Thermal Materials Implications of the Explosion in AI Compute Demand
Led by AI, the demand for increased compute power and on-package memory is pushing advanced packaging to unprecedented leaps in physical size. While this is creating a host of technical problems that require new solutions, the specific associated challenges in thermal dissipation and warpage management are heavily interlinked, driving the next wave of materials development across the industry. This talk provides an overview of these challenges, their interlinked nature, and the various approaches being taken across the industry to solve them.
BIOGRAPHY
Chris Baldwin is Vice President, Product, at Boston Materials, a company developing advanced-energy-transfer materials with a current emphasis on high-performance thermal interface materials. Chris’s focus is shaping the product roadmap based on inputs from customers, development partners, and engineering.
Prior to joining Boston Materials in January 2025, Chris spent 27 years at Intel Corporation as an individual contributor, people manager, and program manager contributing to and leading advanced-packaging development efforts. As a program manager, he directed major assembly/test development programs for server, mobile, desktop, AI, FPGA, networking, and ASIC product families through the full development, certification, and production life cycle. His last decade at Intel was spent progressing the initial generations of EMIB (Embedding Multi-die Interconnect Bridge) technology from pathfinding concepts to established high-volume production.
Chris holds bachelor’s and master’s degrees in mechanical engineering from Auburn University as well as four US patents.