MILPITAS, Calif.  — April 12, 2021 — Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will take center stage at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2021), May 10-12, 2021, as more than 65 industry experts gather to deliver 30 hours of technical presentations on the latest manufacturing strategies and methodologies. Registration for the virtual event is now open.

Expected to draw hundreds of attendees from across the industry, the 32^nd annual ASMC will feature discussions on the global COVID-19 pandemic’s impact on manufacturing leadership, semiconductor market trends, heterogenous integration and quantum computing.

ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Dr. Ishtiaq Ahsan of IBM and Alexa Greer of KLA.

ASMC 2021 Keynotes and Invited Presentations

	Dr. Gary L. Patton, Corporate VP, General Manager of Design Enablement, Intel Requirements for Manufacturing Leadership in the Post-Pandemic Era
	Dr. John Pellerin, VP and Chief Technologist, GLOBALFOUNDRIES A Reflection on the Impact of the Pandemic on the Semiconductor Industry
	Robert Maire, President, Semiconductor Advisors Emerging Trends in the Global Semiconductor Market
	Dr. Mukta Farooq, Distinguished Research Staff Member, IBM Research Heterogeneous Integration Developments
	Dr. Lester Lampert, Research Engineer, Intel Quantum Computing Tutorial
	Christian Dieseldorff, Senior Principal for Semiconductors at Industry Research, SEMI Semiconductor Manufacturing Market Trends

ASMC 2021 technical sessions will cover topics including:

• Advanced Equipment Processes and Materials
• Advanced Metrology
• Advanced Patterning / Design for Manufacturability
• Advanced Semiconductor Developments
• Advanced Process Control
• Contamination-Free Manufacturing
• Data Management
• Defect Inspection & Reduction
• Equipment Optimization
• Fabless Experience
• Factory Automation
• Industrial Engineering
• Innovative Silicon Devices and Processes
• Non-Silicon/Non-CMOS processing
• Patterning and 3D Metrology
• Smart Manufacturing
• Yield Enhancement
• Yield Methodologies

A workforce development panel discussion with executives from CITI, NY Creates, RIT, TSMC and  ST Microelectronics will be moderated by Ed Sperling, editor-in-chief at Semiconductor Engineering.

ASMC 2021 is the fourth of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. This coast-to-coast series provides a platform to foster critical discussions on short- and long-term influences as well as technical and business opportunities in the more than $2 trillion electronics supply chain.

For more conference details, contact Paul Cohen at [email protected]. The media should contact Scott Stevens (for SEMI Americas communications) at [email protected] for registration information.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Virtual ASMC 2021 to Spotlight Advanced Semiconductor Manufacturing Excellence

MILPITAS, Calif. — March 22, 2021 — North America-based manufacturers of semiconductor equipment posted $3.14 billion in billings worldwide in February 2021 (three-month average basis), logging a record high for the second consecutive month, according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 3.2 percent higher than the final January 2021 billings of $3.04 billion and is 32 percent higher than the February 2020 billings level of $2.37 billion.

“February billings of North America-based semiconductor equipment manufacturers once again exceeded $3 billion, powered by robust secular semiconductor demand across diverse end-use markets,” said Ajit Manocha, SEMI president and CEO. “The digitization of industries worldwide continues to drive rising investments in semiconductor equipment.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), March 2021

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data. 

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes 

Next SEMI Billings report is April 26, 2021 at 3:00pm Pacific. 

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

• Read more about North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month

MILPITAS, Calif. — March 22, 2021 — The global semiconductor materials market grew 4.9% in 2020 to $55.3 billion in revenue, surpassing the previous market high of $52.9 billion set in 2018, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).

Wafer fabrication materials and packaging materials revenues totaled $34.9 billion and $20.4 billion, respectively, in 2020 for year-over-year increases of 6.5% and 2.3%. The photoresist and photoresist ancillaries, wet chemicals, and CMP segments accounted for the strongest growth in wafer fabrication materials, while the packaging materials expansion was driven by organic substrates and bonding wire market growth.

For the eleventh consecutive year, Taiwan, at $12.4 billion, was the world's largest market for semiconductor materials on the strength of its large foundry capacity and advanced packaging base. With its aggressive capacity build-up, China surpassed Korea to claim the second spot. Both China and Taiwan registered stronger growth, while the South Korea, Japan and ROW markets also expanded. The North America and Europe markets saw declines due to the COVID-19 pandemic.

2019 and 2020 Regional Semiconductor Materials Markets (US$ Billions)

Source: SEMI (www.semi.org), March 2021

Note: Summed subtotals may not equal the total due to rounding.

* The ROW region constitutes Singapore, Malaysia, Philippines, other areas of Southeast

Asia and smaller global markets.

** 2019 data have been updated based on SEMI’s data collection programs.

The Materials Market Data Subscription (MMDS) from SEMI provides annual revenue with 10 years of historical data and a two-year forecast. The annual subscription includes quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, Japan, Taiwan, South Korea, China and ROW). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and lead frames.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. 

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Materials Market Sets New High of $55.3 Billion With 5% Expansion in 2020, SEMI Reports

SINGAPORE — March 23, 2021 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced the rescheduling of SEMICON Southeast Asia (SEA) to 23-27 August 2021 as a hybrid event to ensure the safety of exhibitors, partners and guests as the world continues to combat the COVID-19 pandemic and the rollout of vaccines progresses.

SEMICON SEA 2021 will consist of the following two segments:

• 23-27 August 2021 – A virtual exposition with a business-matching program and other opportunities to help grow the businesses of exhibitors and attendees.

• 23-25 August 2021 – An on-site conference in Singapore at a venue to be announced soon. The three-day conference will also be livestreamed to the virtual platform, where attendees can participate in a broad range of plenary and conference sessions online.

Themed Powering Innovation – 5G and Beyond, SEMICON SEA 2021 will gather industry visionaries and experts to discuss the latest innovations, trends and developments in electronics including Smart Manufacturing, Smart Mobility, Smart Data, artificial intelligence (AI) and 5G as technology reshapes the lives of people worldwide like never before.

“Careful preparation for SEMICON SEA 2021 is an important part of our commitment to protect the health and safety of our participants while ensuring uninterrupted business exchanges and opportunities for them to form new connections and expand their businesses,” said Bee Bee Ng, president of SEMI Southeast Asia. “We will continue to closely monitor COVID-19 and vaccination developments and provide regular progress updates as the event nears.”

SEMICON SEA 2022 is scheduled for 21-23 June 2022. The exposition will return to the Setia SPICE Convention Centre in Penang, Malaysia.

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Carmen Chaw/SEMI SEA
Program and Marketing
Phone: 65.6391.9516
Email: [email protected]

• Read more about SEMICON Southeast Asia Rescheduled to 23-27 August 2021 as Hybrid Event

SHANGHAI – March 16, 2021 ─ SEMICON China 2021, the world’s largest semiconductor conference and exhibition, opens tomorrow, gathering industry leaders and visionaries for insights into the latest developments and trends in the electronics industry. SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials. The event is March 17-19 at the Shanghai New International Expo Centre.

SEMICON China 2021 will combine an exhibition with a virtual platform for easy, convenient participation in the event’s programs from around the world. Sessions including the Grand Opening Keynotes and CSTIC will be broadcast live. Registration is open.

SEMICON China 2021 will feature nearly 1,100 exhibitors at more than 4,000 booths – a sprawling footprint reflecting the region’s rising prominence in the global semiconductor industry. Powered by new fab projects and capacity expansion, China's capital equipment market grew to become the world's largest for the first time last year, SEMI market data shows.

SEMICON China 2021 Highlights

• Grand Opening Keynotes – speeches will feature industry leaders as they discuss global business and technology developments and market trends.

• China Semiconductor Technology International Conference (CSTIC) – China’s largest international technology conference focused on the semiconductor industry, CSTIC will feature symposiums on the latest technology trends and innovations. The virtual conference will be held March 14-April 11.

• SIIP China: SEMI Innovation and Investment Forum – Key topics will include the economic environment, industry dynamics, trade friction, STAR Market opportunities, international cooperation, equipment materials procurement, semiconductor supply chain challenges, technology hot spots, new infrastructure and Internet of Things (IoT).

• Design Innovation Forum – The session will focus on advances in semiconductor design.

• Smart Manufacturing Forum – The event will focus on areas such as the semiconductor industry’s vision for smart manufacturing, key challenges, big data analytics and artificial intelligence (AI).

• Advanced Manufacturing Forum – This session will explore the latest developments, innovations and trends in advanced manufacturing.

• NEW: Advanced Material Forum – With advanced materials now a critical enabler and accelerator of electronics innovation, industry experts will discuss the latest developments.

• Advanced Packaging Forum – The program will address emerging advanced packaging technologies and the heterogeneous integration ecosystem and opportunities.

• Power & Compound Semiconductor International Forum 2021 – The two-day program will target topics including wide bandgap power electronics, optoelectronics, compound semiconductors in communications, and emerging power device technologies.

• Memory Strategic Forum – The program will address emerging memory technologies, storage, packaging and testing, PCRAM technology and its AI applications, and atomic layer deposition (ALD) technology applications.

Workforce Development Pavilion

As the microelectronics industry works to build its talent pipeline and China collaborates with industry and government partners to fill the talent gap, the Workforce Development Pavilion will connect hiring companies with prospective workers through features such as a job fair and mentoring program, job board and the SEMI Workforce CXO Talent Forum.

Follow SEMICON China:

WeChat ID: SEMI 

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Cherry Sun
SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

Michael Hall
SEMI Headquarters
Email: [email protected]
Phone: 1.408.943.7988

• Read more about SEMICON China 2021 Opens Tomorrow with Chip Industry Innovation, Growth, Talent in Focus

MILPITAS, Calif. — March 16, 2021 — Fueled by surging pandemic-inspired demand for electronics devices, the global semiconductor industry is on track to register a rare three consecutive years of record highs in fab equipment spending with a 16% increase in 2020 followed by forecast gains of 15.5% this year and 12% in 2022, SEMI highlighted today in its quarterly World Fab Forecast report.

Fabs worldwide will add about $10 billion worth of equipment in each of the three years as spending climbs to top $80 billion at the end of the forecast period. Explosive demand for electronics that are the backbone of communications, computing, healthcare and online services – sectors that mounted robust responses to the COVID-19 outbreak as the world rallied to curb the coronavirus’s spread – account for much of the spending.

Fab equipment spending has historically been cyclical, with one or two years of growth typically followed by a downtrend of roughly equal length. The semiconductor industry last saw three straight years of fab equipment investment growth in a run that started in 2016. It was nearly 20 years before that streak that the industry recorded an expansion of at least three years. In the  mid-1990s, the chip industry boasted a four-year period of growth.

The bulk of fab investments in 2021 and 2022 will be seen in the foundry and the memory sectors. Driven by leading edge investment, foundry spending is expected to grow 23% in 2021, reach $32 billion and flatten in 2022. Overall memory spending will increase in the single digits to reach $28 billion in 2021 while DRAM will surpass NAND Flash, and then surge by 26% in 2022 on the strength of both DRAM and 3D NAND investment.

The power and MPU segment will also see strong spending growth over the forecast period. Power is forecast to show strong investment growth of 46% and 26%, respectively, in 2021 and 2022 driven by strong demand for power semiconductor devices. MPU will add to the momentum with 40% growth in 2022 as microprocessor investments increase.

The World Fab Forecast report lists 1,374 facilities and lines globally, including 100 future facilities and lines with various probabilities that will start volume production in 2021 or later.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: [email protected] 

• Read more about Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports

Join the virtual Semiconductor Outlook on Thursday, March 4 – Presented by SEMI 

Four briefings to present microelectronics industry and Wall Street forecasts and discuss global economic opportunities 

WHAT: With supply chains disrupted and markets dislocated, industry leaders are debating how long until an upturn and what the new reality will look like. Discussion includes regional and global economies and how the new administration will impact the industry for these issues:

• How the pandemic has turbocharged digitization, and lessons learned for steps to withstand the next pandemic or crisis
• What financial analysts are predicting for chipmakers and the semiconductor equipment companies for 2021 trends and market forecasts
• Wall Street’s view of the state of the Electronic Design Automation (EDA) industry
• How memory and data storage will impact the pace of the Data Economy

WHO: Micron Technology, JP Morgan, Griffin Securities, VLSI Research

• Moderated by Ed Sperling, editor-in-chief, Semiconductor Engineering
• Live Q&A to follow the presentations

WHERE: Semiconductor Outlook 2021 Virtual Forum

WHEN:   Thursday, March 4, 8:30-10:30 a.m. PDT

HOW:     Members of the media should contact Scott Stevens ([email protected]) for

a complimentary pass. Others can sign up using general registration. 

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: +1.512.288.4050
Email: [email protected]

• Read more about MEDIA ADVISORY - Navigating Through Turbulent Times – Is the End Near?

MILPITAS, Calif. – March 1, 2021 – Leading-edge MEMS and sensors advances for driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC 2021), April 13-15, as industry visionaries and experts gather to discuss the latest trends and innovations in sensorization. Themed the Next Wave of Sensorization for Solving Our Shared Challenges, the virtual event will feature keynotes, panels, technical sessions, career booths and networking opportunities to help participants grow their businesses. MSTC 2021 will run daily 8:30am to 1:00pm Pacific Time. Registration is now open.

Sponsored by SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2021 will offer a deep dive into how to bring sensor products to market, from design through fabrication and packaging, to end-use applications. Industry experts will explore the software and systems needed to expand both legacy and emerging MEMS and sensors to open new markets and business opportunities.

MSTC 2021 Keynote Speakers

	Pieris Berreitter,Director of Hardware Engineering, Fitbit/Google Crafting a Wellness Experience: How Commercial Sensors Can Transform Health
	Alberto Speranzon, PhD, Technical Fellow, Autonomous Systems, Advanced Technology, Honeywell Aerospace Sensors and Software Enabling Autonomy for Urban Air Mobility
	Julien Simon, Global Technical Evangelist AI/ML, Amazon Web Services Predictive Maintenance with Machine Learning on AWS
	Tuomas Tikka,CEO, Reaktor Space Lab Hyperspectral Nanosatellites as a Solution for Solving Global Ecological Challenges

MSTC 2021 Technical Sessions

MSTC 2021 will also showcase sensor applications in the following areas:

• Health and Well-Being
• Autonomous and Industrial Vehicles
• Environmental
• Industrial Revolution 4.0
• Sensor Analytics 

See the complete agenda for MSTC 2021. Follow MSTC 2021 on Twitter and LinkedIn.

MSTC 2021 is the third of eight conferences comprising SEMI’s third annual Technology Leadership Series of the Americas. This coast-to-coast series provides a platform to foster critical discussions on short- and long-term influences as well as technical and business opportunities in the $2 trillion emerging markets.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Virtual MSTC 2021 to Showcase Next Wave of Sensorization for Driving Medical and Mobility Advances

MILPITAS, Calif. – February 25, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.

“We thank President Biden and bipartisan congressional leaders for their support of incentives for U.S. semiconductor manufacturing and research. Enacting an investment tax credit and funding the programs authorized last year will help build needed semiconductor manufacturing capacity in the U.S. and reverse America’s declining share of global chip production. We look forward to working with the Biden administration and Congress on these and other policies to strengthen the semiconductor manufacturing supply chain that is the lifeblood of technology innovation driving countless societal and economic benefits worldwide.”

SEMI strongly supported the CHIPS for America Act, which included a refundable investment tax credit (ITC) to build U.S. semiconductor manufacturing capacity, a Commerce Department program to provide grants to semiconductor manufacturing projects, and authorizations for significant new semiconductor research programs and funding. The Fiscal Year 2021 National Defense Authorization Act signed into law this January authorized the Commerce Department and semiconductor research programs in the CHIPS for America Act but failed to provide new funding. SEMI supports enactment of all three major pillars of the CHIPS for America Act, which together will promote U.S. semiconductor research and manufacturing.

Attending the meeting with President Biden were Sens. Cornyn (R-TX), Warner (D-VA), Baldwin (D-WI), Blackburn (R-TN), Braun (R-IN), Duckworth (D-IL), Hassan (D-NH), and Portman (R-OH); and Reps. Matsui (D-CA), McCaul (R-TX), and Joyce (R-PA).

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives

MILPITAS, Calif. — February 22, 2021 — North America-based manufacturers of semiconductor equipment posted $3.04 billion in billings worldwide in January 2021 (three-month average basis), the first time monthly billings have reached $3 billion, according to the January Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 13.4 percent higher than the final December 2020 billings of $2.68 billion and is 29.9 percent higher than the January 2020 billings level of $2.34 billion.

“January billings of North America-based semiconductor equipment manufacturers marked a historic monthly high for the industry and a great start to the year,” said Ajit Manocha, SEMI president and CEO. “The acceleration of digital transformation is fueling strong, durable demand for semiconductor equipment.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), February 2021

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is March 22, 2021 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

• Read more about North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time