AI Demand, Advanced Logic and Memory Drive Record Semiconductor Equipment Billings in 2025

MILPITAS, Calif. – April 7, 2026 – Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today. The data is available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report. 

In 2025, the global front-end semiconductor equipment market posted solid growth, with wafer processing equipment sales increasing 12% and other front-end segments rising 13%. The expansion was driven primarily by continued investment in leading-edge logic and memory capacity, supported by AI-related demand and ongoing node and technology migrations.

The back-end equipment segment also recorded strong growth in 2025. Test equipment billings surged 55% year-over-year as AI devices and high-bandwidth memory (HBM) increased performance requirements and test intensity, while assembly and packaging equipment sales rose 21% as adoption of advanced packaging technologies continued to expand.

"Record semiconductor equipment billings of $135 billion in 2025 underscore the scale and urgency of the industry's buildout as AI accelerates demand for leading-edge logic, advanced memory and high-bandwidth architectures," said Ajit Manocha, SEMI President and CEO. "From wafer fab investments to the rapid rise of advanced packaging and test, the global ecosystem is expanding capacity and capability to support the next wave of innovation."

Regionally, semiconductor equipment spending remained concentrated in Asia in 2025, with China, Taiwan, and Korea together accounting for 79% of the global market, compared with 74% in 2024.

In 2025, spending in China remained near record levels at $49.3 billion, down just 0.5% from the prior year, as domestic chipmakers continued to invest in mature nodes and select advanced capacity. Equipment spending in Taiwan rose 90% year-over-year to a record $31.5 billion, reflecting AI- and HPC-driven capacity expansion. Korea increased 26% to $25.8 billion as investment in HBM and DRAM remained strong. 

In 2025, spending in China remained near record levels at $49.3 billion, down just 0.5% from the prior year, as domestic chipmakers continued to invest in mature nodes and select advanced capacity. Equipment spending in Taiwan rose 90% year-over-year to a record $31.5 billion, reflecting AI- and HPC-driven capacity expansion. Korea increased 26% to $25.8 billion as investment in HBM and DRAM remained strong. 

Japan recorded 22% growth to $9.5 billion, supported by continued investment in domestic advanced-node manufacturing. Europe declined 41% to $2.9 billion, marking a second consecutive year of contraction amid ongoing weakness in automotive and industrial demand. North America fell 20% to $10.9 billion as spending moderated following earlier capacity expansion. The rest of the world increased 25% to $5.2 billion, reflecting expanding activity in emerging semiconductor production markets.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS report is a summary of the monthly billings figures for the global semiconductor equipment industry.

About SEMI Market Data

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: 

• Monthly SEMI North American Billings Report, an early perspective of equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
• Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

Download a sample EMDS report.

For more information or to subscribe, please contact SEMI Market Intelligence at [email protected]. Details on SEMI market data are available at SEMI Market Data.   

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SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

• Read more about SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year

Rogue Valley Microdevices (RVM), a U.S.-based pure-play MEMS foundry, today announced the launch of its foundry-flexible MEMS Design Services, expanding its ability to support customers from early concept through production-ready device design.

This new capability allows customers to work with RVM as a design partner independent of fabrication location. Customers can develop manufacturable MEMS devices with RVM and then choose to fabricate at the foundry that best aligns with their technical requirements, capacity needs, and supply chain strategy.

RVM offers three flexible engagement models:
• Design – MEMS device design, modeling, and layout development
• Design & Technology Transfer – Design with structured transfer to a customer-selected foundry
• Design & Fabricate – Integrated design-to-manufacturing within RVM’s MEMS foundry

This approach gives customers greater control over development risk, cost, and supply chain resilience while ensuring designs are grounded in real fabrication processes from the start.

To lead this initiative, Rogue Valley Microdevices has appointed Scott Rauscher, PhD, a MEMS engineering leader with nearly two decades of experience spanning U.S. government research, defense programs, and commercial technology development.

MEMS Design Services at Rogue Valley Microdevices

The addition of design services reflects growing demand for deeper collaboration during device development and increased flexibility in selecting manufacturing partners.

“Many of our customers are pushing the boundaries of MEMS performance and integration, and that requires close collaboration between design and manufacturing,” said Jessica Gomez, CEO of Rogue Valley Microdevices. “By adding design services alongside our fabrication capabilities, we help customers accelerate development, optimize device performance, and move more efficiently from concept to commercialization. Scott Rauscher’s experience across design, modeling, and microfabrication makes him the ideal leader to build this capability.”

RVM’s Design Services support customers across key areas of MEMS development, including:
• MEMS device design and layout development
• Implementation of design rule checks and layout standards
• Design-of-experiment (DOE) array creation
• Integration of process monitors for lithography, etch, and thin film validation
• Process flow development and refinement for manufacturability

RVM’s engineering team works closely with customers to align device design with proven fabrication methods, reducing iteration cycles and improving first-pass success.
In parallel, Rogue Valley Microdevices is developing more automated design workflows using industry tools such as L-Edit and K-Layout, while advancing toward a formal Process Design Kit (PDK) to further streamline collaboration and accelerate development timelines.

Scott Rauscher Joins Rogue Valley Microdevices Team

Scott Rauscher brings extensive experience in MEMS design and technology development across both government and industry. Most recently at L3Harris Technologies, he led process architecture and technology strategy while managing a microfabrication and design engineering team. In that role, he developed critical device technology and helped grow it into a portfolio exceeding $80 million.

His career also includes leadership roles at the Naval Surface Warfare Center and the U.S. Army Research Laboratory, where he served as a MEMS device inventor and microfabrication lead. Rauscher holds more than ten patents issued and pending and has been active in industry and research organizations, including the Florida Semiconductor Institute, the MMEC consortium’s Quantum Working Group, and national semiconductor infrastructure initiatives.

“Rogue Valley Microdevices is uniquely positioned to help customers bridge the gap between innovative device concepts and manufacturable products,” said Dr. Scott Rauscher, Chief Innovation Officer, Rogue Valley Microdevices. “With the new Palm Bay facility coming online and the addition of integrated design services, we have an opportunity to build a collaborative environment where device engineers can work closely with the fab to accelerate development and scale promising technologies into production.”

The launch of Design Services marks another step forward for Rogue Valley Microdevices as it prepares to open its Palm Bay facility and expand its U.S.-based manufacturing capabilities. Together with the company’s established operations in Medford, Oregon, the new fab will strengthen domestic MEMS production capacity while providing customers with greater supply chain resilience and advanced wafer services.

To learn more about RVM’s Design Services, please contact: [email protected]

About Rogue Valley Microdevices

Rogue Valley Microdevices (RVM) is a U.S.-based pure-play MEMS foundry providing integrated design services, MEMS manufacturing, and wafer services, enabling customers to move efficiently from concept to scalable manufacturing. RVM supports the full MEMS development lifecycle, from device design and process development to volume manufacturing. By aligning design with proven fabrication processes from the outset, RVM helps reduce development risk and accelerate time to market.
With operations in Medford, Oregon, and a new 300 mm MEMS-capable facility in Palm Bay, Florida, RVM supports applications across MEMS, sensors, photonics, and specialty post-CMOS technologies. The company serves customers in industries including healthcare and biotech, industrial sensing, aerospace and defense, communications, and advanced electronics. By combining collaborative design expertise, flexible process development, and domestic manufacturing capability, RVM delivers a transparent, customer-focused approach that strengthens supply chain resilience and provides a clear path from innovation to volume manufacturing.
For more information, visit www.roguevalleymicro.com

Media Contact:
Maria Doyle
Doyle Strategic Communications (for Rogue Valley Microdevices)
781-964-3536
[email protected]

• Read more about Rogue Valley Microdevices Launches MEMS Design Services; Names Industry Veteran Scott Rauscher as Chief Innovation Officer to Lead the Initiative

High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

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About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

• Read more about Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs