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MILPITAS, Calif. – December 2, 2020 – Global semiconductor equipment billings surged 30% year-over-year and rose 16% to US$19.4 billion from the prior quarter, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

semi logo

SEMI and the Semiconductor Equipment Association of Japan (SEAJ) gather the data from more 80 global equipment companies that provide monthly reports. Following are quarterly billings data in billions of U.S. dollars quarter-over-quarter and year-over-year change by region:

 

Region

Q32020

Q22020

Q32019

3Q2020/2Q2020

3Q2020/3Q2019

China

5.62

4.59

 3.44

23%

63%

Taiwan

4.75

3.51

 3.90

36%

22%

Korea

4.22

4.48

 2.20

-6%

92%

Japan

2.24

1.72

 1.67

30%

34%

North America

1.37

1.64

 2.49

-17%

-45%

Rest of the World

0.60

0.37

 0.76

64%

-21%

Europe

0.58

0.46

 0.39

25%

47%

Total

 19.38

 16.77

 14.86

16%

30%

Source: SEMI (www.semi.org) and  SEAJ (www.seaj.or.jp), December 2020

 

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance  the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

 

Registration

Registration Fee: $985 Members | $1,185 Non-members

Students*: $100
*Current students (18 and above) are invited to register for a student pass. Please plan to have your student ID available when picking up your badge onsite. 

(Airfare and hotel accommodations are not included)

  • All Keynotes, tutorial, panel discussion, technical and poster sessions 
  • All conference materials (conference proceedings, attendee list, and approved PDF presentations) 
  • Breakfast, Lunch, and networking breaks
  • All Networking Events (Welcome Reception, Poster Session Reception, and Networking Happy Hour)
  • Complimentary entry to the Women In Semiconductors (WiS) Program ($50 value) 
  • Complimentary registration to the SEMI Standards Meetings (Registration Required)
  • Discount on SEMI U Workshop registration
  • Discount room rate at Hilton Albany 
  • Cancellations refund request must be submitted in writing to Taylor Zhao ([email protected]) on or before April 10, 2026 and will be subject to a $150 processing fee. After April 10, only substitution requests will be accepted. 
  • Substitution requests are welcome and will be accepted in writing from the original registrant by May 10, 2026. Email request to Taylor Zhao ([email protected]). 

If you have any questions regarding the conference or registration, please contact Taylor Zhao ([email protected]). 

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United States SEMI ASMC Advanced Semiconductor Manufacturing Conference Business Technical

Hotel

Hilton Albany

ASMC attendees may book accommodations at the Hilton Albany using our conference rate: 

The reservation deadline is Closed. We encourage early booking, as rooms may sell out before the cutoff.

Other hotels near Hilton Albany: 

Hilton Albany

2026 Sponsors

Become an ASMC Sponsor

Align your company with the ASMC, one of the most highly respected semiconductor manufacturing conferences in the industry. The attendees are an excellent audience to expand your brand image to new and existing markets.

CONTACT

Shane Poblete
Director, Sales & Business Development - Expo and Events, SEMI
Tel: +1 202-847-5983
Email: [email protected]

Media Sponsors

SEMI is proud to partner with the following media to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.

www.3dincites.com

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www.meptec.org

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www.semiconductordigest.com

Read | Subscribe | Website

www.techbriefs.com

Read | Subscribe | Website

Advancing Semiconductor Manufacturing Excellence

ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results and select ASMC manuscripts are published in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing.

The ASMC Committee is composed of industry professionals representing the microelectronics supply chain. All papers presented at the conference are peer-reviewed by the ASMC Technical Committee.

 

WHO SHOULD ATTEND

  • Academia
  • Chief Technology Officers
  • Fab Managers
  • Equipment Manufacturers
  • IC Manufacturers
  • Materials Suppliers
  • Operations Managers
  • Process Engineers
  • Product Managers
  • Technical Experts

       
     

Mobile App Sponsor—

 

ASMC 2026 Full Agenda

 

 

Hilton Albany
40 Lodge St
Albany, NY 12207
United States

Technical Sessions

Advanced Equipment Processes and Materials

Advanced Metrology

Sponsor—Nova

Nova

Advanced Patterning

Advanced Process Control

Big Data Management and Machine Learning

Contamination Free Manufacturing

Defect Inspection and Reduction

Equipment Optimization

Factory Optimization

Smart Manufacturing

Inficon Logo 170x65

Wafer Level Packaging & Novel Devices

GlobalFoundriesNEW_170x65

Yield Enhancement / Yield Methodologies

Networking Events

Welcome Reception

Sponsor—Axcelis

Axcelis

Buffet Lunch

Sponsor—SilcoTek

SilcoTek 170x65_NEW

Poster Session Reception

Student Robotics Demo

TEL

Networking Happy Hour

- APHI

ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies. 

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Co-located Events & Meetings

 

SEMI University (SEMI U)

We are excited to partner with SEMI University on Monday, May 11 and Thursday, May 14, 2026.  Whether you're a seasoned professional looking to improve your skills or a newcomer eager to break into the industry, SEMI U specializes in semiconductor training, certifications, and the technical education to support your personal and professional growth. 

SEMI University (SEMI U) is the premier learning platform designed for individuals passionate about advancing their careers in the global semiconductor and electronics industry. With over 800 courses available in multiple languages and flexible formats, SEMI U empowers you with knowledge to enhance your expertise, staying ahead in our rapidly evolving field.  

 

Women in Semiconductors

We look forward to reuniting with Women in Semiconductors (WiS), to be held on Thursday, May 14, 2026 at the Albany Hilton, Albany, New York. 

WHO SHOULD ATTEND?

Company leaders, managers, team members, HR professionals, academia and students. Regardless of gender, we encourage attendance by everyone who is interested in fostering a more diverse, equitable and inclusive semiconductor industry, and by anyone who is responsible for developing internal or external programs to support women. 

 

SEMI Standards

Shape the Future of Our Industry! Attend and participate in SEMI Standards meetings during ASMC.
Discover more and register at no cost.

WHO SHOULD ATTEND?

Technical; process engineers, materials specialists, director of engineering, software programmers, EHS/sustainability officers

 

SCIS General Meeting

The Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community - General Meeting is on Thursday, May 14, 11:30am-1:00pm. 

WHO SHOULD ATTEND?

All SEMI SCIS members are welcome to attend.

To RSVP, or if you are a SEMI member interested in learning more about how to get involved with SCIS, please contact Christie Baker at [email protected] for more information.
 

SEMI Manufacturing Cybersecurity

The Semiconductor Manufacturing Cybersecurity Consortium (SMCC)  Technology Community - Hybrid General Meeting is on Wednesday, May 13, 4-5 PM. Contact [email protected] for questions and RSVP at http://tiny.cc/smcc26
 

Glass4Chips Summit

Join FuzeHub in partnership with SEMI and NY Creates on May 14–15, 2026 in Albany, NY for the Glass4Chips Summit 2026.

Hosted at NY Creates (May 14) and the Hilton Albany (May 15), this two-day summit will convene leaders from industry, government, academia, and national security to:

✔ Address adoption barriers
✔ Strengthen the domestic glass supply chain
✔ Define actionable next steps to secure U.S. leadership

WHO SHOULD ATTEND?

Semiconductor manufacturers and suppliers, startups and design houses, defense stakeholders, researchers, policymakers, and ecosystem strategists.

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Group Discounts Codes—

  • SMC3 - Register 3: 15% off (must register all 3 on same order)
  • SMC5 - Register 5: 20% off (must register all 5 on same order)
  • SMC10 - Register 10: 25% off (must register all 10 on same order)

NOTE:  For Group Discounts, Attendees must be registered within the same order.

For more information, please contact Karen Popp, Senior Program Manager, at [email protected].

Registration is final. Cancellations will not be accepted. No refunds provided. Substitutions are only accepted with written permission from the original registrant.

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Hotel

SMC24 Hayes Mansion San Jose Photo

HAYES MANSION
200 Edenvale Avenue
San Jose, CA, CA 95136

Book your hotel room before the link expires on June 12, 2026.

 

HEALTH & SAFETY

Your health and safety are our top priority. The personal preference of the attendees to wear masks is respected at all SEMI events. SEMI Americas (“SEMI") monitors developing federal, state, and local health and safety recommendations as well as requirements regarding COVID to determine the most appropriate safety protocols for our in-person events.

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Gold

Edwards Vacuum Logo 170x65
EFC Gases & Advanced Materials NEW
Huntsman

Silver

Applied Materials
Lam Research
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Event

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JSR Micro
Sundt

BECOME A SPONSOR FOR SMC

Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives. Become a sponsor and brand your company to an influential audience at SMC.

 

CONTACT

Shane Poblete
Director, Sales & Business Development - Expo and Events, SEMI
Tel: +1 202-847-5983
Email: [email protected]

Materials Innovation in the AI Era: Powering Semiconductors to One Trillion Dollars and Beyond

Beyond the AI boom lies a challenge—and opportunity—that is far more foundational: ensuring the materials ecosystem underpinning a $2.5 trillion industry is resilient enough to support the next era of innovation. As artificial intelligence accelerates demand for advanced hardware, energy infrastructure, and high‑performance components, the pressure on global materials supply chains has never been greater.

This year, SMC explores how industries can achieve scale readiness through smarter design, diversified sourcing, sustainable processes, and breakthrough materials science. It invites leaders to look past the excitement of AI itself and toward the essential building blocks that will determine whether this technological revolution is secure and sustainable.

The Strategic Materials Conference—SMC offers valuable content and unprecedented networking opportunities for semiconductor industry professionals who share common strategic objectives on materials innovation, management, and business success. 

Sessions

  • ​Market, Geopolitics & Outlook 
  • ​Materials for Scalable AI Systems​
  • Advanced Packaging & Materials Integration​
  • From Labs to FabsAccelerating Materials Deployment at Industrial Scale
  • ​Quantum & Emerging Devices

Executive Panel–Strengthening the Supply Chain​

REGISTRATION INCLUDES

  • Approved speaker PDF presentations
  • Breakfast, lunch, coffee breaks
  • Two networking receptions
  • Tabletop exhibits

WHO SHOULD ATTEND

SMC offers valuable content and unprecedented networking opportunities for semiconductor industry professionals who share common strategic objectives on materials innovation, management, and business success. 

CEO  ●  CTO  ●  Presidents & General Managers  ●  Executive VP & Senior Executives  ●  Engineering & Fab Managers ●  Academia  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms  ●  Consortiums
 

2026 ORGANIZING COMMITTEE

SMC Photo Gallery

Hayes Mansion
200 Edenvale Avenue
San Jose, CA, CA 95136
United States

MONDAY, JULY 13, 2026

5:30 pm - 7:00 pm

Welcome Reception

Entegris 170x65

TUESDAY, JULY 14, 2026

8:00 am - 8:30 am

Registration, Check-In/Continental Breakfast

8:30 am - 8:40 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:40 am - 8:50 am
Sanjiv Bhatt, Mitsubishi
SMC Co-Chair
Sanjiv Bhatt
Director, OEM
Mitsubishi Chemical Advanced Materials

Opening Remarks

8:50 am - 9:20 am
Hideaki Okamoto, Mitsubishi Headshot
Hideaki Okamoto
Director, New Generation Business Development
Mitsubishi Chemical

Keynote—A Strategic Approach in the Era of Materials Innovation

9:20 am - 9:50 am
Audrey Charles, Lam Research
Audrey Charles
Senior Vice President, Corporate Strategy and Advanced Packaging, Lam Research
President, Lam Capital

Keynote—Co-Engineering the AI Era: How Materials, Process and Equipment Innovations Converge in Advanced Packaging

9:50 am - 10:20 am

Networking Break

Session 1—Market, Geopolitical & Economic Trends, Forecast & Outlook

10:20 am - 10:25 am

Opening Remarks

Sundt
10:25 am - 10:55 am
Charles Shi, Needham & Company
Charles Shi, PhD
Managing Director
Needham & Company
10:55 am - 11:25 am
Clark Tseng, SEMI Market Intelligence Team (MIT)
Clark Tseng
Senior Director, Market Intelligence
SEMI
Mark Thirsk, Linx Consulting
Mark Thirsk
Managing Partner
Linx Consulting

11:25 am - 11:55 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

News from Washington and Beyond

11:55 pm - 1:30 pm

Lunch

Session 2—Materials for Scalable AI Systems

Session Sponsor

EMD Electronics Logo 170x65
1:30 pm - 1:35 pm

Opening Remarks

1:35 pm - 2:05 pm
Katherine Hutchinson, EMD Electronics
Katherine Hutchinson, PhD
Vice President and General Manager, Metallics, Thin Film Business
EMD Electronics

Materials Discovery in the Era of Scientific Super Intelligence

2:05 pm - 2:35 pm
Mark O'Neill
Vice President, R&D and Engineering
Entegris

Taming AI Scaling Stresses—Digital Materials Discovery for Manufacturing-Ready Adoption

2:35 pm - 3:05 pm
Mingqi Li, Qnity Electronics
Mingqi Li, PhD
Technical Fellow
Qnity Electronics
3:05 pm - 3:35 pm

Networking Break

3:35 pm - 4:05 pm
Chris Baldwin, Boston Materials
Chris Baldwin
Vice President, Product
Boston Materials

Thermal Materials Implications of the Explosion in AI Compute Demand

Session 3—Advanced Packaging & Materials Integration

4:05 pm - 4:10 pm

Opening Remarks

4:10 pm - 4:40 pm
Sony Varghese, Applied Materials
Sony Varghese
Managing Director
Applied Materials

Materials Engineering for Improved Stacking in HBM and Chiplet Integration

4:40 pm - 5:10 pm
Kazuyuki Mitsukura, Resonac
Kazuyuki Mitsukura, PhD
Technical Director
Resonac America
5:10 pm - 5:40 pm
Rozalia Beica, Rapidus Design Solutions
Rozalia Beica
Field CTO, Packaging Technologies
Rapidus Design Solutions

Advanced Packaging at the Heart of the AI Age

5:40 pm - 7:00 pm

Networking Reception & Start-Up Poster Session

WEDNESDAY, JULY 15, 2026

7:30 am - 8:00 am

Registration, Check-In/Continental Breakfast

8:00 am - 8:05 am

Opening Remarks

8:05 am - 8:35 am
Beth Adkison, Intel
Beth Adkison
Senior Director, Global Materials Organization
Intel

Keynote—From Innovation to Scale: Ramp Readiness in the AI Era

8:35 am - 9:05 am
Chuck Mattera, Avalanche Thinking
Chuck Mattera
Founder and CEO
Avalanche Thinking

Keynote—Compound Semiconductors in the Cognitive Age

Session 4—From Lab to Fab—Accelerating the Industrialization of Next Generation Materials Deployment and Manufacturing

9:05 am - 9:10 am

Opening Remarks

9:10 am - 9:40 am
Mitchell Hsing, InchFab
Mitchell Hsing, PhD
Co-Founder and CEO
InchFab
9:40 am - 10:10 am
Adrian Alvarez
Business Development Director, Deputy CTO
RASIRC

10:10 am - 10:40 am

Networking Break

10:40 am - 11:10 am
Asif Khan, Georgia Institute of Technology
Asif Khan, PhD
Associate Professor, School of Electrical and Computer Engineering
Georgia Institute of Technology
11:10 am - 11:40 am

11:40 am - 12:40 pm

Lunch

Session 5—Quantum and the Future of Emerging Devices

12:40 pm - 12:45 pm

Opening Remarks

12:45 pm - 1:15 pm
Pooya Tadayon, Ayar Labs
Pooya Tadayon
VP and Senior Fellow
GlobalFoundries

Enabling Quantum Computing Through Advanced Packaging

1:15 pm - 1:45 pm
Elica Kyoseva, NVIDIA
Elica (Elitsa) Kyoseva
Director, Quantum Algorithm Engineering
NVIDIA

Defining the Quantum-GPU Supercomputer

1:45 pm - 2:15 pm
Percy Gilbert, PhD, SkyWater Technology
Percy Gilbert, PhD
Senior Vice President, Engineering
SkyWater Technology / IonQ

Industrializing the Next Compute Era—From Materials to Manufacturing

2:15 pm - 2:45 pm

Networking Break

Session 6—Executive Panel: Strengthening the Supply Chain for Industry Growth

3:00 pm - 3:05 pm

Opening Remarks

3:05 pm - 4:05 pm
Chuck Mattera, Avalanche Thinking
Chuck Mattera
Founder and CEO
Avalanche Thinking

Executive Panel—Strengthening the Supply Chain for Industry Growth

4:05 pm - 4:10 pm

Closing Remarks

- APHI EMG Off Add to Calendar 2026-07-13 00:00:00 2026-07-15 00:00:00 SMC 2026—Strategic Materials Conference Hayes Mansion 200 Edenvale Avenue San Jose, CA, CA 95136 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 1

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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC30 Business Executive Technical
Highlighted content

High-temperature materials are critical for applications in harsh-environment circuitry, where devices must operate reliably under extreme thermal, chemical, and mechanical stress. In this Master Class, Dr. Shenqiang (Shen) Ren will present a high-throughput ink materials development strategy enabled by non-equilibrium processing and hybrid additive manufacturing. This approach enables rapid synthesis, combinatorial screening, and direct integration of functional materials onto diverse substrates. The resulting materials exhibit strong electrical performance, robust adhesion, and long-term stability under harsh operating conditions. This high-throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, providing a versatile pathway toward next-generation printed electronics designed for extreme environments.

ABOUT THE SPEAKER

Shenqiang (Shen) Ren, PhD
Dr. Shenqiang Ren is a Professor of Materials Science and Engineering at the University of Maryland, College Park, with research interests in emerging functional and structural materials. He received his Ph.D. in Materials Science and Engineering from the University of Maryland, College Park, and subsequently completed postdoctoral training at the Massachusetts Institute of Technology (MIT). 

United States

Shenqiang Ren
Shenqiang (Shen) Ren , PhD
Department of Materials Science and Engineering, Professor
University of Maryland, College Park
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a focused Master Class with Dr. Shenqiang (Shen) Ren, exploring the development of high‑temperature materials for harsh‑environment printed and flexible hybrid electronics (FHE). This session will examine how devices can be engineered to operate reliably under extreme thermal, chemical, and mechanical stress—conditions where conventional materials and processes often fail.

The Master Class will also highlight how this high‑throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, offering a versatile pathway toward next‑generation printed electronics designed for extreme conditions.

10:00 am - 12:00 pm Off Add to Calendar 2026-08-26 10:00:00 2026-08-26 12:00:00 FEMC#30 High Throughput Material Development for Extreme Environment Printed Electronics Join us for a focused Master Class with Dr. Shenqiang (Shen) Ren, exploring the development of high‑temperature materials for harsh‑environment printed and flexible hybrid electronics (FHE). This session will examine how devices can be engineered to operate reliably under extreme thermal, chemical, and mechanical stress—conditions where conventional materials and processes often fail.The Master Class will also highlight how this high‑throughput framework accelerates the discovery and deployment of printable materials for interconnects, heaters, and EMI shielding, offering a versatile pathway toward next‑generation printed electronics designed for extreme conditions. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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Belgium France Germany Ireland Italy United States Plasma Etching 8/25 Training

Course Description

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed. 

Learning Objectives

  • Understand the fundamentals of dry etching and the basic concepts of plasma etching
  • Understand the physics of rf glow discharges (both high and low density)
  • Understand the surface science aspects of RIE including the role of energetic ions
  • Recognize the factors which influence etching anisotropy
  • Define the steps of plasma-surface chemistry leading to etching

Topics Covered

  • Fluorocarbon plasma etching of Si and its compounds
  • Selectivity, loading effects, and aspect ratio dependent etching
  • Uniformity of etching, damage, feature charging issues, and particles
  • Etching of other materials (Al, organics, III-V compounds, etc)
  • Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
  • Issues in high density plasma etching, wall effects, and ion beam-based methods
  • Deep Reactive Ion Etching (DRIE)
  • Applications and processing etching using ALE
  • End point detection

Who Should Attend

This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field. 

Instructor

Richard Beaudry

PT International, LLC

Instructor Bio
 

Testimonials

See what previous course participants had to say about this training!

  • "Instructors' Process and Hardware knowledge were impressive."
  • "I finally gained a clear understanding of the RIE process."
  • "The instructor had a very good knowledge of the content."
  • "I had a great time to learn fundamental concepts of plasma etching course from SEMI."
  • "The aspect of the course that I found most beneficial was the Bosch processing parameter discussions on profile management. This subject was clearly the expertise of the presenter who skillfully addressed my questions regarding the subject."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. 

Pricing
  • Members: $745
  • Non-Members: $845

* * Group pricing for up to 20 attendees: $9900
Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2026-08-25 08:00:00 2026-08-26 12:00:00 Plasma Etching, ALE, & RIE (Americas & EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $745Non-Members: $845* * Group pricing for up to 20 attendees: $9900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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United States Overview of Semiconductor Mfg 8/19 Training
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Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Dates and Times

August 19, 2026  8:00 - 5:00PT

August 20, 2026  8:00 - 1:30 PT

Pricing

Early Bird Special! $100 off

  • Members: $995 $895
  • Non-Members: $1,095 $995

 * Group pricing for up to 20+ attendees: $12,900
Any questions, please contact [email protected]

8:00 am - 5:00 pm Off Add to Calendar 2026-08-19 08:00:00 2026-08-20 17:00:00 Overview of Semiconductor Manufacturing (Americas) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.Dates and TimesAugust 19, 2026  8:00 - 5:00PTAugust 20, 2026  8:00 - 1:30 PTPricingEarly Bird Special! $100 offMembers: $995 $895Non-Members: $1,095 $995 * Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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United States Understanding Training

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "Denny Frye knows so much about the history of the semiconductor industry that he was able to tie together many different industries and technologies that I have heard about but never knew how they were connected."
  • "Great overview of the semiconductor industry & market."
  • "This was a very detailed course on many facets of the industry, would recommend!"
  • "It was a great mix of technical and overview of the key players in the market!"
  • "Good blend on technical and commercial topics."
  • "Excellent introduction to the semiconductor world."
  • "Great session on the understanding of the semiconductor industry in a nutshell."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

Early Bird Pricing $100 off  

  • Members: $845 $745
  • Non-Members: $945 $845

* Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

8:00 am - 5:00 pm Off Add to Calendar 2026-08-18 08:00:00 2026-08-18 17:00:00 Understanding Semiconductor Technology and Business (Americas) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingEarly Bird Pricing $100 off  Members: $845 $745Non-Members: $945 $845* Group pricing for 20+ attendees: $9900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
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SEMI
CA
United States

9:00 am - 9:15 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
Ben Gross Headshot
Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
Jeff Rudnik Headshot
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
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Registration

SEMI Members: $25
Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members: $50

Students: Contact Paul Cohen ([email protected]) for student pricing.

Germany Taiwan United States ESDA Savage on Security 3 360.jpg Technical
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Designing functionally correct, high-performance, and provably secure system-on-chips (SoCs) has become a strategic imperative for modern computing infrastructure. Yet traditional design and verification methodologies are increasingly strained by escalating complexity, massive design scales, heterogeneous integration, and rapidly evolving security threats. Ensuring correctness, scalability, comprehensiveness, and adaptability across the full SoC lifecycle now exceeds the practical limits of conventional toolchains and human-centric workflows.

The emergence of large language models (LLMs) introduces a transformative opportunity for SoC design automation. Beyond natural language understanding and code generation, advanced LLMs demonstrate capabilities in architectural reasoning, specification refinement, vulnerability analysis, and design-space exploration. However, monolithic models alone are insufficient for the multidisciplinary and iterative nature of chip design. An agentic paradigm—where specialized LLM-driven agents collaborate within a coordinated framework—enables modular reasoning, cross-layer verification, security validation, and adaptive decision-making throughout the design process.

This talk will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. The framework integrates design synthesis, threat modeling, formal reasoning, runtime monitoring strategies, and hardware–software co-verification into a cohesive workflow. Looking ahead, such agentic systems point toward a future of self-optimizing, security-aware, and continuously verified silicon—where AI-driven design environments not only accelerate innovation but also fundamentally redefine how we conceive, build, and trust next-generation microelectronic systems.

 

United States

9:00 am - 9:10 am
Warren Savage
Warren Savage
Researcher
University of Maryland Applied Research Laboratory for Intelligence and Security

Welcome and Introduction

9:10 am - 10:00 am
Mark Tehranipoor
Mark M. Tehranipoor
Distinguished Professor
Department of Electrical and Computer Engineering, University of Florida

Featured Presentation

ESD Alliance

This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification.

9:00 am - 10:00 am Off Add to Calendar 2026-09-10 09:00:00 2026-09-10 10:00:00 ESD Alliance Webinar: Gen-AI for Chip Design and Security This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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