United States

Dan Trojan

CEO

Axus Technology

Catherine Bullock

Director Process Technology

Axus Technology

Silicon Carbide (SiC) is revolutionizing the semiconductor industry, enabling the development of advanced technologies across AI, MEMS, sensors, automotive, and semiconductor sectors. As a next-generation material, SiC offers advantages that silicon cannot match. However, processing SiC is challenging and expensive. Leading CMP semiconductor manufacturers still rely on outdated technology and inefficient processes, resulting in high costs which hinder innovation. To address these challenges, Axus Technology is hosting a webinar on SiC to introduce its modern, flexible CMP technology and solutions for efficient SiC processing. 

United States

In our rapidly urbanizing world, smart cities have evolved from futuristic ideas to tangible realities. Central to this concept are innovative sensor technologies that enable cities to gather data, analyze patterns, and make informed decisions to improve efficiency, sustainability, and quality of life for residents.

SEMI MSIG will host a workshop at the Smart Cities Connect Conference in Raleigh on May 7th. Participants from the sensor industry and municipalities will engage in open discussions, addressing pain points in the advancement of smart cities and exploring how sensor technologies can effectively address these challenges.

Join us for a pre-workshop webinar in preparation for the Smart Cities Connect Workshop, where we'll bring together leading sensor makers like Bosch, TDK, and NXP, hardware integrators, and municipal leaders. Sensor manufacturers will introduce their technology to the Smart City audience. MSIG will also be presenting the SEMI MSIG multi-sensor node concept. 

Don't miss this chance to be part of a dynamic exchange of ideas and insights with industry leaders. Register now to secure your spot and be part of the conversation shaping the future of smart cities.

Arjen Janssens, Senior Director PLD, Lam Research Corporation

Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.

Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.

United States

Dr. Arjen Janssens

And yes, we’ve got a solution for that.

MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.

Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.

In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.

UCLA
Los Angeles, CA
United States

SEMI MSIG PNT Gap Analysis Workshop

Learn About Phase 2 of the Positioning, Navigation and Timing (PNT) Funding Program

Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.

United States

Dr. Kevin (Cheng-Hao) Ko

SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.

In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.

United States

Introduction to Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

Mesoline’s Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process where a polymeric stamp is used to transfer ink onto a substrate. This novel microfabrication technology offers ultra-small and reproducible micro features fabricated with extensive parallelization and high scalability. Unique process features include: (1) full wafers patterning in 15-minutes, (2) 1 to 50mm structures with up to 5/1 aspect ratios and 3) full 3D-control of the printed structures. Many different sensor applications of this technology will be introduced, including: (1) printing sensing electrodes for metal oxide gas sensors, (2)printing of getters for microbolometers, (3) printing of porous electrodes for biosensing applications and (4) accurate deposition of glass frit for advanced packaging applications.

Micro-electromechanical systems (MEMS) are revolutionizing how humans interact with the world. Atomic layer deposition (ALD) can be an enabling technology to improve performance of existing MEMS architectures and developing future devices.

Due to their digital growth nature, ALD processes provide a discrete and reproducible amount of film in each cycle. Multilayered films can be deposited to tune physical properties of the films, including dielectric properties, such as dielectric constant, leakage current, and breakdown voltage.  These “nanolaminate” barrier films can be produced by adding discrete layers of a 2nd metal oxide, like Al2O3 or ZrO2, to a primary dielectric, like HfO2. The multilayer technique can also be exploited to drastically improve moisture and oxygen barrier properties of ALD films over a bulk film and to tune the internal film stresses.

Whether using a single-wafer system or multi-wafer batch system, extremely low ALD deposition rates have made it difficult to implement ALD into high volume manufacturing. Another barrier to adoption of ALD in MEMS applications is the inefficiency of precursor usage, which leads to unacceptable operating costs.

In this webinar, Nano Forge will present how to use ALD to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. A brief description of the differentiating features and product offerings in the ALDx toolset will also be discussed.

Forge Nano’s ALDx toolset offers the fastest and most efficient single-wafer system on the market, enabling ALD to be integrated earlier in the product development cycle.

Online, Virtual
United States

Moderator

Paul Carety

Director, MSIG

SEMI MSIG

Matt Weimer

Principal R&D Scientist

Forge Nano

In this webinar, Forge Nano will present how to use Atomic Layer Deposition (ALD) to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. This approach overcomes the perception of ALD as a barrier to high-volume manufacturing and as a material intensive process.  Join Paul Carey and Matt Weimer of Forge Nano to explore a new approach.

Dynamic Control of ALD Films for Fast & Efficient MEMS Manufacturing

A MEMS Manufacturing Webinar

Abstract: 

Recognition methodologies for electrochemical sensing of specific analytes have been developing over many years. Creating specificity over similar analytes has been a goal, as often similar shaped molecules can bind to the sensor alongside the targeted analyte.  

One of the cutting-edge ways to enable targeted electrochemical sensing is to use single strand DNA or RNA molecules, also known as aptamers, as the biorecognition elements (BRE).

This seminar will provide insights into: 

• Overview of strategies for Biomolecular Sensing
• Electrochemical based sensing
  • Optical based methods
    • Plasmonic resonance energy transfer (PRET)
    • Nanoparticle surface energy transfer (NEST)
    • Surface plasmon resonance (SERS) biosensors
• Aptameric based sensing – key design elements to target analytes displayed in recent literature
  • Surface binding/functionalization approaches
  • Reporter/redox molecules to facilitate signal generation
  • BRE molecular structure dynamics

The seminar will be useful for the many researchers reviewing methods for effectively and reliably identifying science-based biomarkers for a wide range of diagnoses and reporting requirements for integration into products with a wide range of consumer and healthcare uses.

About the Featured Speaker

Jack Ly is a Program Manager and Research Scientist at UES, Inc. He received his PhD in Polymer Science and Engineering from the University of Massachusetts Amherst in 2018. At UES, Inc, he supports the Air Force Research Lab in designing, fabricating, and validating specialty polymers and analyte sensing chromophores for optical sensors. Most recent relevant published work involves fabrication of implantable, degradable phosphorescent O2 sensors.

Online
United States

Jack Ly

Program Manager & Research Scientist

UES

Gity Samadi, PhD

Sr. Director R&D Programs

SEMI

Fundamentals of Electrochemical, Aptameric-based Sensors

As AI proliferates rapidly, AI models and datasets are also growing rapidly in size, giving rise to two fundamental challenges. First, this growth far outpaces performance improvement in hardware systems and infrastructure, and second, the energy consumption for AI continues to grow unsustainably.

These challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI (www.semi.org), a global electronics industry association with 3300 member companies, is organizing this workshop under its Smart Data-AI Initiative. We are bringing together experts to discuss the latest innovations in the entire-AI ecosystem – including novel devices, 2D materials, analog computing, advanced packaging, chiplets, photonics, hardware-software co-optimzation and energy-efficient architectures & algorithms for data centers, cloud & edge.

Please join us on March 19th in Milpitas, CA. We will start with an inspiring keynote from Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials, and continue through the day with industry leaders (AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, Mckinsey, Micron, Nvidia, Qualcomm, SK Hynix); exciting start-ups (Cerebras, LightMatter, Mentium) and leading-edge academic researchers (Stanford U. and U. of California). Together, let us explore collaborative, system-level solutions for sustainable progress in AI systems.

SEMI
673 S. Milpitas Blvd
Milpitas, CA 95035
United States

THIS EVENT IS SOLD OUT

Future of Computing

Sustainable AI Systems
[In-Person Event]