Andrew O. Fung, Ph.D., Director of Business Development, A.M. Fitzgerald & Associates LLC
Dr. Fung advances product development programs for MEMS-enabled microsystems. He has 25 years of multinational experience in industry teams and research, with broad awareness of integrated microsystems. His track record covers technology innovation, collaborative research, community building, fundraising, and mentorship. Prior to joining AMFitzgerald, Dr. Fung was Team Leader of MEMS, Nanofabrication, and Integration at CMC Microsystems, and Scientific Advisor to Aterica Health Inc. Dr. Fung received his B.A.Sc. in Electrical Engineering from University of Waterloo and Ph.D. in Biomedical Engineering from University of California, Los Angeles.
The global medical device market is poised to benefit from miniature sensors that enable increasing instrumentation for data acquisition. Wearable health monitors, precision surgical tools, active implantables, and point-of-care diagnostics continue to drive demand for sensorization. As medtech companies race to innovate, MEMS-based solutions are revolutionizing patient care—enabling real-time monitoring, improving clinical outcomes, and reducing healthcare costs. Join A.M. Fitzgerald & Associates in this webinar to explore cutting-edge intersections of MEMS and healthcare, from wearable biosensors and intelligent implants to breakthrough microfluidic diagnostics. This session will highlight emerging technology opportunities and key challenges, providing actionable insights for medtech innovators looking to accelerate product development and scale MEMS-enabled devices successfully.
What You’ll Learn:
✔ Market trends shaping the future of MEMS in medtech
✔ How MEMS sensors are transforming patient monitoring and intervention
✔ Strategies for overcoming design, manufacturing, and regulatory hurdles
✔ Examples of A.M. Fitzgerald innovations in MEMS-enabled medtech products
Who Should Attend?
Medtech executives, product managers, R&D leaders, engineers, innovators, and MEMS enthusiasts eager to see how MEMS technology is being integrated into next-generation healthcare solutions.
Don’t miss this opportunity to gain a competitive edge in the fast-evolving medtech landscape!
Register Now to secure your spot.
Empowering Tomorrow’s Precision MedTech with Sensor Solutions
May 7, 2025
8-9am PT
8:00 am - 9:00 am
Off
Add to Calendar2025-05-07 08:00:002025-05-07 09:00:00A.M. Fitzgerald Webinar - Empowering Tomorrow’s Precision MedTech with Sensor SolutionsHosted by SEMI MSIGThe global medical device market is poised to benefit from miniature sensors that enable increasing instrumentation for data acquisition. Wearable health monitors, precision surgical tools, active implantables, and point-of-care diagnostics continue to drive demand for sensorization. As medtech companies race to innovate, MEMS-based solutions are revolutionizing patient care—enabling real-time monitoring, improving clinical outcomes, and reducing healthcare costs. Join A.M. Fitzgerald & Associates in this webinar to explore cutting-edge intersections of MEMS and healthcare, from wearable biosensors and intelligent implants to breakthrough microfluidic diagnostics. This session will highlight emerging technology opportunities and key challenges, providing actionable insights for medtech innovators looking to accelerate product development and scale MEMS-enabled devices successfully. What You’ll Learn: ✔ Market trends shaping the future of MEMS in medtech ✔ How MEMS sensors are transforming patient monitoring and intervention ✔ Strategies for overcoming design, manufacturing, and regulatory hurdles ✔ Examples of A.M. Fitzgerald innovations in MEMS-enabled medtech products Who Should Attend? Medtech executives, product managers, R&D leaders, engineers, innovators, and MEMS enthusiasts eager to see how MEMS technology is being integrated into next-generation healthcare solutions. Don’t miss this opportunity to gain a competitive edge in the fast-evolving medtech landscape! Register Now to secure your spot.United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
Marcel Demmler graduated in Physical Engineering in 2007. After graduation, he had a position in the R&D team at a company specializing in ion beam and plasma process technologies. In 2011, he started working as a Sales Director for the US and Japanese markets in that company. Marcel Demmler has been responsible for the worldwide sales and service organization at scia Systems since 2013.
High-precision sensors have been rapidly adopted across various industries and applications, including automotive electronics, industrial equipment, and cloud storage.
Among the advanced techniques used to produce high-quality sensors made of complex multi-layer compositions, ion beam and plasma processing stands out due to their precision and efficacy. In this webinar, scia Systems explains the principles and advantages of ion beam and plasma technologies and how they can be applied to produce sophisticated, high-quality sensors.
Key Takeaways:
· Learn how ion beam processing enables sensor production.
· Understand how ion beam etching streamlines the manufacturing of different sensor types, such as TMR, IR, and pyroelectric sensors.
· Discover the benefits of thin film deposition with scia Systems’ coating solutions for bio-sensors.
MSIG Webinar
Ion Beam Technology – Enabling an ever-evolving sensor landscape
April 23, 2025
8-9am PT
8:00 am - 9:00 am
Off
Add to Calendar2025-04-23 08:00:002025-04-23 09:00:00scia systems webinarHigh-precision sensors have been rapidly adopted across various industries and applications, including automotive electronics, industrial equipment, and cloud storage.Among the advanced techniques used to produce high-quality sensors made of complex multi-layer compositions, ion beam and plasma processing stands out due to their precision and efficacy. In this webinar, scia Systems explains the principles and advantages of ion beam and plasma technologies and how they can be applied to produce sophisticated, high-quality sensors.Key Takeaways:· Learn how ion beam processing enables sensor production.· Understand how ion beam etching streamlines the manufacturing of different sensor types, such as TMR, IR, and pyroelectric sensors.· Discover the benefits of thin film deposition with scia Systems’ coating solutions for bio-sensors.United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
The successful development of MEMS (Micro-Electro-Mechanical Systems) products requires a structured approach that balances innovation with manufacturability, cost, and time to market. The MEMS Manufacturing Readiness Levels (MMRL) Guide provides a comprehensive framework to navigate this process, from initial concept through high-volume production.
In this webinar, we will explore how MMRL facilitates efficient MEMS development by defining commonly accepted readiness levels, best practices, and key decision points. Attendees will gain insights into:
The MMRL framework and its role in MEMS product development
Best practices for reducing risks and accelerating time to market
Strategies for ensuring performance, quality, and cost targets are met
Real-world applications and lessons learned from implementing MMRL
Join us to learn how MMRL can streamline your MEMS development process, improve collaboration, and drive successful product commercialization.
Speakers
Michelle Bourke | Managing Director of Strategic Marketing and Specialty Technologies, Lam Research
Michelle Bourke received her B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University in Scotland, UK. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 she entered the semiconductor capital equipment industry as a technologist and has since accrued more than 25 years of experience in semiconductor technology, strategy, and new product development. She is a specialist in fabrication technologies for MEMS, Power Devices, RF Electronics and Optoelectronics.
Michelle is a frequent presenter at leading industry forums and also serves on many committees and industry councils. In November of 2018, she was inducted into the SEMI MEMS and Sensors Industry Group Hall of Fame and in 2020 she was a Silicon Valley YWCA Tribute to Women Honoree. Michelle is currently Chair of the Semi MEMS Manufacturing Working Group, Co-chair of the SEMI MEMs Standards Committee and a Director on the Transducers Research Foundation Board where she is the Chair of Fund Raising and Development Committee.
Michelle joined Lam Research in 2015 and is currently Managing Director of Strategic Marketing in Lam’s Customer Support Business Group.
Mary Ann Maher | CEO, SoftMEMS LLC
Mary Ann Maher is the CEO of SoftMEMS LLC. She received her Ph.D. degree in 1989 from Caltech in the area of semiconductor device modeling. She has held positions at the Swiss Center for Electronics and Microtechnology (CSEM), Tanner Research and MEMSCAP Inc. She founded SoftMEMS LLC in 2004. She has over 30 years of experience in the field of computer aided design for MEMS.
Rob Pugliese | Principal Engineer, HP Inc.
Rob Pugliese is a Principal Engineer at HP Inc. in Corvallis Oregon. Rob has held several engineering roles in inkjet printhead development in his 32 years at HP, from etching and deposition engineer to yield improvement, printhead architecture design and life science fluid dispensing, as well as a rotation in engineering management. He is currently working in the MEMS section of the Microfluidics Technology Incubation lab, where he guides development of new microfluidic devices, curates the technology development process, and leads the tooling/capability strategy for the MEMS fab. Rob has a Ph.D. in Chemical Engineering from the University of Massachusetts at Amherst.
Tyler Harrison | Design Engineer, Teledyne MEMS
Dr. Tyler Harrison is the lead Design Engineer at Teledyne MEMS in Edmonton, Canada. His undergraduate background in Computer Engineering led to a PhD program focused on ultrasound and photoacoustic systems design and integration, all at the University of Alberta. After graduating, a postdoctoral position shared between the University of Alberta and Micralyne Inc (now Teledyne MEMS) led to full time MEMS development work in 2016. Since then, he’s filled a variety of Engineering roles helping develop new processes and translate customer concepts to fabricated devices. In his tenure at Teledyne MEMS, he’s led several initiatives to automate and error-proof layout processes, standardize process control monitoring, and use data-driven approaches to improve first-run performance on new devices.
Tim Maloney | Senior Director of Business Development, Polar Semiconductor
Tim Maloney is the Senior Director of Business Development at Polar Semiconductor in Bloomington, Minnesota. With over 25 years of experience in the semiconductor industry, Tim has led initiatives across process engineering, factory operations, technology transfers, and supply chain management. In his current role, he is instrumental in Polar Semiconductor’s transformation into a U.S.-based open foundry specializing in power and sensor devices. His career includes leadership roles at Motorola Semiconductor, onsemi, Seagate Technology, SkyWater Technology, and Polar Semiconductor. Tim holds a background in Industrial Engineering from the University of Wisconsin-Madison and Arizona State University.
New SEMI Standard: Guide to MEMS Manufacturing Readiness Levels
March 12, 2025
8-9am PT
8:00 am - 9:00 am
Off
Add to Calendar2025-03-12 08:00:002025-03-12 09:00:00New SEMI MEMS Standard: Guide to MEMS Manufacturing Readiness Levels [Webinar]United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register here
Cancellations received on or before August 16, 2025 are fully refunded with a $100 processing fee. Refunds will not be issued for cancellations (including no-shows) made after August 16, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to:
SEMI is proud to partner with the following media and associations to bring you news about this event. Click below to read, subscribe, or visit their website to learn more about each of them.
Speakers represent the MEMS and sensors supply chain and adjacent industries. The conference will explore cutting-edge topics including photonics, digital twins and AI, machine learning, environmental sensors, quantum sensors, entrepreneurialism, innovation and collaboration. The programming is curated to appeal to the “NextGen” MEMS and sensors professionals through programming features of the conference that include networking, problem-solving, and skill development.
TOPICS
Gain insights as we dive into the following topics:
Environmental Sensors
Innovation
Photonics MEMS and Sensing Technology
Quantum Sensors
Digital Twins and AI for MEMS Design
AI & Machine Learning in MEMS and Sensor Device Operation
WHO SHOULD ATTEND
This conference is open to all MEMS & sensors professionals interested in NextGen technology.
System Approach in Boosting Sensitivity, Selectivity, and Stability of Modern Environmental and Industrial Gas sensors to Deliver Broad Societal Impact
The Computer History Museum (CHM) is a computer museum in Mountain View, California. The museum presents stories and artifacts of Silicon Valley and the Information Age, and explores the computing revolution and its impact on society. Transportation will be provided.
MEMS & Sensors NextGen—MSNG 2025 is the leading NextGen sensor technology technical conference for NextGen professionals related to designing, building, and using sensors.
MEMS & Sensors NextGen 2025
September 16-18, 2025
SEMI HQ, Milpitas, CA
2:30 pm - 6:30 pm
Off
Add to Calendar2025-09-16 14:30:002025-09-18 18:30:00MEMS & Sensors NextGenMEMS & Sensors NextGen—MSNG 2025 is the leading NextGen sensor technology technical conference for NextGen professionals related to designing, building, and using sensors. SEMI HQ 673 South Milpitas Boulevard Seminars 1 & 2 Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Science Foundry innovates on the traditional MEMS foundry business in three key ways: robust Multi-Project Wafer (MPW) offerings, a custom Manufacturing Execution System (MES), and a modular approach to our manufacturing capabilities. Some of our MPW offerings have been around for decades, while others were designed to serve the rapidly growing brain-computer interface industry, but all of our offerings provide production quality manufacturing at a fraction of the cost of custom wafer runs. We designed our MES for flexibility, enabling a level of efficiency beyond traditional wafer fabrication facilities and empowering us to engage with customers earlier in their development. Ultimately, this unlocks bandwidth from our technical staff to focus on creative problem solving and faster iteration cycles. We are expanding into a new facility with a modular upgrading plan that will add new process capabilities and strategically scale for the right partners. Our adaptability is our greatest strength, not only meeting our customers' needs but proactively anticipating the needs of nascent and burgeoning industries.
Kara Zappitelli, Foundry Director
Dr. Kara Zappitelli is the Lead Engineer & Foundry Director at Science Corporation’s pure-play MEMS foundry in RTP, North Carolina. She is a physicist-gone-engineer with a penchant for hard problems and more than a decade of experience in micro and nano fabrication for applications in neural engineering and MEMS. Kara joined Science at its inception and helped drive the initial R&D for the Science Eye device before moving to head up production of both internal and external devices. Kara received a B.S. in Physics from California Polytechnic State University in San Luis Obispo and a Ph.D. in Physics from the University of Oregon, where she was fabricating high surface area electrodes for applications in retinal prostheses. Before joining Science, she completed a post-doc investigating 2-photon lithography integration with 2D planar processing for complex neural interfaces.
Scott Smyser, VP of Sales
Scott has over 25 years of experience in the semiconductor industry leading commercial teams as a strategy, corporate marketing, and sales and business development professional. He has spent much of his career working with MEMS based products including timing devices, inertial sensors, and spectral sensors. At Science Foundry, Scott leads the go-to-market strategy developing long-term relationships with companies that need MEMS foundry services. Scott earned a BS in Electrical Engineering and an MBA from the University of Southern California.
United States
MSIG
8:00 am - 9:00 am
Off
Add to Calendar2025-02-12 08:00:002025-02-12 09:00:00Innovating in the MEMS Foundry BusinessUnited StatesSEMI.org[email protected]America/Los_AngelespublicRegister
Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing
3D-Micromac, a leader in high-precision laser-based semiconductor processing and micromachining, has consistently adapted to meet evolving market demands. As the need for greater precision and efficiency in semiconductor and sensor technology grows, traditional production methods began to show their limitations. To address these challenges, 3D-Micromac has applied its laser technology expertise to develop selective laser annealing, offering innovative solutions that enhance both production quality and efficiency while also enabling the creation of entirely new products.
Laser annealing offers a transformative alternative to conventional annealing methods, particularly in the production of Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. Traditional techniques, such as large magnetic annealing furnaces, significantly limit the throughput for complex sensor designs and increase production costs. The furnace approach also introduces potential yield losses due to its inherent processing complexity.
In contrast, selective laser annealing enables heating only illuminated wafer areas and not the entire wafer to provide extremely precise process control and enable closer placement of sensors to logic elements, laying the foundation for an integrated, monolithic sensor design (Fig. 1). This laser-based sensor programming enables a one-step process, eliminating the need for additional production steps such as dicing or chip transfer, which results in higher throughput and reduced costs.
Another semiconductor processing application that benefits from laser annealing is ohmic contact formation, which is a critical and challenging step in manufacturing silicon carbide (SiC)-based power devices. Traditionally, rapid thermal processing (RTP) has been used to generate well-controlled silicide interfaces because of its small thermal budget, but even RTP limitations become evident as SiC devices become thinner. Pulsed laser sources offer extremely small thermal budgets which enable ohmic contact formation on thinned SiC substrates resulting in superior device performance.
Both of these applications have already been successfully implemented in industrial machining solutions by 3D-Micromac. This webinar will provide in-depth insights into the processes and results (Fig. 2), while also exploring potential new applications of selective laser annealing. This innovative approach enhances device quality and streamlines manufacturing, marking a significant shift towards more efficient and cost-effective production methods in the sensor and semiconductor industries.
Fig. 1. Comparison traditional approach vs. selective laser annealing approach in magnetic sensor annealing
Fig. 2. Result of backside annealing for ohmic contact formation: SEM of NixSiy interface showing outstanding homogeneity
FEATURED SPEAKER
Maurice Clair | Team Lead Technology & Innovation Management
Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department. In his current role, he serves as the technical lead for ohmic contact formation on SiC (silicon carbide) materials, a critical area in advancing semiconductor technologies.
Through his expertise in laser technologies, he has been instrumental in the development of innovative laser micromachining processes, including: laser trimming techniques for fine-tuning electronic components with both digital and analogue approaches and beam shaping for ultra-short pulsed lasers.
United States
MSIG
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Add to Calendar2024-12-04 00:00:002024-12-04 00:00:00Laser Annealing: Revolutionizing Sensor and Semiconductor ManufacturingUnited StatesSEMI.org[email protected]America/Los_AngelespublicRegister
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
Off
Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity
There is an increasing need for sensors and smart devices in optical communications, medical devices, automotive navigation and every market in between. MEMS technology is at the center of this groundswell, presenting new revenue opportunities to companies of all sizes.
As companies seek to push performance and manufacturing limits, a new generation of commercial MEMS devices that use piezoelectric thin films has been emerging. The global piezoelectric MEMS wafer volume is forecast to exceed 1.5M wafers per year or 30% of all MEMS wafers by 2029*.
Piezoelectric thin films, particularly PZT, are the new foundation for high-growth MEMS products like microspeakers and micromirrors, gas sensors, image stabilizers, and ultrasonic transducers.
An alliance between MEMS product development firm AMFitzgerald and foundry service MEMS Infinity, Sumitomo Precision Products, Co.,Ltd. is opening new paths for commercialization of PZT MEMS. Together, AMFitzgerald and MEMS Infinity offer an integrated design-to-production service that expedites commercialization by leveraging production-proven processes from day one.
Join this webinar to learn:
Trends that are driving the adoption of PZT MEMS
Why access to production-quality PZT is especially important for early-stage development
MEMS Infinity’s distinctive foundry service and PZT lineup for actuators, sensors, and transducers
150mm and 200mm wafer lines
The world’s highest piezoelectric coefficient e31f for actuators
Combined high e31f and low relative permittivity for sensors and transducers
Extreme e31f using dual-layer PZT actuators
How to access the highest-quality PZT thin films for your product development
Accelerating Piezoelectric MEMS Product Development
Presented by AMFitzgerald and MEMS Infinity
8:00 am - 9:00 am
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Add to Calendar2024-09-18 08:00:002024-09-18 09:00:00Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
SEMI MEMS & Sensors Industry Group—MSIG, manages a 5-year $5M per year ($25M total) Positioning, Navigation, and Timing—PNT funded R&D Program.
Join us for an overview of the program’s 3rd-year request for proposal (RFP) instructions and get answers to any questions you may have on submitting a proposal.
Presented by: SEMI MEMS & Sensors Industry Group—MSIG
8:00 am - 9:00 am
Off
Add to Calendar2025-06-13 08:00:002025-06-13 09:00:00SEMI MSIG Positioning, Navigation, and Timing Request for Proposal WebinarWEBINAR United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY
Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on the path to $1T in semiconductor revenue.
A significant amount of both markets is concentrated in the Midwestern United States. SEMIEXPO in the Heartland will bring these two key markets together and provide an opportunity for collaboration and growth.
Smart Manufacturing
The program will focus on the deployment of Industry 4.0 or Smart Manufacturing tools, technologies, and methods for the semiconductors required for this growing market.
Smart Mobility
The program will unite stakeholders in the semiconductors/sensors and mobility ecosystems to identify and address technical issues and supply chain dynamics that are best addressed collectively.
Ways to Participate
Exhibit
Sponsor
Speak
Attend
MAKE YOUR MARK AT THE INAUGURAL SEMIEXPO HEARTLAND
Plan Now to Exhibit or Sponsor. Contact— Shane Poblete | +1 202-847-5983 | [email protected]
NEW EVENT!
April 1–2, 2025
Indiana Convention Center, Indianapolis, IN
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Add to Calendar2026-04-29 00:00:002026-04-30 00:00:00SEMIEXPO Heartland 2026Indiana Convention Center 100 S Capitol Ave Detroit, MI United StatesSEMI.org[email protected]America/Detroitpublic
America/Detroit
