Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
8:00 am - 9:30 am
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Add to Calendar2023-03-15 08:00:002023-03-15 09:30:00Silicon Wafer Surface Microroughness WorkshopSilicon Wafer Surface Microroughness Workshop
Date: Wednesday, March 15, 2023
Time: 08:00-09:30 AM Pacific
via Web Conference
AGENDA
(subject to change)
Last updated: Feb 23, 2023
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
United StatesSEMI.org[email protected]America/Los_Angelespublic
Contact
Kevin Nguyen
Manager, International Standards Operations
The passage of the CHIPs Act and the Inflation Reduction Act have created opportunities and challenges for the semiconductor industry supply chain. Join industry professionals as we discuss the implications of this legislation and how materials companies can make the most of it.
What's In it for Materials Companies?
CHIPs Act, Inflation Reduction Act, and Tax Incentives
10:00 am - 11:00 am
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The Fourth Industrial Revolution, or Industry 4.0, revolutionized automation monitoring, enhanced production efficiencies, and improved product quality. Industry 5.0 is the next industrial revolution coming to the forefront.
Industry 5.0 builds and adapts the components of Industry 4.0 (robotization, automation, IoT, connected machines, smart systems, data analytics, AI, ML) with a focus on sustainability, environmental, social, and well-being of the worker, and optimized human-robot interactions.
With the renewed interest in on-shoring manufacturing in the United States, this breakfast forum is a great opportunity to learn about Industry 5.0 and the ecosystem partners developing these future ideas.
Join the conversation on—
Market Trends, Forecast & Outlook
Industry 4.0 + Transition to 5.0—Challenges + Solutions
Digital Journey–AI/ML, Autonomous Solutions, Digital Twin, etc.
Supply Chain / Disruptions: Linear to Circular Economy and Localized Sourcing
Hosted by Analog Devices Presented by the SEMI Pacific Northwest Chapter
Smart Manufacturing—What Does a Smarter World Look Like With Industry 5.0?
SEMI Pacific Northwest Forum IN-PERSON & VIRTUAL EVENT
Pacific Time
8:00 am - 11:30 am
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Add to Calendar2023-05-12 08:00:002023-05-12 11:30:00[Pacific Northwest Forum] Smart Manufacturing—What Does a Smarter World Look Like With Industry 5.0?IN-PERSON AND VIRTUAL EVENT
Hosted by Analog Devices
Presented by the SEMI Pacific Northwest ChapterAnalog Devices—ADI OR United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Health and Safety
We Are Excited to Welcome You Back to the Pacific Northwest Forum
Your health and safety are our top priority. SEMI Americas (“SEMI”) monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.
SEMI will comply with and follow current facility and local government jurisdiction guidelines of the venue's location. The health and safety guidelines outlined below continue to evolve and will be updated as necessary to help support a safe experience for all attendees onsite.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
RELEASE AND WAIVER FORM
This was included in your online registration.
ADDITIONAL SAFETY PROTOCOLS
Please practice social distancing.
Wash and sanitize your hands frequently.
Avoid handshakes.
Wear your attendee badge at all times to indicate that you have gone through the health screening process.
SEMI is committed to upholding the health and safety standards outlined on this page. We will continue to monitor the guidance of public health authorities and government agencies going forward and will make appropriate adjustments in the future based on that guidance. Additional details about policies and procedures will be posted here as they are made available.
Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
SiC devices are displacing their incumbent Si counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting the last barriers to mass commercialization that include higher than Si device cost, relative lack of wafer planarity, the presence of defects like basal plane dislocations, reliability and ruggedness concerns, and the need for a workforce skilled in SiC power technology to keep up with the rising demand. To enable cost-effective manufacturing, high-yielding SiC fabrication in conventional Si fabs is desirable.
In this webinar, I will summarize key aspects of SiC fabrication technology and outline non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs. The SiC industry has successfully leveraged the Si fab infrastructure and has made the relatively small financial investments required to allow existing Si fabs to process SiC. Consequently, SiC chip fabrication in volume fabs alongside Si has emerged as a “cost reduction” model that exploits “silicon” manufacturing economies of scale. Today’s SiC fab infrastructure is vibrant, mirrors that of silicon, and is rapidly expanding.
View Previous Webinar in the SiC Series
Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
Webinar #3—Bidirectional SiC and GaN Switch Technology
Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
Join us online as we dive into SiC fabrication technology and non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs.
SiC—Silicon Carbide Webinar Series #2
Virtual Webinar #2
ON-DEMAND
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Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.
Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession
Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.
Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.
Speakers will discuss strategies for mitigating the impact and how to capture value.
Topics include:
Market Trends & Forecast & Outlook
Accessing Chips Act Funding and Roll out of Incentives
Geopolitical Impact
Advanced Packaging & Chiplets
Emerging and Expanding Markets
This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time
United States
Virtual Forum | Thursday, March 16, 2023 | Pacific Time
8:30 am
-
8:35 am
Joe Stockunas
President
SEMI Americas
Welcome Remarks
8:35 am
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8:55 am
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI
An Update on the CHIPS Act and How to Apply for Funding
Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.
Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.
Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.
Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.
Honors & Recognitions
Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
Named, Chambers USA, Intellectual Property (2021-2022)
Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end. A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.
How to Protect your patent
Flexible Electronics Master Class #14
10:00 am - 12:00 pm
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Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
FHE Market Forecast & Review
Flexible Electronics Master Class #13
8:00 am - 9:00 am
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Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.
Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.
In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.
Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test.
MSIG Webinar: Ultra-sensitive, high bandwidth piezoelectric pressure sensors
First in the Innovative Sensors Webinar Series
8:00 am - 9:00 am
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Add to Calendar2022-09-21 00:00:002022-09-21 00:00:00SEMI-BDO Webinar - The Chips Act Has Passed: Now What?United StatesSEMI.org[email protected]America/Los_Angelespublic
As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation. The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions. Heterogeneous Integration is and will be the key technology direction going forward. This webinar will provide a heterogeneous integration overview and how material suppliers are responding to this dynamic technology environment.
Prepare for Heterogeneous Integration Disruption
10:00 am - 11:00 am
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