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Japan standards Technical
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3-6-11 Ariake,
Koto-ku, Tokyo
1350063
Japan

Standards

Physical Interfaces & Carriers Japan TC Chapter Meeting 

Date: Thursday, December 18, 2025

Time: 9:00 am - 12:00 pm JST

Venue: Room 905, TFT Building 9F, Tokyo, Japan in conjunction with SEMICON Japan + OVTCCM (Hybrid)

 

PLEASE NOTE

- The venue this year is not Tokyo Big Sight but TFT Building.

- Please bring your SEMICON Japan visitor badge.

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:00 am - 12:00 pm Off Add to Calendar 2025-12-18 09:00:00 2025-12-18 12:00:00 Physical Interfaces & Carriers Japan TC Chapter Meeting Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Thursday, December 18, 2025Time: 9:00 am - 12:00 pm JSTVenue: Room 905, TFT Building 9F, Tokyo, Japan in conjunction with SEMICON Japan + OVTCCM (Hybrid) PLEASE NOTE- The venue this year is not Tokyo Big Sight but TFT Building.- Please bring your SEMICON Japan visitor badge. AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here 3-6-11 Ariake, Koto-ku, Tokyo 1350063 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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United States Technical
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Due to unforeseen circumstances, this webinar has been cancelled.

United States

ESD Alliance 10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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Japan standards Technical
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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Automation Technology Japan TC Chapter Meeting 

Date: Friday, December 12, 2025

Time: 1:30 PM - 3:00 PM (JST)

via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)

Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed.

 

AGENDA

 

Standards Contact Information:

Nahoko Koga

Coordinator, Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

1:30 pm - 3:00 pm Off Add to Calendar 2025-12-12 13:30:00 2025-12-12 15:00:00 Automation Technology Japan TC Chapter Meeting Automation Technology Japan TC Chapter Meeting Date: Friday, December 12, 2025Time: 1:30 PM - 3:00 PM (JST)via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)Please note that the meeting venue might be changed due to room capacity.  If there is any change, we will inform you once it is confirmed. AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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Registration

Registration is Required!

After registering, you will receive a confirmation email that includes:

  • Virtual + Voting Instructions
  • Additional virtual meeting information (updated periodically before the meeting)

PLEASE NOTE:

To participate in the meetings, you must be a SEMI Standards Program Member.
Membership is FREE!

Complete the Application Form to become a Standards Member.

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United States

Only TC Chapter Meetings are listed. Please refer to FULL SCHEDULE for all other meetings.

MONDAY, FEBRUARY 9

10:00 am - 11:00 am

MEMS/NEMS North America Technical Committee Chapter Meeting

TUESDAY, FEBRUARY 10

9:00 am - 12:00 pm

Facilities & Gases Joint North America Technical Committee Chapter Meeting

1:00 pm - 4:00 pm

Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1

WEDNESDAY, FEBRUARY 11

9:00 am - 4:00 pm

Information & Control North America Technical Committee Chapter Meeting

9:00 am - 12:00 pm

Physical Interfaces & Carriers North America Technical Committee Chapter Meeting

1:00 pm - 4:00 pm

Liquid Chemicals North America Technical Committee Chapter Meeting - Day 2

Tentative

THURSDAY, FEBRUARY 12

8:00 am - 5:00 pm

Environmental, Health & Safety North America Technical Committee Chapter Meeting

1:00 pm - 2:30 pm

3D Packaging & Integration North America Technical Committee Chapter Meeting

1:00 pm - 3:00 pm

Metrics North America Technical Committee Chapter Meeting

Times are listed in PT (Pacific Time).

- Standards

Join us for the SEMI Standards Meetings

VIRTUAL Only!
 

Remember to save the dates for the upcoming Spring meetings (Albany, NY) in conjunction with SEMI ASMC (May 11-14, 2026) and SEMICON West moving back to San Francisco, CA October 13-15, 2026. 

SEMI Standards will host 9 committees + over 30 task forces engaged in various standardization activities, including:

  • Environmental, Health, and Safety (EH&S)
  • Facilities
  • Gases
  • Information & Control
  • Liquid Chemicals
  • Metrics
  • MEMS/NEMS
  • Physical Interfaces & Carriers
  • 3D Packaging & Integration

Note | Some Technical Committees + Task Forces may meet virtually outside of this Meeting set.

FULL SCHEDULE | PDF or Excel |

All meetings are in Pacific Time.
Subject to change, please check back frequently.
Last updated: Feb 10, 2026

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Next Meetings

Save the Date!

North America Standards Spring Meetings
May 11-14, 2026 @ Hilton Albany, Albany, New York

SEMICON West Standards Meetings
October 12-15, 2026 @ Moscone Center, San Francisco, California

Contact

Kevin Nguyen
Manager, International Standards Operations
(EH&S)

Laura Nguyen
Sr. Coordinator, International Standards
(Facilities, Gases, Liquid Chemicals, MEMS/NEMS, Physical Interfaces & Carriers, 3D Packaging & Integration)

Michelle Sun
Coordinator, International Standards
(Information & Control, Metrics, Traceability)

Register Now
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China https://www.semi.org.cn/semiconchina/mail/251017/251017.html SIIAS2 Business Executive Technical
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New Territories
Hong Kong
China

Off Add to Calendar 2025-12-02 00:00:00 2025-12-02 00:00:00 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS) New Territories Hong Kong China SEMI.org [email protected] America/Los_Angeles public
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Japan standards Technical
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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi
Chiyoda-ku, Tokyo
1010005
Japan

Standards

3D Packaging & Integration  Japan TC Chapter Meeting 

Date: Monday, March 9, 2026

Time: 2:00 PM - 5:00 PM JST

via OVTCCM/ SEMI Japan Office (Hybrid)

 

AGENDA

 

Standards Contact Information:

Akiko Yoshida

Senior Cooordinator, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 5:00 pm Off Add to Calendar 2026-03-09 14:00:00 2026-03-09 17:00:00 3D Packaging & Integration Japan TC Chapter Meeting 3D Packaging & Integration  Japan TC Chapter Meeting Date: Monday, March 9, 2026Time: 2:00 PM - 5:00 PM JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Akiko YoshidaSenior Cooordinator, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1010005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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United States Smarter Fabs Tile Business Executive Technical Training

Suggested Hotels:

Embassy Suites by Hilton Milpitas Silicon Valley
901 East Calaveras Boulevard
Milpitas, CA 95035
(408) 942-0400

Courtyard by Marriott Milpitas Silicon Valley
1480 Falcon Dr.
Milpitas, CA 95035
(408) 719-1966

rayvector

Minds.ai

gauss labs

Inficon Logo 170x65

accelovant

kuka logo

atomscale logo

Schneider testimonial
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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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As part of this process, this session brings together top executives from industry leaders across the entire value-chain spectrum – including device design & fabrication, interconnects & system integration, hyperscale architectures & algorithms, novel materials, as well as emerging disruptive technologies like photonics and quantum. Attendees will have the rare opportunity to get a strategic perspective from these distinguished experts about the state-of-the-art and learn about exciting future trends propelling the industry towards $1 Trillion in revenue.

Phoenix, AZ
United States

Session 1

10:30 am - 10:35 am
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

10:35 am - 11:00 am
Rozalia Beica
Rozalia Beica
Field CTO Packaging Technology
Rapidus Design Solutions

The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration

11:00 am - 11:25 am
Krishna Saraswat
Krishna Saraswat
Rickey/Nielsen Professor, Emeritus
Stanford University

Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics

11:25 am - 11:50 am
Katharina Westrich
Katharina Westrich
Global VP of Electronics, Semiconductors & Simulation
Siemens AG

Challenging the Status Quo: From Chip Innovation to Compute Optimization

11:50 am - 12:15 pm
SriLatha Manne
Senior Fellow
AMD

AMD - Presentation Title TBD

12:15 pm - 12:40 pm
Rad Desiraju
Rad Desiraju
Director, WW Industry Advisory
Microsoft

Scaling AI - From Silicon to Systems

12:40 pm - 12:45 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Session 1 Wrap-up

Session 2

2:00 pm - 2:05 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Welcome Remarks and Session Overview

2:05 pm - 2:30 pm
Noriko Suzuki
Noriko Suzuki
Global Industry Leader - Electronics, Institute for Business Value
IBM

Next generation semiconductor to support AI resiliency

2:30 pm - 2:55 pm
Laura Matz
Laura Matz
Chief Science and Technology Officer
Merck KGaA, Darmstadt, Germany

Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials

2:55 pm - 3:20 pm
Kirk M. Bresniker
Kirk M. Bresniker
Chief Architect and Fellow/VP, HPELabs
Hewlett Packard Enterprise

HPE Labs - Computing Futures from AI to Quantum to GenZ

3:20 pm - 3:45 pm
Jürgen Hatheier
Jürgen Hatheier
Chief Technology Officer of EMEA & APAC,
Ciena

Ciena - Presentation Title TBD

3:45 pm - 4:10 pm
Subodh Kulkarni
Subodh Kulkarni
President and CEO
Rigetti

Rigetti - Presentation Title TBD

4:10 pm - 4:35 pm
Celia Merzbacher
Celia Merzbacher
Executive Director,
Quantum Economic Development Consortium

Quantum Economic Development Corporation (QEDC) - Presentation Title TBD

4:35 pm - 4:40 pm
Pushkar Apte
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI

Closing Remarks

The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.

10:30 am - 4:40 pm Off Add to Calendar 2025-10-07 10:30:00 2025-10-07 16:40:00 Future of Computing: Energy-Efficient Computing for AI and Beyond The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem. Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public
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United States

Standards

Join us for the SEMI Standards

3D Packaging & Integration (3DP&I)

North America Technical Committee Chapter Fall Meeting

Date: Tuesday, October 14, 2025

Time: 13:00-14:30 Pacific Time

Online via Web Conference

To receive the calendar invite, please reach out to the contact below.

 

AGENDA

(Subject to change)

Last updated:  September 14, 2025

 

1:00 pm - 2:30 pm Off Add to Calendar 2025-10-14 13:00:00 2025-10-14 14:30:00 3D Packaging & Integration North America TC Chapter Fall Meeting 2025 Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated:  September 14, 2025  United States SEMI.org [email protected] America/Los_Angeles public

Virtual + Voting Instructions

SEMI uses RingCentral to host virtual meetings.

To receive the calendar invite, please reach out to the contact below.

To Vote During TC Chapter Meetings

  1. Open a separate Web browser and go to:  https://svm.semi.org/
  2. Click “Login”
  3. Enter your Standards Membership username and password (same login you use for voting on ballots)
  4. Find the meeting room you wish to attend under “Room Name”
  5. Click “Go” to enter the meeting room.

NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".

Contact

Laura Nguyen
Sr. Coordinator, International Standards

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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1010005
Japan

Standards

Information & Control Japan TC Chapter Meeting 

Date: Tuesday, October 21, 2025

Time: 9:30 am - 12:00 pm JST

Venue: SEMI Japan Office Room 1 + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:30 am - 12:00 pm Off Add to Calendar 2025-10-21 09:30:00 2025-10-21 12:00:00 Information & Control Japan TC Chapter Meeting Information & Control Japan TC Chapter Meeting Date: Tuesday, October 21, 2025Time: 9:30 am - 12:00 pm JSTVenue: SEMI Japan Office Room 1 + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku, Tokyo 1010005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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