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Virtual

REGISTRATION

Registration

REGISTRATION

  • Early-bird Registration Close: 5 pm, Friday, May 13(KST)
  • Registration Fee
    • Early Bird (~ May 13)
      • SEMI Member: KRW 280,000
      • Non Member: KRW 330,000
    • Regular (After Early-bird-May 25)
      • SEMI Member/ Student : KRW 330,000
      • Non Member: KRW 380,000
Registration
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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Translation(Korean subtitles) will be provided only for Keynote presentations.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live-streamed on Afternoon, Wednesday, May 18(KST).
  • On-demand Session will be provided 24/7 during the event period(May 18-31)

 


 

CONTACT

South Korea

Live Session- May 18(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
1_Jae Hyun Kim.png
Jaehyun Kim
Fellow/ Material Development, Future Tech R&D Center,
SK hynix

[Collaboration] ESG & EUV

2:35 pm - 3:05 pm
2_Youn Joung Cho.jpg
Youn Joung Cho
Master of Material Development Team,
Samsung Electronics

[Collaboration] Challenges and Opportunities of Materials for Next Generation Semiconductors

On-demand Session- 24/7, May 18(Wed)-31(Tue)

K1_Christoph Adelmann
Christoph Adelmann
Scientific Director,
imec

[Keynote] Materials Aspects in Advanced Logic and Memory Technology

K2_Christophe Fouquet_Photo
Christophe Fouquet
Member of ASML Board of Management, EVP EUV,
ASML

[Keynote] Extending Lithography into the next decade with EUV 0.55 NA.

K3_Dan Hutcheson
G. Dan Hutcheson
Vice Chair,
TechInsights

[Keynote] New Challenges = Greater Opportunities - Semiconductor Industry Macro Trends

S1-1_Jae Hwan Sim
Jae Hwan Sim
R&D Manager,
DuPont Electronics & Industrial, Korea Technology Center

[Advanced Patterning] Thin Organic Underlayers for EUV Lithography

S1-3_Rich Wise.jpg
Rich Wise
Vice President, Dry Photoresist Products,
Lam Research

[Advanced Patterning] Defect free EUV Patterning with Dry Photoresist System

S1-4_Ming Feng Li
Ming Feng Li
Senior Marketing director in Surfscan-ADE division,
KLA

[Advanced Patterning] Material Qualification through Inspection and Wafer Geometry Metrology

S1-5_HakJoo Lee
HakJoo Lee
Process Development Manager / Plasma ALD Nitride Process Division,
ASM

[Advanced Patterning] Selective Nitride Deposition by Plasma ALD

S2-1_Yichen Liang
Yichen Liang, Ph. D.
Scientist/Team Lead,
Brewer Science

[Emerging Materials] Application of Underlayers on Printing High Resolution Line/Space and Contact Hole Patterning Using Extreme Ultraviolet Lithography

S2-2_Bing Han_Photo_re
Bing Han
Executive Director and Global Marketing Head,
Thin Film Solutions | Electronics business of Merck KGaA, Darmstadt, Germany

[Emerging Materials] Material Development Through Collaboration

S2-3_Young Soo Park
Young Soo Park
Executive Vice President,
Soulbrain

[Emerging Materials] Building Materials for a Sustainable Semiconductor Business

blank
Ashutosh Misra
Group Vice President, Sustainable Development,
Air Liquide

[GWP (Global Warming Potential)] Novel Etch Gases with Low Global Warming Potential

S3-2_Hyeong-Kwan Kim
Hyeong-Kwan Kim
Senior Managing Director,
Global Standard Technology

[GWP (Global Warming Potential)] Reduction Technologies of GHGs Emission in Semiconductor Production

S4-1_Mark Thirsk.jpg
Mark Thirsk
Managing Partner,
Linx Consulting

[Market Trends] Materials Market Dynamics

S4-2_Shumin Wang
Shumin Wang
Chairman & CEO,
Anji Microelectronics Technology (Shanghai)

[Market Trends] Viewing of the SEMI Materials Ecosystem in China

S4-3_Lita Shon-Roy
Lita Shon-Roy
President / CEO,
TECHCET

[Market Trends] Impact of Chip Expansions on Semiconductor Supply Chains – Critical Materials

-

[NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.

 

Materials- The Next Big Thing 

In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts!

Off Add to Calendar 2022-05-18 00:00:00 2022-05-31 00:00:00 SMC Korea 2022 [NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.   Materials- The Next Big Thing  In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together. SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts! South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
Event format
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Place your business front and center at the SEMI Northeast & Pacific Northwest Forum Webinars. 

For more information please contact:
 Lin Tso | [email protected]

U.S. Semiconductor Industry Incentive Proposals

The CHIPS Act and FABS Act propose significant new incentives for semiconductor manufacturing in the United States. Both have advanced in Congress, but the legislative process remains unfinished while other countries are pursuing and implementing additional incentives. These incentives are essential to put the U.S. on a strong footing to compete for the next wave of new semiconductor manufacturing capacity, strengthen the supply chain in the U.S. and address shortages that have impacted countless downstream industries. It is also clear that the microelectronics industry doesn't only have a supply chain problem, but a significant workforce shortfall.  Diversifying and growing the talent pipeline will be critical to meet the growing demands of the industry.

Join leaders in Congress and industry experts to discuss:

  • CHIPS Act funding – where it stands and what it means for industry  
  • The FABS Act and federal tax incentives for U.S. semiconductor manufacturing
  • Supply Chain Challenges & Opportunities
  • Critical need and initiatives for diversifying and building a robust workforce

United States

WEDNESDAY, APRIL 20, 2022 | PACIFIC TIME

9:00 am
Anne Hao
GSM Technical Strategy, SEMI Pacific Northwest Co-Chair, Intel Corporation
Intel Corporation

Welcome & Introduction

9:05 am
Kimberly Ekmark
Director, Public Policy & Advocacy
SEMI

9:10 am
Charles E.Schumer, US Senator of NY
Charles E. Schumer (Video)
U.S. Senate Majority Leader
U.S. Senator of New York

KEYNOTE 1

9:15 am
Jon Cardinal, Director of Economic Development for U.S. Senate Democratic Leader Charles E. Schumer
Jon Cardinal
Director of Economic Development
for U.S. Senate Democratic Leader Charles E. Schumer
9:40 am
U.S. Senator Ron Wyden of Oregon
Ron Wyden (Video)
U.S. Senator of Oregon

KEYNOTE 2

9:50 am
Bobby Andres, Senior Policy Adviser, U.S. Senate Finance Committee, Majority Staff
Bobby Andres
Senior Policy Adviser, U.S. Senate Finance Committee
Ron Wyden Staff
10:15 am
Joe Pasetti, SEMI
Joe Pasetti
VP Global Public Policy & Advocacy
SEMI

Introductions—Panel Moderator

Industry Panelists from TSMC, Samsung, and Intel

10:20 am
Claire Sanderson, TSMC
Claire Sanderson
Senior Director, Global Government Affairs
TSMC
10:25 am
Holly Pataki
Head of Government Relations
Samsung Semiconductor

10:30 am
Erin Adrian, Intel
Erin Adrian
Head of Competition and Economic Affairs and Global Tax Policy
Intel Corporation
10:35 am

Industry Panelists Q&A (TSMC, Samsung, Intel) - Moderated by Joe Pasetti

10:50 am
Shari Liss, SEMI Foundation
Shari Liss
Executive Director
SEMI Foundation
11:05 am
Jeff Hanan
SEMI Northeast Chair, Principle Member of the Technical Staff
Globalfoundries

Closing Remarks

Presented by—
The SEMI Northeast & Pacific Northwest Chapters

 

9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 1
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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/new-gdsi-dicing-process-webinar-on-demand.html MSIG WEbinar tile Business Executive Technical Featured Speakers

About the Speaker:  Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.

United States

Richard Boardman GDSI
Richard Boardman
Senior Sales Engineer
GDSI

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. 

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .

8:00 am - 9:00 am Off Add to Calendar 2022-03-30 08:00:00 2022-03-30 09:00:00 MSIG Webinar GDSI Dicing Process Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.  In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications. The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting. Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. . United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

REGISTRATION

PRICING

  • Member: $49
  • Non-Member: $99

STUDENTS

  • Must have a valid Student ID.
  • Contact Michelle Fabiano, [email protected]
    for a student registration code.
United States REGISTER NOW Texas Forum Business
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Amkor Technology
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Valqua America

Workforce Shortage—Meeting Challenges for the Semiconductor Industry

As demand for semiconductors is increasing, foundries and other makers of chips are expanding their manufacturing capacities.  With new fabs that will bring thousands of new jobs to the US, Arizona and Texas are poised to gain many of those positions. Where will we find the talent to fill the upcoming surge of engineering and technical personnel needed to support our existing infrastructure, but also support the new fabs coming in just two-four years?  ​

The SEMI Arizona and Texas Chapters will explore this topic by hearing from Arizona and Texas-based leadership on the current market conditions, trends and outlook.  We will also hear from the semiconductor industry, experts from industry, universities/colleges and military who will provide insight into preparing a new workforce to meet our current workforce needs and needs of our not-to-distant future. ​

United States

WEDNESDAY, MAY 18, 2022 | CENTRAL TIME

12:00 pm

Welcome & Opening Remarks​

12:05 pm

The Workforce Supply Chain Crunch and Need for Workforce Development

12:20 pm
Edward Latson
Ed Latson
Founder & Executive Director
ARMA-Austin Regional Manufacturers Association

Where's the Funnel?

12:35 pm

What Makes Some Colleges Better at Building Semiconductor Talent Pipelines that Scale?

12:50 pm

Powerful Partnerships—Building a Pipeline Together

1:05 pm
Lisa Pivin, Intel Corporation
Lisa Pivin
Research Scientist
Intel Corporation

Intel Overview & Technical Opportunities

1:20 pm

It’s Time to Serve Those Who Served

1:35 pm

Preparing Warriors to Fill Key Corporate Positions

1:50 pm
Stacy Gardner
Stacy Gardner
Talent Acquisition
EMD Electronics

The Winning Side in the War for Talent—An Electronics Perspective

2:05 pm

Panel Discussion

2:25 pm

Closing Remarks

2:30 pm

Adjourn

Workforce Development

The SEMI Arizona & Texas Chapters Present
WORKFORCE SHORTAGE—Meeting Challenges for the Semiconductor Industry

12:00 pm - 2:30 pm Off Add to Calendar Disabled America/Chicago 2
Event format
GDSI logo

This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

GDSI logo
Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Contact

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

+
United States Register Now Silicon Valley Forum - Environmental Sustainability Business Executive
ASNA
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UCT

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley Virtual Forum.

Contact Shane Poblete, +1.202.847.5983 or Eric Rude, +408.943.7047 to learn about available sponsorship opportunities.

Environmental Sustainability—Semiconductor Industry Challenges

High demand for semiconductor chips is driving significant growth and increased visibility of the industry. At the same time, the world is becoming more environmentally conscious and the topic of sustainability of semiconductor manufacturing is coming to the forefront. This requires the entire semiconductor value chain to concurrently support this growing demand while minimizing waste, toxic chemicals and gas emission to produce these chips. 

Join us for a Virtual Webinar on March 18, 2022 as the SEMI Silicon Valley Chapter presents “Environmental Sustainability—Semiconductor Industry Challenges” for a great line-up of industry leaders from their own perspectives.

Topics include:

  • SEMI’s Sustainability Initiative 
  • Sustainability trends in the industry
  • Smart sustainable semiconductor chips 
  • Lowering utilities consumption, reducing carbon footprint 
  • Addressing chemicals and materials of concern 
  • Increasing fabrication/production energy efficiency 
  • Net Zero Strategy; multiple company perspectives 

 

United States

Virtual Forum | Friday, March 18, 2022 | Pacific Time

9:00 am - 9:05 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Welcome Remarks

9:05 am - 9:25 am
James Amano, SEMI
James Amano
Senior Director, Standards, EHS, and Sustainability
SEMI

Introduction to SEMI Sustainability Initiative

9:25 am - 9:45 am
Dean Freeman, Freeman Technology and Market Advisors
Dean Freeman
Chief Analyst
Freeman Technology and Market Advisors

Searching for Sustainability in the Microelectronics and AI World

9:45 am - 10:05 am
Andrew Byrnes, Micron Technology
Andrew Byrnes
Venture Capital, AI
Micron Technology

S3: Startups for Semiconductor Sustainability

10:05 am - 10:25 am
Chris Librie, Applied Materials
Chris Librie
Director, ESG
Applied Materials

Make Possible a Better Future ESG from OEM Perspective – Applied Materials

10:25 am - 10:45 am
Bill Seymour, Entegris
Bill Seymour
Vice President and Co-Chair of Corporate Social Responsibility (CSR) Council
Entegris

ESG Strategy from Materials Manufacturer's Perspective – Entegris

10:45 am - 11:05 am
Mark Patel, McKinsey & Co
Mark Patel
Senior Partner
McKinsey & Company

Decarbonization Priorities in the Semiconductor Value Chain

11:05 am - 11:25 am

Q&A - Moderated by James Amano

11:25 am - 11:30 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Closing Remarks

The SEMI Silicon Valley Chapter Presents:
ENVIRONMENTAL SUSTAINABILITY—Semiconductor Industry Challenges

9:00 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

China CSM forun Business Executive Expositions Technical

Traffic Reminder

Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)

  • Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
  • Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
Highlighted content

China

8:30 am - 9:00 am

Registration

9:00 am - 9:15 am

Opening Remark

9:15 am - 9:45 am
wang jiangbo
Jiangbo Wang
Vice President
HC SemiTek Corporation

Key Technologies for Mass Manufacturing of MicroLEDs

9:45 am - 10:15 am
Neng Zhang
Neng Zhang
Product Director
Sinopatt Technology Co.,Ltd.

Application and Developing Trend for Patterned Sapphire Substrate

10:15 am - 10:45 am
Qian Fan
Qian Fan
Vice President
Suzhou HanHua Semiconductor Co.,Ltd

Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

10:45 am - 11:15 am
Liang Wu
Jason Wu
CEO
Ultratrend Technologies Inc.

Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

11:15 am - 11:45 am
Yang Wang
Yang Wang
Vice Director
Songshan Lake Materials Laboratory

Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

11:45 am - 1:30 pm

Break

1:30 pm - 2:00 pm
Tiejun Zhou
Terry Zhou
GM
Vital Micro-Electronics Technology Co., Ltd

Processing and Application Prospectives of Large-Scale Compound Semiconductors

2:00 pm - 2:30 pm
Zhengwei Chen
Zhengwei Chen
GM
Beijing Ming Gallium Semiconductor Co., Ltd.

Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

2:30 pm - 3:00 pm
De'ang Liu
De'ang Liu
Scientist
ETARESEARCH

HVPE Growth of 4 Inch GaN Freestanding Wafer

3:00 pm - 3:30 pm
Kangfu Ma
Kangfu Ma
GMA
Shanxi Shuoke Crystal Co.,Ltd.

Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

3:30 pm - 4:00 pm
Yong Ji
Yong Ji
CEO
Guizhou Haotian Optoelectronics Technology Co.,Ltd.

Large Scale Deposition Technology of AlN and AlScN for SMR BAW

4:00 pm - 4:30 pm
Zhang Xing
Xing Zhang
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.

The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

Standards Workforce Development

Compound Semiconductor Materials Technology Forum

Time: TBD

Location:Dongguan, Guangdong, China

 

Event Contact information:

Cassie Li

SEMI China

Email: [email protected]

Phone: 86.21.6027.7645

 

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

8:30 am - 5:00 pm Off Add to Calendar Disabled
Event format