Brings Advocacy for the adoption of RISC-V processors and processor verification tool standards

Leverages broad experience in EDA business strategy, marketing and sales

SAN JOSE, Calif., March 05, 2026 (GLOBE NEWSWIRE) -- Breker Verification Systems today named Larry Lapides, former Synopsys Executive Director of RISC-V Tools Business Development, to its Advisory Board.

In making today’s announcement, David Kelf, Breker’s CEO, noted that Lapides has been a tireless advocate for the adoption of RISC-V processors and the urgent need for RISC-V processor verification tool standards. “Larry’s RISC-V knowledge and his ties to the RISC-V community are welcome additions to Breker and our advisory board.”

“Breker sits at the forefront in the development of commercial processor verification solutions and is a valued member of the RISC-V community,” remarks Lapides. “It will be a pleasure to work with Breker to move this important effort forward.”

Larry Lapides Biography
Lapides joined Synopsys through the acquisition of Imperas Software, where he was Vice President of Worldwide Sales and Marketing. He previously ran worldwide sales at EDA companies including Verisity Design and has more than 30 years in software tools and EDA, plus time spent in infrared systems engineering.

Lapides holds a Bachelor of Arts degree in Physics from UC Berkeley, a Master of Science degree in Applied Physics from Cornell University and an MBA from Clark University in Worcester, Mass.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

• Read more about Breker Verification Systems Adds RISC-V Industry Expert Larry Lapides to its Advisory Board

SurplusGLOBAL has rolled out a set of upgrades to SemiMarket (www.SemiMarket.com), its online marketplace for legacy semiconductor equipment and parts, aimed at making inventory discovery more actionable and sourcing workflows more practical for engineers and procurement teams operating in the secondary supply chain.

A central update is the expansion of how SemiMarket publishes and organizes Harvest-completed parts. The platform has opened Special Event sections that group harvested inventories by their "parent" tool, enabling buyers to navigate end-of-life components in the same equipment-centric structure fabs use for maintenance planning and spares management. By surfacing harvested parts in a tool-based format within the marketplace, SurplusGLOBAL says SemiMarket is becoming a more direct channel for sustaining older tool fleets as OEM availability thins or ends.

SemiMarket is also adding functionality for high-volume sourcing and internal review. A new bulk download feature lets users request an item list by selecting a top-level category and clicking "Download list" from the front-end interface. Once approved by the operations team, the file becomes available for download. SurplusGLOBAL positions the tool as a practical bridge between marketplace browsing and the internal processes procurement groups use to compare options, circulate listings, and document sourcing decisions at scale.

The changes address a growing pain point across mature-node fabs: when a single discontinued spare can sideline a tool, downtime can extend while teams source across brokers, refurbishers, and regional networks. The legacy spares supply chain remains fragmented, and even organizations with donor-tool pools often face challenges extracting, verifying, and redeploying parts efficiently at scale. SurplusGLOBAL says the trend is increasingly reaching 300mm tools manufactured before 2010, intensifying demand for more structured, searchable legacy parts supply.

To respond, the company says it is expanding its Harvest program—disassembling used equipment and remarketing parts—supported by in-house verification and data standardization. SurplusGLOBAL said it has harvested about 60 tools to date and plans to harvest roughly 200 to 300 tools this year, backed by teams spanning Harvest operations, parts verification, AI, SemiMarket, database engineering, and sales.

The company also said it is applying AI and OCR-driven workflows to accelerate classification, imaging, standardization, and listing creation, while building tool–part relationships, parts BOM coverage, and personalized recommendations.

The upgrades follow a recent rise in platform engagement tied to industry events. During SEMICON KOREA 2026, held Feb. 11–13 at COEX in Seoul, SurplusGLOBAL said about 3,000 industry visitors stopped by its booth and more than 800 signed up for SemiMarket on-site. The company said many of the new members included process and maintenance engineers, as well as employees from global equipment makers—roles closely connected to day-to-day tool operation and purchasing decisions.

Bruce Kim, SurplusGLOBAL's CEO, said the updates reflect "growing demand for faster, clearer decision-making and more actionable inventory discovery in the mature-node ecosystem, where uptime pressures and supply variability often push teams beyond OEM channels." He added that the company is expanding Harvest-led supply and improving how SemiMarket organizes that inventory so buyers can move from discovery to decision more quickly.

SurplusGLOBAL also pointed to a near-term offline expansion intended to complement online sourcing. The company said a 39,670m2(12,000-pyeong) SemiMarket Offline Parts Mall is scheduled to be completed in July, enabling customers to view large-scale inventory in person and access services such as parts verification and repair, strengthening global support for legacy tool sustainment.

• Read more about SurplusGLOBAL Builds on SEMICON KOREA 2026 Success, Upgrades SemiMarket for Harvest Parts Discovery and Bulk Sourcing

Location: Richardson, Texas

Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence. The collaboration combines Modus Test’s high-performance socket test technology with yieldWerx’s enterprise-scale yield management platform to provide manufacturers with direct visibility into the relationship between socket health and device performance.

The partnership addresses a long-standing disconnect between test execution and data analytics in high- volume manufacturing. Degraded, misaligned, or worn sockets can introduce false failures or escapes without clear root-cause identification. By integrating hardware performance data with yield analytics, manufacturers can better distinguish contact-related artifacts from true silicon failures.
Through this partnership, customers can now:
• Monitor and trend socket performance across testers, sites, and handlers
• Correlate device failures to specific sockets, test cells, or contact events
• Identify unnecessary device rejects caused by socket degradation
• Detect potential escapes where devices pass due to intermittent contact issues
• Optimize preventive maintenance cycles using data-driven insights

By integrating Modus Test equipment data with yieldWerx’s wafer-, lot-, and device-level analytics, manufacturers gain the ability to separate true device behavior from test interface variability, improving confidence in test outcomes and accelerating root-cause resolution.

About yieldWerx
yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates data from wafer fabrication through final test, delivering visibility into product quality, process performance, and yield improvement opportunities.

About ModusTest
Modus Test, LLC was founded on the idea that there are creative ways to improve results by combining innovation with the best-known methods in test design and manufacturing. Providing innovative test solutions includes the MPT series of parametric tests, systems, and accessories. Modus Test has a global presence and the capability to support customers in all the IC development centers and high-volume manufacturing sites around the world. See for yourself how combining innovation with best-known methods can improve your results.

Statements from Leadership
“yieldWerx was built to unify disparate manufacturing data into actionable yield intelligence,” said Aftkhar Aslam, CEO of yieldWerx. “Valuable data exists across testers, handlers, sockets, MES systems, and inspection tools, but it often remains siloed. Our platform connects these domains into a unified analytical framework that enables faster, data-driven decisions that reduce costs.”

“This partnership represents an important step forward in bringing greater transparency and intelligence to semiconductor test,” said Jesse Ko, COO of Modus Test. “Modus Test’s high-performance socket validation solutions, combined with yieldWerx’s powerful analytics platform, create a closed-loop ecosystem where hardware performance and yield outcomes are fully correlated. Together, we are enabling a smarter, more adaptive test environment.”

For further information, please visit https://www.yieldWerx.com or https://www.ModusTest.org.

• Read more about Modus Test Partners with yieldWerx to Deliver Closed-Loop Socket to Silicon Correlation

Breker Verification Systems and Moores Lab AI Partner to Create First AI-Driven SoC Verification Solution
• Test Suite Synthesis, agentic AI integration will enable automated specification test generation across range of SoC designs on varied verification platforms
• AI-driven synthesis verification flow prototype to be demonstrated during DVCon U.S. in March
• Joint Breker, Moores Lab AI reception at DVCon U.S. Monday evening followed by AI in verification panel
SAN JOSE, CALIF.––February 26, 2026––Breker Verification Systems and Moores Lab AI today formalized a partnership to create the first AI-driven SoC verification flow integrating Breker’s Trek Test Suite Synthesis with Moores Lab agentic AI technology.

The solution leverages Breker’s vast experience in test generation for complex system design scenarios with the agentic AI VerifAgent™ product from Moores Lab AI. It seamlessly enables automated multicore, multitool, C or transaction level modeling (TLM) test generation for complex SoC scenarios from manually composed specifications.

The flow uses agentic AI to read a specification and generate appropriate scenario models for test synthesis that will produce combined C and SystemVerilog tests that can be run on simulation and emulation platforms targeting high-coverage SoC scenarios.

A prototype of the AI-driven verification flow will be demonstrated in Breker’s Booth (#203) and the Moores Lab AI Booth (#101) during DVCon U.S. March 2 through March 4 at the Hyatt Regency in Santa Clara.

“SoC verification requires highly complex scenario tests that find unpredictable corner cases across advanced, multi-core architectures,” says David Kelf, CEO of Breker Verification Systems. “The Moores Lab AI VerifAgent technology is an excellent complement to our proven Trek synthesis products that leverages our deep verification experience to drive the first AI SoC verification solution.”

“Breker has long been a pioneer in portable stimulus and system-level verification innovation,” notes Shelly Henry, CEO of Moores Lab AI. “Integrating VerifAgent with the Breker solutions creates a powerful synergy that enables engineering teams to verify increasingly complex silicon much faster and with greater confidence. We’re excited to partner with Breker to bring AI-driven transformation to SoC-level verification workflows.”

Combining Test Suite Synthesis with Agentic AI
Test Suite Synthesis generates high coverage tests efficiently for complex SoC-specific scenarios using various verification approaches, while agentic AI can accelerate the understanding of specifications to automatically derive verification plans and scenario models.

Combining the two can drive an automated verification solution that enables test generation for complex SoC scenarios from a manually composed specification that may be applied across a broad range of designs on varied verification platforms.

Availability
The AI-driven verification flow will be developed throughout 2026.

For more information, visit: http://www.breker.com or [email protected], or www.mooreslab.ai or [email protected].

Breker and Moores Lab AI at DVCon U.S.
In addition to the AI-driven verification flow prototype, Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. To arrange a demonstration or private meeting, send email to [email protected].

Moores Lab AI will showcase the VerifAgent product and discuss its product roadmap for agentic AI-driven silicon engineering at DVCon U.S. Email [email protected] to schedule an on-site meeting.

On Monday, March 2, Breker and Moores Lab AI will host an evening reception at DVCon in the Hyatt Regency Hotel Cypress room beginning at 6:30 p.m. and followed by a panel discussion on AI-driven SoC verification.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: https://www.brekersystems.com/
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
X: @BrekerSystems

About Moores Lab AI
Moores Lab AI is building the next generation of AI tools for semiconductor design and verification. Its agentic AI platform transforms the chip development lifecycle by drastically reducing engineering time and cost, without changing existing flows, tools, or documentation. Moores Lab AI is headquartered in Austin, Texas, and proudly develops its products entirely in the United States.

For more information, visit www.mooreslab.ai or on social media:
LinkedIn: https://www.linkedin.com/company/mooreslabai/
X: @MooresLabAI

• Read more about Breker Verification Systems and Moores Lab AI Partner to Create First AI-Driven SoC Verification Solution

Phoenix, AZ – February 18, 2026 – Plasmatreat USA, Inc., a subsidiary of Plasmatreat GmbH and a global leader in atmospheric pressure plasma systems and equipment, will showcase advanced solutions for particle-free, contactless, chemical-free, and inline-compatible surface pretreatment for semiconductor and electronics manufacturing at the IMAPS Device Packaging Conference, March 2–5, 2026, in Phoenix, Arizona.

As semiconductor devices continue to shrink while power densities increase, manufacturers face growing demands for surfaces that are exceptionally clean, oxide-free, and highly wettable to ensure reliable hybrid and chiplet bonding as well as wafer-level packaging. At the same time, flux residues, epoxy contamination, and oxide layers must be removed without chemicals while meeting stringent cleanroom requirements and maintaining consistent cycle times.

To address these challenges, Plasmatreat will present expanded plasma technologies designed to deliver low-particle, potential-free, dry surface preparation that integrates directly into inline production. These solutions enable both selective, localized treatment and uniform activation across large areas, resulting in stable interfaces, improved yields, and sustainable manufacturing processes without VOCs or aggressive chemical media.

Plasma Nozzle Technologies for Semiconductor Manufacturing

At IMAPS, Plasmatreat will highlight nozzle solutions based on Openair-Plasma® technology that support hybrid bonding, wafer-level packaging, and advanced semiconductor assembly.

The PDW100 dielectric barrier discharge (DBD) nozzle is a flat atmospheric plasma solution with a treatment width of up to 100 mm, enabling uniform activation across large, sensitive substrates. The system removes organic residues and oxide layers without generating particles, supporting high process stability and repeatability.

The PFA10 plasma nozzle delivers low-particle, potential-free plasma treatment for highly precise, localized surface preparation. The nozzle effectively removes organic contaminants and oxides while activating metallic and polymer surfaces, creating optimal conditions for hybrid bonding and chiplet stacking.

“With the expansion of our plasma nozzle portfolio, we are enabling new levels of purity and process reliability in semiconductor manufacturing,” said Hardev Grewal, President and CEO of Plasmatreat North America. “The PFA10 and PDW100 provide uniform, contamination-free surface treatment that is essential for reliable electrical and mechanical connections, even in ISO Class 1 cleanroom environments.”

HydroPlasma® Enables Advanced Residue and Oxide Removal

In addition to the nozzle technologies, Plasmatreat highlights HydroPlasma®, an advanced cleaning process that combines the physical effects of Openair-Plasma with the chemical reactivity of ionized water molecules to remove stubborn organic and inorganic contamination.

During the HydroPlasma® process, water is introduced into the plasma and ionized, creating highly reactive species that break down contaminants in a manner similar to detergent cleaning — but without chemical agents. The process is delivered through a precision jet, enabling targeted, non-abrasive cleaning of sensitive semiconductor components.

HydroPlasma® is particularly effective for removing epoxy residues commonly left on metal surfaces after die attach, underfill, encapsulation, potting, and rework processes. It also removes naturally occurring metal oxides that can degrade adhesion, electrical performance, and downstream process yields. The result is oxide- and residue-free surfaces that improve bonding reliability and overall manufacturing consistency.

The technology provides efficient removal of organic and inorganic contamination, including heavy oil residues, while remaining environmentally friendly, VOC-free, and safe for use on metal, glass, and polymer surfaces.

Plasmatreat’s Openair-Plasma® technology platform provides dry, chemical-free, and fully inline-capable surface treatment. The process reliably removes organic contaminants, silicones, and electrostatic dust while increasing surface energy to greater than 72 mN/m, supporting downstream processes such as die bonding, wire bonding, and underfill applications. Surface treatment is completed within seconds, delivers highly consistent results, and utilizes cost-effective process gases including compressed air or nitrogen.

• Read more about Plasmatreat USA Highlights Advanced Plasma Nozzle and HydroPlasma® Cleaning Technologies for Semiconductor Packaging at IMAPS