturing processes. The first session will focus on materials strategies for the AI era, exploring market and technology trends as well as AI-driven development approaches to provide a comprehensive view of next-generation semiconductor innovation. The second session will offer an in-depth exploration of process-ready materials essential for advanced semiconductor manufacturing, highlighting practical applications in areas such as photoresists, etching chemistry, and cleaning processes. By convening key players across the semiconductor ecosystem, this conference provides a unique platform to gain a holistic perspective on the present and future of materials innovation in the AI era. Participants will have the opportunity to gain valuable technical insights while fostering collaboration and connections across the industry. Suwon Convention Center South Korea SEMI.org [email protected] Asia/Seoul public May 10, 2026 Asia/Seoul

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In Person

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Co-Intelligence™: The New Architecture of Semiconductor Ecosystems

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The semiconductor industry is entering an era of deep interdependence, rapid innovation, and growing complexity. Breakthroughs in AI accelerators, advanced lithography, heterogeneous integration, and next-generation computing rely on globally distributed ecosystems of suppliers, governments, research institutions, and manufacturers. Yet intelligence systems remain fragmented, limiting visibility and slowing coordinated responses to disruptions and market shifts.

This webinar introduces Co-Intelligence™, a new model that connects intelligence across organizations—not just within them—to enable shared context, collective situational awareness, and coordinated decision-making.

We will also explore Conductor™, a platform designed to operationalize ecosystem-level intelligence by integrating signals across stakeholders and enabling faster, more aligned responses to industry challenges.

Attendees will gain:

A comprehensive view of Co-Intelligence™, the intelligence model for complex semiconductor ecosystems
Access to key insights from an industry leader
An exclusive inside look at the Conductor™ platform
Front-row access to the launch of a new era for the semiconductor industry and invitations to join the emerging network

Agenda:

Welcome & Introductions - Setting the Stage for Co-Intelligence™ – 5 minutes

Keynote – 10 minutes

Roundtable discussion - 10 minutes

Conductor™ Demo – 20 minutes

Q&A – 10 minutes

Session Closes – 5 minutes

Keynote Speaker

I-Ting Fang
Department Manager
AI for business intelligence
TSMC

Bio:
I-Ting Fang is a Department Manager at TSMC's Corporate Planning Organization — the “brain” for balancing demand, supply, and capacity planning. She leads teams building intelligence platforms that monitor supply chain health, assess market demand, and track potential events impacting the semiconductor industry and TSMC.

Panelists

Bettina Weiss
Chief of Staff & Corporate Strategy
SEMI

Sharon Su
Director of Strategic Supplier Partnership
Dell Technologies

Thelma Onyeka
Co-Chief Executive Officer
Beebolt

Talal Abu-Issa
Co-Chief Executive Officer
Beebolt

United States

Apr 8, 2026 - Apr 10, 2026 SCM

Semiconductor supply chain innovation and orchestration at scale now requires collective intelligence and ecosystem coordination. Join this webinar to explore Co-Intelligence™ and get an exclusive preview of the Conductor™ platform to improve visibility and resilience.

Choose your session:

9-10am CST, April 9 // 6-7pm PDT, April 8 [Register Now]
6-7pm CST // 12-1pm CEST, April 9 [Register Now]
9-10am PDT, April 10 (pre-recorded keynote with live Q&A) [Register Now]

Co-Intelligence™: The New Architecture of Semiconductor Ecosystems

Webinar | Global Sessions

Off Add to Calendar 2026-04-08 00:00:00 2026-04-10 00:00:00 Co-Intelligence™: The New Architecture of Semiconductor Ecosystems Semiconductor supply chain innovation and orchestration at scale now requires collective intelligence and ecosystem coordination. Join this webinar to explore Co-Intelligence™ and get an exclusive preview of the Conductor™ platform to improve visibility and resilience.Choose your session:9-10am CST, April 9 // 6-7pm PDT, April 8 [Register Now] 6-7pm CST // 12-1pm CEST, April 9 [Register Now]9-10am PDT, April 10 (pre-recorded keynote with live Q&A) [Register Now] United States SEMI.org [email protected] America/Los_Angeles public Apr 7, 2026 America/Los_Angeles

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FEMC#29 Digital Twins for Printed Electronics: How Can AI Learn FHE Printing?

SEMI Members: $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members: $149

Students: Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

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Digital Twin is a virtual representation of the structure, context, and behavior of physical systems or a process, with a live link to a physical system serving as a key enabler for predictive and data-driven optimization. In Printed and Flexible Hybrid Electronics (FHE), manufacturing involves multiple interdependent variables—different printing technologies, inks, substrates, and process conditions—each introducing its own complexity. In practice, additional challenges such as equipment drift, batch-to-batch variations, and environmental fluctuations further impact process consistency and yield. Changing a process or transferring it between tools is often difficult, as each setup is highly customized and sensitive to local conditions. To address these challenges, Digital Twin frameworks connect data from design, fabrication, and metrology into continuously learning digital models. They enable early detection of process drifts, virtual experimentation for process development, and data-driven optimization that reduces time, cost, and waste.

This course introduces Digital Twin frameworks for FHE, focusing on Deep Neural Network (DNN)-based predictive models. Participants will learn how to integrate design, fabrication, and metrology data into continuously learning virtual twins that detect process drifts, enable virtual experimentation, and optimize manufacturing. The program covers the full workflow—from image processing and virtual metrology to AI model training, validation, and hyperparameter tuning—using real datasets. A hands-on “Build Your Own Digital Twin” module in Google Colab will provide practical experience in training and refining models for printed electronics applications, equipping attendees with both theoretical insight and applied skills for process optimization and performance prediction.

ABOUT THE SPEAKER

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Department of Electrical and Computer Engineering at Northeastern University, Boston, Massachusetts, where his research centers on integrated microsystems for sensing and computation using mechanical waves. His work spans acoustic and ultrasound transducers, biointerfaces, and microcalorimetry, with a strong emphasis on data-guided nanofabrication, advanced semiconductor device manufacturing, and interdisciplinary approaches to microsystem design and manufacturing. He earned his Ph.D. in Electrical and Computer Engineering from Marquette University in 2016 and completed a postdoctoral appointment at Cornell University.

United States

Ben Davaji, PhD

Assistant Professor

Northeastern University

Moderator

Gity Samadi, PhD

Sr. Director, R&D Programs

SEMI

Jun 10, 2026 NBMC Smart MedTech FlexTech

Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization.

Digital Twins for Printed Electronics: How Can AI Learn FHE Printing?

Flexible Electronics Master Class #29

10:00 am - 12:00 pm Off Add to Calendar 2026-06-10 10:00:00 2026-06-10 12:00:00 FEMC#29 Digital Twins for Printed Electronics: How Can AI Learn FHE Printing? Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization. United States SEMI.org [email protected] America/Los_Angeles public Jun 12, 2026 America/Los_Angeles Watch on-demand

Event format