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Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.

Speaker Bio 

Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials. 

Online, Virtual
United States

Nikhil Jani
Nikhil Jani
Business Development Specialist
Zeon Specialty Materials
MSIG

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.  

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

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Wafer Fabricated Atomic Reference Cells

Tom Kornack, Chief Scientist, Twinleaf LLC

Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.

Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.



Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays

Dr. Dirk Lewke, Team Leader Technology Innovation Management

 

Abstract:  This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.

Speaker Bio:  Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.

Online, Virtual
United States

Tom Kornack
Dr. Thomas Kornack
Chief Scientist
Twinleaf LLC
Dirk Lewke
Dr. Dirk Lewke
Team Leader Technology Innovation Management
3D-Micromac
MSIG

We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.  

These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device?  Then this is the webinar series for you.  

Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Lin Tso, [email protected] or Paul Cohen, [email protected] to learn about available sponsorship opportunities.

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.      

Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.     

Speakers will discuss strategies for mitigating the impact and how to capture value.   

Topics include:

  • Market Trends & Forecast & Outlook    

  • Accessing Chips Act Funding and Roll out of Incentives  

  • Geopolitical Impact    

  • Advanced Packaging & Chiplets     

  • Emerging and Expanding Markets    

 

This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time

United States

Virtual Forum | Thursday, March 16, 2023 | Pacific Time

8:30 am - 8:35 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am - 8:55 am
John Cooney
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI

An Update on the CHIPS Act and How to Apply for Funding

Biography

8:55 am - 9:20 am
Jay Vleeschhouwer, Griffin Securities
Jay Vleeschhouwer
Software Research
Griffin Securities

The State of EDA: A View from Wall Street

Biography

9:20 am - 9:45 am
Dan_Hutcheson_VLSIresearch
Dan Hutcheson
Vice Chair
TechInsights

New Perspectives in Semiconductors: Cycles & Outlooks

Biography

9:45 am - 10:10 am
Jean-Christophe Eloy, Yole Développement
Jean-Christophe Eloy
President and CEO
Yole Développement

Status of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?

Biography

10:10 am - 10:35 am
Lita Shon-Roy
Lita Shon-Roy
President/CEO
TECHCET

The Impact on Supply Chains - Materials & Equipment Consumables

Biography

10:35 am - 11:00 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Q&A and Closing Remarks

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

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This year’s theme for the International Trade Partners Conference—ITPC—will guide an exploration of geopolitics, contentious trade and national security concerns, and our deep-rooted ambitions to maintain the global footprints we have created. Our manufacturing infrastructures, trade connections, and supply chains are now part of the geopolitical state – something few could have anticipated. We are finally witnessing governments, the media, and the general public taking notice of semiconductors and their critical importance.

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Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.

Contact Tim Janes, [email protected],   +1.720.939.4992 to learn more.

Sponsorship opportunities are available! (View the brochure.)
For information, contact Tim Janes, [email protected].

View Past Phil Kaufman Award Recipients

 

Hosted by

SEMI ESDA                        IEEE CEDA

Hayes Mansion
200 Edenvale Avenue
San Jose, CA 95136
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Phil Kaufman Honoree

Master of Ceremonies

Ed Sperling, Semiconductor Engineering
Ed Sperling
Editor in Chief
Semiconductor Engineering

Biography

Tribute Presenters

ESD Alliance

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.

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MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.

The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Corporate sponsorship opportunities are available. Contact Bob Smith, executive director of the ESD Alliance, at [email protected] for more information.

Dr. De Micheli is Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland. He is being recognized for his contributions to electronic design automation (EDA). His research on EDA tools and methodologies has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions.

About the Phil Kaufman Award
The Phil Kaufman Award, co-sponsored by the ESD Alliance and CEDA, honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The annual award was established in 1994 as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems. Visit the Phil Kaufman Award webpage for more details and a list of previous recipients.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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United States Register Now MSIG Webinar Tile TMR Technical Featured Speakers
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Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.

Crocus has cracked the code to fabricating and integrating TMR sensors with its XtremeSense(tm) range of magnetic sensors. XtremeSense TMR technology is integrated in the back-end of a standard CMOS process on 8” and 12” wafers enabling single-die sensor products. In fact, Crocus has successfully shipped >100 Million ICs based on the XtremeSense process.

This webinar will focus on the principles of TMR sensor and the technology gains made by Crocus to enable Mass Production of TMR sensors.

Speaker Biography

Dr. Mohan is currently serving as VP of Engineering at Crocus Technology, a Silicon-Valley based Magnetic Sensor Company. He is responsible for Worldwide Applications Engineering and New Product Introduction. He has developed next generation of Integrated Magnetic Devices since 2007 and has 15+ granted patents in the field. Prior to joining Crocus Technology, he has worked at Texas Instruments, Maxim Integrated and Bosch Sensortec.

Virtual, Online
United States

Anuraag Mohan
Anuraag Mohan, Ph.D.
VP Applications Engineering
Crocus Technology
Paul Carey
Paul Carey
Director, R&D Programs
SEMI MSIG
MSIG

Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.

During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.

8:00 am - 9:00 am Off Add to Calendar 2022-12-14 08:00:00 2022-12-14 09:00:00 Tunnel Magnetoresistance Sensors Webinar Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications. During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors. Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

Registration

Sponsor tile for Jan workshops

Registration covers all 3 days of Workshops.  No discounts given for partial attendance.  Full refunds through December 17, 2022.  December 18-January 19 - substitutions only.

SEMI, FlexTech, NBMC & NextFlex Members:  $199

Non-Members:  $499

If you have any questions, please contact Gity Samadi, [email protected].

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Hotel Information

SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.  

To reserve the rate visit Staybridge Suite website and follow these steps:

Step 1 – Enter your dates

Step 2 – Choose Rate Preference, then group rate, type in SJ1

Alternatively, you may email the General Manager at [email protected]

HEALTH AND SAFETY

Your health and safety are our top priority.  We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.  For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.

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SEMI FlexTech FHE Technical Gap Analysis Workshop  - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA

As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

  • Direct Write Interconnects
  • Substrates and Buildup Layers
  • Interposers, Bridges & Architectures
  • Circuitization

SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States

Tuesday, January 17 @ SEMI Milpitas

8:00 am - 8:30 am

Continental Breakfast

SEMI FlexTech FHE Technical Gap Analysis Workshop

8:30 am - 8:45 am
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

8:45 am - 9:00 am
Eric Forsythe, PhD
Program Manager
ARL

RFP Process and Background

9:00 am - 9:15 am
Bob Pranio, CHASM
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials

A Look Back and The Path Ahead & RFP Process

9:15 am - 10:45 am

Breakout Sessions for Technical Gap Analysis

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Break out Review & Summary

11:45 am

Wrap-Up

12:00 pm - 1:00 pm

Lunch

CHASM Technologies Logo

NBMC Technical Gap Analysis Workshop

1:00 pm - 1:15 pm
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

1:15 pm - 1:30 pm
Gina Tollefson
Program Manager
AFRL

NBMC 2023

1:30 pm - 1:45 pm
Azar Alizadeh
Principal Scientist
GE Research

RFP Process & Insights

1:45 pm - 2:00 pm

Break

2:00 pm - 4:00 pm

NBMC Break Out Sessions

4:00 pm - 4:45 pm

Final Review & Summary

4:45 pm - 5:00 pm

Wrap-Up

5:00 pm - 7:00 pm

Reception & Networking

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Wednesday, January 18, 2022

FHE Standards Workshop

8:00 am - 8:30 am

Continental Breakfast

8:30 am - 8:45 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI
PT
Paul Trio
Director, SEMI Standards
SEMI

Introduction of Project & Status

8:45 am - 9:15 am
Randall Parker
Randall Parker
American Semiconductor

The Need for Standards in Flexible & Printed Electronics

Bayflex logo
9:15 am - 10:45 am

Breakout Session on Selected Topics

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Review and Summaries from Breakouts

11:45 am - 12:00 pm

Wrap-Up

12:00 pm - 1:00 pm

Lunch

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1:00 pm - 2:00 pm

Travel Time to NextFlex -

For a detailed program agenda for this workshop visit NextFlex.us

- FlexTech MSIG Standards

Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.

Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability. 

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