downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

Virtual

Registration is free

Belgium France Germany Ireland Italy Japan South Korea United States ESDA_Thumbnail Image Business Executive
Highlighted content

United States

Moderator

9:00 am
Raj Gautam Dutta, CEO, Silicon Assurance
Moderator
Raj Gautam Dutta
CEO
Silicon Assurance

Panelists

Serge Leef
Serge Leef
Head of Secure Microelectronics
Microsoft
Swarup Bhunia, Semmoto Endowed Professor and Director of Warren B. Nelms Institute
Swarup Bhunia
Semmoto Endowed Professor and Director
Warren B. Nelms Institute
Salman Nasir
Salman Nasir
Sr. Technical Program Manager
Battelle
John Hallman
John Hallman
Digital Verification Technology Solutions Manager
Siemens EDA
Steve Carlson
Steve Carlson
Director/Solutions Architect, Aerospace and Defense Solutions
Cadence Design Systems
Ming Zhang
MIng Zhang
VP of R&D Acceleration
PDF Solutions
EMG

Many semiconductor-based systems are moving toward 2.5D and 3D designs consisting of different pre-manufactured chips (chiplets) that perform specific functions. These are often provided by multiple vendors and are typically interconnected using an interposer. However, unlike monolithic multi-function chips, chiplets can be developed anywhere and at any process node. As such, chiplets from untrusted vendors can be unreliable or malicious. Third parties can reverse engineer, overproduce, or steal the IP of chiplets. Consequently, they raise new security challenges for an industry still figuring out ways to effectively mitigate hardware security threats to monolithic chips.

The webinar will focus on the potential threats that occur at the different stages of bringing chiplets to life, including design, assembly, and testing. The panelists will assess current safeguards to mitigate these risks and discuss open challenges for industry and academia.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
Event format

Registration for this course is free.

For questions, please contact Paul Trio at [email protected]. 

+
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMS course Ad tile Business Executive

Electromagnetic Interference and Electrical Overstress Management: Why, What, and How

Electromagnetic interference (EMI) is becoming more critical in all aspects of semiconductor manufacturing, affecting productivity and yield.  

The SEMI E176 Standard, "Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment," addresses this issue. This document provides practical, actionable guidance on establishing an acceptable EMI environment in semiconductor processes: from assessing the EMI environment to EMI mitigation to verification. SEMI E176 sets recommended EMI limits for different process categories. The Standard can benefit every stage of the semiconductor process and electronic assembly.  
 

Who Should Attend:

  • Semiconductor Device Manufacturers
    • Manufacturing and Quality Directors
    • Department and Production Managers
    • Line Supervisors
    • Sales: VP and Managers
  • Equipment Manufacturers
    • Director-Level and VP Engineering and QA
    • Engineering Department Managers
    • Sales: VP and Managers (customer satisfaction)

 

Meet the Instructor

Vladimir Kraz

 

 

 

 

 

Vladimir Kraz, President, OnFILTER

Biography

 

 

SEMI HQ
CA
United States

1. Overview of SEMI and SEMI Standards
- SEMI as a resource for your company

2. EMI and EMC - an overview

3. Effect of EMI on processes and equipment
- EMI and Electrical Overstress
- Equipment precision
- Process variations
- Other problems

4. Sources and propagation of EMI

5. Overview of SEMI E.33
- Emphasis on Table 1: Compliance Assignment/Responsibility Table

6. Overview of SEMI E.176

7. Basics of a viable EMI program at a factory based on SEMI E.176
- Purpose
- Structure
- Resources and budget
- Similarity and synergy with already-existing ESD program

Standards

Join us for a hybrid experience with both in-person and virtual attendance options.

4:00 pm - 5:00 pm Off Add to Calendar 2023-12-18 16:00:00 2023-12-18 17:00:00 EMI and EOS Management Course Join us for a hybrid experience with both in-person and virtual attendance options. SEMI HQ CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register now
Event format

Registration

Registration is free 

United States Leveraging the CHIPS Act Thumbnail Business Executive

Leveraging the CHIPS Act in the Silicon Heartland: Ohio Semiconductor Industry Initiatives

SEMI has invited key stakeholders from Ohio to discuss state initiatives that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. Webinar participants will learn why Ohio is a premier location for semiconductor operations and what government initiatives are available to strategically complement competitive CHIPS proposals. JobsOhio, the state’s unique private economic development corporation, acts as a catalyst for high-growth business investments and job creation that are helping propel the state’s ingenuity and ambitions forward.

 

Meet the Speakers 

 

Joe Stockunas

 

Joe Stockunas
President
  SEMI Americas

 

David Brewster

 

David Brewster
Managing Director, Technology Sector
 JobsOhio

 Biography 

 

Michael GOBiz

 

Justin Badlam
Knowledge Expert
 McKinsey & Company

 Biography 

 

Co-sponsored by 

                        

semi logo

                                    JobsOhio                                    Ohio logo

 

This Virtual Forum is 1:00–2:00pm Eastern Time

United States

Co-sponsored by SEMI, JobsOhio and the State of Ohio

 

1:00 pm - 2:00 pm Off Add to Calendar Disabled America/New_York 2 Register Now
Event format

Registration

Registration for this workshop is free.

For questions, please contact Mayura Padmanabhan at [email protected].

 

+
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Cybersecurity workshop new location Business Executive Technical
Highlighted content

SEMI Cybersecurity Launch Workshop

Join us for a 2-day working session to align our industry on concrete next steps to secure semiconductor manufacturing against an ever-evolving threat environment. With our complex and interconnected supply chains, no single company can be safe unless all companies are safe. Our consortium of device makers, foundries, equipment makers, component suppliers, and software suppliers are working together to rapidly develop a practical plan to improve security now, and for years to come while minimizing costs and avoiding duplication.

 

Who should attend:

• Device makers • Foundries • Tool suppliers • Component makers • Software suppliers ​and CISOs • Executives • Decision-makers • Managers • Security professionals

Intel - SC12 - Santa Clara 12
CA
United States

Day 1: December 6, 2023 - Noon - 7 pm PT

12:00 pm - 7:00 pm

• Consortia governance, structure, deliverables, and roadmap for 2024
• E187 SEMI Standard implementation ideation session
• Develop a method to survey, evaluate, and certify manufacturing equipment cybersecurity protections
• Globalization of SEMI Taiwan’s E187 reference architecture and checklist

Day 2: December 7, 2023 - 8 am - 3 pm PT

8:00 am - 3:00 pm

• Opportunities for collaboration and information sharing for cyber threats and incidents
• Supply Chain Cybersecurity working session
• Create a semiconductor industry-specific framework to measure security and implementation approach across the entire ecosystem
• Review NIST industry profiles and evaluate for suitability in semiconductor
• Next steps: Including forming working groups and assigning leaders

- Standards

Join us for a 2-day workshop aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.

Time:

Day 1: Noon - 7 pm PT

Day 2: 8 am – 3 pm PT

In-person registration has reached capacity. However, you can still register to participate online.

 

Off Add to Calendar Disabled America/Los_Angeles Register now
Event format
United States Mesoline Webinar Graphic Business Technical

United States

MSIG

Introduction to Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

Mesoline’s Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process where a polymeric stamp is used to transfer ink onto a substrate. This novel microfabrication technology offers ultra-small and reproducible micro features fabricated with extensive parallelization and high scalability. Unique process features include: (1) full wafers patterning in 15-minutes, (2) 1 to 50mm structures with up to 5/1 aspect ratios and 3) full 3D-control of the printed structures. Many different sensor applications of this technology will be introduced, including: (1) printing sensing electrodes for metal oxide gas sensors, (2)printing of getters for microbolometers, (3) printing of porous electrodes for biosensing applications and (4) accurate deposition of glass frit for advanced packaging applications.

8:00 am - 9:00 am Off Add to Calendar 2023-12-06 08:00:00 2023-12-06 09:00:00 Mesoline’s 3D Micro Printing Technology & Microchannel Particle Deposition Introduction to Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors Mesoline’s Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process where a polymeric stamp is used to transfer ink onto a substrate. This novel microfabrication technology offers ultra-small and reproducible micro features fabricated with extensive parallelization and high scalability. Unique process features include: (1) full wafers patterning in 15-minutes, (2) 1 to 50mm structures with up to 5/1 aspect ratios and 3) full 3D-control of the printed structures. Many different sensor applications of this technology will be introduced, including: (1) printing sensing electrodes for metal oxide gas sensors, (2)printing of getters for microbolometers, (3) printing of porous electrodes for biosensing applications and (4) accurate deposition of glass frit for advanced packaging applications. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso | Sr. Programs & Events Manager
[email protected]
T: +1 408-943-7920     
M: +1 510-921-1165  

+
United States Register Now 2023 Regional Forum - Semiconductor Outlook Business Executive
ASNA 170x65
DSV Global Transport and Logistics
SRP 170x65

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Arizona & Texas Virtual Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

ONSHORING AND SUPPLY CHAIN OPPORTUNITIES

In this dynamic online gathering, industry leaders, experts, and stakeholders come together to explore the burgeoning landscape of onshoring and supply chain development in the United States. This forum serves as a pivotal hub for insightful discussions about the immense potential of the United States to reshape the manufacturing and distribution sectors. 

Discover a wealth of knowledge from Alvarez & Marsal, DSV, EMD Electronics, Gartner, Huntsman, and Intel on:

  • Economic, infrastructural + regulatory factors
  • Rebalancing + expanding the supply chain
  • Investments that make the United States a prime destination for onshoring
  • And much more

Gain a comprehensive understanding of the advantageous attributes that draw businesses to establish and expand their operations in the US, including strategic geographic locations, advanced transportation networks, and access to skilled talent pools. 

Other topics will include the intricacies of supply chain optimization, risk mitigation, resilience-building strategies, and driving economic growth and sustainability through localized production and distribution networks. The reshaping of global supply chains, reducing dependency on foreign production, and enhancing end-to-end logistical efficiency will also be discussed. 

United States

WEBINAR | Wednesday, November 15, 2023

PT 9–10:30am | MT 10–11:30am | CT 11am–12:30pm | ET 12–1:30pm

9:00 am - 9:05 am
Makayla Dillon. Edwards Vacuum
Makayla Dillion
Talent Acquisition
Edwards Vacuum

Welcome Remarks

9:05 am - 9:10 am
Samantha Hay, DSV
Samantha Hay
Sales & Marketing Analyst
DSV

Overview of DSV: Global Transport and Logistics

9:10 am - 9:25 am
Chris Lanman_Alvarez & Marsal
Chris Lanman
Managing Director, Private Equity Performance Improvement
Alvarez & Marsal

Rebalancing the Semiconductor Supply Chain: Implications for a Resilient Ecosystem

9:25 am - 9:40 am
Cori Masters, GARTNER
Cori Masters
Sr. Director Research Analyst, Semiconductor/High Tech Supply Chain
Gartner

Semiconductor Resiliency: The Expanding Supply Network

9:40 am - 9:55 am
Cody Philpot
Cody Philpot
Sr. Director, Supply Chain Affordability and Strategic Programs in the Global Sourcing of Equipment and Materials
Intel Corporation

Supply Chain Resilience: Unlocking Opportunities

9:55 am - 10:10 am
Daniel Muscat_EMD
Daniel Muscat, PhD
Head of Strategic Supply Network
EMD Electronics

EMD Investments in the US and Growth Opportunities for the Industry

10:10 am - 10:25 am
Jay Henderson_Huntsman Performance Products
Jay Henderson
Global Marketing Manager
Huntsman Performance Products

Building a Strong Local Production of Upstream Chemicals for Semiconductor Materials

10:25 am - 10:30 am
Doug Woodul
Chair, SEMI Texas Chapter; President, Americas and Europe
Key Foundry

Closing Remarks + Key Foundry Onshoring Perspective

The SEMI Americas FALL OUTLOOK Webinar—

Discover a wealth of knowledge as speakers unveil insights into the economic, infrastructural, and regulatory factors for prime destinations for onshoring. 

9:00 am - 10:30 am Off Add to Calendar Disabled America/Los_Angeles 2
Event format
United States standards

United States

Standards

SEMI Silicon Wafer Roughness Workshop - AFM Workgroup

Location: Online (Contact staff for call-in information)

Agenda (Link)

Purpose:

  • Develop a SEMI standard protocol to align on AFM tool conditions and measurement parameters.
  • In the latest workgroup meeting (August 02, 2023), different requirements on AFM roughness measurements were discussed.
  • The points of discussion are collected in a “Questionnaire on AFM Roughness measurements.” This questionnaire shall be distributed to all participants to collect suggestions on AFM roughness measurement conditions. The feedback on the questionnaire will be discussed in a follow-up meeting.
  • Discuss on a possible questionnaire, the organization of response collection and general organizational topics of the AFM workgroup.
8:00 am - 9:00 am Off Add to Calendar 2023-09-27 08:00:00 2023-09-27 09:00:00 SEMI Silicon Wafer Roughness Online Workshop SEMI Silicon Wafer Roughness Workshop - AFM Workgroup Location: Online (Contact staff for call-in information) Agenda (Link) Purpose: Develop a SEMI standard protocol to align on AFM tool conditions and measurement parameters. In the latest workgroup meeting (August 02, 2023), different requirements on AFM roughness measurements were discussed. The points of discussion are collected in a “Questionnaire on AFM Roughness measurements.” This questionnaire shall be distributed to all participants to collect suggestions on AFM roughness measurement conditions. The feedback on the questionnaire will be discussed in a follow-up meeting. Discuss on a possible questionnaire, the organization of response collection and general organizational topics of the AFM workgroup. United States SEMI.org [email protected] America/Los_Angeles public

Contact

Kevin Nguyen
Manager, International Standards Operations
[email protected] 

Event format
United States standards

United States

Standards

Microlithography North America TC Chapter Meeting

Date: Tuesday, October 31, 2023

Time: 09:00-11:00 AM Pacific

via Web Conference

 

AGENDA (Click Here)

(subject to change)

Last updated: September 12, 2023

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

9:00 am - 11:00 am Off Add to Calendar 2023-10-31 09:00:00 2023-10-31 11:00:00 Microlithography North America TC Chapter Meeting Microlithography North America TC Chapter Meeting Date: Tuesday, October 31, 2023 Time: 09:00-11:00 AM Pacific via Web Conference   AGENDA (Click Here) (subject to change) Last updated: September 12, 2023   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! United States SEMI.org [email protected] America/Los_Angeles public

Contact

Kevin Nguyen
Manager, International Standards Operations
[email protected] 

Event format
United States Register for On-demand
Highlighted content

The CHIPS Act stipulates that semiconductor manufacturers requesting more than $150 million in direct funding under the CHIPS Act will need to submit plans for providing affordable, accessible, reliable and high-quality childcare for the workers who build and facilitate their fabs. The reasoning behind this is simple: without reliable childcare, parents cannot work. But designing and implementing a childcare plan requires a keen understanding of both the needs of workers and the landscape of childcare opportunities proximate to your company. Many resources and solutions are available on local, regional, and national levels. Join us to hear directly from the CHIPS office and representatives from local and national childcare providers about this issue and to participate in a robust Q&A session to help you shape your childcare strategy.

United States

11:00 am
Michelle Williams
Michelle Williams-Vaden
Deputy Director
SEMI Foundation

Welcome & CHIPS Act Application Support

11:05 am
Liat Krawczyk
Liat Krawczyk
Senior Advisor, Workforce & Childcare Strategy
CHIPS Office, U.S. Department of Commerce 
Jesse Stoneman round
Jessica Stoneman
Deputy Director, Public Engagement
CHIPS Office, U.S. Department of Commerce 
11:20 am
Alessandra Lezama Headshot Round
Alessandra Lezama
CEO
TOOTRiS Solutions

Innovative Strategies: How Real-Time Child Care is Powering the Semiconductor & Manufacturing Sectors

11:30 am
Jessica Chang
Jessica Chang
CEO and Co-Founder
Upwards (formerly WeeCare)

Technologically-driven Childcare Solutions

11:40 am
Tracey Carey
Tracey Carey
Executive Director
Midwest Urban Strategies

Local Workforce Development Solutions

11:45 am
Jeffrey Capizzano
Jeffrey Capizzano
CEO
Policy Equity Group

Matrix Tool for Determining Workforce Needs

11:50 am - 12:00 pm

Q&A

Workforce Development 11:00 am - 12:00 pm Off Add to Calendar 2023-09-19 11:00:00 2023-09-19 12:00:00 Childcare in the CHIPS ACT: Resources and Solutions United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

REGISTRATION

Registration is free.

United States ESDA Webinar - SEMI License Server Certification Protocol Business

SEMI License Server Certification Protocol

The SEMI Server Certification Protocol was developed to minimize the unauthorized use (piracy) of licensed software. Developed by a partnership of companies in the Electronic Design Automation (EDA) industry and managed by the Electronic System Design Alliance, a SEMI Technology Community, the protocol is applicable to many high-value software solutions. The protocol achieves this by being able to uniquely identify license servers – closing a loophole that is often exploited to enable unauthorized software use.

Later this year, SEMI will begin offering licenses to the protocol to companies wishing to strengthen their software license management systems against unauthorized usage. 

On Wednesday, September 27th, the ESD Alliance will be presenting a webinar on the protocol including:

  • How software piracy impacts both software vendors and their customers
  • An overview of how the protocol is used to prevent license server duplication
  • A description of the protocol and its scope
  • How the protocol can be integrated into a software license management system
  • Additional background on use cases and how the protocol can be applied in different environments

The webinar will be presented by the chair of the joint development team that developed the protocol and will include a Q&A session.

United States

Wednesday, September 27, 2023 | 10:00-11:30am Pacific Time

10:00 am - 10:15 am
Bob Smith
Bob Smith
Executive Director, ESDA,
SEMI

Welcome and Impact of Software Piracy

10:15 am - 11:00 am
Sashi Subramanian, Cadence
Chair, SEMI/ESDA License Management and Anti-Piracy Committee
Sashi Subramanian
Senior Group Director, Licensing, Downloads and Release Operations,
Cadence

Introduction to the SEMI Server Certification Protocol

11:00 am - 11:30 am

Q&A

ESD Alliance

Are you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you!

Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance.

10:00 am - 11:30 am Off Add to Calendar 2023-09-27 10:00:00 2023-09-27 11:30:00 SEMI License Server Certification Protocol Webinar Are you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you! Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
Event format