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Registration Details

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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About the Instructor

Dr. Toni Mattila is the Head of Sustainable Manufacturing at Business Finland, which is a governmental agency for R&D and innovation funding, business development and internationalization services. Toni leads a national business development program with the goal of transforming Finnish manufacturing industries towards sustainable development. Toni worked for fourteen years in academia as a researcher in the field of microelectronics. Toni is an active member of IEEE Electronics Packaging Society, and a frequent attendee of various electronics conferences.

United States

Tony Mattila
Toni T. Mattila
Head of Sustainable Manufacturing
Business Finland
FlexTech

This Master Class was held live on December 1, 2021.  It is still available On Demand.

Sustainability is more a way of thinking than a technological solution. To achieve sustainability, a company must develop a comprehensive approach that covers multiple levels and segments of its business.

Watch this course to develop an understanding of the essential components of industrial carbon footprint and discuss actions companies and industry can take to reduce theirs. Throughout the course, we paid particular attention to the electronics industry; what the sector has already contributed and what remains to be achieved.

The role of new technologies – e.g. FHE - was discussed and what role they play in reducing the carbon footprint so that ‘sustainability’ can become a sustainable business.

Watch this course to focus on a broader picture of sustainability in the electronics sector.

9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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Webinar - The Future of Work: Leading Remote Teams

Open to all.

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Webinar - The Future of Work: Leading Remote Teams
United States Save Your Seat https://discover.semi.org/computing-in-2040-ondemand.html A Look Into the Future: Computing in 2040 Executive Technical

Society has come to depend on the rapid, predictable, and affordable scaling of computing performance for consumer electronics, the rise of ‘big data’ and data centers, scientific discovery, and national security. The approaching end of lithographic scaling threatens to hinder continued health of the $2T electronics industry, impacting many related fields that depend on computing and electronics. By some projections, within a decade, the technological underpinnings for Moore’s Law will come to an end, as lithography gets down to atomic scale. At that point, it will not be feasible to create lithographically produced devices, with dimensions nearing atomic scale, where a dozen or fewer silicon atoms are present across critical device features and will therefore represent a practical limit for implementing logic gates for digital computing. In 2019, SEMI launched a special thought leadership initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.

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8:00 am
Ajit Manocha SEMI CEO 2021
Ajit Manocha
President and CEO
SEMI

Welcome Remarks and Speaker Introductions

8:07 am
Bettina Weiss Nov 2021
Bettina Weiss
Chief of Staff
SEMI

What are SEMI Think Tanks? Concept, Scope and Deliverables

8:12 am
Mukesh Khare
Mukesh Khare
Vice President: Hybrid Cloud
IBM

"It Takes a Village" Think Tank Leadership View on the Future of Computing

8:32 am
Jim Sexton
Jim Sexton
IBM Fellow; Department Group Manager, Data Centric Systems
IBM

Progress Report on Active and Planned Think Tank Workstreams

Jim Clarke
Jim Clarke
Director of Quantum Hardware
Intel

8:47 am

Q&A

8:55 am

Closing

SEMI

8:00 am - 9:00 am Off Add to Calendar 2021-12-01 08:00:00 2021-12-01 09:00:00 A Look Into the Future: Computing in 2040 United States SEMI.org [email protected] America/Los_Angeles public
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China

Standards Workforce Development

BIPV TASK FORCE MEETING

光伏建筑一体化（BIPV）屋顶抗风揭试验方法标准交流会

BIPV TASK FORCE MEETING

9:00 am - 5:30 pm Off Add to Calendar 2021-09-28 09:00:00 2021-09-28 17:30:00 BIPV TASK FORCE MEETING BIPV TASK FORCE MEETING 光伏建筑一体化（BIPV）屋顶抗风揭试验方法标准交流会 China SEMI.org [email protected] America/Los_Angeles public
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China

Standards Workforce Development

会议邀请：4H-SiC同质外延片工作组线上会议

4H-SiC Homoepitaxial Wafer Task Force Meeting 

 

Meeting：Link

Friday, September 17, 2021

10:00-11:30

10:00 am - 11:30 am Off Add to Calendar 2021-09-17 10:00:00 2021-09-17 11:30:00 4H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请：4H-SiC同质外延片工作组线上会议 4H-SiC Homoepitaxial Wafer Task Force Meeting    Meeting：Link Friday, September 17, 2021 10:00-11:30 China SEMI.org [email protected] America/Los_Angeles public
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REGISTRATION

Webinar

Complimentary for SEMI Members.

Use your corporate email address during login to be recognized as a SEMI Member.

$99 for Non-Members.

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Webinar
United States Save Your Seat EMG Shopify Image Technical

The semiconductor industry is expected to reach US$1 trillion by the end of the decade.  The next big technology revolutions (AI, 5G/6G, VR/AR, qubit computing, and more) are driving the need to manage exponential amounts of data. Everything from cars to coffee machines are generating data that needs to be moved, stored, computed, secured, and converted to end-user information. To make this a vision a reality requires innovation throughout the semiconductor industry, from new materials to new and improved process equipment to new device architectures designed to perform at speeds and densities once thought unachievable. In this webinar, we will hear from industry experts on what the 10-year technology trends look like and how semiconductor material and equipment suppliers are responding to the trends.  

Dr. Todd Younkin, President and CEO of Semiconductor Research Corporation (SRC) will discuss the evolving challenges and five “seismic shifts” that are driving advancement in the semiconductor industry.

Following Dr. Younkin’s talk, David Medeiros, Senior Director, CTO Office of Entegris, Inc. will address these challenges and describe how Entegris is driving materials innovation to overcome the obstacles faced by chip manufacturers.

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10:00 am - 10:03 am
Darron Jurajda Brewer Science
Darron Jurajda
Director, Semiconductor Business Operations
Brewer Science

Session Introduction

Biography: Darron Jurajda is the Director of Semiconductor Business Operations at Brewer Science. He is an expert in materials and process research for anti-reflective materials, multilayer materials, and processes for lithography. He has a diverse background including photolithography, chemical operations, and laboratory research. Darron has published in several technical proceedings and publications including SPIE, IEEE, and Solid State Technology. He has been a member of multiple SEMI Committees over the last 10 years. Darron holds a BS in chemical engineering from the University of Texas at Austin.

10:03 am - 10:25 am
Dr. Todd Younkin
Todd Younkin
President and CEO
Semiconductor Research Corporation (SRC)

Biography: Dr. Todd Younkin is a talented and seasoned executive with more than 20 years of experience in technology innovation. His extensive Research and Development experience spans Intel’s 0.18um to 5nm nodes with technical contributions in novel materials, nanotechnology, integration, advanced lithography, and integrated photonics. Most recently, he engineered, launched, and led all programmatic aspects of the five-year, $240 million JUMP research initiative. It has six multi-university, multi-disciplinary innovation Centers with 133 faculty, 835 students, and 360 industrial engineering liaisons. It emphasizes the advancement of Computer Science, Electrical Engineering, and Materials to secure continued U.S. thought leadership.

Todd brings a wealth of expertise with strengths in areas such as cultivating relationships with strategic partners, entrepreneurship and investment strategies, technology innovation, operational excellence, and talent management. He has spent much of his career working alongside young minds that are aspiring to influence the ever-changing world of smart and autonomous electronics. He has built programs from the ground up, leveraging his entrepreneurial leadership to drive new business development that has generated multi-millions in funding. He has been a key contributor in introducing new technology advances and starting new global research in the U.S., Europe, and Asia.
Dr. Younkin holds a Ph.D. from the California Institute of Technology in Pasadena, California. He completed his Bachelor of Science at the University of Florida in Gainesville, Florida. He aspires to continue to influence the next generation of technology and inventors, bringing ideas and investors together to drive heterogeneous electronic solutions that will deliver a smarter, shared future.

10:25 am - 10:45 am
Dave Medeiros
Dave Medeiros
Senior Director, CTO Office
Entegris

Biography: David Medeiros joined Entegris as a Senior Director of Engineering in the office of the CTO in April of 2021. His responsibilities involve developing an enterprise-wide lithography strategy, with a primary focus on the rapidly expanding field of EUV. Previously he spent six years at GLOBALFOUNDRIES (GF), first as the Senior Director of Patterning at Fab 8 in Malta, NY, and later as the Vice President of Central Engineering. Prior to GF, he spent seventeen years at IBM, starting as a Research Staff Member at T. J. Watson Research Center and culminating as the Director of Patterning R&D in the Microelectronics Division. His career began in the semiconductor industry as a synthetic chemist at Shipley Company, which is now part of DuPont. David holds a Ph.D. in Organic Chemistry from the University of Texas, Austin, where he was an Eastman Kodak fellow, and a B.S. in Chemistry from the University of Massachusetts, Amherst.

10:45 am - 10:55 am

Q&A with Audience Input

10:55 am - 11:00 am

EMG Overview & Wrap up

EMG

EMG Logo

10:00 am - 11:00 am Off Add to Calendar 2021-10-13 10:00:00 2021-10-13 11:00:00 Throwing the Kitchen Sink at IT - Innovations Driving towards a US$1 Trillion Semiconductor Industry United States SEMI.org [email protected] America/Los_Angeles public
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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public
Event format

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

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Course Outline

  1. Flexible hybrid electronics:  definition, design, and fabrication
  2. Challenges to interface hard and soft electronic components
  3. Introduction to the IEEE Heterogeneous Integration Roadmap (HIR)
  4. Overview of inks and encapsulants
  5. Printing methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing
  6. Electromechanical evaluation of printed interconnects
  7. Additive manufacturing of resistors and capacitors
  8. Highly stretchable conductors
  9. Interconnecting in the z direction - printed vias
  10. Printed RF devices and antennas
  11. Device and component placement and assembly
  12. Thinned semiconductor devices
  13. Approaches to bond devices and components to flexible substrates
  14. Concepts of operation and evaluation of performance and reliability
  15. Applications to medical and industrial sensors will be incorporated throughout

About the Instructor

Mark PoliksMark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 

His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. 

He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019.  He has authored over one hundred fifty technical papers and holds forty-eight US patents.   He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors. 

United States

EMG FlexTech Standards

This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.

This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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REGISTRATION

If you are SEMI Standards program member, please register here.

Registration
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Traffic Reminder

Venue: Xinhua Ballroom, 3F of HUALUXE Wuhu (No. 34 Changjiang South Road, Yijiang District, Wuhu City, Anhui Province)

  • Venue to Huhu Railway Station 8.5 miles, 20 minutes’ drive.
  • Venue to Wuhu Xuanzhou Airport 50 miles, 1 hour’ drives.
  • Venue to Nanjing Lukou International Airport 100 miles, 1.5 hours’ drive.
  • Venue to Hefei Xinqiao International Airport 180 miles, 3 hours’ drive.
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development

SEMI International Standards Program

HB-LED China TC Chapter Fall Meeting 2021

Wednesday, September 22, 2021

13:30-16:30

Wuhu, China

 

Agenda

13:00 – 13:30 Registration

13:30 – 13:50 Welcome

13:50 – 13:55 Review and Approval of Previous Meeting Minutes

13:55 – 14:00 SEMI Staff Report

14:00 – 14:15 Liaison Reports

14:15 – 15:00 Task Forces Reports

15:00 – 15:50 Documents Request for Ballots

15:50 – 16:20 New SNARFs Application

16:20 – 16:25 New Action Items

16:25 – 16:30 Next Meeting Date & Locale

Web Meeting link：Click here

 

Standards Contact information:

Isadora Jin

Manager, SEMI China

Email: [email protected]

Phone: 86.21.6027.8578

1:30 pm - 4:30 pm Off Add to Calendar 2021-09-22 13:30:00 2021-09-22 16:30:00 HB-LED China TC Chapter Fall Meeting 2021 SEMI International Standards Program HB-LED China TC Chapter Fall Meeting 2021 Wednesday, September 22, 2021 13:30-16:30 Wuhu, China   Agenda 13:00 – 13:30 Registration 13:30 – 13:50 Welcome 13:50 – 13:55 Review and Approval of Previous Meeting Minutes 13:55 – 14:00 SEMI Staff Report 14:00 – 14:15 Liaison Reports 14:15 – 15:00 Task Forces Reports 15:00 – 15:50 Documents Request for Ballots 15:50 – 16:20 New SNARFs Application 16:20 – 16:25 New Action Items 16:25 – 16:30 Next Meeting Date & Locale Web Meeting link：Click here   Standards Contact information: Isadora Jin Manager, SEMI China Email: [email protected] Phone: 86.21.6027.8578 China SEMI.org [email protected] America/Los_Angeles public
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China Business Executive Expositions Technical
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development

SEMI International Standards Program

Compound Semiconductor Technology Forum

 

Note: Forum language is mandarin, no simultaneous Interpretation provided

Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates

Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd

Thursday, September 23, 2021

16:30-17:00

Wuhu, Anhui, China

 

Webinar Link: Click here

 

Event Contact information:

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

4:15 pm - 4:35 pm Off Add to Calendar 2021-09-23 16:15:00 2021-09-23 16:35:00 Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates SEMI International Standards Program Compound Semiconductor Technology Forum   Note: Forum language is mandarin, no simultaneous Interpretation provided Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd Thursday, September 23, 2021 16:30-17:00 Wuhu, Anhui, China   Webinar Link: Click here   Event Contact information: Ein Wu SEMI China Email: [email protected] Phone: 86.21.6027.8509 China SEMI.org [email protected] America/Los_Angeles public
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