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In the two-day event, leading manufacturing partners will show how application visions in manufacturing are implemented through concrete software solutions and considerations. You will experience first-hand the presentation of application case details from various industrial manufacturers and their ongoing collaboration with partner camLine.

In association with Elisa IndustrIQ, you will get first insights into camLine’s AI-driven manufacturing strategy. Development highlights of camLine’s sophisticated LineWorks Suite, InFrame Synapse, XperiDesk, and Cornerstone software products will also be presented for discussion. Several solution demo stations will be available in the foyer.

In the User Group Meetings, participants are given the opportunity to vote on the priorities of future product
developments.

Register now: https://www.camline.com/forum-registration/

Mobiveil and Avery Design Systems Extend Partnership to Accelerate Design and Verification of NVMe 2.0-Enabled SSD Development

SANTA CLARA, CALIF. –– August 2, 2022 –– Mobiveil, Inc. and Avery Design Systems today announced an expanded partnership to help customers accelerate NVMe-based SSD design and verification.

The complementary intellectual property/verification IP (IP/VIP) solution combines Mobiveil’s design IP for NVM Express, DDR4 and LDPC IP with Avery’s verification IP for NVMe, DDR4 and ONFI and NVMe virtual platform solutions. The two companies are also collaborating on SSD emulation platforms.

NVMe technology is the leading interface for SSDs with the potential for tremendous market growth worldwide. NVMe architecture is designed for future SSD development and form factors as the semiconductor industry enters a new era in hyperscale and enterprise computing that drives digital transformation.

“As the NVMe standard continues to evolve to meet new and changing requirements, it is important that product developers have access to design and verification solutions that allow them to take full advantage of the latest features and are complaint with the standard. Our NVMe VIP and virtual platform solutions provide pre-silicon SSD SoC hardware and system-level verification solutions for the latest NVMe 2.0 designs. Our partnership with Mobiveil means that together we can deliver best-in-class IP design and verification solutions to our customers including simulation, FPGA emulation, and virtual system platforms,” said Chris Browy, vice president of sales and marketing at Avery.

Mobiveil’s UNEX™ NVM Express Controller IP and Avery NVMe-Xactor supports the latest NVMe 2.0 specifications:
• Namespace Types support
• Simple copy command
• Zoned Namespace command set
• Key value (KV) command set
• 32b/64b CRC based End to End protection
• NVM Set and Endurance Group Management

In addition, Mobiveil’s ONFI/Toggle IP (EFC™) supports the latest ONFI 5.0 specifications. Both IP are fully verified using Avery Design’s NVMe/PCIe and ONFI VIP solutions.

Avery offers a complementary set of VIP for NVMe to ensure comprehensive verification and protocol and timing compliance. It includes a complete set of models, protocol checkers and compliance test suites in 100% native SystemVerilog and UVM. The support for virtual platform co-simulation enables full system-level verification including running UNH-IOL INTERACT™ and other Linux-based performance analysis applications on pre-silicon NVMe SoC designs.

“By providing pre-verified and interoperated SSD Design IP and Verification IP, both companies allow SoC design and verification teams to focus on their primary goal of full chip design and verification, thus significantly reducing their time to market,” said Ravi Thummarukudy, Mobiveil’s CEO. “By leveraging the intellectual property provided by these companies with specification-compliant solutions, designers can be assured of first-time success for their SoC designs”

At Flash Memory Summit
Mobiveil and Avery will exhibit at the 2022 Flash Memory Summit (FMS) that starts today, August 2, at the Santa Clara Convention Center. Mobiveil, a gold sponsor, will be in Booth #839 highlighting its broad portfolio of SIP and platforms for SSD development. Avery can be found in Booth #749.

FMS registration is open. Contact Mobiveil at [email protected] to arrange a meeting or demonstration.

About Mobiveil, Inc.
Mobiveil is a fast‐growing technology company that specializes in the development of Silicon Intellectual Property (SIP), platforms and solutions for storage, IoT and communications applications. It leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect SIP and custom and standard form factor hardware boards to leading semiconductor companies worldwide. For the SSD market, Mobiveil provides NVM Express Controller (UNEX™), Universal Memory Controller (UMMC™), ONFI/Toggle (EFC™) and LDPC IP blocks as well as a Xilinx- and Intel-based FPGA validation platforms. Mobiveil is headquartered in Milpitas, Calif., with engineering development centers located in Chennai, Bangalore and Hyderabad, India, and sales offices and representatives located in U.S., Europe, Israel, Japan, Taiwan and China.

Engage with Mobiveil at:
Website: www.mobiveil.com
Twitter: @Mobiveil
LinkedIn: https://www.linkedin.com/company-beta/2725746/
Facebook: https://www.facebook.com/Mobiveil

About Avery Design Systems
Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of formal analysis applications for gate-level X-pessimism verification and real X root cause and sequential backtracing; and robust core-through-chip-level Verification IP for PCI Express, CXL, CCIX, Gen-Z, USB, AMBA, UFS, MIPI CSI/DSI, I3C, DDR/LPDDR, HBM, ONFI/Toggle/NOR, NVM Express, SATA, AHCI, SAS, eMMC, SD/SDIO, CAN FD, and FlexRay standards. The company has established numerous Avery Design VIP partner program affiliations with leading IP suppliers. More information about the company may be found at https://www.avery-design.com

On-Demand Pricing

FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00

DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 2Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 3Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00

STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.

CONTACT
Mark da Silva
[email protected]

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Sponsorship Contact

[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

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2022 Organizing Committee

  • John Behnke | INFICON

  • Holland Smith | INFICON

  • Chan Pin Chong | KULICKE & SOFFA

  • Michael Arnold | PEER GROUP

  • Bobby Mitra | TEXAS INSTRUMENTS

  • James Lin | UMC

United States

TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT

SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition

7:00 am
Mark da Silva
Mark da Silva
SEMI

Opening Remarks

7:02 am
Ajit Manocha
SEMI

Conference Opening Remarks

7:15 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Keynote: Autonomous Smart Factory of the Future

7:35 am
Michael Arnold
Michael Arnold
PEER Group

Moderator Welcome

7:40 am
Praneetha Poloju
Praneetha Poloju
Chief Technologist
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization​

Bella Chan
Bella Chan
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization

8:05 am
Doug Suerich
Doug Suerich
PEER Group

End-to-End Smart Manufacturing: Using EDA to Advance the Backend ​

8:30 am
Fahad Golra
Dr. Fahad Golra
Research & Innovation Coordinator
Agileo Automation

Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry

8:55 am
Padmanabha Kannampalli
Padmanabha Kannampalli
Engineer
Teradyne

Data Connectivity in Semiconductor Test—Challenges

9:20 am
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards​

9:40 am
Michael Arnold
Michael Arnold
PEER Group

Closing Remarks

SESSION 2—Intelligent INSIGHTS: Current Point Systems

5:00 pm
James Lin, UMC
MODERATOR
James Lin
UMC

Welcome Remarks

5:05 pm
CS Tan
CS Tan
Group VP & General Manager
STMicroelectronics

Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED​

5:30 pm
John Foley
John Foley
Kulicke & Soffa

Big Data Analytics for Back-End Assembly Equipment​

5:55 pm
Bappaditya Dey
Bappaditya Dey
Senior R&D Engineer
imec

Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node

6:20 pm
Ivan Aduna
Ivan Aduna
KY Technology

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory​

6:45 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
AR Photonics

A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting ​

7:35 pm
James Lin
UMC

Closing Remarks

WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT

SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin

7:00 am
Holland Smith
MODERATOR
Holland Smith
Inficon

Welcome Remarks

7:05 am
Marc Engel
Marc Engel
Agileo Automation

How Existing Semiconductor Equipment Can Benefit From Digital Twins

7:30 am
Sarbajit Ghosal
Sarbajit Ghosal
SC Solutions

Development of Digital Twins for Manufacturing Applications

7:55 am
Basil Milton
Basil Milton
Kulicke & Soffa

Wire Bonding Digital Twin Enhancements for Smart Manufacturing

8:20 am
Shankar Ranganathan
Shankar Ranganathan
Associate General Manager R&D
HCL Technologies

Scalable Options to Support Semiconductor Capital Equipment's

8:45 am
Sriny Sundararajan
Sriny Sundararajan
CTO
Clip Automation

Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing

Vikrant Kahlir
Vikrant Kahlir
Vendia
9:10 am
Anuj Mahendrum
Anuj Mahendru
Global Director, Semiconductor and Hi-Tech Industries
Rockwell Automation

Cleanroom Redefined—Addressing the Wafer Transport Challenge

9:35 am
Holland Smith
Holland Smith
Inficon

Closing Remarks

SESSION 4—Intelligent PREDICT: AI/ML Solution Integration

5:00 pm
Chan Pin Chong
MODERATOR
Chan Pin Chong
Kulicke & Soffa

Welcome Remarks

5:05 pm
KEYNOTE | John Herlocker, PhD | TIGNIS
Jon Herlocker, PhD
CEO
Tignis

KEYNOTE: Empowering Process Engineers With Self-Service AI/ML

5:30 pm
Jasper van Heugten
Jasper van Heugten
minds.ai

An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning

5:55 pm
Jimmy Bramante
Jimmy Bramante
Inficon

Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data​

6:20 pm
Nikunj Mehta
Nikunj Mehta
Founder & CEO
Falkonry

Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI

6:45 pm
Erik Collart
Erik Collart
Global Product Manager SCADA
Edwards

Effective Use of Vacuum Assets Through Smart Manufacturing

7:10 pm
Yak Hua Khoo, ViTrox Technologies
Yak Hua Khoo
ViTrox Technologies

SMT Electronic Smart Close-Loop Prediction System​

7:30 pm
Chan Pin Chong
Chan Pin Chong
Kulicke & Soffa

Closing Remarks

THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT

SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control

7:00 am
Bobby Mitra
MODERATOR: Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Welcome Remarks

7:05 am
Christoph Koegler, Infineon
Christoph Koegler
Director Innovation, Digitalization & AI
Infineon

A Flood of Problems Drained—Fixing Valves the Smart Way​

7:30 am
Gautham Unni
Gautham Unni
AWS

AWS for Semiconductor Smart Manufacturing ​

7:55 am
Peter Lendermann
Peter Lendermann
Chief Business Development Officer
D-SIMLAB Technologies

Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production​

8:20 am
Ivy Qin
Ivy Qin
Senior Director of Engineering
Kulicke & Soffa

Road to Autonomous Wire Bonder

8:45 am
Matthew Putman
Matthew Putman
CEO
Nanotronics

Inspect, Correct, Protect

9:10 am
Christophe Curny
Christophe Curny
Soitec

Soitec 4.0 Journey​

9:35 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Closing Remarks

SESSION 6 — Foundational Topics

5:00 pm
John Behnke
MODERATOR
John Behnke
General Manager FPS Product Line
Inficon

Welcome Remarks

5:05 pm
Koen de Backer
Koen de Backer
Vice President Smart Manufacturing and Artificial Intelligence
Micron

KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals

5:30 pm
Ming Chang Wu
Ming-Chang (Bright) Wu
Hon Hai Research Institute, Foxconn

Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards​

5:55 pm
Jim Montgomery
Jim Montgomery
Principal Solution Architect
TXOne Networks

Is Wait-and-See a Good OT Security Strategy?

6:20 pm
Houng Sun
Dr. Houng Sun
Mirle

Advanced Automation for Smart Manufacturing​

6:45 pm
Andrew Seward, TEL
Andrew Seward
Field Solutions Product Marketing and Analytics Manager
TEL
David Gross, Siemens
Dave Gross
Portfolio Development Executive
Siemens

SEMI Smart Manufacturing Maturity Assessment Model 

7:10 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Conference Closing Discussion—Where do we go from here?​

Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

7:35 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Closing Remarks

- FOA ITL Standards

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Off Add to Calendar Disabled America/Los_Angeles 2
Event format

Kitchener, Ontario, July 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software for the semiconductor industry, is inviting software developers to register for a virtual hiring event happening on August 16, 2022, beginning at 4:00 p.m. ET.

The hiring event is part of the Kitchener-based software company’s planned growth strategy to add talented resources across all engineering departments to meet the demand for its software products and solutions. The openings are located at the company’s Toronto and Kitchener offices.

The two-hour drop-in event will provide attendees the opportunity to learn about the current openings and speak with PEER Group representatives, including members of the software development management team, several software developers, and the talent acquisition team.

“This is a great time to start a career in the semiconductor industry,” shares Mike Pryzmant, PEER Group’s Director of Engineering Services. “Our software teams do amazing work making sure the world’s largest semiconductor factories and tools are operating at their best. The challenges we face are complex, exciting, and always interesting.”

Scott McKee, PEER Group’s Talent Manager, along with members of his team, will be present to share details about working at PEER Group, including the hybrid work model, flex hours, comprehensive benefits plan, expert mentorship, personal development and career opportunities, profit sharing, and more.

“The way we designed this hiring event is to give jobseekers a forum to learn about anything they want to know about our culture, industry, or development projects,” says McKee. “We’ll have several team members, both technical and from the HR side, who will be able to provide in-depth answers to any questions prospective candidates may have.”

PEER Group has been having a banner year in 2022, which marks the company’s 30th year in business. In March, PEER Group was named a 2022 Intel EPIC Outstanding Supplier – one of only six companies out of more than 9,000 Intel suppliers to receive the recognition. Great Place to Work Canada named PEER Group one of Canada’s Best Workplaces for the 11th time. The company also opened a new 4,000 sq. ft. office in the heart of downtown Toronto.

Those interested in attending the hiring event can register by completing the form and uploading a resume using the link below. All attendees will be entered into a draw for a chance to win an Apple iPad.

PEER Group Hiring Event registration page: https://bit.ly/3zpZpiV .

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Rolla, Mo. – July 20, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is named a Greater St. Louis Top Workplace winner for 2022, marking the eighth consecutive year the company has received this recognition.

The St. Louis Dispatch published the list of 23 companies that were named a 2022 Top Workplace, with Brewer Science being the only manufacturing company on the list and the only company based in Rolla, MO.

Winners of the Top Workplaces are determined solely on employee feedback gathered through an employee engagement survey issued by Energage, a research company with more than 16 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

Brewer Science ranked above average in three culture drivers, thus earning a separate Culture Excellence Awards for Innovation, Work-Life Flexibility, and Compensation & Benefits, described by Energage as the following recognition:

Innovation:
The Innovation Top Workplaces award will celebrate organizations that have embedded innovation into their culture and create an environment where new ideas come from all employees.

Work-Life Flexibility:
The Work-Life Flexibility Top Workplaces award celebrates the organizations that provide options to their employees in how and where they work and have managers who care for their employees’ concerns.

Compensation & Benefits:
The Compensation & Benefits Top Workplaces awards celebrate the organizations that provide employees not only with material rewards but also with an appreciation for their work.

“Receiving the Innovation Culture Excellence Award by Top Workplaces exemplifies our employees’ commitment to providing the most innovative solutions in the industry,” states Dan Brewer, Executive VP Corporate Resources of Brewer Science. “It epitomizes our culture where everyone feels welcome to share their novel ideas, so we can transform those to practical implementation, bringing the most cutting-edge solutions to our customers.”

In addition to receiving the regional Greater St. Louis Top Workplace, Brewer Science was named a 2022 National Top Workplace, announced earlier this year.

Brewer Science is on the list of Top Five Manufacturing & Production Companies to Work for in the USA, published in March 2022, recognizing that amidst a national labor shortage and global supply chain crisis, companies with strong company cultures proved to be successful in retaining employees and mitigating risk to assist in building a more robust economy. The hire-to-retire development model emphasizes growth. Recently, a Printed Electronics Intern published an article on 3D Incites sharing his internship experiences at Brewer Science.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting their website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

About Energage
Making the world a better place to work together.™
Energage is a purpose-driven company that helps organizations turn employee feedback into useful business intelligence and credible employer recognition through Top Workplaces. Built on 14 years of culture research and the results from 23 million employees surveyed across more than 70,000 organizations, Energage delivers the most accurate competitive benchmark available. With access to a unique combination of patented analytic tools and expert guidance, Energage customers lead the competition with an engaged workforce and an opportunity to gain recognition for their people-first approach to culture. For more information or to nominate your organization, visit energage.com or topworkplaces.com.

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum“, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative LiDAR solutions for the industry.

LiDAR (light detection and ranging) technology is becoming the standard equipment in medium-end and high-end vehicles. In the next five years, the demand for automotive LiDAR in advanced driver assistance systems (ADAS) applications will grow at a compound annual growth rate (CAGR) of 94%. Compared to optical transceivers, automotive LiDAR needs to pass more stringent reliability verification, in which both the reliability of the photonic chips and their assembly technologies are critical. Assembling photonic chips with high reliability and zero-defect in large-scale productions is one of the great challenges facing the emerging automotive LiDAR industry.

Both companies bring decades of expertise to the collaboration. Based on its expertise in providing reliable diode laser solutions for communication and consumer applications, Lumentum has developed a series of diode laser products that meet the quality, scope, and reliability requirements of the automotive industry. Lumentum provides 1550 nm narrow linewidth DBR diode lasers for the frequency modulated continuous wave (FMCW) coherent LiDAR, 905 nm and 940 nm VCSEL array laser with corresponding power for long-distance LiDAR and in-cabin monitoring.

MRSI Systems is a global leading supplier of fully automated high-accuracy die bonders, providing high-precision, high-flexibility, high-reliability, and high-speed fully automatic chip assembling solutions for the optoelectronic and microelectronic industries. In the automotive LiDAR industry, MRSI provides high reliability and fully automated assembling solutions for different die bonding processes.

To be announced at the 2022 Compound Semiconductor Conference for Advanced Technology and Applications (Suzhou, Taicang), MRSI’s collaboration with Lumentum will provide high-reliability photonic chip assembly solutions and services for the automotive LiDAR industry. The conference presentation titled, “Discussion on Photonic Chips and Assembling Technologies in Automotive LIDAR”, will be delivered by Dr. Limin Zhou of MRSI on behalf of both companies. Dr. Zhou’s speech will focus on the companies’ collaborative work, including key assembly requirements and technologies, best mass production solutions for high-reliability and zero-defect, and experimental results.

“Reliability is critical for automotive LiDAR applications and both the laser chip and the module assembly technology are essential to passing the strict reliability requirements for vehicles,” said Mr. Lu Yong, Senior Product Line Manager of Lumentum. “We are excited to continue our work with MRSI Systems, Mycronic Group. Our combined efforts will better support customers with a complete solution that includes high-reliability laser chip and assembly products.”

Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems, said, “We are happy to collaborate with Lumentum in the automotive LiDAR industry. MRSI Systems, Mycronic Group will have more opportunities to work with the global leading photonics company to develop high-reliability chip assembly solutions for the fast-growing Industry. The end-to-end solutions from chip to module assembly provided by our collaboration will shorten time-to-market and play a very important role in enabling mass production of automotive LiDAR solutions.”

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd.
Tel: +86 135 0289 9401
E-mail: [email protected]

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437


Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

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Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock

TEMPE, Ariz. and Austin, Texas—July 19, 2022—Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today welcomed David Arkow as the company’s head of global sales. The hiring of Arkow further expands the leadership team at Moov, which in April announced Rajiv Chegu as the company’s head of operations and Andrew Wolstan as the company’s general counsel and head of corporate development.

Moov is on a mission to accelerate global manufacturing, research and development and technological progress by fundamentally improving the supply chain. Moov’s digital marketplace is rapidly approaching $4 billion in active listings for used semiconductor equipment, and Moov recently announced end-to-end services to make buying and selling even easier. Moov’s intelligent management software facilitates the buying and selling of used semiconductor manufacturing equipment for enterprise customers.

Arkow, who will be based at Moov’s new headquarters in Tempe, Arizona, joins an executive team that comprises co-founder and CEO Steven Zhou, co-founder and Managing Director Maxam Yeung, Head of Technology Nick Griffith, Head of Finance James Qiu, Head of Customer Success Raymond Mahon and Chegu and Wolstan.

“We are excited to have secured David to lead sales and business development globally for Moov,” Zhou said. “David’s a force to be reckoned with in the world of sales, and has successfully scaled enterprise-sales organizations at multiple hyper-growth companies. David’s combination of results and culture-driven leadership are fully aligned with our values at Moov. We could not have found a better individual to lead our global sales organization.”

Arkow is a veteran sales leader with experience at early-stage startups and mature organizations across the e-commerce, fintech, insurtech and pharma industries. He brings to Moov an invaluable skill set that includes building and scaling strategic sales organizations, implementing scalable sales operations and cultivating team cultures that attract top talent.

Most recently, Arkow served for two years as vice president of sales at New York City-based Mulberry Technology, an e-commerce Series B-stage product company. There, Arkow quadrupled revenue in his first 12 months. Prior to joining Mulberry, Arkow spent more than seven years at Trustpilot — where he rose to become director of sales — an online-reviews platform headquartered in Copenhagen, Denmark. Arkow helped lead the company from its Series A-phase to its 2021 IPO on the London Stock Exchange. He built and ran Trustpilot’s U.S. West Coast sales division, and was Trustpilot’s No. 1 global seller. His performance earned Arkow three Trustpilot President’s Club awards. He earned a business certificate from Columbia University in New York City and earned a bachelor’s degree in business from Ithaca College in New York.

“David was a legend at Trustpilot, both as the company’s top seller, and as a leader building and scaling their west coast sales organization,” Zhou added. “David has proven experience leading sales organizations from early stage through IPO. Moov is on an accelerated growth trajectory, and David has experience and know-how to lead Moov’s sales organization through this growth because he’s done it before.”

Zhou said with Arkow part of the team, Moov will be able to augment the speed and efficiency of its transactions, its customer service, value-added services and account management quality and availability.

“Moov continues to attract top talent,” Zhou said. “We have become the clear market leader within our segment. Growth continues to accelerate for Moov. As a result, companies are increasingly turning to us for all their used-equipment buy, sell and management needs and opportunities.”

Moov is uniquely positioned to solve a problem identified by a U.S. Department of Commerce January report: Less-advanced chips are feeling supply shortages most keenly; they are produced by equipment often no longer in production — an obstacle compounded by the fact that no unified secondary market for equipment exists. The scarcity of semiconductor equipment and parts have resulted in the worst supply-chain delays in decades, extending chip manufacturers’ wait times up to 18 months.

In May, the company announced its real-time logistics tracking and virtual equipment inspections offering and 100% insurance coverage on purchased equipment during transit. It boasts an ecosystem of aftermarket services including tracking, digital inspections and refurbishing within its portal.

Moov is eliminating purchase risk for manufacturers looking to diversify their supply chain strategy by sourcing used equipment with its no-questions-asked, money-back guarantee, according to SEMI, the California-based global association that represents the electronics and supply-chain design industries.

Moov’s new headquarters in the 100 Mill building in Tempe, Arizona, will command the entire 16th floor, spanning about 32,000 square feet. The 18-story tower is among the premier commercial real estate locations in Greater Phoenix. Amazon and Deloitte also are building tenants. Moov will employ more than 150 total employees by the end of this year.

Customers utilizing the Moov platform include Applied Materials, Western Digital, Maxim Integrated, KLA and Microchip.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov’s platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. Moov currently employs about 80 people, and also boasts a presence in San Francisco; Shanghai, China; and Taipei, Taiwan. To learn more, please visit Moov.co.

Media contact
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Lindsly Penny
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