• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec reports a 19% year-over-year growth rate for the third quarter of 2022

The Electronic System Design Alliance, a SEMI Technology Community, today announced Axiomise, a leading provider of cutting-edge formal verification training, services and custom solutions, is the newest member of its growing ecosystem.

“It’s important for companies of our size to be part of the thriving electronic system design community,” remarks Dr. Ashish Darbari, CEO and founder of Axiomise. “The networking and educational events and technical programs offer us a platform to reinforce the value of formal verification in semiconductor design in the global electronics industry.”

“Verification is an increasingly critical part of system design,” adds Bob Smith, the ESD Alliance’s executive director. “We’re pleased Axiomise is now a member of our ecosystem and expect Ashish will quickly become a valued participant in our activities.”

As a member of the ESD Alliance, Axiomise is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Axiomise
Axiomise is dedicated to furthering the adoption of formal verification through its unique combination of training, consulting and services, along with specialized verification solutions for RISC-V. Founded by Dr. Ashish Darbari, a formal verification practitioner for over two decades, it offers cutting-edge, formal verification training, consulting and services. An active user of all formal technologies, including theorem proving, model checking and equivalence checking, Dr. Darbari and his team have trained more than 200 engineers across the semiconductor industry. Dr. Darbari has 47 patents in the field of formal verification.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

• Read more about SEMI ESD Alliance Adds Axiomise to Member Roster

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices

Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process Control Smart Manufacturing Conference (APCSM).

The three-day conference, which is taking place in Austin, Texas, from October 10-13, brings together members of the microelectronics and related industries, including semiconductor OEMs and factories. The APCSM features tutorials, technical presentations, and exhibits covering various topics and trends related to APC, AI, and smart manufacturing.

Doug Suerich, PEER Group’s Product Evangelist and Director of Marketing, is co-chairing the conference alongside APCSM perennial Co-chair, Bradley Van Eck, James Moyne, an Associate Research Scientist at the University of Michigan and CTO of the Integrated Measurement Association (IMA), and John Pace, President of the IMA.

“We look forward to welcoming all attendees, presenters, and exhibitors to Austin for this year’s APCSM,” says Van Eck. “After two years as a virtual conference, being back in person is going to be great. We have an amazing lineup of tutorials and presentations that are sure to shed light on some of the current challenges our industry is facing and how innovations in advanced process control will help us overcome them.”

A key component of the APCSM is the Monday tutorials, which provide attendees with in-depth information on the latest trends and advancements in microelectronics manufacturing. Albert Fuchigami, Senior Software Developer at PEER Group, and the 2022 recipient of the Leadership Award for his contributions to the SEMI® Standards Program, is co-presenting the first of two tutorials. The tutorial, titled Understanding SEMI Information and Control Standards, will provide an overview of, and the philosophies behind, the SEMI Standards and how they fit together to help factories get data from equipment so it can be utilized to improve production capabilities. It will also provide technical details of these highlighted features.

For complete details, including agenda, presentation topics and how to register, visit the APCSM website.

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

• Read more about PEER Group to showcase expertise at APCSM 2022

Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

• Read more about Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products