Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

• Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
• Process Nodes: Process nodes and their impact on device performance and cost
• Device Physics and Transistor Operation: Principles of device operation and transistor functionality
• Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
• Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
• Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
• Wafer Processing:
  • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
• Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing

• Members: $695
• Non-Members: $795
• Students/Vets: $595

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Overview of Semiconductor Manufacturing

Webinar - Asia

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

• Understand the fundamental principles and theories semiconductor technology.
• Communicate with other associates and understand wafer processing steps.
• Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
• Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
• Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
• Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
• Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
• Analyze and evaluate research literature in semiconductor technology.
• Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, check your junk/spam folders before contacting SEMI U for support.

Singapore

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

• Members: $545
• Non-Members: $645
• Students/Vets: $445

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Understanding Semiconductor Technology and Business

Webinar - Asia

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

• Directors
• Managers
• Process Engineers
• R&D Engineers
• Sales and Application Engineers who supply packaging materials and tools

Course Topics

• Advanced packaging and material characterization.
• Packaging principles and how packaging evolves into heterogeneous packaging.
• Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
• Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
• Assembly processes from backgrinding to singulation for QFP and FBGA packages.
• Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Please note that only the person who registered will receive a certificate of completion. 

United States

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. 

Pricing

• Members: $645
• Non-Members: $745
• Students/Vets: $545

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 

Advanced Packaging and Material Characterization for Microelectronics

Webinar - US

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

• Understand the fundamental principles and theories semiconductor technology.
• Communicate with other associates and understand wafer processing steps.
• Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
• Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
• Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
• Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
• Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
• Analyze and evaluate research literature in semiconductor technology.
• Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Please note that only the person who registered will receive a certificate of completion. 

Germany

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

Early Bird Special! $200 off

• Members: $845 $645
• Non-Members: $955 $745
• Students/Vets: $845 $545

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Understanding Semiconductor Technology and Business

Webinar - EU

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

• Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
• Process Nodes: Process nodes and their impact on device performance and cost
• Device Physics and Transistor Operation: Principles of device operation and transistor functionality
• Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
• Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
• Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
• Wafer Processing:
  • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
• Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Please note that only the person who registered will receive a certificate of completion. 

Germany

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing

Early Bird Special! $200 off

• Members: $995 $795
• Non-Members: $1,095 $895
• Students/Vets: $895 $695

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Overview of Semiconductor Manufacturing

Webinar - EU

This webinar will introduce members of the military community to the semiconductor industry and connect them directly with veterans and recruiters. Employers recognize and need this skilled and talented community to join as the industry prepares for huge growth in the next few years.  We will dive into the roles expected and qualifications needed to jump into an exciting new career. Opportunities nationwide!

About SEMI VetWorks

The SEMI VetWorks Initiative aims to address the microelectronics industry's need for attracting, developing, and retaining talent by tapping into the skills and experiences of military veterans and reservists. SEMI prioritizes connecting its members with this talented pool through initiatives that align industry hiring practices, internship, and apprenticeship programs. By leveraging existing training and credentialing opportunities, veterans gain access to well-paid technician and operator roles. The SEMI VetWorks Guidebook offers tools and recommendations for recruiting, hiring, and retaining veterans, while the SHRM Veterans at Work Certificate program provides additional resources for connecting with the military community.

Watch the recording of the March webinar

United States

10:00 am - 10:20 am

Melinda Gomez

Program Manager, Veteran Initiatives

SEMI Foundation

Industry Overview

Biography

Members of the Military Community, join us for an interactive and informative session about career opportunities in the semiconductor industry. Hear from employers and veterans in the industry directly!

SEMI VetWorks: Careers in Chips

The semiconductor industry needs your skills and experience!

Virtual Event #2
10:00am - 12:00pm PT, June 26th

Your company has built a strong patent portfolio — now what? This webinar will discuss strategies for managing existing patents, including how to use IP to strengthen your business and maximize return on investment.  Topics will include best practices for patent marking, controlling rising maintenance fees, and licensing, as well as insights into emerging trends in patent enforcement and litigation in the semiconductor sector.

 

 ABOUT THE SPEAKER

Michael Jones, Partner, Rothwell Figg
Michael H. Jones’s practice includes patent litigation, patent prosecution, and IP counseling.  Michael advises clients who have developed a broad range of technologies, including semiconductor devices and manufacturing, integrated circuits and systems, green energy, terahertz electronics, hardware and protocols for wireless communications, and various online technologies. Although much of his work is with large multinational clients with complex patent portfolios, Michael also has a significant, and growing, practice with smaller high-technology clients, ranging from startups to growth companies dealing with patent issues for the first time in their evolution. Michael has a B.S. in Electrical and Computer Engineering from University of Virginia, a M.S. in Electrical and Computer Engineering from University of California, Santa Barbara, and a J.D. from The George Washington University Law School.

United States

Michael Jones

Member

Rothwell Figg

Gity Samadi

Director, R&D Programs

SEMI

Best Practices for Semiconductor Patent Portfolio Management

Flexible Electronics Master Class #23

United States

Dan Trojan

CEO

Axus Technology

Catherine Bullock

Director Process Technology

Axus Technology

Silicon Carbide (SiC) is revolutionizing the semiconductor industry, enabling the development of advanced technologies across AI, MEMS, sensors, automotive, and semiconductor sectors. As a next-generation material, SiC offers advantages that silicon cannot match. However, processing SiC is challenging and expensive. Leading CMP semiconductor manufacturers still rely on outdated technology and inefficient processes, resulting in high costs which hinder innovation. To address these challenges, Axus Technology is hosting a webinar on SiC to introduce its modern, flexible CMP technology and solutions for efficient SiC processing. 

United States

Michael Doescher

NXP

Manibarsha Goswami

DuPont

Wojtek Osowiecki

Lam Research

Justin Harris

SEMI / Climate Equity Collaborative

Join this webinar to find out how companies across the semiconductor value chain are prioritizing employee-driven climate action and social impact,. Hear how employee-driven initiatives are enhancing sustainability and equity -- and gain ideas on how you and your organization might benefit.

With the Paris Climate Agreement and growing awareness of the climate crisis, many people are asking "how can I contribute in my private and professional life?"  

This Employee Action Workshop, organized by the Climate Equity and Social Impact (CESI) workgroup of SEMI will focus on setting up sustainability-based employee groups within your company. How to engage speakers and attendees, and the resources that exist to help.  

We will show you how to create an in-house, bottom-up sustainability network and offer concrete ideas for action. Industry leaders will share their experiences and successes, providing valuable insights into volunteerism, ESG innovation, and impactful employee initiatives.

For anyone who wants to use your biggest multiplier - your workplace - to make a difference in Climate Change.

This webinar takes place 8:00 AM - 9:00 AM Pacific Time Zone

How to Start & Grow an Employee Action Group for Sustainability

A high quality patent can turn an innovation into a valuable business asset. Strategic drafting of patent applications and the management of the prosecution of the application around the world is essential to obtaining maximum value. Learn how to ensure your valuable innovation remains protected while avoiding common pitfalls, including losing rights through errors like public disclosure or incomplete protection.

ABOUT THE SPEAKER

Brian Rosenbloom, Partner, Rothwell Figg
With over two decades of experience in the intellectual property (IP) field and a strong technical background in the electrical and software arts, Rothwell Figg partner Brian Rosenbloom is an expert in patent prosecution, IP counseling, and patent litigation proceedings before the U.S. Patent and Trademark Office and in district courts across the country. Brian represents clients ranging from Fortune 100 companies to independent inventors, entrepreneurs, and emerging enterprises, and works with a broad range of technologies. Brian received a Bachelor’s degree in Electrical Engineering from Columbia University (Tau Beta Pi Engineering Honor Society, Eta Kappa Nu Electrical Engineering Honor Society), and worked as a software engineer at General Electric Information Services for several years. After working at GE, he pursued a law degree and received a J.D. from Georgetown University Law Center (cum laude).

United States

Brian S. Rosenbloom

Member

Rothwell Figg

Gity Samadi

Director, R&D Programs

SEMI

How to Protect Your Valuable IP in the Microelectronics Industry

Flexible Electronics Master Class #22