Deventer, June 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and EnSilica plc, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), today announce that they have successfully brought a mixed signal automotive ASIC to commercial production following the official launch of a new flagship vehicle by a premium automotive company. The ASIC provides key differentiating features in the chassis control of the vehicle.

As announced in 2018, RoodMicrotec was selected by EnSilica to support it in the qualification and testing of this mixed signal automotive ASIC. RoodMicrotec will undertake final testing and shipment of the ASICs for EnSilica.

EnSilica is pleased to confirm that the main production run has now commenced with the official launch of the vehicle. The production schedule for more than 2.5 million ASICs over the next 12 months has been received. The ASIC has an anticipated seven-year production life and depending on the model, there are up to 24 ASICs per vehicle.

“It has been exciting to support EnSilica in bringing this project to production over the last few years. We are now looking forward to supporting production of this device in our Nördlingen facility”, says Martin Sallenhag, CEO of RoodMicrotec. “It again shows the demand for our unique combined capabilities, in depth experience and excellent track record in bringing automotive products to the market for our valued customers.”

“We are delighted to be entering the full production volume of this exciting project, having successfully collaborated with RoodMicrotec over a number of years. Our joint effort across this highly technical automotive project has now resulted in successful launch of the vehicle”, says Ian Lankshear, CEO of EnSilica.

About EnSilica
EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has a design centres across the UK and in Bangalore, India and Porto Alegre, Brazil.
Further information on EnSilica at www.ensilica.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
Further information on RoodMicrotec at www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about Premium Automotive Vehicle Launched with EnSilica’s Key Mixed Signal ASIC

Brewer Science presents EUV lithography innovation at largest tech conference in Asia
Roles of underlayers in EUV lithography is the keynote speech at CSTIC 2022
 

Rolla, Mo. June 20, 2022 - Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present the keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, at the China Semiconductor Technology International Conference (CSTIC), one of the largest and the most comprehensive annual semiconductor technology conferences in Asia.

Semiconductor Innovation Requires Materials for Extreme Ultraviolet Lithography (EUV)
EUV lithography is used to pattern the smallest features in advanced semiconductor devices. The demand for smaller devices with more capabilities requires industry innovation in EUV processes and materials. Additionally, EUV plays a critical role in the evolution of technology and enables the continuous advancement of the semiconductor roadmap, as it provides the capabilities of higher processing power, while using less energy, and providing higher performance. However, one of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.

 
Roles of Underlayers in Novel Patterning for EUV Lithography
Dr. Douglas Guerrero, Senior Technologist at Brewer Science, has published over 60 papers in the areas of conducting polymers, BARCs, DSA, and underlayers for EUV lithography, and is an inventor on over 20 US patents. In his keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, during the Symposium II: Lithography and Patterning at CSTIC, he will provide information on the device and materials roadmap, as well as answer questions to the most critical questions in the industry:

• How does overall EUV patterning require thinner layers?
• What challenges do chemically amplified resists (CARs) and underlayers face?
• What role will underlayer play in future patterning?
• What are the options for patterning without a CAR?

Additionally, Zhimin Zhu, Senior Scientist at Brewer Science, will be co-chairing the Session II panel, Lithography Materials, within the Symposium II: Lithography and Patterning.

CSTIC will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. CSTIC is organized by SEMI and IEEE-EDS, co-organized by IMECAS. The conference will be held June 14th, 2022 through July 12, 2022 accessed online through the SEMI Cloud.

If you are unable to attend, but wish to learn more about Brewer Science’s innovative EUV lithography materials, you can visit our website to view datasheets and schedule a call with an EUV expert.

 
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science presents EUV lithography innovation at largest tech conference in Asia

Breker Verification Systems, the leading provider of advanced test content synthesis solutions for SoC, UVM and Post-Silicon verification environments, appointed FirstEDA as its exclusive European distributor.

Twenty-year-old FirstEDA, a value-added distributor of design automation tools and training in Europe, now sells and supports Breker's TrekSoC™ and TrekUVM™ tools that automatically generate self-verifying test cases for multi-threaded, multiprocessor SoC devices and UVM block-based verification. Breker selected FirstEDA for its experienced and highly skilled engineering staff and understanding of the needs of the verification community.

“Breker stands out in the field of verification tools and solutions,” says Julian Lonsdale, Sales Director of FirstEDA, based in the U.K. “It consistently delivers high-quality, innovative and versatile tools to solve the challenges facing verification engineers.”

“FirstEDA is recognized as a trusted and well-connected European partner,” remarks Dave Kelf, Breker’s CEO. “Choosing to partner was an easy decision because we value the skillset and expertise it provides and know our relationship will flourish.”

About Breker Verification Systems
Breker Verification Systems is a leading provider of verification synthesis solutions that leverage SystemUVM, C++ and Portable Stimulus, a standard means to specify reusable verification intent. It is the first company to introduce graph-based verification and the synthesis of high-coverage test sets based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

• Read more about Breker Verification Systems Appoints FirstEDA as Exclusive European Distributor

Breker Verification Systems, the leading provider of advanced test content synthesis solutions for SoC, UVM and Post-Silicon verification environments, named NeXtream of Yokohama, Japan, as its exclusive distributor in Japan.

NeXtream, supplier of software, hardware and intellectual property (IP) created outside of Japan, now sells and supports Breker's TrekSoC™ and TrekUVM™ tools that automatically generate self-verifying test cases for multi-threaded, multiprocessor SoC devices and UVM block-based verification. Breker selected NeXtream for its marketing and sales professionalism and understanding of verification and validation, electronic design automation (EDA) and intellectual property (IP) markets.

“The verification engineering community here and elsewhere needs a solution to automatically generate thousands of tests for every semiconductor design project,” comments Tsunemori Kawahara, president and CEO of NeXtream. “Breker’s TrekSoC is such a solution and is embraced throughout the global chip design verification community.”

“NeXtream has deep ties into the chip design and verification community in Japan and a reputation for exceptional support,” remarks Dave Kelf, Breker’s CEO. “We look forward to a developing a close working relationship.”

About Breker Verification Systems
Breker Verification Systems is a leading provider of verification synthesis solutions that leverage SystemUVM, C++ and Portable Stimulus, a standard means to specify reusable verification intent. It is the first company to introduce graph-based verification and the synthesis of high-coverage test sets based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

• Read more about Breker Verification Systems Names NeXtream Exclusive Distributor in Japan

Zurich, Switzerland / Heidelberg, Germany – Heidelberg Instruments Nano AG in Zurich, a subsidiary office of Heidelberg Instruments Mikrotechnik GmbH celebrated the 10-year anniversary of the commercialization of the NanoFrazor system series. The NanoFrazor is based on the Thermal Scanning Probe (t-SPL) technology and can be used for nanopatterning of quantum devices on 1D/2D materials, grayscale photonics devices, nanofluidic structures or biomimetic substrates for cell growth.

Originally the Thermal Scanning Probe technology was developed at IBM, where a group of researchers showed that the sharp tips of atomic force microscopes can be heated and used as a tool to “drill” nanoscale holes and later to write arbitrary nanostructures by using special, evaporating materials.

After exploring the technology at IBM, Felix Holzner and Philip Paul incorporated SwissLitho AG as a spin-off from ETH Zurich (Heidelberg Instruments Nano AG since 2021) as CEO and CTO with the idea of selling nanolithography equipment for t-SPL. The technical term “Thermal Scanning Probe Lithography” was then replaced by the product name “NanoFrazor”.

After starting operations of then SwissLitho in early 2013, the first commercial NanoFrazor machine named “Titlis”, a NanoFrazor Explore, was installed in 2014 at McGill University in Canada. “Titlis” is still running and just recently received an upgrade with the integration of the laser writer module jointly developed in Heidelberg and Zurich. Today, more than 50 NanoFrazor systems have been installed at renowned facilities all over the world, with new customers lined up for future systems.

“The NanoFrazor team in Zurich works on various promising developments on the instrument as well as on the materials to continuously expand the applications range of the technology. There are still manifold open opportunities for the NanoFrazor, as it can still be considered novel, even 10 years after the start of its commercialization. Everyone at Heidelberg Instruments is excited to see how the NanoFrazor will have developed in another 10 years from now”, Konrad Roessler, CEO of Heidelberg Instruments Mikrotechnik says.

The anniversary was celebrated in the newly opened office of Heidelberg Instruments Nano in Zurich together with family, friends, and numerous partners, who supported the successful journey of the NanoFrazor.

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.

• Read more about Heidelberg Instruments celebrates 10 years of NanoFrazor

Primarius Technologies today announced its SDEP™ intelligent spec-driven model extraction platform has been adopted by Samsung Foundry.

SDEP helps Samsung Foundry and its customers significantly shorten turnaround time for SPICE model development, accelerating development competitiveness at legacy nodes, and enabling fast Design Technology Co-Optimization (DTCO) iterations at advanced process nodes. By continuously embedding know-how in the customized flow, engineers can run automated flows with more than 50% efficiency improvement for curve fitting. That solves resource shortage problems for multiple projects and ensures high-delivery quality of SPICE models independent of engineer’s experience level.

“Samsung and Primarius achieved another success with SDEP’s adoption after intensive testing and qualification of the technology on our advanced process platforms,” remarks Jongwook Kye, Executive Vice President of Foundry Design Enablement Team at Samsung Electronics. “Our mutual customers will benefit from having faster time to market with reduced model development and delivery time. With a SDEP setup, we can provide high-quality SPICE model and meet increasing customer demands with our available engineering resources.”

“Samsung has been a long-time Primarius customer and a strategic partner,” comments Dr. Zhihong Liu, Primarius’ Chairman and CEO. “SDEP is a revolutionary technology to enable an efficient DTCO and meet the toughest needs from advanced process development. We’re glad that SDEP is being adopted by Samsung Foundry, which enables fast iterations with design groups and further increases Primarius’ value as a Samsung SAFE ecosystem partner.”

SPICE modeling is more challenging and takes more effort at smaller technology nodes where device characteristics are more complicated. It now takes several months to develop a full SPICE model library for IC design after process technology development is completed.

In the post-Moore’s Law era, challenges include continuous shrinking of transistors and new process platforms for different applications using older technology nodes. Each variety of a process platform requires a dedicated effort on SPICE model development and foundries see more model development requests than previous generations. As a result, delivery of fast and accurate SPICE models with limited engineering resources is a challenge when faster time to market and quick iterations between process development and circuit designs are expected.

About SDEP
An innovative model development platform designed to tackle advanced SPICE modeling challenges, SDEP provides a system to retain and receive device modeling expertise and build automated flows for different process platforms and applications with intelligent target-oriented algorithms. Modeling experts can establish fully customized model auto-extraction flows for different applications using powerful and flexible modules available. With a built-in parallel SPICE as the core simulation engine for fast performance, it has integrated data analysis and validation utilities, rich parameter control and optimization functions as well as flow automation features.

At 2022 Design Automation Conference
Primarius Technologies will exhibit at the 2022 Design Automation Conference (DAC) in Booth #1419 (First floor) Monday, July 11, through Wednesday, July 13, from 10 a.m. until 6 p.m. at the Moscone Center in San Francisco.

To arrange a meeting or demonstration of the Primarius Technologies product line, send email to: [email protected].

About Primarius
Primarius Technologies (688206.SH) is a global EDA company delivering industry-leading design enablement technologies for advanced SPICE modeling, PDK generation and standard cell library characterizations, and a complete DTCO-enabled custom design EDA flow for complex memory, analog and mixed-signal designs. Powered by leading edge SPICE/FastSPICE simulation technologies, Primarius is committed to deliver innovative DTCO EDA solutions, with the mission to shorten time-to-market and improve YPPA of circuit designs at advanced process nodes, and unique data-driven EDA solutions, supported by full range of semiconductor parametric testing systems and industry’s golden low frequency noise testing systems. Visit Primarius Technologies for more information.

• Read more about Samsung Foundry Adopts Primarius’ SDEP to Shorten SPICE Model Development Turnaround Time

NexTech Batteries, the global leader in proprietary lithium-sulfur battery technology, today named Lucio Lanza, managing partner of Lanza techVentures, to its Board of Directors.

In announcing Lanza’s appointment, Bill Burger, founder, chairman and CEO of NexTech Batteries, praised him for his technical abilities, business acumen and ability to identify the promise of entrepreneurial ventures. “I had the pleasure of working with Lucio at Intel and know the valuable insights he brings to a company he believes in,” says Burger. “Lucio and I will work closely to meet NexTech’s mission to make batteries more affordable, more durable and safer.”

“NexTech is focused on sustainability and environmental stewardship,” notes Lanza. “It holds the promise of delivering solid-state batteries to revolutionize the automotive industry, renewable energy and grid storage applications and portable electronics while setting a new standard in energy density, safety and cost. With Bill Burger’s leadership, extensive experience and well-honed skillset, NexTech is certain to meet its goals to become the leading company in the world for energy storage. I’m delighted to be named to NexTech’s board.”

Headquartered in Carson City, Nevada, NexTech batteries develops lithium-sulfur (Li-S) battery technology using processes and earth-friendly materials to produce batteries with energy densities and overall power superior to current lithium-ion batteries. It was founded in 2016 after securing license rights and patents to lithium sulfur battery technology developed at Lawrence Berkeley National Laboratory, recognizing the promise and scientific superiority of lithium sulfur.

About NexTech Batteries
NexTech batteries is a global leader in lithium-sulfur battery science underpinned by patented processes and materials that produce energy density far superior to previous generation batteries. The Carson City, Nevada- based company is positioned to offer lithium-sulfur batteries with unparalleled safety, superior performance, lower weight and lower cost to global vehicle electrification, consumer electronics, renewable energy storage, aircraft and more. Focus on a more ethical supply chain and environmental stewardship is reinforced by the company’s push for U.S.-sourced materials and no reliance on expensive or foreign commodities. NexTech batteries was founded in early 2016 and was the result of the exclusive license to the rights and patents to the lithium-sulfur battery technology developed at Lawrence Berkeley National Laboratory.

About Lanza techVentures
Lanza techVentures is an early-stage investment firm that transforms innovative startups into high-value companies through unique vision, insight and a profound understanding of technology and its trends. Founded in 2001 by Lucio Lanza, Lanza techVentures acts as a strategic partner and advisor for early- to mid-stage companies in the design software and IP, semiconductor and the open-source silicon movement, healthcare and biotechnology market sectors. Dr. Lanza, who serves as Lanza techVentures’ managing partner, has been active in the technology sector as an engineer, an executive and an investor for more than 50 years. Computer and chip design done today directly benefits from the critical role that he and Lanza techVentures play in bringing key technologies to market, having invested in more than 50 companies in Silicon Valley and beyond. Many of these companies continue to be growing concerns, while others have reached successful outcomes through an IPO or by merger or acquisition with other companies.

Follow Lanza techVentures at:
Website: http://lanzatechventures.com/
Twitter: @LTechventures
LinkedIn: https://bit.ly/3CFKlxn

• Read more about Lanza techVentures’ Lucio Lanza Joins NexTech Batteries Board of Directors

Cape Town, Western Cape: May 24th, 2022 — DataProphet Operations Pty Ltd announced today that The Globee® Awards has named DataProphet a winner of both the Grand Trophy and a Gold Globee®.

The bestowal of the Gold Globee® and the Grand Trophy on DataProphet—by the organizers of the world’s premier business awards programs and business ranking lists—recognizes DataProphet’s global preeminence as a Disruptor Company in the manufacturing space. In their consideration, Globee® noted that in one advanced industrial context, DataProphet’s AI-as-a-Service achieved 2022% ROI within a year for a manufacturer client, simultaneously offsetting its own lifetime Co2.

DataProphet has created a novel and fully scalable IIoT system architecture (CONNECT) for its multi-award-winning flagship AI product (PRESCRIBE). Its product suite empowers manufacturers to achieve Digital Maturity (i.e., a fully connected factory) while putting the automating intelligence of prescriptive analytics, powered by deep learning discovery—at the fingertips of factory operators.

DataProphet delivers its AI-driven guidance via an intuitive HMI (human-machine interface) through which factory operators enact preemptive adjustments to control plans and machine setpoints. These course corrections allow them to meet and exceed production KPIs, drive sustainable production, and increase the useful lifecycle of a plant’s high-value production assets.

Because they run on industrial data already owned by the manufacturer, DataProphet’s process optimization and prescriptive maintenance solutions are non-capital intensive and apply across multiple manufacturing verticals. They are also deployed with collaborative value tracking and measurement for guaranteed RoI. For example, one deployment reduced the robotic stud welding defects of an automotive original equipment manufacturer (OEM) for an annualized RoI of up to 75x the OEM’s investment.

CEO Frans Cronje co-founded DataProphet in 2014, inspired by the significant, measurable value that prescriptive AI could bring to local manufacturers as an industry consultant. Since then, his purpose has been to establish this innovative, results-driven company as the leading global provider of AI-as-a-Service for manufacturing. In response to receiving this award, Frans Cronje had the following to say:

“The DataProphet team is delighted to be recognized by The Globee® Awards as a Gold Globee® Grand Trophy winner. Through our AI-as-a-Service and AI-driven product suite, we’re committed to helping manufacturers achieve their Industry 4.0 goals and build a solid foundation for data-driven solutions towards autonomous manufacturing. We believe this recognition from Globee® is further validation that DataProphet is moving in the right direction.”

About the Globee® Awards
Globee Awards are conferred in nine programs and competitions: the American Best in Business Awards, Business Excellence Awards, CEO World Awards®, Cyber Security Global Excellence Awards®, Disruptor Company Awards, Golden Bridge Awards®, Information Technology World Awards®, Sales, Marketing, Service, & Operations Excellence Awards, and Women World Awards®. A judging panel of industry peers and experts recognizes the outstanding accomplishments and contributions of companies, business executives, and professionals worldwide.

In DataProphet’s case, the Gold Globee® and the Grand Trophy are testaments to disruptive technology applied as an innovative solution for transforming the consumer experience of manufacturing process and machine health optimization.

About DataProphet
DataProphet is a venture-backed AI-as-a-Service company pioneering the application of artificial intelligence and machine learning to optimize advanced manufacturing. Its team of 50+ data scientists and solution engineers do this across key industry verticals throughout Africa, Europe, the Americas, and Asia. DataProphet customers include manufacturers of automotive, cast iron, aluminum, minerals, semiconductors, and EV batteries. Part of the company’s expansion strategy is to extend partnerships with its technology integrators (including Machine Builders) as it continues to expand globally. A WEF Global Innovator, DataProphet’s mission is to safely guide the machines making the world to next-generation production and measurably contribute to a more sustainable and connected future.

• Read more about DATAPROPHET WINS GLOBEE® GRAND TROPHY IN THE 2ND ANNUAL 2022 DISRUPTOR COMPANY AWARDS