Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Physical Interfaces & Carriers Japan TC Chapter Meeting
9:00 am - 12:00 pm
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Add to Calendar2025-12-18 09:00:002025-12-18 12:00:00Physical Interfaces & Carriers Japan TC Chapter MeetingPhysical Interfaces & Carriers Japan TC Chapter Meeting Date: Thursday, December 18, 2025Time: 9:00 am - 12:00 pm JSTVenue: Room 905, TFT Building 9F, Tokyo, Japan in conjunction with SEMICON Japan + OVTCCM (Hybrid) PLEASE NOTE- The venue this year is not Tokyo Big Sight but TFT Building.- Please bring your SEMICON Japan visitor badge. AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here3-6-11 Ariake, Koto-ku, Tokyo 1350063 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
1:30 pm - 3:00 pm
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Add to Calendar2025-12-12 13:30:002025-12-12 15:00:00Automation Technology Japan TC Chapter MeetingAutomation Technology Japan TC Chapter Meeting Date: Friday, December 12, 2025Time: 1:30 PM - 3:00 PM (JST)via Official Virtual TC Chapter Meeting + SEMI Japan (Hybrid)Please note that the meeting venue might be changed due to room capacity. If there is any change, we will inform you once it is confirmed. AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click hereSEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Remember to save the dates for the upcoming Spring meetings (Albany, NY) in conjunction with SEMI ASMC (May 11-14, 2026) and SEMICON West moving back to San Francisco, CA October 13-15, 2026.
SEMI Standards will host 9 committees + over 30 task forces engaged in various standardization activities, including:
Environmental, Health, and Safety (EH&S)
Facilities
Gases
Information & Control
Liquid Chemicals
Metrics
MEMS/NEMS
Physical Interfaces & Carriers
3D Packaging & Integration
Note |Some Technical Committees + Task Forces may meet virtually outside of this Meeting set.
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Add to Calendar2025-12-02 00:00:002025-12-02 00:00:002025 Semiconductor Innovation and Intelligent Application Summit (SIIAS)New Territories Hong Kong ChinaSEMI.org[email protected]America/Los_Angelespublic
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
2:00 pm - 5:00 pm
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Add to Calendar2026-03-09 14:00:002026-03-09 17:00:003D Packaging & Integration Japan TC Chapter Meeting3D Packaging & Integration Japan TC Chapter Meeting Date: Monday, March 9, 2026Time: 2:00 PM - 5:00 PM JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Akiko YoshidaSenior Cooordinator, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click hereSEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1010005 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Smart Sensors and Edge Intelligence for Advanced Process Control
Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.
Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system
Smart Sensors and Edge Intelligence for Advanced Process Control
Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.
Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system
8:00 am
-
8:45 am
Registration & Breakfast
8:45 am
-
8:55 am
Anshu Bahadur
SEMI
Day 1 - Welcome All
Welcome & SEMI Manufacturing Coalitions Overview
8:55 am
-
9:30 am
Russell Dover
General Manager, Service Product Line
LAM
Keynote: Vision – Edge Inference – Process Control, APC, FDC
9:30 am
-
9:55 am
James Bramante
Senior Data Scientist
INFICON
Managing Edge AI for Smart Sensor Process Control
9:55 am
-
10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler
Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing
10:20 am
-
10:35 am
Coffee Break
10:35 am
-
11:00 am
Chris Dickens
Application Eng
Beckhoff Automation
A Unified Industrial Platform for Production-Ready AI
11:00 am
-
11:25 am
Gokul Sathya
Research Scientist
Siemens
Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment
11:25 am
-
11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds
Intelligent Robots & Digital Twins for Advanced Manufacturing
11:50 am
-
12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector
Sensor as the Eyes and Ears of AI
12:05 pm
-
1:00 pm
Networking Lunch
Afternoon, Day 1: March 18th, 2026
.
Yield Enhancement through Edge-Driven Defect Detection and Classification
Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.
Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards
1:00 pm
-
1:05 pm
Karim Somani
SEMI
SEMI Fab Owners Alliance (FOA)
1:05 pm
-
1:35 pm
Surya Kalidindi
Co-Founder
Multiscale
Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier
1:35 pm
-
2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL
Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals
2:00 pm
-
2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense
Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test
2:25 pm
-
2:40 pm
Coffee Break
2:40 pm
-
3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA
Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures
3:05 pm
-
3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation
Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics
3:30 pm
-
3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic
Overcoming the challenges of AI defect detection and classification of semiconductor macro defects
3:55 pm
-
4:20 pm
Chengli He
Industry Manager
MathWorks
From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights
4:20 pm
-
4:35 pm
Stephen March
Semiconductor Leader
Schneider
Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing
4:35 pm
-
6:35 pm
Reception
Morning, Day 2: March 19th, 2026
Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination
Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.
Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems
8:00 am
-
8:45 am
Registration & Breakfast
8:45 am
-
8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI
Day 2 - Welcome All
Day 1 Overview & MSIG Overview
8:55 am
-
9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA
Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling
9:30 am
-
9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson
Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance
9:55 am
-
10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D
Perception-Enabled Assurance of Semiconductor Manufacturing Systems
10:20 am
-
10:35 am
Coffee Break
10:35 am
-
11:00 am
Murali Krishna
Vice President of Products
Minds.ai
Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance
11:00 am
-
11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine
Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs
11:25 am
-
11:50 am
Greg Berger
Solution Consultant
Rockwell Automation
Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs
11:50 am
-
12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon
The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence
12:15 pm
-
12:30 pm
Anshu Bahadur
SEMI
Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing
12:30 pm
-
1:30 pm
Networking Lunch
Afternoon, Day 2: March 19th, 2026
Predictive Maintenance at the Edge: From Vibration to Vision
Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.
Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization
1:30 pm
-
2:05 pm
James Bramante
Senior Data Scientist
INFICON
Keynote: Predictive Maintenance at the Edge - AI Enabling PdM
2:05 pm
-
2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM
Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations
2:30 pm
-
2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch
The Edge Revolution: Predictive Maintenance Reborn with Edge AI
2:55 pm
-
3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards
The Challenge Of AI At The Edge – Making Use Of Advanced Sensors
3:20 pm
-
3:35 pm
Coffee Break
3:35 pm
-
4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation
Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing
4:00 pm
-
4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI
Edge AI: The Future of Industrial Machine Health Monitoring
4:25 pm
-
4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens
How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%
Unlocking Smarter, More Autonomous Fabs with Edge AI
As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.
This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:
Predictive maintenance to prevent downtime
Adaptive process automation for maximum efficiency
Real-time decision-making at the source of data generation
Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.
Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing
In-Person Workshop | March 18-19, 2026 | Milpitas, CA
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Add to Calendar2026-03-18 00:00:002026-03-19 00:00:00Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor ManufacturingUnlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.Milpitas, CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
On Demand
As part of this process, this session brings together top executives from industry leaders across the entire value-chain spectrum – including device design & fabrication, interconnects & system integration, hyperscale architectures & algorithms, novel materials, as well as emerging disruptive technologies like photonics and quantum. Attendees will have the rare opportunity to get a strategic perspective from these distinguished experts about the state-of-the-art and learn about exciting future trends propelling the industry towards $1 Trillion in revenue.
Phoenix, AZ United States
Session 1
10:30 am
-
10:35 am
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Welcome Remarks and Session Overview
10:35 am
-
11:00 am
Rozalia Beica
Field CTO Packaging Technology
Rapidus Design Solutions
The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration
11:00 am
-
11:25 am
Krishna Saraswat
Rickey/Nielsen Professor, Emeritus
Stanford University
Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics
11:25 am
-
11:50 am
Katharina Westrich
Global VP of Electronics, Semiconductors & Simulation
Siemens AG
Challenging the Status Quo: From Chip Innovation to Compute Optimization
11:50 am
-
12:15 pm
SriLatha Manne
Senior Fellow
AMD
AMD - Presentation Title TBD
12:15 pm
-
12:40 pm
Rad Desiraju
Director, WW Industry Advisory
Microsoft
Scaling AI - From Silicon to Systems
12:40 pm
-
12:45 pm
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Session 1 Wrap-up
Session 2
2:00 pm
-
2:05 pm
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Welcome Remarks and Session Overview
2:05 pm
-
2:30 pm
Noriko Suzuki
Global Industry Leader - Electronics, Institute for Business Value
IBM
Next generation semiconductor to support AI resiliency
2:30 pm
-
2:55 pm
Laura Matz
Chief Science and Technology Officer
Merck KGaA, Darmstadt, Germany
Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials
2:55 pm
-
3:20 pm
Kirk M. Bresniker
Chief Architect and Fellow/VP, HPELabs
Hewlett Packard Enterprise
HPE Labs - Computing Futures from AI to Quantum to GenZ
3:20 pm
-
3:45 pm
Jürgen Hatheier
Chief Technology Officer of EMEA & APAC,
Ciena
Ciena - Presentation Title TBD
3:45 pm
-
4:10 pm
Subodh Kulkarni
President and CEO
Rigetti
Rigetti - Presentation Title TBD
4:10 pm
-
4:35 pm
Celia Merzbacher
Executive Director,
Quantum Economic Development Consortium
Quantum Economic Development Corporation (QEDC) - Presentation Title TBD
4:35 pm
-
4:40 pm
Pushkar Apte
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Closing Remarks
The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.
Future of Computing: Energy-Efficient Computing for AI and Beyond
10:30 am - 4:40 pm
Off
Add to Calendar2025-10-07 10:30:002025-10-07 16:40:00Future of Computing: Energy-Efficient Computing for AI and BeyondThe rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.Phoenix, AZ United StatesSEMI.org[email protected]America/Los_Angelespublic
3D Packaging & Integration North America TC Chapter Meeting
1:00 pm - 2:30 pm
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Add to Calendar2025-10-14 13:00:002025-10-14 14:30:003D Packaging & Integration North America TC Chapter Fall Meeting 2025Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated: September 14, 2025 United StatesSEMI.org[email protected]America/Los_Angelespublic
Virtual + Voting Instructions
SEMI uses RingCentral to host virtual meetings.
To receive the calendar invite, please reach out to the contact below.
Enter your Standards Membership username and password (same login you use for voting on ballots)
Find the meeting room you wish to attend under “Room Name”
Click “Go” to enter the meeting room.
NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".
Contact
Laura Nguyen Sr. Coordinator, International Standards
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Information & Control Japan TC Chapter Meeting
9:30 am - 12:00 pm
Off
Add to Calendar2025-10-21 09:30:002025-10-21 12:00:00Information & Control Japan TC Chapter MeetingInformation & Control Japan TC Chapter Meeting Date: Tuesday, October 21, 2025Time: 9:30 am - 12:00 pm JSTVenue: SEMI Japan Office Room 1 + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click hereSEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku, Tokyo 1010005 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo