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United States Register & Watch PNT2 800x800 tile Business Executive Technical Featured Speakers
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This webinar unveiled the details of the 5-year $5M per year ($25M total) Positioning, Navigation, and Timing Phase 2 (PNT2) funded R&D Program starting in 2022.  The formal Request for Proposals (RFP) is expected on June 6, 2022.

The PNT2 program follows a successful Phase 1 program that saw 10 projects funded over 2 years starting in 2020 ($6M total funding).

Watch to learn how you can respond to the PNT2 RFP.  Topics covered:

  • technical thrust area
  • cost share requirements
  • proposal instructions
  • team requirements
  • Q&A

About the Speaker

Dr. Paul Carey joined SEMI in April 2021 and is responsible for managing the MSIG PNT program, the MSIG webinars, and supporting the Manufacturing, Device and Reliability Workgroups and all MSIG related conferences and events. Before joining SEMI, he worked at X-Ray imaging backplane supplier and FOA member, dpiX, in various positions starting in 2003.  He was the process, equipment, and yield manager in their Gen 2.5 Palo Alto glass Fab until 2012 when dpiX moved its production to a new Gen 4.5 Fab in Colorado Springs.  He rejoined dpiX in 2014 and worked on the flexible substrate equipment selection team and later became their first business development manager in 2018 when dpiX announced its Foundry Business.

Earlier positions were held at Applied Materials where he helped develop a laser annealing system for semiconductor shallow junctions and silicides, and start-up company FlexICs, where he was a co-founder and VP of Engineering.  FlexICs developed low temperature thin film transistor (TFT) fabrication technology relevant to flexible OLED displays now used in cellphones.  Prior to founding FlexICs, he worked as a staff scientist and program leader at Lawrence Livermore National Laboratory where his group initially developed the low temperature polysilicon-on-plastic TFT technology.

Dr. Carey received a double major BS from UC Berkeley in Electrical Engineering and Computer Science (EECS) and Materials Science and Engineering (MSE).  He received his MS in EECS from UC Berkeley and Ph.D. in MSE from Stanford University.

Virtual, Online
United States

Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG
MSIG

Watch this webinar to learn more about this opportunity to propose for R&D Funding to advance the state-of-the-art in positioning, navigation and timing (PNT) technology.  

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Abstract/Description

Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.

The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.

With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.

About the Instructors

Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.

Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU).  At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.

United States

Dr. Robert MacCurdy
Dr. Robert MacCurdy
Asst. Professor of Mechanical Engineering
University of Colorado, Boulder
Greg Whiting
Greg Whiting, PhD.
Assoc. Professor
University of Colorado, Boulder
FlexTech

Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.  

Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.

Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.

This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.

Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics.  These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.

Example PFHE and printed energy materials topics:

  • Dispensing and 3D printing of electronic and energy materials
  • Aerosol printing
  • High resolution inkjet printing and coating
  • Screen Printing
  • Flexographic Printing
  • Gravure printing
  • Slot die coating
  • Convective, IR and photonic thermal processing
  • Microcontact printing and embossing
  • Submicron electrohydrodynamic printing

About the Instructor

Devin MacKenzie

J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW.  Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. 

Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed  flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration.  Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom.  Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories.

Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.

This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand.  See the full list.

United States

FlexTech

The field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power.  Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.

In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating.  The instructor also addressed the latest materials and updates on supplementary thermal processing needs.

This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.

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On-Demand Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #1 

United States Register Now Business Technical

SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon

Silicon (Si) power devices have dominated power electronics due to their excellent starting material quality, ease of fabrication, low cost volume production, and proven reliability. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

In this webinar, the favorable material properties of Silicon Carbide (SiC), which allow for highly efficient power devices with reduced form-factor and cooling requirements, will be outlined. High impact application opportunities, where SiC devices are displacing their incumbent Si counterparts, will be reported. Material and device fabrication aspects will be highlighted with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus specific to SiC. Fab models will be analyzed, and the vibrant U.S. SiC manufacturing infrastructure (that mirrors that of Si) will be presented.

 

View Previous Webinar in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker
 

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us as we dive into the special properties of silicon carbide (SiC) and how they're displacing their incumbent silicon counterparts. 

 

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United States standards
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Online, Pacific Time
United States

Standards

Compound Semiconductor Materials North America TC Chapter Meeting

Date: Wednesday, June 15, 2022

Time: 09:00-11:00 AM Pacific

via Web Conference

 

AGENDA

(subject to change)

Last updated: April 28, 2022

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:00 am - 11:00 am Off Add to Calendar 2022-06-15 09:00:00 2022-06-15 11:00:00 Compound Semiconductor Materials North America TC Chapter Meeting Compound Semiconductor Materials North America TC Chapter Meeting Date: Wednesday, June 15, 2022 Time: 09:00-11:00 AM Pacific via Web Conference   AGENDA (subject to change) Last updated: April 28, 2022   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

Kitchener, Ontario, April 27, 2022 – PEER Group®, a leading supplier of innovative factory automation software products, is hosting a live webinar on May 17, 2022 at 10:00 a.m. PT/ 1:00 p.m. ET that will help explain how the upcoming integration of gRPC into the EDA Standards will impact the semiconductor industry.

The webinar, titled: gRPC: What You Need to Know, will be hosted by PEER Group’s Director of Marketing, Doug Suerich, along with SEMI Standards Technical Committee Member, Albert Fuchigami.

Topics covered will include an overview gRPC and how it fits into existing factory automation communication landscapes, how gRPC interacts with EDA / Interface A, and the impact it will have on other SEMI Standards such as SECS/GEM and GEM300. The webinar will wrap up with suggestions on how to future-proof your software in preparation for the transition to gRPC. There will also be an opportunity for attendees to ask questions during a Q&A.

Those interested in watching the free webinar can request a recording by visiting: https://www.peergroup.com/grpc-what-you-need-to-know/

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 10 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Registration Details

Attending this webinar is Free.

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Sponsored by

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Featured Speakers

About the Speaker

Dr. Chris Huang ASEDr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.

Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering

United States

MSIG

The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond. 

During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.

He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.

Q&A will follow.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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RoodMicrotec shows strong financial performance for the year 2021, resulting in:

• Total income of EUR 14.5 million with an EBITDA of EUR 2.8 million
• Net profit of EUR 1.4 million
• Cash flow from operating activities of EUR 2.2 million

Deventer, April 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the Company’s Annual Report for the financial year 2021 including the audited financial statements. The 2021 Annual Report is available for download on the corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

The total income for 2021 amounted to EUR 14.5 million, which was 22% higher than in 2020. The net result after taxes for 2021 was EUR 1.4 million positive, mainly due to a higher delivery of services during the year.

“We were expecting a significant increase in total income and a profit in 2021 and managed to outperform our expectations by focusing on our core business and services”, says Martin Sallenhag, CEO of RoodMicrotec. “We are very pleased with the overall Company development during 2021 and expect that the increase in total income will continue in 2022. The cash situation makes it possible for us to invest in capacity and capability to meet the increasing demand from the market and our customers.”

Throughout 2021, the Test Operations unit showed a sharp increase, which was related to the general up-swing in the market and the excellent position RoodMicrotec has with its customers. The Supply Chain Management unit also showed a strong increase compared to last year. In the second half of 2021, we however saw a decrease in total income compared to the first half of 2021 due to the world-wide shortage of components and raw materials in the semiconductor industry. RoodMicrotec has put actions in place to mitigate the impacts as far as possible. Some of the new projects have not yet been moved into volume production due to the COVID-19 pandemic. In 2021, the Qualification & Failure Analysis unit saw a decrease compared to 2020 due to the delayed start of new projects. Some of these delayed projects started in the second half of 2021, so the total income in this unit increased compared to the first half of 2021.

2021 HIGHLIGHTS / MAIN DEVELOPMENTS
Financials
• Total income: EUR 14.5 million (2020: EUR 11.9 million).
• EBITDA: EUR 2.8 million (2020: EUR 1.3 million).
• Balance sheet total: EUR 15.0 million (2020: EUR 14.3 million).
• Net result: EUR 1.4 million positive (2020: EUR 0.3 million negative).
• Net cash flow from operating activities: EUR 2.0 million (2020: EUR 1.5 million).
Commercial/operational
• RoodMicrotec now offers test services at wafer level for new types of photonic integrated circuits to customers from the semiconductor industry. Jenoptik provides the necessary technology platform with the UFO Probe® Card and thus supports RoodMicrotec in setting up the respective test structure.
• An AIOLOS Wafer Level Test Handler from AEM’s Afore Wafer Level Test Solutions has been installed at the RoodMicrotec facility in Nördlingen. With this handler, RoodMicrotec is now able to offer its customers additional capabilities in the fast-growing markets of sensor testing. This system is also set up for 200 mm wafer frame probing of a wide range of semiconductor devices. RoodMicrotec will not only extend its business areas, but also its testing capabilities.
• During 2021 the booked SCM projects have continued to progress towards production through test program development as well as qualification work. Some of the projects are now close to ramp-up and we start to see the first volumes for these customers. The SCM team is continuing to prepare for future projects with pre-development of certain functions that will be used in future products.
• A consortium of 31 key players for packaging of electronics, optics and photonics, leading equipment suppliers and testing experts from 11 countries are involved in APPLAUSE, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,”. The project fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing where RoodMicrotec will be able to benefit with new solutions in these areas.
• The refinancing of the bond loan issued in 2014 has been completed by the end of the first quarter 2021. A group of long-time investors provides the refinancing in the amount of EUR 2.6 million. Also the management participates so show their confidence in the Company’s business plans and future projects.
• The Court of Appeal has given a verdict in the legal proceedings concerning the dispute about (non) fulfillment of contractual obligations of a debtor. The Court of Appeal ratified the verdicts of the Subdistrict Court of Zwolle and sentenced the debtor to bear the costs of appeal.
• Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") initiated legal proceedings before the Regional Court of Hamburg (Landgericht Hamburg) against RoodMicrotec GmbH regarding the perpetual bond (Genussscheine) of EUR 500k that RoodMicrotec GmbH issued in 2012.

Events after balance sheet date
• In February 2022 Robus and RoodMicrotec GmbH agreed on a full and final settlement of the 2012 perpetual bond. This final settlement has been reached before and confirmed by the Regional Court of Hamburg.
• Robus initiated legal proceedings before the Regional Court of Frankfurt am Main (Landgericht Frankfurt am Main) against RoodMicrotec GmbH regarding the perpetual bond (Genussscheine) of EUR 1,994k that RoodMicrotec GmbH issued in 2010. RoodMicrotec GmbH contests all allegations and claims, and denies that any compensation payments are due on the perpetual bond or that any grounds for extraordinary termination of the perpetual bond exist. Accordingly, RoodMicrotec GmbH will ask the court to reject Robus' claim.

Key figures
(x EUR 1,000) 2021 2020
Results
Total income 14,532 11,874
EBITDA 2,786 1,345
EBIT (operating result) 1,227 -199
EBT 1,038 -369
Net cash flow from operating activities 2,049 1,517
Net result 1,435 -265

Capital, Debt & Liquidity Ratios
Total assets 14,995 14,337
Group equity 5,583 3,844
Net debt 374 1,870
Invested capital (net debt + equity) 5,957 5,714
Gearing ratio (net debt/ capital) 6% 33%
Solvency (group equity / total liabilities) 37% 27%
Debt ratio (net debt / EBITDA) 0.1 1.4
Net working capital 317 -55
Working capital ratio (net working capital / total income) 2.2% -0.5%
ROCE (EBIT / average invested capital) 21.0% -3.3%

Assets
Tangible and intangible fixed assets 8,295 9,177
Investments in (in)tangible fixed assets 681 866
Depreciation of (in)tangible fixed assets 1,559 1,544

Data per share (x EUR 1)
Group equity 0.074 0.051
Operating results 0.016 -0.003
Net cash flow from operating activities 0.027 0.020
Net result 0.019 -0.004
Share price: at year-end 0.201 0.183
Share price: highest 0.267 0.267
Share price: lowest 0.176 0.107

Other information
Number of issued shares at year end (x 1,000) 75,076 74,896
Average number of employees (FTE) 89 86
Total income / Average FTE 163 138

Sales and result
In 2021, RoodMicrotec’s total income came in 22% higher than in 2020 at EUR 14.5 million (2020: EUR 11.9 million), with 94% of its total sales in the European countries.

In the first half of 2021, wafers were ordered and received for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.5 million has been realized for these wafers as total income and approximately the same amount has been accounted for in the cost for raw materials and consumables. The parts will be delivered during 2022, where only part of the selling price will be recognized in the total income but with a positive impact on the net result.

Total income from the automotive sector increased in 2021 by 37% to EUR 6.9 million (2020: EUR 5.0 million) and represents 48% of the total income. The total income in the industrial / medical sector increased in 2021 by 15% to EUR 6.3 million (2020: EUR 5.5 million) and represents 43% of the total income. The HiRel / aerospace sector increased by 2% to EUR 0.9 million (2020: EUR 0.9 million). The total income in this sector mainly consists of failure analysis and qualification work and this is very much depending on the design cycles at our customers. Total income in other sectors declined by 8% to EUR 0.5 million (2020: EUR 0.5 million).

Total income by market sector:
(x EUR 1,000) 2021 2020 change

Automotive 6,886 5,021 37.1%
Industrial/Healthcare 6,270 5,454 15.0%
HiRel / Aerospace 926 908 2.0%
Others 450 491 -8.4%
Total 14,532 11,874 22.4%

In 2021 the total income in the Supply Chain Management unit increased by 27% to EUR 3.4 million (2020: EUR 2.7 million). The total income in the Test Operations unit increased by 46% to EUR 7.9 million (2020: EUR 5.4 million). The total income in the Qualification & Failure Analysis unit came in 15% lower, at EUR 3.2 million (2020: EUR 3.8 million).

Total income results per operational unit:
(x EUR 1,000) 2021 2020 change

Supply Chain Management 3,364 2,659 26.5%
Test Operations 7,938 5,429 46.2%
Qualification & Failure Analysis 3,230 3,786 -14.7%
Total 14,532 11,874 22.4%

Personnel and organization
During 2021, RoodMicrotec continued to optimize the organization to keep track with the changing demands from the customers and markets. Furthermore, we recruit highly experienced personnel to be able to support our plans for the future. The average number of full time employees (FTE) was 89 in 2021. Total income per average full-time employee increased to EUR 163,000 from EUR 138,000 in 2020. Our policy is to strive for growth of sales per FTE.

Until May 2021 we used short-time working in our company in order to be able to react to the international effects of COVID-19. After that date the demand from our customers was high and stable and we therefore decided to discontinue the short-time work. Short-time work had an effect on the average full-time employees of minus 4 FTEs. It was and is absolutely crucial for us not to have to lay off any employees, so we were very happy to be able to use the short-time working option. In some positions, our employees have also decided to voluntarily work more from home in order to reduce the number of colleagues present in our facilities.

We have not experienced any interruptions in the business operations due to the COVID-19 pandemic. The measures taken with masks, distance between the working places, home offices and general care, have enabled us to offer a safe environment for our employees and we have had very few incidents in the company during 2021.

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Conference call
You are invited to take part in RoodMicrotec’s conference call for shareholders, financial press and analysts on
Thursday, April 21, 2022 at 9:30 CEST.
The management will present the Annual Report 2021 in detail and answer your questions.
The dial-in number for the call is: +31 (0)20 531 5863 (via operator)

Annual General Meeting of Shareholders
The Annual General Meeting of Shareholders of the Company will be held by webcast (virtual meeting) on Thursday, June 9, 2022 at 15:00 CEST. The Board of Management and Supervisory Board have decided to organize the AGM in such manner, that it can only be attended by registered shareholders through a webcast. Shareholders do not have the option to attend the AGM in person, as the Meeting will only be held remotely via a digital platform (virtual meeting).

The convening notice (including registration and voting instructions) and the agenda with explanatory notes, as well as all other meeting documents for the AGM will be available from Thursday April 28, 2022 onwards on our corporate website: www.roodmicrotec.com/en/investor-relations-en/annual-general-meeting.

Financial calendar
April 28, 2022 Publication of invitation and agenda for the Annual General Meeting of Shareholders
June 9, 2022 Annual General Meeting of shareholders
July 21, 2022 Publication Interim Report 2022
July 21, 2022 Conference call for shareholders, press and analysts
October 13, 2022 Trading update quarter 3-2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses of the Board of Management and on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English only.

Nijmegen, the Netherlands, April 12, 2022

Chip Integration Technology Center (CITC) has signed a Memorandum of Understanding (MoU) with the Electronics & Photonics Innovation Centre (EPIC) in Torbay, UK. The move offers an exciting opportunity for both organizations to collaborate and benefit from the synergies that exist between the two centers.

EPIC is located within a rich cluster of microelectronics and photonics packaging specialists. The center offers businesses access to labs, offices, >€3M of prototyping capability and a classified cleanroom. Dutch-owned EFFECT Photonics have chosen EPIC as their R&D facility and have benefited from extensive local funding to support this growth. Other businesses located within EPIC include Spanish MEMS innovators Nanusens and photonics packaging specialists Bay Photonics.

CITC is a non-profit innovation center specializing in heterogeneous integration and advanced chip packaging technology for semiconductor and photonic applications. It is a place where companies, research and educational institutes work together on bridging the gap between academics and industry and creating a new generation of packages providing smart, safe and rugged housing for chips.

The MoU will see both parties sharing information with their respective businesses to showcase the technical capability and services on offer at both centers. EPIC and CITC will also be exploring opportunities to add each other’s centers to future funding bids with a view of generating additional revenue for both projects.

Both centers have close links to relevant universities and higher education partners therefore encouraging collaboration between academia will also be explored.

EPIC Centre Director, Wayne Loschi, is excited about the partnership: “There are so many clear opportunities for collaboration which will benefit our respective centers and our businesses. We’d love to see our companies working closer with CITC to improve innovation and equally we’d welcome more Dutch companies to join EFFECT Photonics within EPIC”.

CITC Business Development Manager, Marco Koelink, is also looking forward to starting the relationship: “EPIC offers a rich ecosystem in microelectronic and photonic R&D and assembly activities. Collaboration, especially in photonic packaging is crucial to develop high-volume and low-cost solutions for meaningful application areas such as communications, medical and automotive. CITC and EPIC jointly strengthen their value proposition in providing access to innovation, infrastructure and education”.