Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock

• Read more about Sikama International Celebrates 40th Anniversary

Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for RF and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s Thermal High-Performance Packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability rugged interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner or innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead (Pb) within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride (GaN) and silicon carbide (SiC) power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
www.citc.org

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2021, Henkel reported sales of more than 20 billion euros and adjusted operating profit of about 2.7 billion euros. Henkel employs about 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX.
www.henkel-adhesives.com/electronics

Contact
CITC: Marco Koelink | M +31 6 15 15 66 41 | E [email protected]
Henkel: Ruud de Wit | M +31 6 43 37 21 08 | E [email protected]

• Read more about CITC and Henkel forge partnership to accelerate high-thermal die attach solutions

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ Sanchez has joined the company’s senior leadership team as Vice President of Quality and Managing Director of YES’s new Technology Center in Chandler, Arizona.

Mr. Sanchez, who is based in Chandler, is a seasoned operations and business leader with over two decades of experience driving excellence in the manufacturing operations of semiconductors, microelectronics, printed electronics, antenna technology, and hard drives.

“Russ has an impressive track record of developing technology centers and manufacturing operations to support the growth of high-technology sector customers,” said Rezwan Lateef, President of YES. “His ability to implement quality systems and to partner closely with our customers to realize their next-generation devices will be invaluable as we move into the next phase of our company’s growth.”

Mr. Sanchez came to YES from NthDegree Worldwide Technologies, where he was Vice President of Operations. Before that, he held a variety of roles within Manufacturing and Quality at technology companies including Airgain, NXP Semiconductors, ST Microelectronics/Western Digital Corporation, Hynix Semiconductor of America, and Philips Semiconductors. He holds a Bachelor of Science degree in Business Administration from the University of Phoenix.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center

Deventer, July 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, will publish the Company’s first half-year report for 2022 before stock opening on July 21, 2022.

CEO Martin Sallenhag and CFO Arvid Ladega will comment on the report and will respond to questions during the conference call for media, analysts and shareholders on July 21, 2022 at 9:30 CEST.

You are invited to join the Microsoft TEAMS event using the following login instructions:
Join with your computer or mobile app Click here to join the meeting
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+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English only.

• Read more about RoodMicrotec N.V.: Invitation to the presentation of the first half-year’s results for 2022

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.

“MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high-flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing,” said Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems.

For additional information, please contact:
Dr. Irving Wang
Director of Product Marketing, MRSI Systems, Mycronic Group
Tel: +1 (978) 667 9449, e-mail: [email protected]
Time Zone: ET – Eastern Time

Jennifer Russo
Marketing Manager, MRSI Systems, Mycronic Group
Tel: +1 (978) 495 9731, e-mail: [email protected]
Time Zone: ET – Eastern Time

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

• Read more about MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

Sikama International is excited to exhibit at SEMICON West 2022 this July, presenting the innovative Electron Attachment fluxless reflow technology, our upcoming 40th anniversary, and an extensive product line for a broad range of applications providing customers with the highest efficiency, smallest footprint, and most versatility in the industry. Our patented Electron Attachment technology, developed in partnership with AirProducts™, provides unmatched performance offering truly safe and residue-free fluxless reflow. The system is operated with N2 cover gas and an H2/N2 blend with less than 5% hydrogen, ensuring safe operation. The EA UP1200 utilizes an electrically isolated ceramic roller transport mechanism to move the work item from zone-to-zone through the oven. The work item is deoxidized in the EA zones prior to reflow which eliminates the need for flux coating or washing. This technology has shown to be superior to formic acid processes time and time again. In addition, this revolutionary breakthrough offers the safest and lowest cost per wafer yet for the semiconductor packaging industry.

Sikama is looking forward to discussing their full product line at SEMICON West this year. Visit our booth #1447 to learn more and enter to win an iPad Air!

• Read more about Sikama International at SEMICON West 2022 – “Reliable, Repeatable, Responsible Reflow”

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has promoted Dan O’Connell to Vice President of Strategic Accounts.

Mr. O’Connell joined YES in November of 2021 as Senior Director of Key Account Management. In his newly expanded role, he will work closely with the company’s Sales, Marketing and Technology teams to nurture strategic customer relationships and ensure YES’s alignment with current and future customer technology requirements.

“Dan’s extensive strategic account experience in the semiconductor industry has contributed to our rapid growth,” said Rezwan Lateef, President of YES. “His proven ability to develop strong industry relationships aimed at enabling technology roadmaps, coupled with his intimate knowledge of Advanced Packaging processes, make Dan a valued addition to our senior leadership team.”

Prior to joining YES, Mr. O’Connell held senior key account management positions of increasing responsibility at ASM Pacific Technology Ltd., Tokyo Electron (TEL), LAM/Novellus, and Ebara. He holds a bachelor’s degree in Chemical Engineering from Worcester Polytechnic Institute.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about YES Names Dan O’Connell as Vice President of Strategic Accounts

Primarius Technologies will unveil its flexible and scalable design environment for custom memory and analog/mixed-signal IC design and new circuit simulation and design enablement solutions during the Design Automation Conference (DAC) July 11-13 at Moscone Center in San Francisco.

Demonstrations will feature Primarius’ NanoDesigner™, a full custom design platform; SDEP™, an innovative spec-driven modeling automation platform; PCellLab™, a PDK parameterized cell library development platform; NanoCell™, a standard cell library characterization solution; and 9812AC, the first commercial AC dynamic noise measurement system.

Other demonstrations will highlight products such as an all-in-one semiconductor parameter analyzer FS-Pro™, and a portfolio of solutions for SPICE model, process design kit (PDK) and standard cell library verification including ME-Pro™, PQLab™ and LibWiz™.

New Additions to Primarius Product Portfolio
Primarius is committed to delivering innovative data-driven design technology co-optimization (DTCO) EDA solutions powered by leading-edge SPICE/FastSPICE simulation technologies, shortening time to market and improving yield, power, performance and area of circuit designs at advanced process nodes.

Its DTCO solutions such as SDEP, PCellLab, NanoCell and FS-Pro reduce the iteration cycle from process technology development to IC design for models, PDKs and standard cell development products available from Primarius.

NanoDesigner provides an extendable and flexible design environment with schematic entry, layout editing and in-design physical verification that supports full-custom memory and analog/mixed-signal designs. It integrates with NanoSpice, Primarius’ circuit simulator series that offer the full spectrum of circuit simulation capabilities including high-performance parallel SPICE to an adaptive dual-simulation engine FastSPICE. Both offer more accurate and faster results than traditional SPICE and FastSPICE. NanoDesigner’s expanded capabilities cover mixed-signal verification, aging, EM/IR, random telegraph noise (RTN) and high Sigma yield analysis.
PCellLab, a user-friendly automated standard Pcell library development tool, pairs with PQLab, a PDK-quality verification platform, to form a complete solution for PCell generation and verification.

Primarius’ new NanoCell, a solution used for standard cell library characterization, and LibWiz, a user-friendly GUI to qualify libraries, combine for a standard cell library characterization and qualification solution.

And finally, 9812AC is the first commercial low-frequency dynamic noise measurement system. It has superior capabilities and versatility for measuring low-frequency noise characteristics of semiconductor devices over a wide range of bias voltage and excitation frequencies.

More Products in the Primarius Portfolio
SDEP, an innovative model development platform designed to tackle advanced SPICE modeling challenges, provides a system to retain and receive device modeling expertise and build automated flows for different process platforms and applications with intelligent target-oriented algorithms. It has a built-in parallel SPICE simulation engine for fast performance and includes rich data analysis and validation utilities, powerful parameter control and optimization functions and flow automation features.

FS-Pro is an all-in-one parametric analyzer used with semiconductor device DC/AC, reliability and statistical measurement solutions.

At 2022 Design Automation Conference
Primarius Technologies will exhibit at DAC Booth #1419 (First floor) Monday, July 11, through Wednesday, July 13, from 10 a.m. until 6 p.m. at the Moscone Center in San Francisco.

To arrange a meeting or demonstration of the Primarius Technologies product portfolio, send email to: [email protected].

About Primarius
Primarius Technologies (688206.SH) is a global electronic design automation (EDA) company. It delivers the semiconductor industry’s leading design enablement technologies for advanced SPICE modeling, PDK generation and standard cell library characterizations, and a complete design technology co-optimization (DTCO)-enabled custom design flow for complex memory, analog and mixed-signal designs. Powered by leading-edge SPICE/FastSPICE simulation technologies, Primarius is committed to delivering innovative DTCO solutions. Its mission is to shorten time to market and improve yield, power, performance and area of circuit designs at advanced process nodes. Primarius’ unique data-driven EDA solutions are supported by a full range of semiconductor parametric testing systems and the industry’s golden low-frequency noise testing systems. Visit Primarius Technologies for more information.

• Read more about Primarius Unveils Custom Design Environment, Circuit Simulation and Design Enablement Solutions at DAC