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Virtual

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

United States Harvey Kauget with Title Business Technical
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Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.

Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.

Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.

Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.

Honors & Recognitions

  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
  • Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
  • Named, Chambers USA, Intellectual Property (2021-2022)
  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
  • Florida Trend, "Legal Elite," Intellectual Property Rights (2005, 2007-2008, 2010-2016, 2018, 2020-2021)
  • Florida Super Lawyers, Intellectual Property (2009, 2011-2021)

United States

CAST EMG ESD Alliance FlexTech MSIG SOI

Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end.  A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

Belgium France Germany Ireland Italy United States FEMC13 On Demand tile Business Executive Featured Speakers
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Bio

Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.

This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.

Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.

ABOUT THE SPEAKER

Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.

At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
 

United States

Dr. Craig Milroy
Dr. Craig Milroy
National Research Council (NRC) Research Associate
Air Force Research Laboratory (AFRL)
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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United States Register Now MSIG PZ Webinar tile Business Technical Featured Speakers

Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.

Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.

In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.

United States

Jim Macy Kistler
Jim Macy
Application Expert BU Advanced Manufacturing
Kistler Instrument Corp.
Robert Hillinger
Robert Hillinger
Kistler Instrument Corp.
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG
MSIG

Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test. 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format
United States Register Now HI Webinar 2022

United States

10:00 am - 10:10 am
Kim Yess
Kim Yess
Executive Director, WLP Materials
Brewer Science, Inc.

Welcome & Introduction

10:10 am - 10:30 am
E. Jan Vardaman, TechSearch International
Jan Vardaman
CEO
TechSearch International, Inc.

Markets & Challenges Around Heterogeneous Integration

10:30 am - 10:50 am
Diane Sheele
Diane Scheele
Head of Marketing Surface Prep and Clean, Patterning Business Field
EMD Electronics

EMD Approach to the Rise of Heterogeneous Integration

10:50 am - 11:00 am

Q&A

EMG

As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation.  The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions.  Heterogeneous Integration is and will be the key technology direction going forward. This webinar will provide a heterogeneous integration overview and how material suppliers are responding to this dynamic technology environment.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #6.

Taylor Zhao
Manager, Programs & Committees
[email protected]

+
United States SiC Webinar 6 Business Technical

SiC—Silicon Carbide Webinar #6: Basal Plane Dislocation Defects and the Impact on Device Performance

 

Silicon carbide (SiC) chips are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting remaining barriers to mass commercialization including the higher-than-silicon chip cost that increases disproportionately with area, defects that limit chip yield and area, reliability and ruggedness concerns, and the need for a trained workforce to skillfully insert SiC into power electronics circuits.

With respect to fabrication, the SiC industry is successfully leveraging the fully depreciated legacy silicon fab infrastructure and is making the relatively small financial investments that allow mature silicon fabs to process SiC. A key aspect of cost-effective fabrication is limiting defects that degrade device performance and compromise yields. Over the past twenty years, significant progress has been made in improving SiC material quality, and Basal-Plane-Dislocations (BPDs) are the last major catastrophic defect. In this presentation, I will discuss how bipolar-current induced electron-hole pair recombination at basal plane dislocations generates stacking fault (SF) formation and expansion, which degrade on-state current conduction. I will present and interpret experimental data of several transistors that exhibit severe BPD related electrical degradation, and of others that demonstrate “intermediate” or no degradation at all. For impacted transistors, I will identify and analyze the electrical characteristics that exhibit degradation as well as those that remain unaffected under bipolar stress. Finally, I will show that BPD related degradation is fully reversed by high temperature annealing, and the transistor returns to its original “undamaged” operational state.

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Join us online for the sixth webinar in the Silicon Carbide Series.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1 Register Now
Event format

REGISTRATION

Member Price: Complimentary

Non-Member Price: $49

SAP Employees, Customers & Partners: Use the Promo Code provided via email from SAP or contact Dyan Schertler, [email protected].

Registration is final. No refunds provided. Following the Virtual Forum, all registrants will receive a link with content.

EVENT CONTACT
Mark da Silva
[email protected]

+
United States Register Now Smart Manufacturing Webinar 2022 - Accelerate Your Industry 4.0 Transformation Business Executive Technical

Partner & Sponsor

Sponsor & Partner SAP

Accelerate Your Industry 4.0 Transformation
by Combining Your ERP and Manufacturing Data 

WHAT IF YOU

  • Accurately can assess your cost of yield and products?

  • Track your sales from order entry to delivery and, if needed, trace them back to the lot with accurate genealogy?

  • Receive financial insights into areas such as manufacturing waste, capacity, or utilization, and the impact they have on corporate profitability?

  • Visualize cause-and-effect relationships across your financial, supply chain, and manufacturing data sets?

JOIN US for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.

United States

THURSDAY, SEPTEMBER 22, 2022

10:00 am - 10:05 am
Mark da Silva
Mark da Silva, PhD
Sr. Director Smart Manufacturing
SEMI

Welcome Remarks

10:05 am - 10:55 am
Satish Maktal, SAP
MODERATOR
Satish Maktal
Industry Advisor, High Tech
SAP

Executive Panel Discussion & Q&A—Accelerate Your Industry 4.0 Transformation by Combining Your ERP and Manufacturing Data

Jeff Howell, SAP
EXECUTIVE PANELIST
Jeff Howell
Global Strategy Leader, Global VP
SAP
Kimon Michaels, PDF Solutions
EXECUTIVE PANELIST
Kimon Michaels
Executive VP, Products & Solutions, Director & Co-Founder
PDF Solutions
Surya Iyer, Polar Semiconductor
EXECUTIVE PANELIST
Surya Iyer
President and COO, Board Member
Polar Semiconductor
10:55 am - 11:00 am

Closing Remarks

WEBINAR: 1011am Pacific Time 

Organized by SEMI in Partnership with SAP

Join us for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format
United States Register Now Technical
Highlighted content

In 2019, SEMI launched a special thought leadership” initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.

In December 2021, we shared with you an introduction to the SEMI “Future of Computing” Think Tank, a thought leadership group that is tasked with creating an “Intellectual Blueprint” of what computing might look like in 2040 – and what the semiconductor industry can do now to get ready for the next era of disruption.

In this 2nd session, Dr. Alessandro Curioni, Vice President of Research Europe and Africa and Director of Research Lab in Switzerland at IBM, will host and showcase the progress the group has made in 2022. Next, Jim Sexton, Department Group Manager of Data Centric Systems at IBM, will introduce a White Paper the Think Tank is currently drafting as a first steppingstone towards an industry blueprint. Both he and James Clarke, Director of Quantum Hardware, Intel will then go deeper into two of the White Paper sections, one on Classical, the other on Quantum Computing.  

Reserve your spot now to learn about how you and your company can contribute to shaping the future!

 

 

United States

8:00 am
Bettina Weiss headshot
Bettina Weiss
Chief of Staff & Corporate Strategy
SEMI

Welcome, brief SEMI Think Tank Intro

8:05 am
Alexandro headshot
Dr. Alessandro Curioni
IBM Fellow, Vice President IBM Research Europe & Africa, Director IBM Research Europe – Zurich
IBM

The importance of Future of Computing effort to the industry, intro to the speaker

8:15 am
Jim Sexton profile
Jim Sexton
IBM Fellow, Department Group Manager, Data Centric Systems
IBM

Introduction to White Paper draft

8:30 am
James Clark headshot
James Clarke
Director of Quantum Hardware
Intel

Deeper Dive into Quantum Computing

8:00 am - 9:00 am Off Add to Calendar 2022-09-20 08:00:00 2022-09-20 09:00:00 A look into the Future: Computing in 2040 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

On-Demand Pricing

FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00

DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 2Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 3Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00

STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.

CONTACT
Mark da Silva
[email protected]

+
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now Global Smart Manufacturing Conference 2022 Business Technical

Sponsorship Contact

[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

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AUTONOMOUS FACTORY OF THE FUTURE

GSMC On-Demand gives you access to approved presentations and videos. You'll hear global experts share strategies and best practices to improve manufacturing data capture and analysis. Find ideas and solutions to maintain business continuity and meet the increasing demands of customers.  

  • ACCESS GSMC On-Demand 24/7 until December 11, 2022.
  • WATCH available presentations and video recordings.
  • DOWNLOAD and save a copy of approved PDFs


 

2022 Organizing Committee

  • John Behnke | INFICON

  • Holland Smith | INFICON

  • Chan Pin Chong | KULICKE & SOFFA

  • Michael Arnold | PEER GROUP

  • Bobby Mitra | TEXAS INSTRUMENTS

  • James Lin | UMC

United States

TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT

SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition

7:00 am
Mark da Silva
Mark da Silva
SEMI

Opening Remarks

7:02 am
Ajit Manocha
SEMI

Conference Opening Remarks

7:15 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Keynote: Autonomous Smart Factory of the Future

7:35 am
Michael Arnold
Michael Arnold
PEER Group

Moderator Welcome

7:40 am
Praneetha Poloju
Praneetha Poloju
Chief Technologist
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization​

Bella Chan
Bella Chan
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization

8:05 am
Doug Suerich
Doug Suerich
PEER Group

End-to-End Smart Manufacturing: Using EDA to Advance the Backend ​

8:30 am
Fahad Golra
Dr. Fahad Golra
Research & Innovation Coordinator
Agileo Automation

Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry

8:55 am
Padmanabha Kannampalli
Padmanabha Kannampalli
Engineer
Teradyne

Data Connectivity in Semiconductor Test—Challenges

9:20 am
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards​

9:40 am
Michael Arnold
Michael Arnold
PEER Group

Closing Remarks

SESSION 2—Intelligent INSIGHTS: Current Point Systems

5:00 pm
James Lin, UMC
MODERATOR
James Lin
UMC

Welcome Remarks

5:05 pm
CS Tan
CS Tan
Group VP & General Manager
STMicroelectronics

Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED​

5:30 pm
John Foley
John Foley
Kulicke & Soffa

Big Data Analytics for Back-End Assembly Equipment​

5:55 pm
Bappaditya Dey
Bappaditya Dey
Senior R&D Engineer
imec

Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node

6:20 pm
Ivan Aduna
Ivan Aduna
KY Technology

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory​

6:45 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
AR Photonics

A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting ​

7:35 pm
James Lin
UMC

Closing Remarks

WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT

SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin

7:00 am
Holland Smith
MODERATOR
Holland Smith
Inficon

Welcome Remarks

7:05 am
Marc Engel
Marc Engel
Agileo Automation

How Existing Semiconductor Equipment Can Benefit From Digital Twins

7:30 am
Sarbajit Ghosal
Sarbajit Ghosal
SC Solutions

Development of Digital Twins for Manufacturing Applications

7:55 am
Basil Milton
Basil Milton
Kulicke & Soffa

Wire Bonding Digital Twin Enhancements for Smart Manufacturing

8:20 am
Shankar Ranganathan
Shankar Ranganathan
Associate General Manager R&D
HCL Technologies

Scalable Options to Support Semiconductor Capital Equipment's

8:45 am
Sriny Sundararajan
Sriny Sundararajan
CTO
Clip Automation

Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing

Vikrant Kahlir
Vikrant Kahlir
Vendia
9:10 am
Anuj Mahendrum
Anuj Mahendru
Global Director, Semiconductor and Hi-Tech Industries
Rockwell Automation

Cleanroom Redefined—Addressing the Wafer Transport Challenge

9:35 am
Holland Smith
Holland Smith
Inficon

Closing Remarks

SESSION 4—Intelligent PREDICT: AI/ML Solution Integration

5:00 pm
Chan Pin Chong
MODERATOR
Chan Pin Chong
Kulicke & Soffa

Welcome Remarks

5:05 pm
KEYNOTE | John Herlocker, PhD | TIGNIS
Jon Herlocker, PhD
CEO
Tignis

KEYNOTE: Empowering Process Engineers With Self-Service AI/ML

5:30 pm
Jasper van Heugten
Jasper van Heugten
minds.ai

An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning

5:55 pm
Jimmy Bramante
Jimmy Bramante
Inficon

Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data​

6:20 pm
Nikunj Mehta
Nikunj Mehta
Founder & CEO
Falkonry

Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI

6:45 pm
Erik Collart
Erik Collart
Global Product Manager SCADA
Edwards

Effective Use of Vacuum Assets Through Smart Manufacturing

7:10 pm
Yak Hua Khoo, ViTrox Technologies
Yak Hua Khoo
ViTrox Technologies

SMT Electronic Smart Close-Loop Prediction System​

7:30 pm
Chan Pin Chong
Chan Pin Chong
Kulicke & Soffa

Closing Remarks

THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT

SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control

7:00 am
Bobby Mitra
MODERATOR: Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Welcome Remarks

7:05 am
Christoph Koegler, Infineon
Christoph Koegler
Director Innovation, Digitalization & AI
Infineon

A Flood of Problems Drained—Fixing Valves the Smart Way​

7:30 am
Gautham Unni
Gautham Unni
AWS

AWS for Semiconductor Smart Manufacturing ​

7:55 am
Peter Lendermann
Peter Lendermann
Chief Business Development Officer
D-SIMLAB Technologies

Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production​

8:20 am
Ivy Qin
Ivy Qin
Senior Director of Engineering
Kulicke & Soffa

Road to Autonomous Wire Bonder

8:45 am
Matthew Putman
Matthew Putman
CEO
Nanotronics

Inspect, Correct, Protect

9:10 am
Christophe Curny
Christophe Curny
Soitec

Soitec 4.0 Journey​

9:35 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Closing Remarks

SESSION 6 — Foundational Topics

5:00 pm
John Behnke
MODERATOR
John Behnke
General Manager FPS Product Line
Inficon

Welcome Remarks

5:05 pm
Koen de Backer
Koen de Backer
Vice President Smart Manufacturing and Artificial Intelligence
Micron

KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals

5:30 pm
Ming Chang Wu
Ming-Chang (Bright) Wu
Hon Hai Research Institute, Foxconn

Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards​

5:55 pm
Jim Montgomery
Jim Montgomery
Principal Solution Architect
TXOne Networks

Is Wait-and-See a Good OT Security Strategy?

6:20 pm
Houng Sun
Dr. Houng Sun
Mirle

Advanced Automation for Smart Manufacturing​

6:45 pm
Andrew Seward, TEL
Andrew Seward
Field Solutions Product Marketing and Analytics Manager
TEL
David Gross, Siemens
Dave Gross
Portfolio Development Executive
Siemens

SEMI Smart Manufacturing Maturity Assessment Model 

7:10 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Conference Closing Discussion—Where do we go from here?​

Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

7:35 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Closing Remarks

- FOA ITL Standards

Get access to approved GSMC 2022 presentations and videos.
Discover ideas and solutions for making your manufacturing smarter.

Off Add to Calendar Disabled America/Los_Angeles 2
Event format
United States Register Now EMG webinar tile2 Business Executive
Highlighted content

United States

10:00 am - 10:05 am
Kevin McLaughlin
Kevin McLaughlin
SACHEM

Welcome

10:05 am - 10:25 am
Matthew Beard Brewer Science
Matthew Beard
Executive Director, Strategic Planning, Mgmt Systems & Sustainability
Brewer Science

Sustainability Approaches for the Semiconductor Materials Industry

10:25 am - 10:45 am
Shari Liss, SEMI Foundation
Shari Liss
Executive Director
SEMI Foundation

SEMI Workforce Development – When Everyone Wants Workers Now

10:45 am - 11:00 am

Q&A

EMG Workforce Development

Two overarching business issues face the industry today – how to responsibly create sustainability strategies and how to find and train strong workers.  Both issues are challenging management teams to think creatively and change fundamental processes of their business. 

SEMI members are looking to SEMI to provide industry-wide guidance and support to share best practices, build grassroots processes, and guidebooks that both large and small companies can use to improve their efforts.

Attend this webinar to get an update and insights, with a special tilt toward the materials industry, on how you can incorporate SEMI guidebooks for hiring qualified and diverse DEI and Veterans hiring, as well as other efforts toward strengthening your workforce.  On the Sustainability topic, hear how the industry is coming together to help each other in Scope 1,2, and 3 measuring and reporting mechanisms, and more!

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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