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Technical

United States Smarter Fabs Tile Business Executive Technical Training

Suggested Hotels:

Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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As part of this process, this session brings together top executives from industry leaders across the entire value-chain spectrum – including device design & fabrication, interconnects & system integration, hyperscale architectures & algorithms, novel materials, as well as emerging disruptive technologies like photonics and quantum. Attendees will have the rare opportunity to get a strategic perspective from these distinguished experts about the state-of-the-art and learn about exciting future trends propelling the industry towards $1 Trillion in revenue.

Phoenix, AZ
United States

Session 1

10:30 am - 10:35 am
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

10:35 am - 11:00 am
Rozalia Beica
Rozalia Beica
Field CTO Packaging Technology
Rapidus Design Solutions

The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration

11:00 am - 11:25 am
Krishna Saraswat
Krishna Saraswat
Rickey/Nielsen Professor, Emeritus
Stanford University

Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics

11:25 am - 11:50 am
Katharina Westrich
Katharina Westrich
Global VP of Electronics, Semiconductors & Simulation
Siemens AG

Challenging the Status Quo: From Chip Innovation to Compute Optimization

11:50 am - 12:15 pm
SriLatha Manne
Senior Fellow
AMD

AMD - Presentation Title TBD

12:15 pm - 12:40 pm
Rad Desiraju
Rad Desiraju
Director, WW Industry Advisory
Microsoft

Scaling AI - From Silicon to Systems

12:40 pm - 12:45 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Session 1 Wrap-up

Session 2

2:00 pm - 2:05 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

2:05 pm - 2:30 pm
Noriko Suzuki
Noriko Suzuki
Global Industry Leader - Electronics, Institute for Business Value
IBM

Next generation semiconductor to support AI resiliency

2:30 pm - 2:55 pm
Laura Matz
Laura Matz
Chief Science and Technology Officer
Merck KGaA, Darmstadt, Germany

Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials

2:55 pm - 3:20 pm
Kirk M. Bresniker
Kirk M. Bresniker
Chief Architect and Fellow/VP, HPELabs
Hewlett Packard Enterprise

HPE Labs - Computing Futures from AI to Quantum to GenZ

3:20 pm - 3:45 pm
Jürgen Hatheier
Jürgen Hatheier
Chief Technology Officer of EMEA & APAC,
Ciena

Ciena - Presentation Title TBD

3:45 pm - 4:10 pm
Subodh Kulkarni
Subodh Kulkarni
President and CEO
Rigetti

Rigetti - Presentation Title TBD

4:10 pm - 4:35 pm
Celia Merzbacher
Celia Merzbacher
Executive Director,
Quantum Economic Development Consortium

Quantum Economic Development Corporation (QEDC) - Presentation Title TBD

4:35 pm - 4:40 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Closing Remarks

The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.

10:30 am - 4:40 pm Off Add to Calendar 2025-10-07 10:30:00 2025-10-07 16:40:00 Future of Computing: Energy-Efficient Computing for AI and Beyond The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem. Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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United States

Standards

Join us for the SEMI Standards

3D Packaging & Integration (3DP&I)

North America Technical Committee Chapter Fall Meeting

Date: Tuesday, October 14, 2025

Time: 13:00-14:30 Pacific Time

Online via Web Conference

To receive the calendar invite, please reach out to the contact below.

 

AGENDA

(Subject to change)

Last updated:  September 14, 2025

 

1:00 pm - 2:30 pm Off Add to Calendar 2025-10-14 13:00:00 2025-10-14 14:30:00 3D Packaging & Integration North America TC Chapter Fall Meeting 2025 Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated:  September 14, 2025  United States SEMI.org [email protected] America/Los_Angeles public

Virtual + Voting Instructions

SEMI uses RingCentral to host virtual meetings.

To receive the calendar invite, please reach out to the contact below.

To Vote During TC Chapter Meetings

  1. Open a separate Web browser and go to:  https://svm.semi.org/
  2. Click “Login”
  3. Enter your Standards Membership username and password (same login you use for voting on ballots)
  4. Find the meeting room you wish to attend under “Room Name”
  5. Click “Go” to enter the meeting room.

NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".

Contact

Laura Nguyen
Sr. Coordinator, International Standards

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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1010005
Japan

Standards

Information & Control Japan TC Chapter Meeting 

Date: Tuesday, October 21, 2025

Time: 9:30 am - 12:00 pm JST

Venue: SEMI Japan Office Room 1 + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:30 am - 12:00 pm Off Add to Calendar 2025-10-21 09:30:00 2025-10-21 12:00:00 Information & Control Japan TC Chapter Meeting Information & Control Japan TC Chapter Meeting Date: Tuesday, October 21, 2025Time: 9:30 am - 12:00 pm JSTVenue: SEMI Japan Office Room 1 + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku, Tokyo 1010005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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KOMORI CORPORATION, Tsukuba Plant
203-1 Nakayama
Tsukuba-shi, Ibaraki
300-1268
Japan

Standards

Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting 

Date: Friday, October 17, 2025

Time: 3:30 PM - 5:30 PM JST

via OVTCCM/ KOMORI CORPORATION, Tsukuba Plant, Ibaraki, Japan (Hybrid)

 

AGENDA

 

Standards Contact Information:

Nahoko Koga

Coordinator, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

3:30 pm - 5:30 pm Off Add to Calendar 2025-10-17 15:30:00 2025-10-17 17:30:00 Flexible Hybrid Electronics Japan TC Chapter Meeting Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting Date: Friday, October 17, 2025Time: 3:30 PM - 5:30 PM JSTvia OVTCCM/ KOMORI CORPORATION, Tsukuba Plant, Ibaraki, Japan (Hybrid) AGENDA Standards Contact Information:Nahoko KogaCoordinator, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here KOMORI CORPORATION, Tsukuba Plant 203-1 Nakayama Tsukuba-shi, Ibaraki 300-1268 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC #27- recorded Business Executive Technical
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A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. 

This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins. 

ABOUT THE SPEAKERS

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.

Peter Doerschuk, PhD

Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
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Peter Doerschuk, PhD
Professor
Cornell Engineering
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.

10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-Demand
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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi
Chiyoda-ku, Tokyo
1000005
Japan

Standards

FPD Materials & Components and FPD Metrology Japan Joint TC Chapter Meeting 

Date: Wednesday, October 15, 2025

Time: 3:00 PM - 5:00 PM JST

via OVTCCM/ SEMI Japan Office (Hybrid)

 

AGENDA

 

Standards Contact Information:

Nahoko Koga

Coordinator, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

3:00 pm - 5:00 pm Off Add to Calendar 2025-10-15 15:00:00 2025-10-15 17:00:00 FPD Materials & Components and FPD Metrology Japan Joint TC Chapter Meeting FPD Materials & Components and FPD Metrology Japan Joint TC Chapter Meeting Date: Wednesday, October 15, 2025Time: 3:00 PM - 5:00 PM JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Nahoko KogaCoordinator, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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Registration

Conference Pricing

SEMI Members: $1,500.00 (Use your corporate email address during log-in to be recognized as a SEMI Member.)

Non-Members: $1,800.00

Speakers and Students: $550.00

Cancellations received on or before April 26, 2026 will be refunded, less a $30 cancellation fee.

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

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Hotel

Wild Horse Pass

Limited rooms are available at the Wild Horse Pass Resort. Reserve your stay within our room block using the link below.

Deadline: Friday, April 17

Wild Horse Pass

Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.

Contact Tim Janes at [email protected]

View Sponsorship Brochure 

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The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing. Formerly presented by Linx Consulting, SPCC continues its legacy of delivering high-quality technical content through invited presentations, peer-reviewed sessions, and poster presentations covering all aspects of cleaning science, process integration, materials, equipment, and metrology.

SPCC will feature invited business-focused presentations that examine macroeconomic, market, and structural trends shaping the global semiconductor industry that were formerly included in the Business Interface Conference (BIC). These sessions will provide attendees with valuable context on industry dynamics, supply chain, and strategic outlooks that complement the technical discussions at SPCC.

Now a unified conference, SPCC unites both business and technical aspects of industry into a comprehensive program that bridges technology development and business strategy, offering attendees enhanced opportunities for cross-disciplinary learning, collaboration, and networking with industry leaders, researchers, and decision-makers across the semiconductor ecosystem.

Join our premier technical forum with topics including—                                                                                                          

  • Cleaning Science
  • Equipment
  • Industry Dynamics
  • Materials
  • Metrology
  • Process Integration
  • Strategic Outlook
  • Supply Chain

Wild Horse Pass
5040 Wild Horse Pass Blvd
Chandler, AZ , AZ 85226
United States

MONDAY, MAY 18, 2026

Session 1

8:00 am - 9:00 am

Breakfast

9:00 am - 9:20 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Opening Remarks

9:20 am - 9:50 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

KEYNOTE—Semiconductor Industry Update

9:50 am - 10:10 am
Alma Vela Ramirez_IBM
Alma Vela Ramirez
Unit Process Engineer
IBM

Dummy Gate Poly Wet Etch Studies in GAA Nanosheet Flow

10:10 am - 10:30 am
Adara Yang
Shihui (Adara) Yang
Member of Technical Specialist
Micron

Enabling Novel Innovation in Containers Profile Sculpting for Cell Structure Improvement

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Gary Van Schooneveld
Gary Van Schooneveld
President
CT Associates

Particle Precursors and On-Wafer Defectivity: IRDS Collaborative Research Progress and Future Directions

11:20 am - 11:40 am
Tomoki Nara
Tomoki Nara
Research Scientist
Mitsubishi Chemical Corporation

Si/SiGe Selective Wet Etchant for BSPDN Application: Maximization of Selectivity in Single Wafer Spin Wet Processing

11:40 am - 12:00 pm
Deepak Kumar
Deepak Kumar
Technical Program Director
ACM Research

Optimization of Particle and Atmosphere Control in the SPM Process via Nozzle Cover

12:00 pm - 12:20 pm
Daiki Morimoto
Daiki Morimoto
Process Engineer
TEL

New Surface Preparation System; Batch-Single Hybrid Equipment

12:20 pm - 1:50 pm

Lunch

Session 2

1:50 pm - 2:20 pm
Duncan Meldrum, Hilltop Economics
Duncan Meldrum
Chief Economist
Hilltop Economics

Market Outlook

2:20 pm - 2:40 pm
Hsin-Yu Hsu
Hsin-Yu Hsu
R&D Engineer
Interuniversity Microelectronics Centre (IMEC)

Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al Stacks

2:40 pm - 3:00 pm
Chun-Ren (Jack) Ke
Chun-Ren (Jack) Ke
R&D Manager
Qnity Electronics

Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor Devices

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Nawaphorn Kuhakongkiat
Nawaphorn Kuhakongkiat
Researcher
Hiroshima University

Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface Control

3:50 pm - 4:10 pm
Soonmin Lee
Soonmin Lee
Master's Student
Hanyang University

An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration Scheme

4:10 pm - 4:30 pm
Wei-Shang Lo
Wei-Shang Lo
Advisory Scientist
IBM Research

Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures

4:30 pm - 4:50 pm
Ryotaro Maeda
Ryotaro Maeda
Engineer
Tokyo Electron Kyushu

Approaches to Further Enhance Cut Accuracy

4:50 pm - 5:10 pm
Hiroki Uoyama
Hiroki Uoyama
Manager
Micron Memory Japan, K.K

Advancements in Wafer Backside cleaning for DRAM Manufacturing

TUESDAY, MAY 19, 2026

Session 3

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 2 Opening Remarks

9:10 am - 9:50 am
Inna Skvortsova
Inna Skvortsova
Market Research Manager
SEMI

Day 2 Keynote—Navigating the AI-driven Cycle: Fab Investments and Materials Dynamics in a Fragmented World

9:50 am - 10:10 am
Srini Raghavan, ProSys Headshot
Srini Raghavan
Director of New Process Development
ProSys

Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging Structures

10:10 am - 10:30 am
Amir Taghavi
Amir Taghavi
Research Scientist
TEL

Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon Surface

10:30 am - 11:00 am

Networking Break

11:00 am - 11:20 am
Tyler Duncan
Tyler Duncan
Research Scientist
TEL

Ab Initio Study of Confined HF Etching Mechanism on SiO2

11:20 am - 11:40 pm
Shih Chih lin
Shih-Chih Lin
PhD Candidate
University of Washington

WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process Optimization

11:40 am - 12:00 pm
Moeka Ajiki
Moeka Ajiki
Engineer
Fujimi

Challenges and Solution of Post Ceria CMP Clean

12:00 pm - 1:30 pm

Lunch

Session 4

1:30 pm - 2:00 pm
JC Yang
Ji Chul Yang, Ph.D.
Chief of Technology Executive
EBARA Precision Machinery

Advanced Topography Correction Planarization Technology for Yield Enhancement

2:00 pm - 2:20 pm
Gyeongwon Lee
Gyeongwon Lee
Graduate Student
Hanyang University

Controlling the Molybdenum Dissolution and Oxidation During Post-CMP Cleaning

2:20 pm - 2:40 pm
Mona Moukrati
Mona Moukrati
PhD Student
STMicroelectronics

Controlled Cracking-Induced Delamination for Polymer-Based Cleaning

2:40 pm - 3:00 pm
Shogo Onishi
Shogo Onishi
RD Technical Manager
Fujimi

Design of the Buffing Cleaning Solution for Chemical Mechanical Cleaning on Advanced Technology Node

3:00 pm - 3:30 pm

Networking Break

3:30 pm - 3:50 pm
Suhas Ketkar
Suhas Ketkar
Marketing Leader
Elemental Scientific

Impact of Supply Chain Conditions on IPA Product Quality

3:50 pm - 4:10 pm
Dana Shoken
Dr. Dana Shoken
R&D Manager
CI-SEMI

Trace Water Measurement in Organic Solvent Systems for Semiconductor Manufacturing

4:10 pm - 4:30 pm
Allen Chan
Allen Chan, PhD
R&D Scientist, Balazs™ NanoAnalysis
Air Liquide

Thermal Vacuum Analysis and Identification of Contaminant Outgassing from Polymer Seals

4:30 pm - 4:50 pm
Sina Kaabipour
Sina Kaabipour
Postdoctoral Researcher
imec-USA

Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization Techniques

4:50 pm - 5:10 pm
Padraic O'Reilly
Padraic O'Reilly
Applications Scientist
Molecular Vista

IR-PiFM: Molecular Detection and Identification of Nanoscale Surface Contamination

6:30 pm - 8:00 pm

Networking & Poster Session Reception

WEDNESDAY, MAY 20, 2026

Session 5

8:00 am - 9:00 am

Breakfast

9:00 am - 9:10 am
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Day 3 Opening Remarks

9:10 am - 9:40 am
Ian Brown
Ian J. Brown, Ph.D.
President
SCREEN Advanced Technology Center of America

Wet Etching and Cleaning Trends: Scaling x 3D Integration

9:40 am - 10:00 am
Ashutosh Bhabhe
Ashutosh Bhabhe
CEO
14Si Solutions

Characterization of Particle Filtration Solutions in a Weak Acid

Siddarth Sampath
Siddarth Sampath
Director, Global WEC Filtration Applications
Entegris
10:00 am - 10:30 am

Networking Break

10:30 am - 11:00 am
Steven Kraft Entegris
Steven Kraft, Ph. D., PMP
Director of SG&E R&D Materials Solutions
Entegris

Wet-Etch Solutions Development for Advanced Node Devices

11:00 am - 11:20 am
Arim Woo
Arim Woo
Master's Student
Hanyang University

Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP Cleaning

11:20 am - 11:40 am
Sangita Kumari
Sangita Kumari
Principal Process Engineer
TEL Technology Center, America

Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL Integration

11:40 am - 12:00 pm
Hui Zhou
Hui Zhou
Principal Scientist
Huntsman USA

Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning Performance

12:00 pm - 1:30 pm

Lunch

Session 6

1:30 pm - 2:10 pm
Rebecca Routson
Rebecca Routson
Principal Director for CHIPS Test & Metrology
NIST

Day 3 Keynote—Measuring the Future: CHIPS Metrology Program Updates

2:10 pm - 2:30 pm
Diane Bijou
Diane Bijou
Researcher in Chemistry
Technic France

High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers

2:30 pm - 2:50 pm
Jim De Boer
Jim De Boer
Director, US Product and Operations
Trymax NexGen

TTV Optimization in Wet Chemical Thinning Using Integrated Metrology

2:50 pm - 3:20 pm

Networking Break

3:20 pm - 3:40 pm
Koji Nakata
Koji Nakata
Senior Researcher
Kurita Industries

Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional Water

3:40 pm - 4:00 pm
Chihiro Kobata
Chihiro Kobata
Engineer
JSR

Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOG

4:00 pm - 4:10 pm
Dave Maloney
David Maloney
SPCC Technical Committee Chair
Linx Consulting

Closing Remarks

-

Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.

Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge.

Off Add to Calendar 2026-05-18 00:00:00 2026-05-20 00:00:00 SPCC 2026—Surface Preparation & Cleaning Conference Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge. Wild Horse Pass 5040 Wild Horse Pass Blvd Chandler, AZ , AZ 85226 United States SEMI.org [email protected] America/Phoenix public America/Phoenix
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Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Webinar_2025-SCM_360x317_Event_Calendar_SCM_2025 Business Executive Technical
Highlighted content

Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

United States

SCM

Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.

Choose your session:

9:00 am - 10:00 am Off Add to Calendar 2025-09-23 09:00:00 2025-09-23 10:00:00 2025 Semiconductor Supply Chain survey: Insights for strategy and capabilities Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.Choose your session:US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Speakers

 

Henry Marcil

Partner

McKinsey & Company

Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech)

Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor

 

Kushal Jolapara

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines

Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors

Dan Peacock

Engagement Manager

McKinsey & Company

Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects

Leads Operations projects at Foundries, IDMs, and equipment clients

 

Event Contact:

Krish Dharma

[email protected]

Agenda

•    Lead times throughout the semiconductor value chain
•    Landscape and trends in purchasing agreements and LTAs
•    Demand forecasts, backlogs, and end markets
•    Market outlook, opportunities, and threats
•    New for 2025: Organizational capabilities in supply chain management

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SEMI Japan Office
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Physical Interfaces & Carriers Japan TC Chapter Meeting 

Date: Friday, September 26, 2025

Time: 10:00 am - 1:00 pm JST

Venue: SEMI Japan Office + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 1:00 pm Off Add to Calendar 2025-09-26 10:00:00 2025-09-26 13:00:00 Physical Interfaces & Carriers Japan TC Chapter Meeting Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Friday, September 26, 2025Time: 10:00 am - 1:00 pm JSTVenue: SEMI Japan Office + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan Office 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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