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This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Registration

Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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Contact

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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United States Register Now Silicon Valley Forum - Environmental Sustainability Business Executive
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UCT

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley Virtual Forum.

Contact Shane Poblete, +1.202.847.5983 or Eric Rude, +408.943.7047 to learn about available sponsorship opportunities.

Environmental Sustainability—Semiconductor Industry Challenges

High demand for semiconductor chips is driving significant growth and increased visibility of the industry. At the same time, the world is becoming more environmentally conscious and the topic of sustainability of semiconductor manufacturing is coming to the forefront. This requires the entire semiconductor value chain to concurrently support this growing demand while minimizing waste, toxic chemicals and gas emission to produce these chips. 

Join us for a Virtual Webinar on March 18, 2022 as the SEMI Silicon Valley Chapter presents “Environmental Sustainability—Semiconductor Industry Challenges” for a great line-up of industry leaders from their own perspectives.

Topics include:

  • SEMI’s Sustainability Initiative 
  • Sustainability trends in the industry
  • Smart sustainable semiconductor chips 
  • Lowering utilities consumption, reducing carbon footprint 
  • Addressing chemicals and materials of concern 
  • Increasing fabrication/production energy efficiency 
  • Net Zero Strategy; multiple company perspectives 

 

United States

Virtual Forum | Friday, March 18, 2022 | Pacific Time

9:00 am - 9:05 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Welcome Remarks

9:05 am - 9:25 am
James Amano, SEMI
James Amano
Senior Director, Standards, EHS, and Sustainability
SEMI

Introduction to SEMI Sustainability Initiative

9:25 am - 9:45 am
Dean Freeman, Freeman Technology and Market Advisors
Dean Freeman
Chief Analyst
Freeman Technology and Market Advisors

Searching for Sustainability in the Microelectronics and AI World

9:45 am - 10:05 am
Andrew Byrnes, Micron Technology
Andrew Byrnes
Venture Capital, AI
Micron Technology

S3: Startups for Semiconductor Sustainability

10:05 am - 10:25 am
Chris Librie, Applied Materials
Chris Librie
Director, ESG
Applied Materials

Make Possible a Better Future ESG from OEM Perspective – Applied Materials

10:25 am - 10:45 am
Bill Seymour, Entegris
Bill Seymour
Vice President and Co-Chair of Corporate Social Responsibility (CSR) Council
Entegris

ESG Strategy from Materials Manufacturer's Perspective – Entegris

10:45 am - 11:05 am
Mark Patel, McKinsey & Co
Mark Patel
Senior Partner
McKinsey & Company

Decarbonization Priorities in the Semiconductor Value Chain

11:05 am - 11:25 am

Q&A - Moderated by James Amano

11:25 am - 11:30 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Closing Remarks

The SEMI Silicon Valley Chapter Presents:
ENVIRONMENTAL SUSTAINABILITY—Semiconductor Industry Challenges

9:00 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

China CSM forun Business Executive Expositions Technical

Traffic Reminder

Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)

  • Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
  • Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
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China

8:30 am - 9:00 am

Registration

9:00 am - 9:15 am

Opening Remark

9:15 am - 9:45 am
wang jiangbo
Jiangbo Wang
Vice President
HC SemiTek Corporation

Key Technologies for Mass Manufacturing of MicroLEDs

9:45 am - 10:15 am
Neng Zhang
Neng Zhang
Product Director
Sinopatt Technology Co.,Ltd.

Application and Developing Trend for Patterned Sapphire Substrate

10:15 am - 10:45 am
Qian Fan
Qian Fan
Vice President
Suzhou HanHua Semiconductor Co.,Ltd

Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

10:45 am - 11:15 am
Liang Wu
Jason Wu
CEO
Ultratrend Technologies Inc.

Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

11:15 am - 11:45 am
Yang Wang
Yang Wang
Vice Director
Songshan Lake Materials Laboratory

Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

11:45 am - 1:30 pm

Break

1:30 pm - 2:00 pm
Tiejun Zhou
Terry Zhou
GM
Vital Micro-Electronics Technology Co., Ltd

Processing and Application Prospectives of Large-Scale Compound Semiconductors

2:00 pm - 2:30 pm
Zhengwei Chen
Zhengwei Chen
GM
Beijing Ming Gallium Semiconductor Co., Ltd.

Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

2:30 pm - 3:00 pm
De'ang Liu
De'ang Liu
Scientist
ETARESEARCH

HVPE Growth of 4 Inch GaN Freestanding Wafer

3:00 pm - 3:30 pm
Kangfu Ma
Kangfu Ma
GMA
Shanxi Shuoke Crystal Co.,Ltd.

Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

3:30 pm - 4:00 pm
Yong Ji
Yong Ji
CEO
Guizhou Haotian Optoelectronics Technology Co.,Ltd.

Large Scale Deposition Technology of AlN and AlScN for SMR BAW

4:00 pm - 4:30 pm
Zhang Xing
Xing Zhang
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.

The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

Standards Workforce Development

Compound Semiconductor Materials Technology Forum

Time: TBD

Location:Dongguan, Guangdong, China

 

Event Contact information:

Cassie Li

SEMI China

Email: [email protected]

Phone: 86.21.6027.7645

 

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

8:30 am - 5:00 pm Off Add to Calendar Disabled
Event format
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/zh/5 Business Executive Technical
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China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 CSTIC 中国国际半导体技术大会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/en/5 Business Executive Technical
Highlighted content

China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 China Semiconductor Technology International Conference (CSTIC) China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Business Executive Technical
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://china.semi.org.cn/article/175 Business Executive Technical
Highlighted content

China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles public
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