downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

Virtual

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

Belgium France Germany Ireland Italy United States Watch On-demand 800x800 MCFC12 1019 Business Executive Technical Featured Speakers
Highlighted content

Abstract/Description

Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.

The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.

With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.

About the Instructors

Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.

Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU).  At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.

United States

Dr. Robert MacCurdy
Dr. Robert MacCurdy
Asst. Professor of Mechanical Engineering
University of Colorado, Boulder
Greg Whiting
Greg Whiting, PhD.
Assoc. Professor
University of Colorado, Boulder
FlexTech

Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.  

Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.

Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Belgium France Germany United States Watch On Demand FTMC11 800x800 tile Business Executive Technical
Highlighted content

Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.

This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.

Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics.  These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.

Example PFHE and printed energy materials topics:

  • Dispensing and 3D printing of electronic and energy materials
  • Aerosol printing
  • High resolution inkjet printing and coating
  • Screen Printing
  • Flexographic Printing
  • Gravure printing
  • Slot die coating
  • Convective, IR and photonic thermal processing
  • Microcontact printing and embossing
  • Submicron electrohydrodynamic printing

About the Instructor

Devin MacKenzie

J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW.  Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. 

Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed  flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration.  Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom.  Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories.

Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.

This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand.  See the full list.

United States

FlexTech

The field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power.  Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.

In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating.  The instructor also addressed the latest materials and updates on supplementary thermal processing needs.

This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.

Off Add to Calendar Disabled
Event format

On-Demand Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #1 

United States Register Now Business Technical

SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon

Silicon (Si) power devices have dominated power electronics due to their excellent starting material quality, ease of fabrication, low cost volume production, and proven reliability. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

In this webinar, the favorable material properties of Silicon Carbide (SiC), which allow for highly efficient power devices with reduced form-factor and cooling requirements, will be outlined. High impact application opportunities, where SiC devices are displacing their incumbent Si counterparts, will be reported. Material and device fabrication aspects will be highlighted with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus specific to SiC. Fab models will be analyzed, and the vibrant U.S. SiC manufacturing infrastructure (that mirrors that of Si) will be presented.

 

View Previous Webinar in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker
 

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us as we dive into the special properties of silicon carbide (SiC) and how they're displacing their incumbent silicon counterparts. 

 

Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration Details

Attending this webinar is Free.

Belgium France Germany Ireland Italy United States Register Now Tile for MEMS FDP 3 Business Executive Technical

Sponsored by

ASE Logo byline
Featured Speakers

About the Speaker

Dr. Chris Huang ASEDr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.

Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering

United States

MSIG

The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond. 

During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.

He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.

Q&A will follow.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

Registration
  • Registration Close: 5 pm, Friday, June 24(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 250,000
    • Non-members: KRW 300,000
Registration
South Korea MSIF-Square-Banner.jpg Business Technical

SPONSOR

Amphenol.png    EVG.png    samyoung S&c.png

line_0.png

NOTICE

  • The agenda will be subject to change without notice.
    Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Online
South Korea

[Keynote]

David Bruno
Davide Bruno
Regional Vice President of Marketing & Application for AMS MEMS; Head of Smartphone Competence Center– China and APeC Regions
STMicroelectronics

ST Journey to The OnLife Era Where The Fusion of Technology and Life is Possible

Keynote_Pierre Delbos_Biography & Abstract.jpg
Pierre Delbos
Technology & Market Analyst,
Yole Développement

What Future Lies Ahead For Automotive MEMS & Sensors?

[S1. Fusion Sensor]

S1-1 Abstract_Biography_MSIF Korea 2022(Chung Dohyoung).
Dohyung Chung
Executive Advisor,
TDK InvenSense

Sensor Solutions for Robotics

S1-2_Silvio Graf.png
Silvio Graf
Senior R&D Engineer MEMS,
Sensirion

Solving Contamination for Environmental Sensors in a High-Volume Production

S1-3_Daniel Goehl_Biography & Abstract._0.jpg
Dan Goehl
Co-founder and Chief Business Officer,
Ultrasense System

Mechanical Buttons Out, Solid State Interfaces In: How MEMS and silicon integration is changing the way we interact with the vehicle

MIke housholder
Mike Housholder
VP Marketing & Business Development,
xMEMS

Reinventing Sound with MEMS Speakers

[S2. Sensor for Mobility]

S2-1_Junhwan Kim.jpg
Junhwan Kim
CEO,
StradVision

Production-ready deep-learning-based perception software on embedded SoC for ADAS and autonomous driving

S2-2_HoCheol Suh.jpg
HoCheol Seo
CTO,
Han-Mech Controls

The Trend of H2 Sensor in the FCEV

Joon-Hyuk Lee
Joon-Hyuk Lee
Senior Researcher,
Fire Insurers Laboratories Korea (FILK)

Thermal Runaway Behavior of Li-Ion Battery

[S3. Innovative Applications]

blank
Dohyun Kim
Co-CEO,
Vtouch

Introduction of Vtouch, Inc. and Spatial touch solution

S3-2_Jinhwan Jung_Biography & Abstract.png
Jinhwan Jung
Chief Research Officer (CRO),
Asleep

Essential Solutions for Sleep tech: Contactless Sleep Tracking

S3-3_Nara Won_Photo.jpg
Nara Won
Smart Radar System

The evolution of radar technology for ADAS, Industrial, and Smart City applications

S3-4_Brett Goldsmith_0.png
Brett Goldsmith
CTO,
Cardea

Moving from Sensors to Biosignal Processing Units

- MSIG

[NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).

 

In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this.
MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.
 

Off Add to Calendar 2022-06-29 00:00:00 2022-07-08 00:00:00 MEMS & Sensors Industry Forum 2022 [NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).   In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this. MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.   Online South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

REGISTRATION

Registration

REGISTRATION

  • Early-bird Registration Close: 5 pm, Friday, May 13(KST)
  • Registration Fee
    • Early Bird (~ May 13)
      • SEMI Member: KRW 280,000
      • Non Member: KRW 330,000
    • Regular (After Early-bird-May 25)
      • SEMI Member/ Student : KRW 330,000
      • Non Member: KRW 380,000
Registration
South Korea website-banner-square Business Technical

SPONSORS

Dongwoo_0.png Merck logoNK_0.png Wonik_0.pngDupont_0.png
Entergris_0.pngAIR_LIQUIDE (10)_0.jpg KC Tech.png Linx_0.png BrewerScienceLogo.jpg

 

NOTICE

  • The agenda will be subject to change without notice.
  • Translation(Korean subtitles) will be provided only for Keynote presentations.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live-streamed on Afternoon, Wednesday, May 18(KST).
  • On-demand Session will be provided 24/7 during the event period(May 18-31)

 


 

CONTACT

South Korea

Live Session- May 18(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
1_Jae Hyun Kim.png
Jaehyun Kim
Fellow/ Material Development, Future Tech R&D Center,
SK hynix

[Collaboration] ESG & EUV

2:35 pm - 3:05 pm
2_Youn Joung Cho.jpg
Youn Joung Cho
Master of Material Development Team,
Samsung Electronics

[Collaboration] Challenges and Opportunities of Materials for Next Generation Semiconductors

On-demand Session- 24/7, May 18(Wed)-31(Tue)

K1_Christoph Adelmann
Christoph Adelmann
Scientific Director,
imec

[Keynote] Materials Aspects in Advanced Logic and Memory Technology

K2_Christophe Fouquet_Photo
Christophe Fouquet
Member of ASML Board of Management, EVP EUV,
ASML

[Keynote] Extending Lithography into the next decade with EUV 0.55 NA.

K3_Dan Hutcheson
G. Dan Hutcheson
Vice Chair,
TechInsights

[Keynote] New Challenges = Greater Opportunities - Semiconductor Industry Macro Trends

S1-1_Jae Hwan Sim
Jae Hwan Sim
R&D Manager,
DuPont Electronics & Industrial, Korea Technology Center

[Advanced Patterning] Thin Organic Underlayers for EUV Lithography

S1-3_Rich Wise.jpg
Rich Wise
Vice President, Dry Photoresist Products,
Lam Research

[Advanced Patterning] Defect free EUV Patterning with Dry Photoresist System

S1-4_Ming Feng Li
Ming Feng Li
Senior Marketing director in Surfscan-ADE division,
KLA

[Advanced Patterning] Material Qualification through Inspection and Wafer Geometry Metrology

S1-5_HakJoo Lee
HakJoo Lee
Process Development Manager / Plasma ALD Nitride Process Division,
ASM

[Advanced Patterning] Selective Nitride Deposition by Plasma ALD

S2-1_Yichen Liang
Yichen Liang, Ph. D.
Scientist/Team Lead,
Brewer Science

[Emerging Materials] Application of Underlayers on Printing High Resolution Line/Space and Contact Hole Patterning Using Extreme Ultraviolet Lithography

S2-2_Bing Han_Photo_re
Bing Han
Executive Director and Global Marketing Head,
Thin Film Solutions | Electronics business of Merck KGaA, Darmstadt, Germany

[Emerging Materials] Material Development Through Collaboration

S2-3_Young Soo Park
Young Soo Park
Executive Vice President,
Soulbrain

[Emerging Materials] Building Materials for a Sustainable Semiconductor Business

blank
Ashutosh Misra
Group Vice President, Sustainable Development,
Air Liquide

[GWP (Global Warming Potential)] Novel Etch Gases with Low Global Warming Potential

S3-2_Hyeong-Kwan Kim
Hyeong-Kwan Kim
Senior Managing Director,
Global Standard Technology

[GWP (Global Warming Potential)] Reduction Technologies of GHGs Emission in Semiconductor Production

S4-1_Mark Thirsk.jpg
Mark Thirsk
Managing Partner,
Linx Consulting

[Market Trends] Materials Market Dynamics

S4-2_Shumin Wang
Shumin Wang
Chairman & CEO,
Anji Microelectronics Technology (Shanghai)

[Market Trends] Viewing of the SEMI Materials Ecosystem in China

S4-3_Lita Shon-Roy
Lita Shon-Roy
President / CEO,
TECHCET

[Market Trends] Impact of Chip Expansions on Semiconductor Supply Chains – Critical Materials

-

[NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.

 

Materials- The Next Big Thing 

In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts!

Off Add to Calendar 2022-05-18 00:00:00 2022-05-31 00:00:00 SMC Korea 2022 [NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.   Materials- The Next Big Thing  In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together. SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts! South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
Event format
Promote in calendar
Off
United States Register Now Incentive Bullseye_hi res Business
Edwards 170x65

Place your business front and center at the SEMI Northeast & Pacific Northwest Forum Webinars. 

For more information please contact:
 Lin Tso | [email protected]

U.S. Semiconductor Industry Incentive Proposals

The CHIPS Act and FABS Act propose significant new incentives for semiconductor manufacturing in the United States. Both have advanced in Congress, but the legislative process remains unfinished while other countries are pursuing and implementing additional incentives. These incentives are essential to put the U.S. on a strong footing to compete for the next wave of new semiconductor manufacturing capacity, strengthen the supply chain in the U.S. and address shortages that have impacted countless downstream industries. It is also clear that the microelectronics industry doesn't only have a supply chain problem, but a significant workforce shortfall.  Diversifying and growing the talent pipeline will be critical to meet the growing demands of the industry.

Join leaders in Congress and industry experts to discuss:

  • CHIPS Act funding – where it stands and what it means for industry  
  • The FABS Act and federal tax incentives for U.S. semiconductor manufacturing
  • Supply Chain Challenges & Opportunities
  • Critical need and initiatives for diversifying and building a robust workforce

United States

WEDNESDAY, APRIL 20, 2022 | PACIFIC TIME

9:00 am
Anne Hao
GSM Technical Strategy, SEMI Pacific Northwest Co-Chair, Intel Corporation
Intel Corporation

Welcome & Introduction

9:05 am
Kimberly Ekmark
Director, Public Policy & Advocacy
SEMI

9:10 am
Charles E.Schumer, US Senator of NY
Charles E. Schumer (Video)
U.S. Senate Majority Leader
U.S. Senator of New York

KEYNOTE 1

9:15 am
Jon Cardinal, Director of Economic Development for U.S. Senate Democratic Leader Charles E. Schumer
Jon Cardinal
Director of Economic Development
for U.S. Senate Democratic Leader Charles E. Schumer
9:40 am
U.S. Senator Ron Wyden of Oregon
Ron Wyden (Video)
U.S. Senator of Oregon

KEYNOTE 2

9:50 am
Bobby Andres, Senior Policy Adviser, U.S. Senate Finance Committee, Majority Staff
Bobby Andres
Senior Policy Adviser, U.S. Senate Finance Committee
Ron Wyden Staff
10:15 am
Joe Pasetti, SEMI
Joe Pasetti
VP Global Public Policy & Advocacy
SEMI

Introductions—Panel Moderator

Industry Panelists from TSMC, Samsung, and Intel

10:20 am
Claire Sanderson, TSMC
Claire Sanderson
Senior Director, Global Government Affairs
TSMC
10:25 am
Holly Pataki
Head of Government Relations
Samsung Semiconductor

10:30 am
Erin Adrian, Intel
Erin Adrian
Head of Competition and Economic Affairs and Global Tax Policy
Intel Corporation
10:35 am

Industry Panelists Q&A (TSMC, Samsung, Intel) - Moderated by Joe Pasetti

10:50 am
Shari Liss, SEMI Foundation
Shari Liss
Executive Director
SEMI Foundation
11:05 am
Jeff Hanan
SEMI Northeast Chair, Principle Member of the Technical Staff
Globalfoundries

Closing Remarks

Presented by
The SEMI Northeast & Pacific Northwest Chapters

 

9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 1
Event format
Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/new-gdsi-dicing-process-webinar-on-demand.html MSIG WEbinar tile Business Executive Technical Featured Speakers

About the Speaker:  Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.

United States

Richard Boardman GDSI
Richard Boardman
Senior Sales Engineer
GDSI

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. 

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .

8:00 am - 9:00 am Off Add to Calendar 2022-03-30 08:00:00 2022-03-30 09:00:00 MSIG Webinar GDSI Dicing Process Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.  In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications. The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting. Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. . United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

REGISTRATION

PRICING

  • Member: $49
  • Non-Member: $99

STUDENTS

  • Must have a valid Student ID.
  • Contact Michelle Fabiano, [email protected]
    for a student registration code.
+
United States REGISTER NOW Texas Forum Business
Advantest
Air_Water_Mach_no_tagline_170x65
Amkor Technology
Edwards 170x65
Kanken Logo 170x65
Valqua America

Workforce Shortage—Meeting Challenges for the Semiconductor Industry

As demand for semiconductors is increasing, foundries and other makers of chips are expanding their manufacturing capacities.  With new fabs that will bring thousands of new jobs to the US, Arizona and Texas are poised to gain many of those positions. Where will we find the talent to fill the upcoming surge of engineering and technical personnel needed to support our existing infrastructure, but also support the new fabs coming in just two-four years?  ​

The SEMI Arizona and Texas Chapters will explore this topic by hearing from Arizona and Texas-based leadership on the current market conditions, trends and outlook.  We will also hear from the semiconductor industry, experts from industry, universities/colleges and military who will provide insight into preparing a new workforce to meet our current workforce needs and needs of our not-to-distant future. ​

United States

WEDNESDAY, MAY 18, 2022 | CENTRAL TIME

12:00 pm

Welcome & Opening Remarks​

12:05 pm

The Workforce Supply Chain Crunch and Need for Workforce Development

12:20 pm
Edward Latson
Ed Latson
Founder & Executive Director
ARMA-Austin Regional Manufacturers Association

Where's the Funnel?

12:35 pm

What Makes Some Colleges Better at Building Semiconductor Talent Pipelines that Scale?

12:50 pm

Powerful Partnerships—Building a Pipeline Together

1:05 pm
Lisa Pivin, Intel Corporation
Lisa Pivin
Research Scientist
Intel Corporation

Intel Overview & Technical Opportunities

1:20 pm

It’s Time to Serve Those Who Served

1:35 pm

Preparing Warriors to Fill Key Corporate Positions

1:50 pm
Stacy Gardner
Stacy Gardner
Talent Acquisition
EMD Electronics

The Winning Side in the War for Talent—An Electronics Perspective

2:05 pm

Panel Discussion

2:25 pm

Closing Remarks

2:30 pm

Adjourn

Workforce Development

The SEMI Arizona & Texas Chapters Present
WORKFORCE SHORTAGEMeeting Challenges for the Semiconductor Industry

12:00 pm - 2:30 pm Off Add to Calendar Disabled America/Chicago 2
Event format
GDSI logo

This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

GDSI logo
Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format