Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

• Read more about Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products

Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science presents advanced packaging innovations at SEMICON Taiwan 2022

HATFIELD, Pa. (USA) September 13, 2022 — Brooks Instrument, a world leader in precision fluid measurement and control technology, has launched a Korean-language website to provide its Asia-Pacific customers with better access to resources, including in-depth product info, technical documentation, white papers, service assistance and technical support.

The new www.BrooksInstrument.com/Ko-Kr website launch follows the recent opening of a new Brooks Instrument manufacturing and engineering center in Yongin, Gyeonggi Province, which significantly increased the company’s operational footprint in Korea. Building on more than two decades of operations in Korea, the local-language website further illustrates the company’s long-term commitment to the region, especially for the fast-growing semiconductor manufacturing sector.

“With our Yongin facility, we increased our ability to provide rapid repair, maintenance and calibration support to customers in the region and added another resource to help mitigate supply chain disruptions. With this new website, we’re further strengthening our commitment to support our partners in the Asia-Pacific region,” said Hans Sundstrom, Global Semiconductor Business Unit Manager for Brooks Instrument.

The website leverages best practices in design and navigation to help customers more easily access information they need and minimize project delays or disruptions. Key features of the new website include:

• Sitewide Korean language support to make it easier for customers to explore the Brooks Instrument catalog of products and documentation
• A “quick find” feature to easily locate products and documentation by name or model number
• Fully optimized site layout with simplified access to key products, technical information, guides and support services
• Specific industry sections with helpful application information for areas such as semiconductor manufacturing, life sciences and more

"We developed the new website as a platform to better serve our local customers,” said Jason Lee, Korea Country Manager at Brooks Instrument. “By adding native-language functionality, we’re further removing barriers to access as we continue to show customers how valuable their partnerships are to our business.”

To visit the new Brooks Instrument Korean-language website, go to www.BrooksInstrument.com/Ko-Kr.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.
For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

• Read more about Brooks Instrument Introduces Korean Language Website, Building on Commitment to Local Market

–– Silicon Assurance, a startup addressing security assurance and trust issues in silicon chips under the zero trust model, today joined the Electronic System Design Alliance, a SEMI Technology Community.

Founded in 2021, Silicon Assurance joined the ESD Alliance to connect with members of the community to understand their views on the technical challenges it is trying to address. “We view the ESD Alliance as the center of the electronic system design community,” notes Dr. Raj Gautam Dutta the co-founder and CEO of Silicon Assurance. “Our membership will give us access to other member companies and help us learn about the current state of the security market by interacting with other SEMI initiatives such as Smart Medtech, Smart Mobility and Smart Manufacturing.”

“Startups like Silicon Assurance help ensure the vibrancy and innovation of our design ecosystem,” comments Bob Smith, the ESD Alliance’s executive director. “It’s a pleasure to welcome Silicon Assurance to our member community and we look forward to its participation in our networking, educational opportunities and technical initiatives.”

As a member of the ESD Alliance, Silicon Assurance is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Silicon Assurance
Silicon Assurance was created in 2021 to address the challenge of building trust in silicon chips that drive electronic devices thar are increasingly smarter and more interconnected. It is at the forefront of addressing trust issues by providing security assurance solutions for silicon chips. Silicon Assurance provides best-in-class technologies to evaluate and protect chips used in electronic devices ranging from smartphones to self-driving cars. Its portfolio of products and expertise enhance customer confidence in their devices sold to end-users. www.siliconassurance.com

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance:
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

• Read more about Silicon Assurance Joins SEMI ESD Alliance