Two overarching business issues face the industry today – how to responsibly create sustainability strategies and how to find and train strong workers. Both issues are challenging management teams to think creatively and change fundamental processes of their business.
SEMI members are looking to SEMI to provide industry-wide guidance and support to share best practices, build grassroots processes, and guidebooks that both large and small companies can use to improve their efforts.
Attend this webinar to get an update and insights, with a special tilt toward the materials industry, on how you can incorporate SEMI guidebooks for hiring qualified and diverse DEI and Veterans hiring, as well as other efforts toward strengthening your workforce. On the Sustainability topic, hear how the industry is coming together to help each other in Scope 1,2, and 3 measuring and reporting mechanisms, and more!
Overcoming Worker Shortages and Enhancing Sustainability
10:00 am - 11:00 am
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America/Los_Angeles
Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.
The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.
With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.
About the Instructors
Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.
Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU). At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.
Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.
Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.
Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.
A New Approach to Robotics: Designing for Additive Manufacturing
Flexible Hybrid and Printed Electronics Master Class
10:00 am - 12:00 pm
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Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.
This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.
Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics. These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.
Example PFHE and printed energy materials topics:
Dispensing and 3D printing of electronic and energy materials
Aerosol printing
High resolution inkjet printing and coating
Screen Printing
Flexographic Printing
Gravure printing
Slot die coating
Convective, IR and photonic thermal processing
Microcontact printing and embossing
Submicron electrohydrodynamic printing
About the Instructor
J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW. Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities.
Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration. Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom. Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories.
Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.
This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand. See the full list.
The field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power. Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.
In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating. The instructor also addressed the latest materials and updates on supplementary thermal processing needs.
This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.
SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Silicon (Si) power devices have dominated power electronics due to their excellent starting material quality, ease of fabrication, low cost volume production, and proven reliability. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.
In this webinar, the favorable material properties of Silicon Carbide (SiC), which allow for highly efficient power devices with reduced form-factor and cooling requirements, will be outlined. High impact application opportunities, where SiC devices are displacing their incumbent Si counterparts, will be reported. Material and device fabrication aspects will be highlighted with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus specific to SiC. Fab models will be analyzed, and the vibrant U.S. SiC manufacturing infrastructure (that mirrors that of Si) will be presented.
View Previous Webinar in the SiC Series
Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
Webinar #3—Bidirectional SiC and GaN Switch Technology
Webinar #4—Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level
Dr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.
Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering
The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond.
During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.
He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.
Q&A will follow.
MSIG Webinar: MEMS & Sensors Packaging for Limitless Applications
Third in the Foundry, Dicing & Packaging Series
8:00 am - 9:00 am
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[NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).
In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this.
MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.
MEMS & Sensors Industry Forum 2022
June 29 (Wed) - July 8 (Fri) | Online
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Add to Calendar2022-06-29 00:00:002022-07-08 00:00:00MEMS & Sensors Industry Forum 2022[NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).
In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this.
MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.
Online South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
SMC Korea 2022
REGISTRATION
REGISTRATION
Early-bird Registration Close: 5 pm, Friday, May 13(KST)
[Emerging Materials] Application of Underlayers on Printing High Resolution Line/Space and Contact Hole Patterning Using Extreme Ultraviolet Lithography
[NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.
Materials- The Next Big Thing
In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts!
SMC (Strategic Materials Conference) Korea 2022
May 18-31, 2022 | Online
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Add to Calendar2022-05-18 00:00:002022-05-31 00:00:00SMC Korea 2022[NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.
Materials- The Next Big Thing
In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts!South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
The CHIPS Act and FABS Act propose significant new incentives for semiconductor manufacturing in the United States. Both have advanced in Congress, but the legislative process remains unfinished while other countries are pursuing and implementing additional incentives. These incentives are essential to put the U.S. on a strong footing to compete for the next wave of new semiconductor manufacturing capacity, strengthen the supply chain in the U.S. and address shortages that have impacted countless downstream industries. It is also clear that the microelectronics industry doesn't only have a supply chain problem, but a significant workforce shortfall. Diversifying and growing the talent pipeline will be critical to meet the growing demands of the industry.
Join leaders in Congress and industry experts to discuss:
CHIPS Act funding – where it stands and what it means for industry
The FABS Act and federal tax incentives for U.S. semiconductor manufacturing
Supply Chain Challenges & Opportunities
Critical need and initiatives for diversifying and building a robust workforce
About the Speaker: Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.
United States
Richard Boardman
Senior Sales Engineer
GDSI
Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.
The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.
Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .
MSIG Webinar: The New GDSI Dicing Process
March 30, 2002 8-9 AM PT
8:00 am - 9:00 am
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Add to Calendar2022-03-30 08:00:002022-03-30 09:00:00MSIG Webinar GDSI Dicing ProcessJoin us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.
The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.
Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Workforce Shortage—Meeting Challenges for the Semiconductor Industry
As demand for semiconductors is increasing, foundries and other makers of chips are expanding their manufacturing capacities. With new fabs that will bring thousands of new jobs to the US, Arizona and Texas are poised to gain many of those positions. Where will we find the talent to fill the upcoming surge of engineering and technical personnel needed to support our existing infrastructure, but also support the new fabs coming in just two-four years?
The SEMI Arizona and Texas Chapters will explore this topic by hearing from Arizona and Texas-based leadership on the current market conditions, trends and outlook. We will also hear from the semiconductor industry, experts from industry, universities/colleges and military who will provide insight into preparing a new workforce to meet our current workforce needs and needs of our not-to-distant future.
Dr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.
