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United States

Standards

Microlithography North America TC Chapter Meeting

Date: Tuesday, April 23, 2024

Time: 09:00-11:00 AM Pacific

via Web Conference

 

AGENDA (Click Here)

(subject to change)

Last updated: March 15, 2024

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

9:00 am - 11:00 am Off Add to Calendar 2024-04-23 09:00:00 2024-04-23 11:00:00 Microlithography North America TC Chapter Meeting 2024 Microlithography North America TC Chapter MeetingDate: Tuesday, April 23, 2024Time: 09:00-11:00 AM Pacificvia Web Conference AGENDA (Click Here)(subject to change)Last updated: March 15, 2024 NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! United States SEMI.org [email protected] America/Los_Angeles public

Contact

Kevin Nguyen
Manager, International Standards Operations
[email protected] 

Event format
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam X Technical
Highlighted content

While silicon carbide (SiC) has long been known for its superior properties for power device manufacturing, economical high-volume production has been hard to achieve. Small substrates, high cost, and challenging manufacturing infrastructure have limited the reach of this enabling technology. With the advent of larger substrates, however, the outlook for SiC is ever brighter and, shall we say, more powerful?
From the building of these larger substrates to the development of equipment designed for SiC processing, the semiconductor industry has challenges ahead. In this webinar, we will explore these aspects of growing and maturing the SiC supply chain from the materials and equipment perspective.

United States

Rob circle
Robert Rhoades
President and CTO, X-trinsic;
Sr. Technology Analyst, TECHCET

Market Trends Perspective

David circle
David Kirsch
Vice President & General Manager, North America
EV Group

Implementation Perspective

EMG 10:00 am - 11:00 am Off Add to Calendar 2024-04-03 10:00:00 2024-04-03 11:00:00 Ready for Prime Time - the SiC Value Chain Prepares for Mass Adoption United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format
United States Register Pulsus webinar Business Technical Featured Speakers
Highlighted content

Arjen Janssens, Senior Director PLD, Lam Research Corporation

 

Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.

 

 

Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.

United States

arjen janssens
Dr. Arjen Janssens
MSIG

And yes, we’ve got a solution for that.

MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.

Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.

In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.

8:00 am - 9:00 am Off Add to Calendar 2024-03-27 08:00:00 2024-03-27 09:00:00 Enabling PiezoMEMS applications for today and tomorrow And yes, we’ve got a solution for that.MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition. United States SEMI.org [email protected] America/Los_Angeles public
Event format

Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #3.

Taylor Zhao
Manager, Programs & Committees
[email protected]

+
United States Register Now Business Technical

SiC—Silicon Carbide Webinar #3: Bidirectional SiC and GaN Switch Technology

There are numerous mass volume power applications where it is necessary to control the flow of bidirectional power, including electric vehicles (vehicle to grid, vehicle to home, and vehicle to vehicle), distributed and grid-tie power systems using regenerated energy and/or energy storage components, and solid-state circuit breaker protection. Silicon carbide (SiC) and gallium nitride (GaN) based bidirectional power switches can enable these applications with their compelling advantages of high efficiency, high blocking voltage capability, and low system weight and volume.  In particular, monolithic switches that allow for bidirectional symmetric conduction and voltage blocking with a chip area close to that of a similarly rated unidirectional switch are ideally suited to fuel a revolution in power electronics technology. Today, monolithic bidirectional (MBD) power semiconductor switches are not commercially available. Instead, back-to-back (anti-series) connection schemes of unidirectional power MOSFETs or IGBTs are typically used, resulting in a 4X penalty in chip area and high cost. However, various types of SiC and GaN bidirectional concepts are being investigated including bonded-wafer bidirectional IGBTs, monolithic dual-gate bidirectional GaN switches, and monolithic back-to-back connected SiC MOSFETs and JFETs.


In this presentation, the semiconductor technology of SiC and GaN bidirectional switches will be reviewed including their operating principles, and their lateral and vertical geometry configurations. The performance advantages of MBD switches will be highlighted. Promising MBD devices reported to date will be analyzed, and the key bidirectional switch applications of solid-state circuit breakers and current-source-inverters will be discussed. As SiC and GaN devices approach mass commercialization propelled by insertion in electric vehicles and consumer electronics, respectively, fabrication of SiC/GaN MBD switches is becoming economically viable enabling their wide adoption in key volume applications. 

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level 
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online for the third webinar in the Silicon Carbide Series as we review the semiconductor technology of SiC and GaN bidrectional switches, analyze promising MBD devices, and discuss the key bidrectional switch applications of solid-state circuit breakers and current-source-inverters. 

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1
Event format
Belgium France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_SURoadmap_v6@2x (1).png Business Featured Speakers
Highlighted content

SEMI University celebrates its first anniversary! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - Introduction and 2024 Roadmap." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings, new certifications, and courses offered by SEMI U in 2024.  

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's course catalog.  
  • Learn about the exciting live, in-person training courses scheduled for spring of 2024.  
  • Get insights into new certifications and courses designed to keep you ahead in the industry.  
  • Gain access to a special 10% discount on ALL courses.  

Choose your session:

United States

Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
Workforce Development

Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.

Off Add to Calendar 2024-03-19 00:00:00 2024-03-19 00:00:00 SEMI University - Introduction and 2024 Roadmap Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses. United States SEMI.org [email protected] America/Los_Angeles public
Event format

If you are an employer wanting to get involved, please contact: 

Melinda Gomez 

mgomez@semiorg

+
United States [email protected]
Highlighted content

This webinar will introduce members of the military community to the semiconductor industry and connect them directly with veterans and recruiters. Employers recognize and need this skilled and talented community to join as the industry prepares for huge growth in the next few years.  We will dive into the roles expected and qualifications needed to jump into an exciting new career. Opportunities nationwide!

 

About SEMI VetWorks


The SEMI VetWorks Initiative aims to address the microelectronics industry's need for attracting, developing, and retaining talent by tapping into the skills and experiences of military veterans and reservists. SEMI prioritizes connecting its members with this talented pool through initiatives that align industry hiring practices, internship, and apprenticeship programs. By leveraging existing training and credentialing opportunities, veterans gain access to well-paid technician and operator roles. The SEMI VetWorks Guidebook offers tools and recommendations for recruiting, hiring, and retaining veterans, while the SHRM Veterans at Work Certificate program provides additional resources for connecting with the military community.

United States

9:00 am - 9:30 am
Melinda Headshot Round
Melinda Gomez
Program Manager, Veteran Initiatives
SEMI Foundation

Industry Overview and Trends

9:30 am - 10:00 am

Panel of Veterans in the Industry

10:00 am - 10:30 am

Panel of Industry Needs

10:30 am - 11:00 am

Breakout rooms to network with employers

Workforce Development

Members of the Military Community, join us for an interactive and informative session about career opportunities in the semiconductor industry. Hear from employers and veterans in the industry directly!

9:00 am - 11:00 am Off Add to Calendar 2024-03-26 09:00:00 2024-03-26 11:00:00 SEMI VetWorks: Careers in Chips Members of the Military Community, join us for an interactive and informative session about career opportunities in the semiconductor industry. Hear from employers and veterans in the industry directly! United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-demand
Event format
United States Spectrochip tile Business Technical Featured Speakers

Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.

United States

dr. ko
Dr. Kevin (Cheng-Hao) Ko
MSIG

SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.

In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.

8:00 am - 9:00 am Off Add to Calendar 2024-02-21 08:00:00 2024-02-21 09:00:00 SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing Applications SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-demand
Event format
CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

CAST logo
United States 453x388_Homepage_Ad_tile_Spectro_3.png Technical
Highlighted content

Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers.  How can we standardize it and gain the efficiencies that standards brought to the frontend?  SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb.  This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.

United States

3:00 pm - 3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Opening Remarks

Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.

Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.

3:05 pm - 3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix

SECS/GEM

Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.

3:15 pm - 3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group

EDA/Interface A

Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.

3:25 pm - 3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments

RITdB

Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.

Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.

3:35 pm - 3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions

Traceability and E142

Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.

He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.

3:45 pm - 3:55 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Closing Remarks

CAST 3:00 pm - 4:00 pm Off Add to Calendar 2024-02-22 15:00:00 2024-02-22 16:00:00 Standardizing the Semiconductor Manufacturing Backend United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

Watch On-demand
Event format

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. All registrants will receive the presentation recording after the event.

Taylor Zhao
Email: [email protected]

+
United States Semiconductor Industry Outlook Thumbnail Business Executive
Taiyo Nippon Sanso
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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Industry Outlook 2026 

As we step into 2026, the semiconductor industry continues to evolve at an unprecedented pace, driven by technological innovation, global market dynamics, and shifting economic conditions. Join us for an engaging virtual forum where leading experts will share insights into the trends, challenges, and opportunities shaping the future of the semiconductor ecosystem.

Topics Include:

  • Key market and technology trends shaping the industry.
  • Expert forecasts for 2026 and beyond.
  • Geopolitical impacts.
  • Emerging and expanding markets

Don’t miss out—register now to secure your spot!
 

United States

Virtual Forum | Wednesday, March 4, 2026 | Pacific Time

8:30 am
Joe Stockunas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am
Luke Chang
Moderator
Luke Chang, PhD
Silicon Valley Chair; Program Director
SCREEN

Welcome Remarks

8:40 am
Duncan Meldrum, Headshot
Duncan Meldrum, PhD, CBE™
Business Economist
Hilltop Economics

Uncertainty and the Economic Outlook - Economic Growth and Semiconductors: Focus on the Risks

9:05 am
Scarlett Bickerton
Scarlett Bickerton
Manager, Federal & State Affairs
SEMI

SEMI Advocacy: Shaping the Policy Impacting Corporate Initiatives

9:30 am
Rebecca Routson
Rebecca Routson
Principal Director
CHIPS Metrology Program

CHIPS Metrology Program Update

9:55 am
Joe Gaustad, ClassOne
Joe Gaustad
Director of Product Development
ClassOne Technology

The New 300mm Customer

10:20 am
 Inna Skvortsova
Inna Skvortsova
Research Manager, Market Intelligence
SEMI

From AI Gold Rush to Fab Reality: Capacity, Fab Investments and Materials Outlook

10:45 am

Q&A

10:55 am
Sophia Rogalskyj_TEL
Sophia Rogalskyj
Etch Development Engineer and Northeast Chapter Co-Chair
NY Creates

Closing Remarks

8:30 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2 Register Now
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REGISTRATION

Registration is free.

Belgium France Germany Ireland Italy Japan South Korea United States REGISTER NOW EPA Thumbnail Image_NEW Business Executive

The webinar will feature senior leaders and other experts from EPA and provide SEMI members with an overview of EPA’s efforts under the PFAS Strategic Roadmap; the recently finalized reporting rules under the Toxic Substances Control Act (TSCA) and the Toxics Release Inventory (TRI) program; the review and management of new PFAS chemicals under the TSCA New Chemicals program; and an update on research and development activities, including analytical test methods development.  In addition to hearing directly from EPA officials on these important topics, participants will have an opportunity to ask questions at the end.  

United States

Welcome Remarks

1:00 pm
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Speakers

Michal Freedhoff, PhD, U.S. Environmental Protection Agency
Dr. Michal Freedhoff
Assistant Administrator, Office of Chemical Safety and Pollution Prevention
U.S. Environmental Protection Agency
Matt Klasen, U.S. Environmental Protection Agency
Matt Klasen
PFAS Council Manager
U.S. Environmental Protection Agency
Susan Burden, PhD, U.S. Environmental Protection Agency
Dr. Susan Burden
PFAS Executive Lead, Office of Research and Development
U.S. Environmental Protection Agency
Stephanie Griffin, U.S. Environmental Protection Agency
Stephanie Griffin
Team Lead, Data Collection Branch, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Shari Barash, U.S. Environmental Protection Agency
Shari Barash
Acting Director, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Tyler Lloyd, U.S. Environmental Protection Agency.jpg
Tyler Lloyd
Team Leader, Risk Management Branch 1, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
2:00 pm

Adjourn

Join us to learn more about several of the U.S. Environmental Protection Agency’s recent actions related to PFAS and their relevance to the semiconductor manufacturing industry.

1:00 pm - 2:00 pm Off Add to Calendar Disabled America/New_York
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