Advanced Packaging Materials Innovation Through Co-Creative Evaluation Platform
Advanced packaging has become a key enabler for next-generation AI and high-performance computing through heterogeneous integration. To accelerate innovation in this field, Resonac launched JOINT2, a co-creative packaging evaluation platform, in 2021. This initiative brings together leading materials, equipment, and substrate companies to collaboratively advance 2.xD and 3D packaging technologies.Resonac is also developing fine-pitch vertical and lateral interconnect technologies while investigating fabrication processes and reliability solutions for extremely large-scale 2.5D packages. This presentation will discuss key material challenges and technology roadmaps for advanced packaging, highlight the roles of JOINT2 and US-JOINT—a collaborative packaging R&D consortium based in Silicon Valley—in fostering open innovation, and present recent advances in materials and packaging process R&D for future heterogeneous integration.
BIOGRAPHY
Mitsukura is currently Business Development Director for Resonac and responsible for technical marketing and new R&D consortium “US-JOINT” in Bay area. Since joining Resonac, former Hitachi Chemical, Dr. Mitsukura has worked on semiconductor material development such as photosensitive material, adhesive and underfill. He has worked at imec in Belgium as a company resident for the advanced package development from 2012 through 2014. After returning to Japan, he has led the joint development with the customers and established the consortium “JOINT2” targeting the packaging evaluation platform supported by Japanese government at Resonac with material, equipment, and substrate companies.
He received a Best of Track at IMAPS 2016 and Best paper at IMAPS 2019.
Dr. Mitsukura received PhD Degree in Engineering at Osaka University and also MBA at Tokyo University of Science.