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Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Yee Ching (YC) Wong has joined the company’s senior leadership team as Vice President of Business Development for the Asia Pacific region.

Mr. Wong, who is based in Singapore, assumes overall responsibility for driving product penetration and for increasing backlog and revenue in the region. He will work closely with YES’s Global Sales team to meet booking and revenue targets, expand the customer base, and address new opportunities.

Prior to joining YES, Mr. Wong spent six years as Senior Director of Product Marketing at Veeco SE Asia Pte. Ltd. In that role, he successfully managed the integration of the Ultratech and Veeco sales teams in the region and delivered exceptional results with major customers. His tenure at Ultratech began in 2004 as a Senior Sales Manager in Shanghai and rose through Sales positions of increasing responsibility in Taiwan, China, Korea, and Singapore to become Ultratech’s General Manager of Litho Sales in Asia.

“I am very pleased to welcome YC to the YES senior team,” said Alex Chow, President of YES Asia. “YC is a proven leader and brings with him an impressive track record in the semiconductor capital equipment market. We expect his market understanding, business acumen, and well-honed teambuilding skills to serve him well in driving market share growth for YES in this dynamic region and strengthening key customer relationships at the C-suite and SVP level.”

Mr. Wong holds a bachelor’s degree in Business Administration from the University of Western Sydney, Australia, and an MBA from the National University of Singapore.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

Brewer Science Presents Future of Water Condition Monitoring at Consumer Electronics Show (CES) 2023
Advancing the future of water sensing for real-time detection of lead, nitrate and pH using printed sensors
Las Vegas, Nevada – January 2, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be presenting its newest innovations in Smart Devices at the Consumer Electronics Show (CES) at The Venetian Expo in Las Vegas, Nevada, January 5th through 8th.

Brewer Science will share its vision for advancing the future of water sensing. Its intelligent products empower people to manage critical global resources, such as safe drinking water, to create a sustainable future. Real-time detection of lead, nitrates and pH form the foundation of Brewer Science's technology platform.

Brewer Science’s innovative water sensors are made possible by combining printed electronics with next generation materials. The result is a continuous real-time monitoring platform that has the ability to create multisensing arrays and associated multifaceted sensor solutions. This system is incredibly adaptive and can be integrated and customized for use in numerous industries, applications and use cases.

“Bringing integrated and connected water monitoring solutions to the market requires a sophisticated commitment to material science.  Brewer Science’s decades of experience as a leading manufacturer of next generation materials is enabling the transformative future of water sensing,” according to Robert Frueh, Senior Manager of Business Development – Emerging Technologies at Brewer Science.

Connect with Brewer Science at the Organic and Printed Electronics Association (OE-A) pavilion, Booth 51239.

Brewer Science is looking forward to engaging with other technology leaders at CES to integrate and bring their real-time condition monitoring capabilities to the global market. To meet with an expert, simply submit a request via the contact form on Brewer Science’s website.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

Heidelberg, Germany – We are happy to announce that one hundred and fifty MLA 150 Maskless Aligners have been successfully installed worldwide at our customers facilities. First launched to the market in 2015, the revolutionary maskless technology of the MLA 150 has become firmly established within the advanced microfabrication community.

The MLA 150 was the first and only tool that has become a true alternative to mask-based aligners, offering extremely high exposure speed, high frontside and backside alignment accuracies, warpage compensation, high resolution and high accuracy, and the ability to expose on any substrate size from pieces that are a few square millimeters up to full 8” wafers. Further adding to the flexibility, the non-contact exposure technique for the MLA150 in addition to the simple ease of use makes this the ideal tool in rapid prototyping environments, for low to mid-volume production, and for research and development. Common application areas include MEMS, electronics, micro-optics, micro-fluidics, sensors, and many more.

École Polytechnique Fédérale de Lausanne (EPFL) – Pioneer in maskless technology
The beta-version of the MLA 150 was installed in August 2014 at the Center of MicroNanoTechnology (CMi) of the renowned École Polytechnique Fédérale de Lausanne (EPFL) located in Switzerland, being one of Europe’s most vibrant and cosmopolitan science and technology centres. The CMi is a complex of clean rooms and processing equipment devoted to microtechnology made accessible to trained academic and industrial users. The CMi is at the same time one of the pioneers in maskless lithography.

In 2022, the CMi purchased their second MLA 150 Maskless Aligner, which was installed most recently. “The MLA 150 is today one of the most important equipment in our facility, and there are many users that daily use the machine for printing. So, we wanted to have two of them”, emphasizes Julien Dorsaz, the manager of the photolithography division of the CMi. To get insights into the work at the CMi, and to learn about the MLA 150 experience of the users, we conducted a 30-minute interview with Julien Dorsaz. Get the full interview on our YouTube channel.

Today, the MLA 150 serves as a trusted, indispensable workhorse in many multi-user facilities, microfabrication labs, and research institutes. Since its market introduction, the MLA 150 has developed into one of our most important technologies in our company’s product portfolio. Setting the bar for state-of-the-art maskless lithography, the MLA 150 promises continuous market growth in the coming years.

For further information please visit: www.heidelberg-instruments.com

Rochester, N.Y. -- Linton Crystal Technologies (www.lintoncrystal.com) announces Scott Blazey has joined the company as Director of Operations. Located in Henrietta, New York, Linton is the world leader in the design, development and manufacture of Czochralski silicon furnaces for production of monocrystalline silicon ingots for the semiconductor and solar industries.

“Scott brings with him a wealth of experience in operations, as well as direct knowledge of our Czochralski furnaces and the silicon ingot growth process,” says Todd Barnum, president and COO of Linton Crystal Technologies. “This, combined with his track record in the areas of cost reduction, continuous improvement, quality control, and employee and business development, will help us take advantage of new opportunities in both solar and semiconductor.”

Blazey has a passion for problem-solving, quality control and employee and business development. He most recently served as senior manager of quality for Gleason Works in Rochester, New York. In this position, he focused on driving down the cost of poor quality through process development and continuous improvement. In his previous role, he managed operations and manufacturing for Gleason Works automation and CNC divisions. There, he implemented processes to reduce manufacturing variance and lead time while improving upon on-time delivery. As the operations manager, he successfully led the development, production and installation of many projects for tier one automotive manufacturers. Prior to joining Gleason, he worked for Kayex SPX. Over the course of five years there, he moved from field service engineer to field service site manager, and ultimately to project manager/process development engineer.

Linton specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology since 2013.

For more information, visit www.lintoncrystal.com.

# # #

Deventer, December 15, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and NOVELDA, the world leader in UWB (Ultra-Wideband) sensing solutions, today announce that the companies have reached agreement on the qualification, test and supply of NOVELDA’s new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. This ability enables NOVELDA to offer the most reliable human presence sensor in the world. It will automatically activate a device like a laptop, an LCD screen or a ceiling lamp, when you need it, and turn the device off when you leave. This is useful in a variety of indoor applications in consumer electronics, building automation and in smart building systems. NOVELDA UWB Sensor enables new levels of user experience, increases safety, and reduces energy consumption.

The cooperation with RoodMicrotec as European partner enables NOVELDA to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes and rapid launch of production testing and supply. Furthermore, being a long-term partner, RoodMicrotec will support NOVELDA in continuously optimizing testing procedures to drive cost down over time.

RoodMicrotec will be partnering with NOVELDA in serving the global UWB market, which is forecasted by TSR (Techno System Research) to reach from 300 million units shipped in 2022 towards more than 1.8 billion units shipped by 2030.
“This collaboration provides us with faster time-to-market of our innovative UWB solutions, continuity of supply and constant focus on improvements both in quality and cost”, says Jan-Bjørnar Lund, NOVELDA’s CEO.
For RoodMicrotec, this partnership matches well within its portfolio of capabilities and services, as European leading test house.

Martin Sallenhag, CEO of RoodMicrotec, says: “This partnership is right within the sweet spot of our business proposition; combining our expertise with our customers' interests. We support our customers with state-of-the art RF test development and equipment in 24/7 highly flexible production test environment, complying with world class quality standards.”

About NOVELDA
NOVELDA, the world leader in UWB sensing solutions, provides the world’s most accurate, intelligent and reliable sensor solution for human presence detection. NOVELDA Ultra-Wideband (UWB) short-range impulse radar sensors help save energy and achieve new levels of user experience and interactivity in a variety of indoor applications, including consumer electronic devices and smart building systems. NOVELDA technology complies with worldwide UWB regulations and is protected by several design patents.

Further information
Tove Elisabeth Lutdal – VP Marketing
Phone: +47 90 73 49 49 Email: [email protected] Web: www.novelda.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Phone: +31 570 745623 Email: [email protected] Web: www.roodmcirotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Breker Verification Systems, the leading provider of advanced test content synthesis solutions, today unveiled the Breker Integrity FASTApps™ Portfolio, a library of automated test generation intellectual property (IP) elements targeting difficult-to-verify processor core and system-on-chip (SoC) scenarios.

The FASTApps provide commercial-grade, high-coverage verification for RISC-V processor cores and the SoC platforms that use them.

“The RISC-V Open ISA concept, while powerful, introduces verification challenges to engineering teams unfamiliar with processor complexities,” observes David Kelf, Breker’s CEO, an active RISC-V Consortium member involved with a public effort to improve RISC-V verification methodologies. “By automating test content generation, Breker’s years of verification experience can be encapsulated and applied across many projects, driving high test coverage with a minimal level of effort.”

Breker’s new Integrity FASTApps, ideal for the verification of processors based on the RISC-V Open Instruction Set Architecture (ISA) provide specific test sets for both processor core integrity and the System-on-Chip (SoC) that encompass these cores.
The Processor Core Integrity FASTApps include commonplace, but hard-to-verify scenarios such as load store integrity, random instruction testing, register-to-register hazards, conditionals and branches, exceptions, async. interrupts, privilege level switching, core security, exception testing (memory protection and machine-code integrity), virtual memory/paging and core coherency.

In addition, the SoC Integrity FASTApps include random memory and register tests, system interrupt testing (external, timing and software interrupts), multi-core execution, memory ordering, atomic operations, system coherency, system paging and memory management unit (MMU) operations, system security and power management.

Also available are apps for end-to-end multi-IP SoC testing and early firmware testing for RISC-V.

The FASTApps make full use of the Breker Test Suite Synthesis technology. Features include seamless portability across the entire verification flow and execution platforms, coverage-driven and pre-execution randomization for enhanced use models, powerful debug and performance profiling capability, and concurrent test set. They integrate fully with the Breker TrekApps such as the system coherency, security, power domain, networking and other system verification IP tests for fully comprehensive SoC and core-level verification.

Availability and Pricing
The Breker Integrity FASTApps for RISC-V as well as Arm and X86 based systems are available today.
Pricing is available upon request. Special introductory pricing applies to the FASTApps.
For more information, visit the Breker website or email [email protected].

Breker at the RISC-V Summit
Breker executives and technical staff will be part of the RISC-V Summit program held Tuesday, December 13, and Wednesday, December 14, at the San Jose Convention McEnery Center in San Jose, Calif.
John Sotiropoulos, principal engineer at Breker, will present “The New Verification Ecosystem that Supports RISC-V Verification for all Adopters” with Lee Moore, consulting engineer at Imperas Software, December 13 at 4:20 p.m. P.S. T.
Adnan Hamid, Breker’s CTO, will address “RISC-V SoC and Processor Integrity: Dealing with Unique RISC-V Integrity Issues” December 14 at 12:10 p.m. P.S.T.
Send email to [email protected] to arrange a meeting.

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

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Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.

Speaker Bio 

Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials. 

Online, Virtual
United States

Nikhil Jani
Nikhil Jani
Business Development Specialist
Zeon Specialty Materials
MSIG

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.  

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

Registration is underwritten by SEMI MSIG

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Wafer Fabricated Atomic Reference Cells

Tom Kornack, Chief Scientist, Twinleaf LLC

Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.

Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.



Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays

Dr. Dirk Lewke, Team Leader Technology Innovation Management

 

Abstract:  This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.

Speaker Bio:  Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.

Online, Virtual
United States

Tom Kornack
Dr. Thomas Kornack
Chief Scientist
Twinleaf LLC
Dirk Lewke
Dr. Dirk Lewke
Team Leader Technology Innovation Management
3D-Micromac
MSIG

We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.  

These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device?  Then this is the webinar series for you.  

Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

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Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.      

Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.     

Speakers will discuss strategies for mitigating the impact and how to capture value.   

Topics include:

  • Market Trends & Forecast & Outlook    

  • Accessing Chips Act Funding and Roll out of Incentives  

  • Geopolitical Impact    

  • Advanced Packaging & Chiplets     

  • Emerging and Expanding Markets    

 

This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time

United States

Virtual Forum | Thursday, March 16, 2023 | Pacific Time

8:30 am - 8:35 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am - 8:55 am
John Cooney
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI

An Update on the CHIPS Act and How to Apply for Funding

8:55 am - 9:20 am
Jay Vleeschhouwer, Griffin Securities
Jay Vleeschhouwer
Software Research
Griffin Securities

The State of EDA: A View from Wall Street

9:20 am - 9:45 am
Dan_Hutcheson_VLSIresearch
Dan Hutcheson
Vice Chair
TechInsights

New Perspectives in Semiconductors: Cycles & Outlooks

9:45 am - 10:10 am
Jean-Christophe Eloy, Yole Développement
Jean-Christophe Eloy
President and CEO
Yole Développement

Status of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?

10:10 am - 10:35 am
Lita Shon-Roy
Lita Shon-Roy
President/CEO
TECHCET

The Impact on Supply Chains - Materials & Equipment Consumables

10:35 am - 11:00 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Q&A and Closing Remarks

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

8:30 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2
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