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United States Register Now MSIG PZ Webinar tile Business Technical Featured Speakers

Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.

Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.

In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.

United States

Jim Macy Kistler
Jim Macy
Application Expert BU Advanced Manufacturing
Kistler Instrument Corp.
Robert Hillinger
Robert Hillinger
Kistler Instrument Corp.
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG
MSIG

Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test. 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

HATFIELD, Pa. (USA) September 13, 2022 — Brooks Instrument, a world leader in precision fluid measurement and control technology, has launched a Korean-language website to provide its Asia-Pacific customers with better access to resources, including in-depth product info, technical documentation, white papers, service assistance and technical support.

The new www.BrooksInstrument.com/Ko-Kr website launch follows the recent opening of a new Brooks Instrument manufacturing and engineering center in Yongin, Gyeonggi Province, which significantly increased the company’s operational footprint in Korea. Building on more than two decades of operations in Korea, the local-language website further illustrates the company’s long-term commitment to the region, especially for the fast-growing semiconductor manufacturing sector.

“With our Yongin facility, we increased our ability to provide rapid repair, maintenance and calibration support to customers in the region and added another resource to help mitigate supply chain disruptions. With this new website, we’re further strengthening our commitment to support our partners in the Asia-Pacific region,” said Hans Sundstrom, Global Semiconductor Business Unit Manager for Brooks Instrument.

The website leverages best practices in design and navigation to help customers more easily access information they need and minimize project delays or disruptions. Key features of the new website include:

• Sitewide Korean language support to make it easier for customers to explore the Brooks Instrument catalog of products and documentation
• A “quick find” feature to easily locate products and documentation by name or model number
• Fully optimized site layout with simplified access to key products, technical information, guides and support services
• Specific industry sections with helpful application information for areas such as semiconductor manufacturing, life sciences and more

"We developed the new website as a platform to better serve our local customers,” said Jason Lee, Korea Country Manager at Brooks Instrument. “By adding native-language functionality, we’re further removing barriers to access as we continue to show customers how valuable their partnerships are to our business.”

To visit the new Brooks Instrument Korean-language website, go to www.BrooksInstrument.com/Ko-Kr.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.
For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

United States Register Now HI Webinar 2022

United States

10:00 am - 10:10 am
Kim Yess
Kim Yess
Executive Director, WLP Materials
Brewer Science, Inc.

Welcome & Introduction

10:10 am - 10:30 am
E. Jan Vardaman, TechSearch International
Jan Vardaman
CEO
TechSearch International, Inc.

Markets & Challenges Around Heterogeneous Integration

10:30 am - 10:50 am
Diane Sheele
Diane Scheele
Head of Marketing Surface Prep and Clean, Patterning Business Field
EMD Electronics

EMD Approach to the Rise of Heterogeneous Integration

10:50 am - 11:00 am

Q&A

EMG

As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation.  The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions.  Heterogeneous Integration is and will be the key technology direction going forward. This webinar will provide a heterogeneous integration overview and how material suppliers are responding to this dynamic technology environment.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

–– Silicon Assurance, a startup addressing security assurance and trust issues in silicon chips under the zero trust model, today joined the Electronic System Design Alliance, a SEMI Technology Community.

Founded in 2021, Silicon Assurance joined the ESD Alliance to connect with members of the community to understand their views on the technical challenges it is trying to address. “We view the ESD Alliance as the center of the electronic system design community,” notes Dr. Raj Gautam Dutta the co-founder and CEO of Silicon Assurance. “Our membership will give us access to other member companies and help us learn about the current state of the security market by interacting with other SEMI initiatives such as Smart Medtech, Smart Mobility and Smart Manufacturing.”

“Startups like Silicon Assurance help ensure the vibrancy and innovation of our design ecosystem,” comments Bob Smith, the ESD Alliance’s executive director. “It’s a pleasure to welcome Silicon Assurance to our member community and we look forward to its participation in our networking, educational opportunities and technical initiatives.”

As a member of the ESD Alliance, Silicon Assurance is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Silicon Assurance
Silicon Assurance was created in 2021 to address the challenge of building trust in silicon chips that drive electronic devices thar are increasingly smarter and more interconnected. It is at the forefront of addressing trust issues by providing security assurance solutions for silicon chips. Silicon Assurance provides best-in-class technologies to evaluate and protect chips used in electronic devices ranging from smartphones to self-driving cars. Its portfolio of products and expertise enhance customer confidence in their devices sold to end-users. www.siliconassurance.com

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance:
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #6.

Krish Raghunath
Sr Specialist, Conferences & Committees
[email protected]

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United States SiC Webinar 6 Business Technical

SiC—Silicon Carbide Webinar #6: Basal Plane Dislocation Defects and the Impact on Device Performance

 

Silicon carbide (SiC) chips are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting remaining barriers to mass commercialization including the higher-than-silicon chip cost that increases disproportionately with area, defects that limit chip yield and area, reliability and ruggedness concerns, and the need for a trained workforce to skillfully insert SiC into power electronics circuits.

With respect to fabrication, the SiC industry is successfully leveraging the fully depreciated legacy silicon fab infrastructure and is making the relatively small financial investments that allow mature silicon fabs to process SiC. A key aspect of cost-effective fabrication is limiting defects that degrade device performance and compromise yields. Over the past twenty years, significant progress has been made in improving SiC material quality, and Basal-Plane-Dislocations (BPDs) are the last major catastrophic defect. In this presentation, I will discuss how bipolar-current induced electron-hole pair recombination at basal plane dislocations generates stacking fault (SF) formation and expansion, which degrade on-state current conduction. I will present and interpret experimental data of several transistors that exhibit severe BPD related electrical degradation, and of others that demonstrate “intermediate” or no degradation at all. For impacted transistors, I will identify and analyze the electrical characteristics that exhibit degradation as well as those that remain unaffected under bipolar stress. Finally, I will show that BPD related degradation is fully reversed by high temperature annealing, and the transistor returns to its original “undamaged” operational state.

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Join us online for the sixth webinar in the Silicon Carbide Series.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1 Register Now
Event format

REGISTRATION

Member Price: Complimentary

Non-Member Price: $49

SAP Employees, Customers & Partners: Use the Promo Code provided via email from SAP or contact Dyan Schertler, [email protected].

Registration is final. No refunds provided. Following the Virtual Forum, all registrants will receive a link with content.

EVENT CONTACT
Mark da Silva
[email protected]

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United States Register Now Smart Manufacturing Webinar 2022 - Accelerate Your Industry 4.0 Transformation Business Executive Technical

Partner & Sponsor

Sponsor & Partner SAP

Accelerate Your Industry 4.0 Transformation
by Combining Your ERP and Manufacturing Data 

WHAT IF YOU

  • Accurately can assess your cost of yield and products?

  • Track your sales from order entry to delivery and, if needed, trace them back to the lot with accurate genealogy?

  • Receive financial insights into areas such as manufacturing waste, capacity, or utilization, and the impact they have on corporate profitability?

  • Visualize cause-and-effect relationships across your financial, supply chain, and manufacturing data sets?

JOIN US for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.

United States

THURSDAY, SEPTEMBER 22, 2022

10:00 am - 10:05 am
Mark da Silva
Mark da Silva, PhD
Sr. Director Smart Manufacturing
SEMI

Welcome Remarks

10:05 am - 10:55 am
Satish Maktal, SAP
MODERATOR
Satish Maktal
Industry Advisor, High Tech
SAP

Executive Panel Discussion & Q&A—Accelerate Your Industry 4.0 Transformation by Combining Your ERP and Manufacturing Data

Jeff Howell, SAP
EXECUTIVE PANELIST
Jeff Howell
Global Strategy Leader, Global VP
SAP
Kimon Michaels, PDF Solutions
EXECUTIVE PANELIST
Kimon Michaels
Executive VP, Products & Solutions, Director & Co-Founder
PDF Solutions
Surya Iyer, Polar Semiconductor
EXECUTIVE PANELIST
Surya Iyer
President and COO, Board Member
Polar Semiconductor
10:55 am - 11:00 am

Closing Remarks

WEBINAR: 1011am Pacific Time 

Organized by SEMI in Partnership with SAP

Join us for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Illinois Institute of Technology (Illinois Tech) alumnus Rick Carlson (MATH ’70), vice president of sales for Verific Design Automation, a leading provider of SystemVerilog, Verilog, VHDL, and UPF Parser Platforms, has been elected to the College of Computing Board of Advisors.

Carlson graduated from Chicago’s comprehensive tech-focused university with a Bachelor of Science in Mathematics and was also a member of the Illinois Tech men’s basketball team. “I’m exceptionally proud to join the College of Computing’s Board of Advisors,” he says. “Illinois Tech and the College of Computing provide students of all backgrounds with the best-in-class computational and data science platform to excel in their respective fields.”

With more than 40 years of experience in the electronic design automation (EDA) industry, Carlson will help the College of Computing promote its collective power of difference to advance technology and progress for all. He will serve as an advocate to reinforce the college’s position as the leading creator of computational talent, knowledge and innovation for Chicago and beyond.

Carlson is a Lanza techVentures Investment Partner and an adviser to many EDA startups in his role as vice president of sales for Verific. He was one of the co-founders of the ESD Alliance (formerly the EDA Consortium), an industry trade association that is a SEMI Technology Community. While at Highland Software (now Flexera Software), Carlson helped launch FLEXlm, a software license manager intended for corporate environments to provide floating licenses to multiple computer software end users.

About Illinois Institute of Technology’s College of Computing
Illinois Tech created the College of Computing in 2020 as part of an effort to drive Chicago’s thriving tech ecosystem by educating a future diverse workforce that is rigorously trained in data and computation. Illinois Tech is home to the Midwest’s only Bachelor of Science in Artificial Intelligence degree, and the numerous cybersecurity and intelligence pathways at Illinois Tech explore not only the deep foundations of fast-growing fields of computer science, but also emphasize societal ethics in developing this technology. The United States Department of Homeland Security and the National Security Agency have designated Illinois Institute of Technology (Illinois Tech) as a National Center of Academic Excellence in Cyber Defense Education. The university’s Center for Cyber Security and Forensics Education (C2SAFE) is at the core of Illinois Tech’s designation. Additionally, the center is a member of the United States Strategic Command (USSTRATCOM) Academic Alliance and North American Defense and Security Academic Alliance (NADSAA).

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

PENANG, MALAYSIA - August 2022 ViTrox Technologies, aims to be the world’s most trusted vision inspection solutions provider to the Semiconductor and SMT PCB Assembly industries, is pleased to present the latest edition of Tray-based Vision Series - TH1000SEi Tray-to-tray vision handler. TH1000SEi is a user-friendly model designed that allows you to enjoy high-speed tray to tray inspection capabilities while improving cost efficiency.

TH1000SEi will be your first choice to fulfil all the stringent inspection requirements of today’s advanced integrated circuit (IC) packaging market. This special edition of the Tray-to-tray vision handler features the world's most cutting-edge vision technologies for various IC package sizes ranging from 3mm x 3mm to 40mm x 40mm with no conversion needed on its vision module for the 6-sided inspection.

With an auto-pitching mechanism, TH1000SEi allows you to enjoy speedy and reliable nozzle pitch conversion time with its fourteen (14) pick-up nozzles. Having fourteen (14) pick up nozzles optimizes the machine throughput up to 33,000 units per hour (UPH). Additionally, the warpage clamper flattens unbalanced trays during the process. With this user-friendly and simple operating model, you can enjoy the highest performance in your precise production environment.

Besides, TH1000SEi is designed with various innovative vision technologies to provide high speed, high accuracy, and one-stop vision inspection solutions. Our TH1000SEi supports leaded packages inspection, ball packages inspection, and leadless packages inspection, suitable for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP, etc. Apart from all these attractive features, we offer additional inspection capabilities add-ons such as 2D barcode inspection, mark inspection, package vision inspection, passive component inspection, top colour inspection, etc.

Apart from these features, TH1000SEi is also upgradeable with the tape module for more high speed tray to tape and reel inspection capabilities. Ultimately, the TH1000SEi maximises inspection capabilities, allowing you to achieve maximum machine throughput cost-effectively.

For more exclusive details on the Tray-based Vision Handler series or TH1000SEi, contact our experts at [email protected] for further assistance.

About ViTrox Technologies
Since its inception in 2000, ViTrox aims to be the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances. ViTrox offers a full spectrum of advanced 3D vision inspection solutions, including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 Smart Manufacturing Solution. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.