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United States Belgium France Germany Ireland Italy From Wafer to chip 3/2/27 Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Technical Project Manager
SEMI

 

United States

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • London: 4:00 pm - 8:00 pm 
  • Munich: 5:00 pm - 9:00 pm 

Pricing:                     

  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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United States Belgium France Germany Ireland Italy Semiconductor Ecosystem 2/17/27 Training

Course Description

This interactive course provides a practical, comprehensive overview of the semiconductor industry, with an emphasis on real-world applications, production processes, and the critical roles within semiconductor manufacturing. Attendees will gain insights into the global semiconductor value chain, from initial design and development to final product shipment, and explore how semiconductors power essential technologies in automotive, AI, and healthcare. The course covers emerging trends such as sustainable manufacturing, data-driven operations, and advanced node technology. Participants will also delve into key performance indicators (KPIs) for fab operations, R&D, and product development, and discover career paths and skill requirements within this dynamic industry.

Through engaging discussions, case studies, and hands-on exercises, participants will gain knowledge that can be immediately applied to their roles, empowering them to better understand semiconductor manufacturing’s impact and contribute to their organization’s success.

Learning Objectives

  • Identify key applications of semiconductors across industries

  • Map the semiconductor value chain from design to shipment

  • Gain understanding of smart manufacturing and resource-efficient production

  • Interpret KPIs for fab operations, product development, and R&D

  • Understand key roles and skills within the semiconductor industry

Who Should Attend

This course is ideal for industry newcomers, career changers, recent graduates, technical professionals from related fields, business leaders, and educators seeking a practical, comprehensive understanding of semiconductor applications, processes, roles, and industry dynamics.

  • Industry Newcomers: Individuals new to the semiconductor field who need a comprehensive overview of applications, production processes, and key roles.
  • Early- and Mid-Career Semiconductor Employees: Current employees seeking to deepen their understanding of the semiconductor value chain, industry challenges, and emerging trends.
  • Career Changers and Recent Graduates: Those entering the semiconductor industry or recent graduates looking for insights into industry roles and required skills.
  • Professionals from Related Fields: Technical professionals in areas like automotive, medical devices, consumer electronics, or engineering who want to understand semiconductor applications and manufacturing.
  • Managers and Business Leaders: Leaders in strategy, business development, or operations who need to understand semiconductor production dynamics, KPIs, and sustainability to enhance profitability and competition.
  • Educators and Trainers: Instructors teaching semiconductor technology who want a practical, industry-focused course structure. 

Course Topics

  • Introduction to Semiconductor Applications and Market Impact
  • Semiconductor Value Chain: From Design to Shipment
  • Smart Manufacturing and Technology Evolution
  • Fab Operations and Facility Layout
  • Key Performance Indicators for Semiconductor Functions
  • Quality Assurance and Continuous Improvement
  • Workforce Roles and Skills in Semiconductor Manufacturing
  • Emerging Trends and Future Opportunities
  • Closing and Immediate Application Planning

Instructor

Dr. Sirisha Kuchimanchi 

Sahita Technologies

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

Interested in learning about the semiconductor ecosystem as a whole? This course introduces you to the basics of semiconductors, applications of semiconductors, front-end and back-end processing, fabrication facilities, process control and yield management, jobs and roles within the semiconductor industry, and what life is like working in a fab. Great for anyone seeking an understanding of an overview of the industry.  

Pricing
  • Members: $249
  • Non-Members: $299

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2027-02-17 08:00:00 2027-02-17 12:00:00 Semiconductor Ecosystem Overview (Americas & EU) 2/17 Interested in learning about the semiconductor ecosystem as a whole? This course introduces you to the basics of semiconductors, applications of semiconductors, front-end and back-end processing, fabrication facilities, process control and yield management, jobs and roles within the semiconductor industry, and what life is like working in a fab. Great for anyone seeking an understanding of an overview of the industry.  PricingMembers: $249Non-Members: $299* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Registration

For questions, please contact [email protected]

United States Belgium France Germany Ireland Italy Kickstart 2027 SEMI University Business Training Featured Speakers

Leverage SEMI U learning opportunities to accelerate your professional development in 2027. Our commitment remains focused on delivering comprehensive technical education that helps you build the knowledge and skills needed to thrive in the semiconductor industry.

Join us for our upcoming, "Kickstart 2027 with SEMI University," where you'll get an exclusive preview of new learning opportunities, upcoming training events, and special savings available to learners. 

During this webinar, you will:

  • Discover the latest updates and enhancements to SEMI U's on-demand course catalog.  
  • Explore upcoming virtual and in-person instructor-led training programs scheduled for the first half of 2027. 
  • Learn how to maximize your professional development with SEMI U resources and learning pathways. 
  • Receive access to a special 10% discount on all on-demand courses. 

Don't miss this opportunity to plan your learning journey and stay ahead in a rapidly evolving industry. Register today to reserve your spot.

 

United States

Headshot of Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
SEMI U Workforce Development

Join us to explore SEMI U's current course offerings and upcoming virtual and in-person training opportunities designed to support your professional growth in the semiconductor industry. You'll also have the chance to engage directly with our team during a live Q&A session. As a thank you for attending this free webinar, you'll receive:

  • A 10% discount code valid on all SEMI U on-demand courses. 
  • Entry into a raffle to win a complimentary course bundle valued at $100. 
8:00 am - 8:30 am Off Add to Calendar 2027-01-27 08:00:00 2027-01-27 08:30:00 Kickstart 2027 with SEMI University - US/EU Join us to explore SEMI U's current course offerings and upcoming virtual and in-person training opportunities designed to support your professional growth in the semiconductor industry. You'll also have the chance to engage directly with our team during a live Q&A session. As a thank you for attending this free webinar, you'll receive:A 10% discount code valid on all SEMI U on-demand courses. Entry into a raffle to win a complimentary course bundle valued at $100.  United States SEMI.org [email protected] America/Los_Angeles public
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Secure your spot today!

Don't forget to register for a SEMICON West badge and participate in any of the SEMI Standards Meetings happening all week!

Learn More: https://www.semiconwest.org/special-features/standards

 

United States standards watch banner image dec 2019 upw 1400px Business Technical
Kanomax_NEW

Overview

The workshop will focus on recent advances in analytical methods and instrumentation that address near-term particle metrology challenges identified in the 2024 IRDS Roadmap.

Near-Term Metrology Challenges

ChallengeDescription
#5 — Slurry Particle CharacterizationInsufficient metrology capability and other impurity monitoring.
#7 — Liquid Chemicals: Particles > Critical Size (#/ml)Need reliable monitoring of particles < 10nm.
#8 — CMP Slurries: Large Particles > MPS (#/ml)Need reliable LPC metrology that can measure targeted particle sizes and concentrations that ignore MPS sizes and do not require sample dilution to obtain the measurement.
#9 — Post-CMP (pCMP) Cleans ParticlesSome pCMP cleans have volatile or highly reactive ingredients that form bubbles, requiring new metrology to differentiate bubbles from real particles. Cleans containing surfactants form micelle particles that must be distinguished from foreign particles.
#16 — Particle Precursor Metrology < 10nmNeed better understanding of particle precursors and critical concentrations to form particles, and the relationship between species/concentration and particle size.

Moscone Center
South Building, 300 Level, Room 314
San Francisco, CA
United States

8:30 am
PT
Paul Trio
Director, Standards
SEMI

Welcome

Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific
8:35 am
Juan Atkinson Mora headshot
Juan Atkinson Mora
Carl ZEISS

New Developments in Metrologies to Characterize Particle Size Distribution in CMP Slurries

8:55 am
Tyler Roberts Headshot
Tyler Roberts
Shimadzu Scientific Instruments

Dynamic Image Analysis and Machine Learning for Large Particle Metrology in CMP Slurries

9:15 am
Lisa Mey-Ami Headshot
Lisa Mey-Ami
Air Liquide Balazs

Analytical Advances in Sub-10 nm Nanoparticle Characterization for Next-Generation Semiconductor Manufacturing

9:35 am
Hwan Kim Headshot
Hwan Kim
Principal Scientist
Elemental Scientific

Advances in Analytical Technology – Online Measurement of 5nm Metallic Nanoparticles in Liquid Chemicals

9:55 am
Shane Hale Headshot
Shane Hale
Kanomax FMT

Aerosolization-based Metrology for sub-10 nm Particles & Precursors in Liquid Chemicals

10:15 am
Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific

Q&A Panel Discussion (with first 5 presenters)

10:35 am

Networking Break

10:50 am
Marie Tripp Headshot
Dr. Marie Tripp
VP, North America and Explorer Product Manager
UNISERS AG

Bridging the Gap Between Liquid Contamination and On-Wafer Defectivity

11:10 am
 Haruka Nishikawa Headshot
Haruka Nishikawa
Rorze Automation Inc.

Direct Nanoparticle Analysis on 300 mm Silicon Wafers Using LA-GED-MSAG-ICP-MS

11:30 am
Derrick Quarles Headshot
Derrick Quarles
Elemental Scientific

Exploring the Capabilities of LA-ICPMS and LIBS for Surface, Spatial, and Depth Detection of Nanoparticles and Contaminants in Si and SiC Wafers

11:55 am
Suhas Ketkar headshot
Moderator
Suhas Ketkar
Elemental Scientific

Q&A Panel Discussion (with final 3 presenters)

12:10 pm - 12:15 pm
Suhas Ketkar headshot
Suhas Ketkar
Elemental Scientific

Closing Remarks

Standards

SEMI Standards

Liquid Chemicals Analytical Forum

8:30 am - 12:15 pm Off Add to Calendar 2026-10-14 08:30:00 2026-10-14 12:15:00 SEMI Liquid Chemicals Analytical Forum SEMI StandardsLiquid Chemicals Analytical Forum Moscone Center South Building, 300 Level, Room 314 San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public

Contact

For any questions about the event, please contact:

Laura Nguyen
Sr. Coordinator, International Standards

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United States standards-500w.jpg Technical

United States

Standards

3DP&I North America TC Chapter

Fall September Meeting

Date: Tuesday, September 22

Time: 08:00-09:30 Pacific Time

via Virtual Meeting

 

AGENDA

(subject to change) 

Last updated: August 21, 2026

8:00 am - 9:30 am Off Add to Calendar 2026-09-22 08:00:00 2026-09-22 09:30:00 3D Packaging & Integration North America TC Chapter Fall Meeting 3DP&I North America TC ChapterFall September MeetingDate: Tuesday, September 22Time: 08:00-09:30 Pacific Timevia Virtual Meeting AGENDA(subject to change) Last updated: August 21, 2026 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Voting Instructions

To Vote During TC Chapter Meetings

  1. Open a separate Web browser and go to:  https://web.portal.semi.org/meetings
  2. Click “Sign in”
  3. Enter your Standards Membership username and password (same login you use for voting on ballots)
  4. Find the meeting room you wish to attend (please note you must dial into a teleconference  separately) 
  5. Click “Join” to enter the meeting room.

 

NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".

 

Next Meetings

Save the Date!

SEMICON West Standards Meetings
March 30 - April 1, 2027
Phoenix, Arizona

 

Contact

Please email staff contact below for virtual information:

Laura Nguyen
Sr. Coordinator, International Standards
 

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Registration

2024 Technology Workshop

Early Bird Pricing (until March 25, 2025)
$375 members
$525 non-members

Regular Pricing (After March 25, 2025)
$525 members
$699 non-members

MDM2 members please contact Michelle Fabiano, [email protected], for discount information.

Complimentary student registration is available but has limited capacity. Students can Register here to be contacted about complimentary attendance after March 15th.

Cancellation Policy

Cancellations received on or before March 25, 2025, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 25, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

2024 Technology Workshop
United States Gap analysis 2027 Technical

 

Want to showcase your brand to a targeted audience of industry leaders, government stakeholders, and technical pioneers? Elevate your visibility and demonstrate your leadership by becoming a FLEX Technology Workshop sponsor. For packages and custom benefits, please contact Tim Janes at [email protected].
 

Collaborators

Florida semiconductor Engine NSF
University of Florida logo
Neocity Florida Logo
Highlighted content

Day 1 | Innovation Forum 


Hear the latest advances from FlexTech and NBMC alongside technical presentations from researchers and technology leaders developing tomorrow's semiconductor innovations.

Day 2 | Technical Gap Analysis 


Participate in collaborative breakout sessions that examine technology gaps, explore roadmaps, and help shape future FlexTech and NBMC research priorities. Your expertise will directly contribute to discussions that influence future Request for Proposal (RFP) directions.

Day 3 | AI for Metrology Workshop 

 

This workshop brings together industry, academia, and standards leaders to explore how AI can connect metrology, failure analysis, and test data across the semiconductor supply chain. As chiplets, heterogeneous integration, and advanced packaging drive complexity, AI-assisted defect localization and root-cause analysis backed by non-destructive modalities and targeted physical characterization are becoming essential to closing the loop from electrical failure back to physical origin.

Industry Tours


Take advantage of exclusive industry tours at SkyWater Technology and NeoCity Academy

Including with registration are breakfasts, breaks, lunches and receptions.

In collaboration with:

  • Navid Asadi - Associate Professor, University of Florida
  • Matthew Walsh - Chief Engineer, NSF Florida Semiconductor Engine

Highlights from Flex 2026

See some highlights from last year's FLEX Technology Summit. With a powerful speaker line-up, incredible networking, fascinating innovations, and amazing people.

NeoCity
194 NeoCity Way
Kissimmee, FL 34744
United States

Monday, April 21 (Medtronic Tour)

2:00 pm

Medtronic Tour

(Tour sold out. Sign up for the waitlist.)
Join us for an exclusive one-hour tour of Medtronic’s facility, to explore its advanced operations in designing and manufacturing microelectronics for implantable medical devices.

Note: Space is limited to 24 participants.

Transportation will not be provided.

Tuesday, April 22 (Preliminary Agenda)

7:00 am - 8:00 am

Registration and Breakfast

8:00 am - 8:10 am
Gity Samadi
Gity Samadi
Senior Director
SEMI

Opening Remarks

8:10 am - 8:25 am
Robert Bob Praino
Robert (Bob) F. Praino, Jr.
Chief Operating Officer (COO) and Co-founder
Chasm Advanced Materials

Vision and Mission of FlexTech

8:25 am - 8:50 am
Felippe Pavinatto
Felippe J Pavinatto
Senior Engineer - Printed Electronics
GE Aerospace

Printed Devices for High-Temperature Applications in Aerospace

8:50 am - 9:10 am
Peter Doeschuk
Peter Doerschuk
Professor
Cornell University

Use of Gigahertz Ultrasound Imaging and Artificial Intelligence to Improve Printed Electronics

9:10 am - 9:30 am
Madhu Stemmermann
Madhu Stemmermann
CEO and Co-Founder
Sunray Scientific

Soft Robots with Novel, High-Density Interconnects for Non-Destructive Inspection

9:30 am - 9:50 am
Benyamin Davaji
Benyamin Davaji
Assistant Professor
Northeastern University

Digital Twin in Nanofabrication Cleanroom

9:50 am - 10:05 am

Break

10:05 am - 10:25 am
Pradeep Lall
Pradeep Lall
Director, Electronics Packaging Research Institute MacFarlane Distinguished Professor and Alumni Professor
Samuel Ginn College of Engineering, Auburn University

Reliability Physics and Acceleration Factors for FHE Circuits under Sustained Temperature and Stresses of Daily Motion

10:25 am - 10:45 am
Praveen Sekar
Praveen Sekar
NoiseFigure Research

Additively Manufactured Flexible Hybrid Capacitors and Antennas for Biosensing and RF Applications

10:45 am - 11:05 am
Mike Mastropietro
Michael A. Mastropietro
CTO & Director of R&D
ACI Materials, Inc.

Materials and Processes for High Volume Integration of Stretchable Circuits into E-Textiles

11:05 am - 11:25 am
Shenqiang Ren
Shenqiang Ren
Professor of Materials Science and Engineering
University of Maryland

Printable Ink Materials and Electronics for Extreme Environments

11:25 am - 11:45 am
Robert Bob Praino
Robert (Bob) F. Praino, Jr.
Chief Operating Officer (COO) and Co-founder
Chasm Advanced Materials

Transparent Antennas - Product Market Fit & A Technology Update

11:45 am - 1:15 pm

Networking Lunch

1:15 pm - 1:35 pm
Tiffany Tu.jpg
Tiffany Tu
Program Manager, R&D
SEMI

FlexTech, What happening now?

1:35 pm - 3:05 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

3:05 pm - 3:20 pm

Break

3:20 pm - 4:10 pm

Breakout Sessions Readout

4:30 pm - 6:00 pm

Student Poster Networking Reception & Mayo Clinic Lab for Function Tour

Mayo Clinic
IERB Building
5951 E. Mayo Blvd
Phoenix, AZ 85054

Mayo Lab Tour: If you're interested, please sign up at the registration desk. Space is limited to 20 participants and will be available on a first-come, first-served basis.

Note: Transportation to this reception will not be provided. (2 minute drive.)

Wednesday, April 23 (Preliminary Agenda)

7:00 am - 8:00 am

Registration and Breakfast

8:00 am - 8:10 am
Melissa Grupen-Shemansky
Melissa Grupen-Shemansky
Vice President, Technology Communities
SEMI
8:10 am - 8:25 am
Stephaney Shanks
Stephaney Shanks
Vice President for Health and Performance Technologies
BlueHalo

Vision and Mission of NBMC

8:25 am - 8:45 am
Leila Safa
Leila Safa
NBMC Government Program Manager
Air Force Research Laboratory

NBMC Gap Analysis Workshop AFRL Perspective

8:45 am - 9:10 am
Jesús de la Fuente
Jesús de la Fuente
Founder & CEO
Graphena

Graphene Field-Effect Transistors: Transforming Next-Generation Medical Diagnostics

9:10 am - 9:30 am
Tamoghna Saha
Tamoghna Saha
Postdoctoral Scholar
University of California, San Diego

Sweat Without Sweating: Exploring the Possibilities of Biochemical Monitoring with Passive Sweating

9:30 am - 9:50 am
Peter Roberts
Peter Roberts
Postdoctoral Research Fellow, SHRED Lab, Robotics Institute
Carnegie Mellon University

Bio-inspired Soft Electrodes for Robust and Reusable Bioelectronic Stickers

9:50 am - 10:05 am

Break

10:05 am - 10:25 am
Azar Alizadeh, GE Research
Azar Alizadeh
Principal Scientist
GE HealthCare Technology & Innovation Center

Manufacturing of Low-Cost Wearable Physiological and Molecular Marker Monitoring Patches for DoD Applications

10:25 am - 10:45 am
Goutham Ezhilarasu
Goutham Ezhilarasu
Deputy Director, UCLA Chips
University of California, Los Angeles

Fan-Out Wafer-Level Packaging for Flexible Medical Devices

10:45 am - 11:05 am
John Strang
John Strang
CEO
DermiSense
Jack Twiddy
Jack Twiddy
Biomedical Engineer
DermiSense
Chris Sharkey
Chris Sharkey
ECE Graduate Student
NC State University

Advancing Dermal Interstitial Fluid as a Viable Matrix for Accessible Diagnostics

11:05 am - 11:25 am
Lucas Beagle
Lucas Beagle
Senior Director of Biological, Electronic and Nanoscale Technologies
BlueHalo Company

Transdermal Optical Microneedle Sensors for Continuous Monitoring of Physiological Analytes in Interstitial Fluid

11:25 am - 11:45 am
Syed Ahmed Jaseem
Jaseem Syed Ahmed
PhD Candidate
North Carolina State University

Shaping a Soft Future

11:45 am - 1:15 pm

Networking Lunch

1:15 pm - 1:35 pm
Tiffany Tu.jpg
Tiffany Tu
Program Manager, R&D
SEMI

NBMC, What's Happening Now?

1:35 pm - 3:05 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

3:05 pm - 3:20 pm

Break

3:20 pm - 4:10 pm

Breakout Sessions Readout

5:00 pm - 7:00 pm

Networking Reception and Tours of Wexford Connect

Enjoy Networking, concurrent tours, and presentation content
850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004
https://850pbc.com

5:00 pm - 5:30 pm: Tours of Wexford Connect (Limited to 30 people)

5:30 pm - 6:00 pm: Networking

6:00 pm - 6:15 pm: Welcome. Scarlett Spring, Executive Director, Phoenix Bioscience Core

6:15 pm - 7:00 pm: Panel Discussion:
Bridging Clinical Needs and Emerging Technology: Research, Implementation, and Scale.
Moderator: Chris Yoo, General Partner, Xcellerant Ventures
Panelists:
Suman Bose, Assistant Professor of Biomedical Engineering, Mayo Clinic
Hakan Ceylan, Assistant Professor and Principal Investigator, Mayo Clinic
Ross Bundy, CEO, CRISPRQC
Elsa Abruzzo, CEO, Anuncia Medical
Allen Waziri, CEO and Co-Founder, iCE Neurosystems

Note: Transportation will not be provided. (30+ minute drive.)

Thursday, April 24 (Preliminary Agenda)

7:00 am - 8:00 am

Registration/Breakfast

8:00 am - 8:30 am
Chris Camacho
Chris Camacho
President and CEO
GPEC
Kate Gallego
Kate Gallego
Mayor
City of Phoenix

Welcome Remarks

8:30 am - 9:00 am
Abhishek Khowala
Abhishek Khowala
Head of AI for Health and Life Sciences
Intel

KEYNOTE: AI at the Point of Care: The Next Era of Intelligent, Patient-Centric Healthcare

9:00 am - 9:45 am
Chris Yoo
Moderator
Chris Yoo
Founder, CEO and Regional Innovation Officer
MDM2 Consortium
Kiran Avancha
Kiran Avancha
Chief Innovation Officer
HonorHealth
Rochelle Rivas
Rochelle Rivas
District Director for Healthcare Innovation
Maricopa Community Colleges
Alex Tessmer
Alex Tessmer
Associate Director, BD Peripheral Intervention
Ideation

Panel Discussion: The Arizona MDM2 Consortium - Investing in the Medical Technology Manufacturing Renaissance

Moderator: Chris Yoo, Founder and CEO and Regional Innovation Officer, MDM2 Consortium
Panelists:
Kiran Avancha, Chief Innovation Officer, HonorHealth
Rochelle Rivas, District Director for Healthcare Innovation, Maricopa Community Colleges
Alex Tessmer, Associate Director, BD Peripheral Intervention, Ideation

9:45 am - 10:10 am
Jonathon Parker
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Aman Verma
Aman Verma
Hospitalist
Mayo Clinic, Arizona

FIRESIDE CHAT: How can wearables and implantables improve care of the acutely ill patient?

Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona
Participants:
Aman Verma, Hospitalist, Mayo Clinic, Arizona

10:10 am - 10:25 am

Break

10:25 am - 11:10 am
Kiran Avancha
Moderator
Kiran Avancha
Chief Innovation Officer
Honor Health Innovations
Craig Norquist
Craig Norquist
Chief Innovation Officer
Honor Health
Matthew Anderson
Matthew Anderson
Chief Medical Information Officer - Ambulatory
Honor Health

PANEL DISCUSSION: Health Data 2035: How do we Capture, Integrate, and Secure Health Data Streams From Wearables and Implantables to Improve Patient Care?

Moderator: Kiran Avancha, Chief Innovation Officer, Honor Health Innovations
Panelists:
Craig Norquist, Chief Innovation Officer, Honor Health
Matthew Anderson, Chief Medical Information Officer - Ambulatory, Honor Health

11:10 am - 11:45 am
Jonathon Parker
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Bart Demaerschalk
Bart M. Demaerschalk
Vascular Neurologist
Mayo Clinic, Arizona
Chandan Krishna
Neuro-endovascular Neurosurgeon
Mayo Clinic - Arizona

FIRESIDE CHAT: Stroke Care 2035- How Can Digital Health Data Transform Stroke Care?

Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona
Participants:
Bart M. Demaerschalk, Vascular Neurologist, Mayo Clinic, Arizona
Chandan Krishna, Neuro-endovascular Neurosurgeon, Mayo Clinic, Arizona

11:45 am - 12:15 pm
Jonathon Parker
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Nandita Khera
Nandita Khera
Oncologist, Associate Chair of Digital Health
Mayo Clinic

FIRESIDE CHAT: Real-Time Oncology - How Can Wearables and Implantables Reshape Oncology Care in 2035?

Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona
Participants:
Nandita Khera, Oncologist, Associate Chair of Digital Health, Mayo Clinic

12:15 pm - 1:00 pm
Randal Schulhauser
Moderator
Randal Schulhauser
Founder and CEO
Schulhauser Associates LLC
Jonathon Parker
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic
Allen Waziri
Allen Waziri
Neurosurgeon, Co-Founder iCE Neurosystems
iCE Neurosystems
Paul Gerrish
Paul Gerrish
VP, Technology and Medtronic Fellow
Medtronic

Panel Discussion: The New Frontier of Long-Term Brain Monitoring: Brain Computer Interface Re-Imagined

Moderator: Randal Schulhauser, Founder and CEO, Schulhauser Associates LLC
Panelists:
Jonathon Parker, Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic
Allen Waziri, Neurosurgeon, Co-Founder iCE Neurosystems, iCE Neurosystems
Paul Gerrish, VP, Technology and Medtronic Fellow, Medtronic

1:00 pm - 2:00 pm

Lunch

2:00 pm - 2:15 pm
Melissa Grupen-Shemansky
Melissa Grupen-Shemansky
VP of Technology Communities
SEMI

Opening Remarks

2:15 pm - 2:30 pm
Simon Dodd
Simon Dodd
STMicroelectronics

Enabling Personalized Healthcare and Wellness through the Integration of Electronics

2:30 pm - 2:45 pm
Stephaney Shanks
Stephaney Shanks
Vice President for Health and Performance Technologies
BlueHalo

Health on the Edge: AI, Wearables & The Future of Personalized Healthcare

2:45 pm - 3:00 pm
Anirban Bandyopadhyay
Anirban Bandyopadhyay
Senior Director and Head of the Medical IOT End Market
Global Foundries

Semiconductor Technologies for the Next Generation of Efficient and Innovative Medical Devices

3:00 pm - 3:15 pm

Break

3:15 pm - 4:15 pm
Douglas Kiehl
Moderator
Doug Kiehl
BioCrossroads/Purdue
Bharath Rajagopalan
Bharath Rajagopalan
Director – Strategic Marketing
STMicroelectronics
Anirban Bandyopadhyay
Anirban Bandyopadhyay
Senior Director
Global Foundries
Stephaney Shanks
Stephaney Shanks
Division Director, Integrative Health and Performance Sciences
BlueHalo
Deon Chen
Deon Chen
Sr. Manager, HEOR Strategic Planning
BD

Panel Discussion: Digital Health Revolution: Insights and Innovations

Moderator: Douglas Kiehl, BioCrossroads/Purdue
Panelists:
Bharath Rajagopalan , Director – Strategic Marketing, Health & Wellness, STMicroelectronics
Anirban Bandyopadhyay, Senior Director, Global Foundries
Stephaney Shanks, Division Director, Integrative Health and Performance Sciences, BlueHalo
Deon Chen, Sr. Manager, HEOR Strategic Planning, BD

4:30 pm - 7:00 pm

Evening Program Hosted by Venture Café

850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004
https://venturecafephoenix.org/
Venture Café Phoenix is a dynamic weekly gathering where entrepreneurs, innovators, and business leaders connect to exchange ideas and build meaningful relationships.

Note: Transportation to this program will not be provided (30+minute drive)

5:40 pm - 6:30 pm
Nandini Tandon
Nandini Tandon
Co-Founder of Silicon Valley based VC in HealthTech
IndUS Setu Global Foundation
Jami Mei
VP of Business Development
Arizona Commerce Authority
Douglas E. Kiehl
Sr. Vice President
BioCrossroads
Mark Dydyk
Director of Engineering & Operations
Medtronic

Fireside Chat: Harnessing Semiconductor For transformational Advancements in HealthTech

Abstract
Moderator: Nandini Tandon
Panelists:
Jami Mei, VP of Business Development, Arizona Commerce Authority
Douglas E. Kiehl, Sr. Vice President, BioCrossroads
Mark Dydyk, Director of Engineering & Operations, Medtronic

- CAST NBMC FlexTech

Join us for a three-day workshop uniting SEMI Technology Coalitions: FlexTech, NBMC, and CAST

The workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will feature AI for Metrology (AI4MT) sessions

8:00 am - 6:00 pm Off Add to Calendar 2027-02-16 08:00:00 2027-02-18 18:00:00 Flex Technology Workshop 2027 Join us for a three-day workshop uniting SEMI Technology Coalitions: FlexTech, NBMC, and CASTThe workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will feature AI for Metrology (AI4MT) sessions NeoCity 194 NeoCity Way Kissimmee, FL 34744 United States SEMI.org [email protected] America/New_York public America/New_York
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United States Belgium France Germany Ireland Italy EU CRA 2026 Updates web tile Technical Training
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As the European Union enacts the Cyber Resilience Act (CRA), the semiconductor industry must rapidly adapt to evolving cybersecurity requirements that will impact product design, software compliance, and the global supply chain. Join the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) for a live webinar unpacking what the CRA means for semiconductor companies and how to prepare for compliance.

This session will provide expert insight, practical guidance, and live Q&A with cybersecurity leaders from top technology firms.

Key Topics

  • Overview of the EU Cyber Resilience Act and its latest updates
  • How CRA regulations apply to semiconductor manufacturing, equipment, and design
  • Risk management strategies and third-party software compliance
  • Real-world approaches to implementation from leading global firms
  • Open Q&A with cybersecurity and compliance experts

Who Should Attend

  • Cybersecurity and compliance professionals
  • Semiconductor design and manufacturing leaders
  • Legal and regulatory affairs professionals
  • Product development and software teams
  • Government and policy stakeholders
Standards 3:00 pm - 5:00 pm Off Add to Calendar 2026-09-30 15:00:00 2026-09-30 17:00:00 EU CRA Updates 2026 SEMI.org [email protected] Europe/Berlin public Europe/Berlin

Speakers

Wilko BaksWilko Baks
Manager, Product Security and 3rd Party Software Compliance, ASML
 
Konstantinos Papapanagiotou
Principal Consultant, Styx Cybersecurity Services
 
Round Table: Cyber Resilience Act explanation and implementation Experience  - ISACA Netherlands ChapterRaluca Viziteu
Senior Product Security Compliance Officer, ASML
Register Now
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United States Seeq webinar 3 Business Executive Technical Keynotes
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Featured Speakers

Subhadra Sampathkumar

Subhadra Sampathkumaran, M.S. in Computer Science, is a Software Engineering Manager at Intel Corporation with over 20 years of experience leading digital transformation, data engineering, and automation across global semiconductor fabs. She has built and scaled solutions spanning software architecture, advanced analytics, manufacturing operations, big

data integration, IoT, workflow automation, and agentic AI, helping improve efficiency, reduce costs, enhance operational resilience, strengthen compliance, and enable predictive maintenance, lights-out manufacturing, and real-time decision support. Passionate about orchestrating intelligence across facilities and sub-fabs, she envisions a future where maintenance and operations evolve from reactive, time-based models into adaptive, anticipatory ecosystems that redefine reliability engineering.

 

Sean Tropsa

Sean Tropsa began his career as an engineer in the semiconductor manufacturing industry, where he developed expertise in large-scale data analysis, root cause analysis, and process optimization. As Head of Technical Solutions, Growth Markets at Seeq, he helps semiconductor customers use analytics and AI to turn data into business value, supporting sustainability goals while improving reliability, yield, and quality. Sean earned BS and MS degrees in Chemical Engineering from Arizona State University.

United States

Learn how Intel is using agentic AI-supported workflows in Seeq to transform maintenance operations across its global semiconductor manufacturing footprint. With thousands of critical assets across multiple sites, Intel is projecting 30% faster anomaly detection in ultrapure water systems, a 15-20% reduction in technician workload through autonomous work order generation, and more than 120,000 labor hours saved annually.

These results are powered by a shift from time-based and alarm-driven maintenance to condition-based operations. Intel leverages Seeq to continuously monitor asset health, detect abnormal conditions earlier, forecast maintenance needs, generate work orders, and provide engineers with actionable context. By codifying the expertise of its global engineering and operations teams into scalable workflows, Intel is extending institutional knowledge across facilities, improving consistency, and accelerating action. With human oversight built into every step, Intel is on a practical, governed journey toward semi-autonomous maintenance operations.

This session will explore real-world applications in ultrapure water and compressor maintenance and share practical lessons for implementing agentic AI at scale, including governance, repeatability, and scaling AI-driven reliability programs across a global manufacturing enterprise.

9:00 am - 10:00 am Off Add to Calendar 2026-09-29 09:00:00 2026-09-29 10:00:00 Scaling Smarter Maintenance in Semiconductor Facilities with AI Agents Learn how Intel is using agentic AI-supported workflows in Seeq to transform maintenance operations across its global semiconductor manufacturing footprint. With thousands of critical assets across multiple sites, Intel is projecting 30% faster anomaly detection in ultrapure water systems, a 15-20% reduction in technician workload through autonomous work order generation, and more than 120,000 labor hours saved annually.These results are powered by a shift from time-based and alarm-driven maintenance to condition-based operations. Intel leverages Seeq to continuously monitor asset health, detect abnormal conditions earlier, forecast maintenance needs, generate work orders, and provide engineers with actionable context. By codifying the expertise of its global engineering and operations teams into scalable workflows, Intel is extending institutional knowledge across facilities, improving consistency, and accelerating action. With human oversight built into every step, Intel is on a practical, governed journey toward semi-autonomous maintenance operations.This session will explore real-world applications in ultrapure water and compressor maintenance and share practical lessons for implementing agentic AI at scale, including governance, repeatability, and scaling AI-driven reliability programs across a global manufacturing enterprise. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register
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Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics
Acquisition Broadens Micross' Advanced Packaging, Photonics and Test Capabilities and Expands Its Reach into the European Market

Melville, NY – July 28, 2026 – Micross Components, Inc. ("Micross" or the "Company"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced that it has entered into a definitive agreement to acquire AEMtec GmbH ("AEMtec"). AEMtec is a leading provider of complex micro- and optoelectronic modules, advanced packaging, test and assembly services for high-reliability applications, headquartered in Berlin, Germany and a portfolio company of Capiton.

The acquisition significantly enhances Micross' presence in continental Europe and further broadens Micross' portfolio of high-reliability microelectronic services and products. AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain—from design, prototyping and industrialization through qualification, series production and lifecycle support. AEMtec's technology portfolio spans wafer back-end services and wafer testing, chip-on-board, flip chip, 3D integration and opto packaging, all performed in cleanroom facilities in Berlin and Dresden, Germany, and Boston, Massachusetts. Its deep expertise in miniaturization and high-precision assembly enables highly reliable solutions for the most demanding customer requirements.

Serving demanding customers across the semiconductor, medical and biotechnology, industrial automation, communications, and aerospace & defense sectors, AEMtec offers customized solutions for complex, mission-critical requirements. The company's reputation for engineering excellence and reliability has made it a trusted, single-source development and manufacturing partner to blue-chip customers bringing innovative, high-performance products to market. AEMtec's management team, led by CEO Robert Giertz, will join Micross as part of the transaction.

Micross' acquisition – the eleventh under Behrman Capital's ownership and seventh since consummating a continuation fund transaction in February of 2022 – continues to build on the strategic priorities for the Company, namely broadening Micross' advanced packaging, photonics and test capabilities. The acquisition also materially expands Micross' manufacturing and engineering footprint in Europe, positions the Company closer to leading European customers, and better positions the Company for future growth opportunities. The acquisition of AEMtec enhances Micross's ability to serve existing customers with advanced optoelectronic packaging capabilities, while expanding its European manufacturing footprint to further support the European defense industrial base.

Jim Cannon, CEO of Micross, said, "We are excited to welcome AEMtec to the Micross family, as their world-class expertise in advanced packaging, photonics and optoelectronics will augment our capabilities and accelerate our ability to deliver cutting-edge solutions to our customers. AEMtec establishes our first scaled foothold in continental Europe, augmenting our existing European facilities in the United Kingdom and Denmark, and positions Micross as a leading supplier of high-reliability microelectronic products and services. Together, we look forward to pursuing new business opportunities and expanding our reach in high-growth markets across Europe and beyond."

Robert Giertz, CEO of AEMtec, said, "We are delighted to join Micross and together capitalize on the significant growth capabilities of both AEMtec and Micross. Our broad technological expertise and end-market exposure strategically align with Micross' capabilities and provide our customers and employees a promising future."

Simon Lonergan, Managing Partner of Behrman Capital, said, "Micross' acquisition of AEMtec enhances the combined company's strategic position in the high-reliability microelectronics market. This acquisition underscores the Company's commitment to a truly global offering of high-reliability products and services, allowing us to access the high potential European market. We look forward to supporting Jim and the management to drive growth at Micross."

Financial terms of the transaction were not disclosed. Completion of the transaction is expected in the second half of 2026, subject to customary regulatory approvals. Harris Williams acted as exclusive financial advisor and Goodwin Procter LLP acted as legal counsel for Micross in connection with the transaction.

About Micross

Micross is a provider of advanced, high-reliability microelectronic products and services. With broad authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide differentiated high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 45 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. For more information about Micross, please visit www.micross.com and follow us on LinkedIn.

About Behrman Capital

Based in New York City, Behrman Capital was founded in 1991 by Grant G. and Darryl G. Behrman. The firm invests in management buyouts, leveraged buildups and recapitalizations of established growth businesses. The company's investments are focused in three industries: Defense & Aerospace, Healthcare, and Specialty Industrials. The firm has raised nine private equity funds with combined capital of $4.7 billion and is currently managing active partnerships capitalized at $1.6 billion cumulatively. For more information, please visit www.behrmancap.com.

About AEMtec

AEMtec GmbH is a leading European provider of engineering and electronic manufacturing services specializing in complex micro- and optoelectronic modules and systems. Founded in 2000, AEMtec offers a broad technology portfolio spanning wafer back-end services, chip-on-board, flip chip, 3D integration and opto packaging, serving blue-chip customers across the semiconductor, medical, industrial automation, communications, and aerospace and defense sectors. Headquartered at the Berlin-Adlershof science and technology hub, the company operates cleanroom facilities in Berlin and Dresden, Germany, and Boston, Massachusetts. www.aemtec.com

Contacts

For Micross
Thomas J. Dinges, CFA
Sr. VP of Finance
P: +1 (631) 542-5019
[email protected]

Verific App Store Opens with
Downloadable Examples of Parser Platform Applications

• Initial offerings include a hierarchy explorer, linter, HDL editor, signal tracer, essential tools for hardware design and verification
• Verific App Store opens July 27 as 63rd DAC begins in Long Beach, Calif.

ALAMEDA, CALIF. –– July 22, 2026 –– Verific Design Automation today announced the Verific App Store with a toolkit and downloadable example applications showcasing a variety of essential electronic design automation (EDA) point tools and solutions built using its Parser Platforms.

The Verfic App Store will open Monday, July 27, as the 63rd Design Automation Conference (DAC) convenes at the Long Beach Convention Center in Long Beach, Calif. Verific will offer in DAC Booth #1052 demonstrations of the new Verific App Store examples along with demonstrations of its SystemVerilog, Verilog, VHDL and UPF front-end Parser Platforms.

“We want to show how you can build really cool EDA products with our Platform," remarks Rob Dekker, Verific's president, founder and CTO. "In the Verific App Store, we started with a number of useful EDA point tools that are fast running, simple to license and easy to use by AI and HI (Human Intelligence) alike.”

As the leading provider of front-end platforms, Verific powers EDA with its SystemVerilog, Verilog, VHDL and UPF parser software used as the foundation for both in-house and commercially available EDA tools and flows. Applications range from synthesis and formal verification to emulation, debugging, virtual prototyping, low-power design and design-for-test tools.

Currently Available Parser Platform Apps
Example apps currently available at the Verific App Store include a hierarchy explorer, a linter, an HDL editor and a signal tracer, essential tools for hardware design and verification.

HierRTL is a Hierarchy Explorer that reports the structural hierarchy of Verilog, SystemVerilog, and VHDL designs directly from the parse tree without the need for elaboration. Engineers can visualize and navigate the hierarchical structure of their designs and understand relationships between different modules and components, making it easier to manage complex designs.

LintRTL is a Linter tool for SystemVerilog and VHDL that identifies design issues early with configurable lint rules and advanced synthesizability checks. It analyzes code for potential errors, style issues and adherence to coding standards. It helps ensure that the HDL code is clean and maintainable, reducing bugs before simulation or synthesis.

SnapRTL is an automated HDL editor used to analyze, modify and export designs while preserving the original code and formatting. It gives engineers confidence to be able to modify their designs in a specialized environment for writing and editing HDL code. SnapRTL features syntax highlighting, code completion and error detection, streamlining the coding process and improving productivity.

TraceRTL is a Signal Tracer for SystemVerilog and VHDL to improve traceability and speed debug. It monitors and analyzes signals within the design and provides insights into signal behavior during simulation, helping engineers effectively debug and optimize their designs.

Additional apps will be added in the future.

Availability and Pricing
"We will be adding more EDA point tools as we go,” says Dekker. “Currently most base products are free of charge, and we only charge a small fee for more advanced product features.”

The Verific App Store will open July 27. Tool flow developers can download the tools in the Verific Toolkit with or without being an existing Verific customer, but registration is required. New users will be asked to register with a Verific Passport account.

Basic tools are currently free, but advanced features require a monthly subscription fee. Free evaluations are available for 14 days.

The Verific App Store can be found at: https://store.verific.com/

Verific at DAC
Attendees can arrange demos or private meetings with Verific during DAC exhibit hours July 27-29 by sending email to [email protected].

DAC registration is open.

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups worldwide to develop advanced electronic design automation (EDA) products quickly and cost effectively. Verific’s software serves as the front end to synthesis, formal verification, emulation, debugging, virtual prototyping, low-power design and design-for-test tools. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 80,000 copies of its software used by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/