Advanced Packaging at the Heart of the AI Age
Artificial intelligence (AI) is transforming the semiconductor industry, driving unprecedented demands for computing performance, memory bandwidth, power efficiency, and system scalability. While continued innovation in leading-edge silicon remains essential, meeting the requirements of next-generation AI and high-performance computing systems increasingly depends on advances in packaging, heterogeneous integration, and system-level optimization.
Advanced packaging has emerged as a critical complement to silicon scaling, enabling the integration of leading-edge logic, high-bandwidth memory (HBM), and specialized accelerators into highly efficient computing platforms. Technologies such as chiplets, 2.5D and 3D integration, advanced interconnects, and emerging packaging architectures are redefining how semiconductor systems are designed, manufactured, and deployed.
Presented from the perspective of Rapidus and its vision for next-generation semiconductor manufacturing, this talk will examine the growing role of advanced packaging in enabling scalable AI systems and driving innovation beyond the boundaries of the individual chip. It will discuss key packaging trends, the increasing importance of materials innovation, and the ecosystem collaboration required to support the next generation of AI and high-performance computing platforms.
As the industry evolves from a chip-centric to a system-centric paradigm, advanced packaging is becoming a key differentiator for performance, power efficiency, and scalability, enabling the computing infrastructure that will power the AI age.
BIOGRAPHY
Rozalia Beica is a distinguished leader in the advanced packaging industry with over 28 years of international experience spanning technology development, business strategy, ecosystem partnerships, and market intelligence. Her expertise combines deep technical knowledge with broad cross-industry experience across electronic materials, substrates, semiconductor equipment, system manufacturing, and heterogeneous integration.
She currently serves as Field CTO for Packaging Technologies at Rapidus Design Solutions, leading activities in advanced packaging strategy, technology scouting, ecosystem development, and industry thought leadership. Prior to Rapidus, she held senior leadership and executive roles at Applied Materials, AT&S, DuPont, Lam Research, Maxim Integrated Products, LQDX, and Yole Développement. Having lived and worked across North America, Europe, and Asia, she brings a global perspective on semiconductor ecosystems and supply chain dynamics.
An active industry leader, Rozalia has led numerous international symposiums, technical working groups, and heterogeneous integration roadmapping initiatives. She served on the board of IEEE EPS and IMAPS Executive Council and currently she leads the IMAPS Silicon Valley Chapter. She also serves on multiple technical committees and advisory boards, including SEMI, SIA, ICEP Japan, IMPACT Taiwan, Thintronics, Terecircuits, and NSSRISE.
She has authored and co-authored more than 175 technical publications and presentations, including book chapters on 3D integration, and is the recipient of several industry honors, including R&D 100 Award and the IMAPS Leadership Award. She holds M.Sc. degrees in Chemical Engineering and Technology Management, as well as a Global Executive MBA.