Taming AI Scaling Stresses: Digital Materials Discovery for Manufacturing‑Ready Adoption
As AI scaling stresses device physics across power delivery, heat removal, and nanoscale integration, materials innovation must move faster than traditional development cycles allow. The increasing complexity of devices and integration schemes demands non-traditional discovery methodologies to support speed-to-market/yield. Our talk explores how data-driven materials discovery, development, and scaling, as well as addressing the fab adoption challenges for purity, particle defects, environmental control, and process consistency, are necessary elements for qualification of innovations while delivering manufacturing‑ready, high‑quality, and sustainable solutions for next‑generation logic, memory, and accelerator platforms.
BIOGRAPHY
Dr. Mark O'Neill has almost 30 years of industrial experience in the creation, development, commercialization, and value maximization across all segments of advanced materials and technology for semiconductor manufacturing.
- Mark joined Air Products & Chemicals in 1997 lead the team that discovered and commercialized porous extreme low dielectric constant materials
- As the Global Technology Director of Deposition Materials at Air Products he lead the development & commercialization for low temperature silicon oxide by ALD
- In 2014 Mark moved into role as Global Technology Director for Planarization Materials at Versum Materials developing high performance chemical mechanical planarization slurries and post-CMP cleans
- With the acquisition of Versum Materials by Merck KGaA, Mark held the role of VP of Semiconductor Solutions for one of the industries broadest advanced materials portfolios
- In 2022 Mark founded Innovation Impact Partners, a leading boutique technology and innovation consulting firm focused on AI for advanced materials and process innovation
- Mark joined Entegris in August of 2025 as VP of Engineering, Research, and Development for Materials Solution
- He currently has co-authored more than 70 patent families, published and presented more than 50 papers, and has delivered multiple invited talks at international symposia