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Virtual

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Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Contact

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982

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United States Register Now Silicon Valley Forum - Environmental Sustainability Business Executive
ASNA
Edwards 170x65
UCT

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley Virtual Forum.

Contact Shane Poblete, +1.202.847.5983 or Eric Rude, +408.943.7047 to learn about available sponsorship opportunities.

Environmental Sustainability—Semiconductor Industry Challenges

High demand for semiconductor chips is driving significant growth and increased visibility of the industry. At the same time, the world is becoming more environmentally conscious and the topic of sustainability of semiconductor manufacturing is coming to the forefront. This requires the entire semiconductor value chain to concurrently support this growing demand while minimizing waste, toxic chemicals and gas emission to produce these chips. 

Join us for a Virtual Webinar on March 18, 2022 as the SEMI Silicon Valley Chapter presents “Environmental Sustainability—Semiconductor Industry Challenges” for a great line-up of industry leaders from their own perspectives.

Topics include:

  • SEMI’s Sustainability Initiative 
  • Sustainability trends in the industry
  • Smart sustainable semiconductor chips 
  • Lowering utilities consumption, reducing carbon footprint 
  • Addressing chemicals and materials of concern 
  • Increasing fabrication/production energy efficiency 
  • Net Zero Strategy; multiple company perspectives 

 

United States

Virtual Forum | Friday, March 18, 2022 | Pacific Time

9:00 am - 9:05 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Welcome Remarks

9:05 am - 9:25 am
James Amano, SEMI
James Amano
Senior Director, Standards, EHS, and Sustainability
SEMI

Introduction to SEMI Sustainability Initiative

9:25 am - 9:45 am
Dean Freeman, Freeman Technology and Market Advisors
Dean Freeman
Chief Analyst
Freeman Technology and Market Advisors

Searching for Sustainability in the Microelectronics and AI World

9:45 am - 10:05 am
Andrew Byrnes, Micron Technology
Andrew Byrnes
Venture Capital, AI
Micron Technology

S3: Startups for Semiconductor Sustainability

10:05 am - 10:25 am
Chris Librie, Applied Materials
Chris Librie
Director, ESG
Applied Materials

Make Possible a Better Future ESG from OEM Perspective – Applied Materials

10:25 am - 10:45 am
Bill Seymour, Entegris
Bill Seymour
Vice President and Co-Chair of Corporate Social Responsibility (CSR) Council
Entegris

ESG Strategy from Materials Manufacturer's Perspective – Entegris

10:45 am - 11:05 am
Mark Patel, McKinsey & Co
Mark Patel
Senior Partner
McKinsey & Company

Decarbonization Priorities in the Semiconductor Value Chain

11:05 am - 11:25 am

Q&A - Moderated by James Amano

11:25 am - 11:30 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Closing Remarks

The SEMI Silicon Valley Chapter Presents:
ENVIRONMENTAL SUSTAINABILITY—Semiconductor Industry Challenges

9:00 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

China CSM forun Business Executive Expositions Technical

Traffic Reminder

Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)

  • Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
  • Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
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China

8:30 am - 9:00 am

Registration

9:00 am - 9:15 am

Opening Remark

9:15 am - 9:45 am
wang jiangbo
Jiangbo Wang
Vice President
HC SemiTek Corporation

Key Technologies for Mass Manufacturing of MicroLEDs

9:45 am - 10:15 am
Neng Zhang
Neng Zhang
Product Director
Sinopatt Technology Co.,Ltd.

Application and Developing Trend for Patterned Sapphire Substrate

10:15 am - 10:45 am
Qian Fan
Qian Fan
Vice President
Suzhou HanHua Semiconductor Co.,Ltd

Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

10:45 am - 11:15 am
Liang Wu
Jason Wu
CEO
Ultratrend Technologies Inc.

Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

11:15 am - 11:45 am
Yang Wang
Yang Wang
Vice Director
Songshan Lake Materials Laboratory

Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

11:45 am - 1:30 pm

Break

1:30 pm - 2:00 pm
Tiejun Zhou
Terry Zhou
GM
Vital Micro-Electronics Technology Co., Ltd

Processing and Application Prospectives of Large-Scale Compound Semiconductors

2:00 pm - 2:30 pm
Zhengwei Chen
Zhengwei Chen
GM
Beijing Ming Gallium Semiconductor Co., Ltd.

Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

2:30 pm - 3:00 pm
De'ang Liu
De'ang Liu
Scientist
ETARESEARCH

HVPE Growth of 4 Inch GaN Freestanding Wafer

3:00 pm - 3:30 pm
Kangfu Ma
Kangfu Ma
GMA
Shanxi Shuoke Crystal Co.,Ltd.

Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

3:30 pm - 4:00 pm
Yong Ji
Yong Ji
CEO
Guizhou Haotian Optoelectronics Technology Co.,Ltd.

Large Scale Deposition Technology of AlN and AlScN for SMR BAW

4:00 pm - 4:30 pm
Zhang Xing
Xing Zhang
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.

The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

Standards Workforce Development

Compound Semiconductor Materials Technology Forum

Time: TBD

Location:Dongguan, Guangdong, China

 

Event Contact information:

Cassie Li

SEMI China

Email: [email protected]

Phone: 86.21.6027.7645

 

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

8:30 am - 5:00 pm Off Add to Calendar Disabled
Event format
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/zh/5 Business Executive Technical
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China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 CSTIC 中国国际半导体技术大会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/en/5 Business Executive Technical
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China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 China Semiconductor Technology International Conference (CSTIC) China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Business Executive Technical
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://china.semi.org.cn/article/175 Business Executive Technical
Highlighted content

China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles public
Event format

Registration Details

Members - FREE

    Register with your company email to receive the member price

Non-Members - $25

No Cancellations

Questions:  Contact Ayo Kajopaiye, [email protected]

Belgium France Germany Ireland Italy Russia United States Register Now SEMI SOIC logo Business Executive

Silicon on Insulator technology is a very diverse and multi-faceted enabler of semiconductor products.  In certain areas if offers performance advantages across a wide dynamic range of leakage and in other areas it enables the use of high voltages in multi-domain designs.  It also inherently bring low capacitance which makes it great for ultra-fast switching in RF designs and significantly improved radiation robustness compared to bulk CMOS; it’s easy to see why SOI technology continues to expand in use through-out the industry.

Attend this webinar to see how these advantages are being applied to products in the medical and automotive (and more) application spaces.

CA
United States

8:00 am - 8:10 am
Carlos Mazure
Carlos Mazure
SOI Consortium

Welcome and Introduction

8:10 am - 8:30 am
Jon Cheek
Jon Cheek
Sr. Director, Process Technology Development
NXP Semiconductor

SOI Technology: Enabling Everything from Automotive to 6G

Abstract – The use of Fully-Depleted SOI, FD-SOI, combined with an ultrathin buried oxide create a technology ideally suited for the Internet of Things revolution. FDSOI enables the dynamic modulation of the threshold voltage during operation, not just during the design phase, to open a whole new world of creative product opportunities. One such example is the creation of ultralow leakage embedded SRAM memories which consume so little power that some resulting IoT products can last years on a single household battery. Other versions of SOI Technology with thick buried oxide enable use of 50V to 70V domains on a chip without need of complex isolation schemes. This ability to provide high voltage support along with digital processing is yet another reason SOI is adopted to provided differentiation in product offerings. Each of these approaches will be discussed and shown how it benefits the final products.

8:30 am - 8:50 am
Giulio Ricotti ST
Giulio Ricotti
Design Director & Technical Staff Fellow
ST Microelectronics

BCBD-SOI Technologies and Applications in Ultrasound Imaging and More

Giulio Ricotti – Design Director and Technical Staff Company Fellow - STMicroelectronics

After earning his Electronics Engineering degree, Giulio joined ST in 1994 as a design engineer in their Smart Power (SP) products group. Currently a Design Director and Technical Staff Company Fellow, Giulio has more than 60 patents and has authored 70 publications. Giulio has also been awarded the “Premio dei Premi” in 2009 by the Italian president Giorgio Napolitano for his crucial contribution to innovation with the 4D ultrasound imaging project that is used today all over the world for pregnancy and cardiology screenings.

8:50 am - 9:00 am
Ayo Kajopaiye Pic
Ayo Kajopaiye & Carlos Mazure
SOI Consortium

Discussion & Q&A

FOA

Join us for the the first in a series of webinars focused on applications of SOI technology, brought to you by the SEMI SOI Consortium. The series will underline the breadth of products that SOI technologies cover.

The first webinar of the series will feature ST Microelectronics and NXP.  ST Microelectronics will focus on their BCD-SOI technologies and applications, such as medical ultrasound imaging. NXP will showcase multiple applications of SOI technologies in automotive from power electronics through infotainment.

 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format