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Registration

Sponsor tile for Jan workshops

Registration covers all 3 days of Workshops.  No discounts given for partial attendance.  Full refunds through December 17, 2022.  December 18-January 19 - substitutions only.

SEMI, FlexTech, NBMC & NextFlex Members:  $199

Non-Members:  $499

If you have any questions, please contact Gity Samadi, [email protected].

Sponsor tile for Jan workshops
United States Register Now EofE Vertical Sponsor Logos Business Executive Technical

Hotel Information

SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.  

To reserve the rate visit Staybridge Suite website and follow these steps:

Step 1 – Enter your dates

Step 2 – Choose Rate Preference, then group rate, type in SJ1

Alternatively, you may email the General Manager at [email protected]

HEALTH AND SAFETY

Your health and safety are our top priority.  We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.  For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.

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SEMI FlexTech FHE Technical Gap Analysis Workshop  - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA

As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

  • Direct Write Interconnects
  • Substrates and Buildup Layers
  • Interposers, Bridges & Architectures
  • Circuitization

SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States

Tuesday, January 17 @ SEMI Milpitas

8:00 am - 8:30 am

Continental Breakfast

SEMI FlexTech FHE Technical Gap Analysis Workshop

8:30 am - 8:45 am
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

8:45 am - 9:00 am
Eric Forsythe, PhD
Program Manager
ARL

RFP Process and Background

9:00 am - 9:15 am
Bob Pranio, CHASM
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials

A Look Back and The Path Ahead & RFP Process

9:15 am - 10:45 am

Breakout Sessions for Technical Gap Analysis

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Break out Review & Summary

11:45 am

Wrap-Up

12:00 pm - 1:00 pm

Lunch

CHASM Technologies Logo

NBMC Technical Gap Analysis Workshop

1:00 pm - 1:15 pm
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

1:15 pm - 1:30 pm
Gina Tollefson
Program Manager
AFRL

NBMC 2023

1:30 pm - 1:45 pm
Azar Alizadeh
Principal Scientist
GE Research

RFP Process & Insights

1:45 pm - 2:00 pm

Break

2:00 pm - 4:00 pm

NBMC Break Out Sessions

4:00 pm - 4:45 pm

Final Review & Summary

4:45 pm - 5:00 pm

Wrap-Up

5:00 pm - 7:00 pm

Reception & Networking

CMU Logo

Wednesday, January 18, 2022

FHE Standards Workshop

8:00 am - 8:30 am

Continental Breakfast

8:30 am - 8:45 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI
PT
Paul Trio
Director, SEMI Standards
SEMI

Introduction of Project & Status

8:45 am - 9:15 am
Randall Parker
Randall Parker
American Semiconductor

The Need for Standards in Flexible & Printed Electronics

Bayflex logo
9:15 am - 10:45 am

Breakout Session on Selected Topics

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Review and Summaries from Breakouts

11:45 am - 12:00 pm

Wrap-Up

12:00 pm - 1:00 pm

Lunch

UW SoEngineering logo
1:00 pm - 2:00 pm

Travel Time to NextFlex -

For a detailed program agenda for this workshop visit NextFlex.us

- FlexTech MSIG Standards

Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.

Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability. 

8:00 am - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

MILPITAS, Calif. ─ November 7, 2022 ─ Global silicon wafer shipments are projected to increase 4.8% year-over-year in 2022 to a record high of nearly 14,700 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.

LogoThe growth is expected to temper in 2023 due to challenging macroeconomic conditions but is forecast to rebound in the years that follow on strong demand for semiconductors used in data center, automotive and industrial applications.
 

2022 Silicon* Shipment Forecast (MSI) 

Image


Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

All data cited in this release is inclusive of polished silicon wafers and epitaxial silicon wafers shipped by wafer manufacturers to end users. The data does not include non-polished or reclaimed wafers.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: 
[email protected]

Kitchener, Ontario, November 3, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, has announced the appointment of industry veteran Torsten Werneke as its new European OEM Account Manager.

“Throughout my time in the semiconductor industry, PEER Group has always been an impressive company,” says Werneke. “The quality and design of their products, focus on customer satisfaction, and honesty and openness made it an easy decision to join as the new European OEM Account Manager.”

Werneke has more than 25 years of industrial software development and process management experience in the semiconductor and photovoltaic industries. Based in Friedrichshafen, Germany and working out of PEER Group’s Dresden office, he will be responsible for supporting all current European OEM customers while expanding PEER Group’s presence in Europe.

“There is much excitement in the European semiconductor industry,” says Werneke. “Factories are taking advantage of significant investments to expand production and equipment makers are looking for ways to enhance their tool automation and data collection capabilities to help support this expansion. PEER Group provides the products and solutions for precisely these challenges.”

Previous to working at PEER Group, Werneke, who holds a Mechanical Engineering degree from Chemnitz University of Technology, spent time as a process engineer at Infineon Technologies before founding itemic AG, an APC platform supplier for lithography, CMP, and etching tools. After selling itemic’s core technology to ASML, Werneke launched another venture manufacturing high-end ultra-flat light panels for commercial applications.

“As we get ready to celebrate next year’s twentieth anniversary since the opening of our European office, I am pleased to welcome Torsten to the PEER Group team,” shares Mike Barrett, Director, Global OEM Sales at PEER Group. “His industry knowledge and software development expertise will be of great value to the European equipment makers looking to automate their tools and get accepted into semiconductor fabs.”

Werneke, along with other members of PEER Group, will be attending SEMICON Europa, happening November 15-18. To schedule a meeting with him during the show, visit PEER Group's SEMICON Europa event page and complete the form.

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award-winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and is one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Kitchener, Ontario, October 26, 2022 – PEER Group®, the largest supplier of innovative factory automation software products is excited to attend SEMICON Europa 2022, happening November 15-18 at Messe München in Munich, Germany.

Co-presented with electronica, the four-day show is billed as the “strongest single event for electronics manufacturing in Europe,” bringing together all facets of the semiconductor manufacturing supply chain. There has been increased focus placed on the European semiconductor industry as of late, most notably with the recent announcement of the European Chips Act which, if adopted, would see more than € 43 billion of public and private investments funneled into strengthening Europe’s semiconductor supply chain.

“Next year will mark twenty years since PEER Group first opened its Dresden office,” says Mike Barrett, Director, Global OEM Sales at PEER Group, “and as investments into the European semiconductor industry increase, we are ready to work closely with our current and future customers and partners in helping them achieve their tool and factory automation goals.”

In addition to exhibiting, PEER Group’s Director of Marketing, Doug Suerich, will be presenting the topic: Treading lightly: How a pandemic pivot to remote integrations helped reduce our carbon footprint, as part of the SEMICON Europe Sustainability Summit. The presentation will share lessons learned from two years of performing remote discoveries, integrations, and inspections and how, in some instances, these lessons have become best practices for our customers going forward.

For more information, visit PEER Group’s SEMICON Europa event page: https://www.peergroup.com/news-events/events/semicon-europa-2022/?utm_source=internal&utm_medium=europa&utm_campaign=SEMI

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

United States Harvey Kauget with Title Business Technical
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Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.

Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.

Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.

Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.

Honors & Recognitions

  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
  • Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
  • Named, Chambers USA, Intellectual Property (2021-2022)
  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
  • Florida Trend, "Legal Elite," Intellectual Property Rights (2005, 2007-2008, 2010-2016, 2018, 2020-2021)
  • Florida Super Lawyers, Intellectual Property (2009, 2011-2021)

United States

CAST EMG ESD Alliance FlexTech MSIG SOI

Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end.  A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

Belgium France Germany Ireland Italy United States FEMC13 On Demand tile Business Executive Featured Speakers
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Bio

Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.

This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.

Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.

ABOUT THE SPEAKER

Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.

At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
 

United States

Dr. Craig Milroy
Dr. Craig Milroy
National Research Council (NRC) Research Associate
Air Force Research Laboratory (AFRL)
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

The Electronic System Design Alliance, a SEMI Technology Community, today announced Axiomise, a leading provider of cutting-edge formal verification training, services and custom solutions, is the newest member of its growing ecosystem.

“It’s important for companies of our size to be part of the thriving electronic system design community,” remarks Dr. Ashish Darbari, CEO and founder of Axiomise. “The networking and educational events and technical programs offer us a platform to reinforce the value of formal verification in semiconductor design in the global electronics industry.”

“Verification is an increasingly critical part of system design,” adds Bob Smith, the ESD Alliance’s executive director. “We’re pleased Axiomise is now a member of our ecosystem and expect Ashish will quickly become a valued participant in our activities.”

As a member of the ESD Alliance, Axiomise is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Axiomise
Axiomise is dedicated to furthering the adoption of formal verification through its unique combination of training, consulting and services, along with specialized verification solutions for RISC-V. Founded by Dr. Ashish Darbari, a formal verification practitioner for over two decades, it offers cutting-edge, formal verification training, consulting and services. An active user of all formal technologies, including theorem proving, model checking and equivalence checking, Dr. Darbari and his team have trained more than 200 engineers across the semiconductor industry. Dr. Darbari has 47 patents in the field of formal verification.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process Control Smart Manufacturing Conference (APCSM).

The three-day conference, which is taking place in Austin, Texas, from October 10-13, brings together members of the microelectronics and related industries, including semiconductor OEMs and factories. The APCSM features tutorials, technical presentations, and exhibits covering various topics and trends related to APC, AI, and smart manufacturing.

Doug Suerich, PEER Group’s Product Evangelist and Director of Marketing, is co-chairing the conference alongside APCSM perennial Co-chair, Bradley Van Eck, James Moyne, an Associate Research Scientist at the University of Michigan and CTO of the Integrated Measurement Association (IMA), and John Pace, President of the IMA.

“We look forward to welcoming all attendees, presenters, and exhibitors to Austin for this year’s APCSM,” says Van Eck. “After two years as a virtual conference, being back in person is going to be great. We have an amazing lineup of tutorials and presentations that are sure to shed light on some of the current challenges our industry is facing and how innovations in advanced process control will help us overcome them.”

A key component of the APCSM is the Monday tutorials, which provide attendees with in-depth information on the latest trends and advancements in microelectronics manufacturing. Albert Fuchigami, Senior Software Developer at PEER Group, and the 2022 recipient of the Leadership Award for his contributions to the SEMI® Standards Program, is co-presenting the first of two tutorials. The tutorial, titled Understanding SEMI Information and Control Standards, will provide an overview of, and the philosophies behind, the SEMI Standards and how they fit together to help factories get data from equipment so it can be utilized to improve production capabilities. It will also provide technical details of these highlighted features.

For complete details, including agenda, presentation topics and how to register, visit the APCSM website.

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..